JP3079922B2 - Solder ball mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus for mounting a solder ball on a work such as a substrate.

[0002]

2. Description of the Related Art As means for forming bumps (protruding electrodes) on a work such as a substrate or a chip, a solder ball formed of a solder material is mounted on the work, and the solder ball is heated and melted and solidified. It is known to form bumps. The solder ball mounting device that mounts the solder ball on the work is such that the solder ball is vacuum-adsorbed to the suction hole of the head and picked up, and then the head is moved above the work to transfer the solder ball to the work. Has become.

FIG. 4 is a sectional view of a main part of a conventional solder ball mounting device at the time of pickup. Reference numeral 1 denotes a solder ball, which is stored in a large amount in the container 2. Reference numeral 3 denotes a receiving stand for the container 2, and air is pressure-fed from the compressor 4. Container 2
A hole 5 is opened in the lower surface of the solder ball 1, and the air blown into the container 2 from the hole 5 pressurizes the solder ball 1 in the container 2. Reference numeral 6 denotes a head, on the lower surface of which are formed a large number of suction holes 7 for sucking the solder ball 1 by vacuum. The head 6 is connected to a vacuum device (not shown), and drives the vacuum device to vacuum-suck the solder ball 1 into the suction hole 7. The head 6 is held by a moving means (not shown).
Reciprocate between the container 2 which is the storage part of the above and the substrate which is the work positioned at the positioning part (not shown).

In the above configuration, the air is blown up into the container 2 so that the solder balls 1 are fluidized in the container 2. Therefore, by lowering and raising the head 6,
The solder ball 1 is vacuum-adsorbed to the suction hole 7 and picked up. Subsequently, the head 6 moves above the work, and then descends and rises again, so that the solder ball 1 vacuum-adsorbed to the suction hole 7 is moved to the work. To be mounted on.

[0005]

In the above-mentioned conventional apparatus, air is sent into the lower space of the container 2, and this air is blown up from the hole 5 to fluidize the solder balls 1, thereby forming a large number of suction balls. The holes 7 facilitate the vacuum suction of the solder balls 1. However, in the above-described conventional apparatus, the air sent into the container 2 from the suction hole 5 does not uniformly blow up the inside of the container 2, and the amount of air tends to vary locally. For this reason, as shown in the figure, the upper surface of the layer of the solder balls 1 stored in the container 2 does not become horizontal, and irregularities are likely to occur. If the upper surface of the layer of the solder ball 1 is uneven, the solder ball 1 cannot be vacuum-sucked in all the suction holes 7 of the head 6, and the suction hole 7 in which the solder ball 1 is missing tends to be generated. there were.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a solder ball mounting apparatus capable of vacuum-sucking and picking up solder balls in all suction holes of a head.

[0007]

SUMMARY OF THE INVENTION To this end, the present invention provides a container for storing solder balls, a container, a ventilation sheet disposed above the container and on which solder balls are placed, The rectifier is provided below and gas supply means for feeding gas into a space below the rectifier.

Preferably, the ventilation sheet on which the solder balls are placed is a stretchable sheet.

[0009]

In the above construction, the gas sent into the lower space of the rectifying means is rectified by the rectifying means and then blows up the inside of the container uniformly through the ventilation sheet. There is no variation.
Therefore, since the upper surface of the solder ball layer on the ventilation sheet keeps a horizontal surface, the solder ball can be reliably sucked and picked up in all the suction holes of the head.

If the lower surface of the head is lowered below the upper surface level of the solder ball layer and the lower surface is embedded in this layer, the solder balls are more easily vacuum-adsorbed to all the suction holes. The pressure applied from the head to the solder ball layer is absorbed by the fluidized solder balls, and further absorbed by the ventilation sheet extending downward. Therefore, it is possible to prevent the lower surface of the head from hitting the solder ball strongly and damaging the solder ball.

