JPWO2020178889A1 - Electronic component peeling device and electronic component peeling method - Google Patents

Abstract

To provide an electronic component peeling device and a method for peeling an electronic component, which can reduce the load applied to the electronic component when peeling the electronic component from the adhesive sheet and can appropriately peel the electronic component. The electronic component peeling device is arranged below the adhesive sheet to which the electronic component is attached, is provided with an inclined surface having a predetermined angle with respect to the adhesive sheet, and is a push-up tool that pushes up the adhesive sheet and the electronic component by the inclined surface. , The suction device that sucks the electronic parts and the electronic parts pushed up by the push-up tool are sucked by the suction device, or the electronic parts sucked by the suction device are pushed up by the push-up tool, and then the suction device that sucks the electronic parts is A control device for peeling an electronic component from the adhesive sheet by moving the electronic component in a direction away from the adhesive sheet is provided.

Description

The present disclosure relates to an electronic component peeling device for adsorbing and peeling an electronic component attached to an adhesive sheet, and a method for peeling the electronic component.

Conventionally, there is an electronic component peeling device that sucks an electronic component attached to an adhesive sheet by a suction nozzle and peels the electronic component from the adhesive sheet (for example, Patent Document 1). The electronic component peeling device of Patent Document 1 pushes up an electronic component from below with a push-up tool, and sucks the electronic component from above with a suction nozzle. The suction nozzle lifts the electronic component in a sucked state to peel the electronic component from the adhesive sheet. The push-up tool forms a square pillar. The tip of the push-up tool has a convex shape with the center protruding, and the four corners are cut to form a smooth curved surface.

JP-A-2007-194571 (Fig. 3)

By the way, the thickness of electronic components is becoming thinner and thinner, for example, several tens of μm due to the increase in mounting density in recent years. Therefore, when the electronic component is peeled from the adhesive sheet, it is necessary to reduce the load applied to the electronic component in order to prevent the electronic component from cracking or bending. In the electronic component peeling device of Patent Document 1 described above, the suction nozzle pulls up the electronic component in a direction perpendicular to the sticking surface. Since the electronic component is subjected to a load according to the adhesive area attached to the adhesive sheet, there is a risk of cracking or bending.

The present disclosure has been made in view of the above problems, and is an electronic component peeling device capable of appropriately peeling an electronic component by reducing the load applied to the electronic component when peeling the electronic component from the adhesive sheet. And to provide a method of peeling electronic components.

In order to solve the above problems, the present specification is arranged below the pressure-sensitive adhesive sheet to which the electronic component is attached, and is provided with an inclined surface having a predetermined angle with respect to the pressure-sensitive adhesive sheet. The adhesive sheet, the push-up tool for pushing up the electronic component, the suction device for sucking the electronic component, and the electron sucked by the suction device or the electron sucked by the suction device. An electron including a control device for pushing up a component with the push-up tool and then moving the suction device for sucking the electronic component in a direction away from the pressure-sensitive adhesive sheet to separate the electronic component from the pressure-sensitive adhesive sheet. Disclose the component peeling device.

Further, the content of the present disclosure is not limited to the electronic component peeling device, and it is useful to implement it as a method for peeling electronic components.

According to the electronic component peeling device and the like of the present disclosure, the push-up tool has an inclined surface inclined with respect to the adhesive sheet, and the adhesive sheet and the electronic component are pushed up from below by the inclined surface. The adhesive sheet and the electronic component are in an inclined state along the inclined surface. The suction device sucks an electronic component that is pushed up by a push-up tool and tilted by an inclined surface. Alternatively, the push-up tool pushes up the electronic component sucked by the suction device. Then, the suction device moves in the direction of peeling from the adhesive sheet in the sucked state. The suction device separates the electronic components from the adhesive sheet in order from the lower end of the inclined surface by moving in the separating direction. Thereby, when the electronic component is peeled from the adhesive sheet, the load applied to the electronic component can be reduced. It is possible to suppress cracking and bending of electronic components due to peeling, and to appropriately peel electronic components.

It is a perspective view of the electronic component mounting apparatus which concerns on this embodiment. It is a top view of the electronic component mounting device with the cover removed. It is a perspective view of the push-up device. It is a perspective view of a push-up tool. It is a schematic diagram which shows the positional relationship of a suction nozzle, a die, and a push-up tool. It is a block diagram which shows the control system of the electronic component mounting apparatus. It is an enlarged view of a nozzle holder and a suction nozzle. It is a top view of the state where the elastic member is in contact with a die. It is a flowchart which shows the control content of a mounting operation. It is a schematic diagram which shows the positional relationship of the suction nozzle and the like in the mounting work. It is a schematic diagram which shows the positional relationship of the suction nozzle and the like in the mounting work. It is a schematic diagram which shows the positional relationship of the suction nozzle and the like in the mounting work. It is a schematic diagram which shows the positional relationship of the suction nozzle and the like in the mounting work. It is a top view of the state which the elastic member of another example is in contact with a die.

(Configuration of electronic component mounting device)
Hereinafter, a die feeding device, which is an embodiment of the electronic component peeling device of the present disclosure, will be described with reference to the drawings. FIG. 1 shows a perspective view of an electronic component mounting device 10 including the die feeding device 30 of the present embodiment. FIG. 2 shows a plan view of the electronic component mounting device 10 with the cover 12 removed. As shown in FIGS. 1 and 2, the electronic component mounting device 10 includes a main body 11, a die supply device 30, a liquid agent supply device 26, and an operation device 15. In the following description, the directions shown in FIG. 1 will be used for description. That is, the direction in which the electronic component mounting device 10 conveys the substrate 13 (see FIG. 2) is referred to as the X-axis direction, and the direction horizontal to the plane of the substrate 13 conveyed perpendicular to the X-axis direction is referred to as the Y-axis direction. The