[0011]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a solder ball mounting device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a storage portion of the solder ball mounting device, and FIG. It is sectional drawing. In FIG. 1, reference numeral 11 denotes a base, on which a reservoir 12 for the solder balls 1 is provided. 20
Is a positioning part of the substrate, which is configured by stacking an X table 21 and a Y table 22. Reference numerals 23 and 24 denote driving motors for the X table 21 and the Y table 22. Y
A clamper 25 is provided on the table 22. The clamper 25 clamps and fixes the substrate 26 from right and left. Therefore, when the X table 21 and the Y table 22 are driven, the substrate 26 moves horizontally in the X direction and the Y direction, and the position is adjusted.

Reference numeral 30 denotes a head, which comprises an upper case 31 and a lower case 32. In FIG. 1, the head 30
Is held by a block 37 via a shaft 36. Reference numeral 38 denotes a support frame, on the front of which a vertical guide rail 39 is provided. The block 37 is mounted on a guide rail 39 so as to be able to move up and down. A nut 40 is connected to the block 37. A vertical feed screw 41 is screwed into the nut 40. When the motor 42 is driven and the feed screw 41 rotates, the block 37 moves up and down along the guide rail 39, and the head 30 also moves up and down. 4
A vacuum device 3 is connected to the head 30 via a tube 44. When the vacuum device 43 is driven, the solder balls 1 are vacuum-sucked into a large number of suction holes 35 (FIG. 2) formed on the lower surface of the lower case 32.

Reference numeral 50 denotes a horizontally long frame, on the front of which a horizontal ball screw 51 is provided. A nut (not shown) provided on the back surface of the support frame 38 is screwed to the ball screw 51. When the motor 52 is driven to rotate the ball screw 51, the support frame 38 moves horizontally in the X direction along the ball screw 51, whereby the head 30 reciprocates between the storage section 12 and the substrate 26.
That is, the ball screw 51 and the motor 52 constitute a moving unit for moving the head 30 horizontally.

Next, the storage portion 12 of the solder ball 1 will be described with reference to FIG. Reference numeral 14 denotes a container, and a ventilation sheet 15 is horizontally disposed at an upper portion inside the container. The ventilation sheet 15 of this embodiment is a mesh having elasticity. A rectifying sheet 16 is provided below the ventilation sheet 15.
17 are horizontally arranged at an interval vertically.
The rectifying sheets 16 and 17 are also meshes having ventilation. The ventilation sheet 15 and the flow regulating sheets 16 and 17 may be perforated plates other than the mesh, but in this case, the holes are desirably formed as densely and as finely as possible. The number of rectifying sheets 16 and 17 is arbitrary, but it is preferable to arrange two or more rectifying sheets in terms of rectifying effect.

A gas discharge portion 13 for discharging a gas such as air or nitrogen gas is provided inside the base 11. As shown in FIG.
Through to the gas supply unit 28. The gas supplied from the gas supply unit 28 blows out from the discharge unit 13 into the lower space 18 of the container 14 through the tube 27. The blown gas passes through the rectifying sheets 16 and 17 and has a uniform air volume in the container 14 (see the dashed arrow).
It is fed into the layer of the solder ball 1 through the ventilation sheet 15 and blows up. As a result, the solder ball 1 is fluidized, but the gas is blown up uniformly, so that the upper surface of the solder ball 1 keeps a horizontal surface. In the present embodiment, the rectifying sheets 16 and 17 constitute rectifying means for rectifying the gas discharged from the discharge unit 13.

This solder ball mounting apparatus has the above-described configuration. Next, the overall operation will be described. As shown in FIG. 1, the head 30 is positioned above the storage unit 12 and the motor 42 is driven forward. Then, the feed screw 41 rotates forward and the head 30 descends. FIG. 3 shows a state in which the lower surface of the lower case 32 of the head 30 is lowered to a level lower than the upper surface level of the layer of the solder ball 1 and is slightly embedded in the layer of the solder ball 1. As described above, when the head 30 is lowered until the lower surface thereof is lower than or equal to the upper surface of the layer of the solder ball 1, the solder ball 1 is more easily vacuum-adsorbed to the suction hole 35. At this time, the gas is blown up and the solder balls 1 are fluidized, so that the solder balls 1 are vacuum-sucked in all the suction holes 35. When the head 30 descends to the embedding position, pressure is applied to the layer of the solder ball 1, and this pressure is applied to the fluidized solder ball 1.
The air is further absorbed by the ventilation sheet 15 extending downward so as to be bent as shown by a chain line in the figure. Therefore, the solder ball 1 is not strongly rubbed against the lower surface of the head 30 and the solder ball 1 is not damaged.

Next, the motor 42 is driven in reverse to raise the head 30 to pick up the solder ball 1. Next, in FIG. 1, the motor 52 rotates forward, the ball screw 51 rotates forward, and the head 30 moves upward to the substrate 26. Then, the motor 42 is driven forward, the head 30 is lowered, and the solder balls 1 are landed on the electrodes of the substrate 26. Then, the vacuum suction state of the solder balls 1 by the vacuum device 43 is released. The head 30 is raised by driving, and the solder ball 1 is mounted on the substrate 26. When the solder ball 1 is mounted on the substrate 26 in this manner, the head 3
0 is returned above the storage section 12 shown in FIG. 1, and the above-described operation is repeated.

The present invention may be embodied with various modifications. For example, the rectifying means may be constituted by using a plurality of blades instead of the rectifying sheets 16 and 17. Any material can be used as long as it can rectify the flow of the gas blown out from the discharge unit 13 substantially uniformly.

[0019]

As described above, according to the present invention, the gas sent into the lower space of the rectifying sheet is rectified by the rectifying sheet and then blown up uniformly in the container through the ventilation sheet. Therefore, the air volume of the gas passing through the container does not vary from place to place, so the upper surface of the solder ball layer on the ventilation sheet keeps a horizontal plane, so that the solder balls are securely vacuum-sucked in all the suction holes of the head. Can be picked up.

If the lower surface of the head is lowered to a level lower than the upper surface level of the solder ball layer and the lower surface is embedded in this layer, the solder balls are more easily vacuum-sucked in all the suction holes. Therefore, the pressure applied to the solder ball layer from the head is absorbed by the fluidized solder ball, and further absorbed by the airflow sheet extending downward, so that the lower surface of the head strongly contacts the solder ball and damages the solder ball. Can be resolved.

[Brief description of the drawings]

FIG. 1 is a side view of a solder ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a storage portion of the solder ball mounting device according to one embodiment of the present invention.

FIG. 3 is a sectional view of a main part of the solder ball mounting device according to one embodiment of the present invention at the time of pickup.

FIG. 4 is a cross-sectional view of a main part of a conventional solder ball mounting device during pickup.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball 12 Storage part 13 Discharge part 14 Container 15 Ventilation sheet 16, 17 Rectification sheet 18 Lower space 20 Positioning part 26 Substrate 30 Head 35 Suction hole 51 Ball screw 52 Motor

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/34 B23K 3/06

Claims (3)

(57) [Claims] A head having a plurality of suction holes formed on a lower surface thereof for vacuum-sucking the solder balls; And a moving means for reciprocating between the containers, wherein the storage portion is a container, a ventilation sheet disposed on an upper portion of the container and on which the solder balls are placed, and An apparatus for mounting a solder ball, comprising: a rectifying means disposed below a seat; and a gas supply means for feeding gas into a space below the rectifying means. 2. The solder ball mounting apparatus according to claim 1, wherein the ventilation sheet on which the solder balls are mounted has elasticity. 3. The solder ball mounting apparatus according to claim 1, wherein said rectifying means is at least one air-permeable rectifying sheet.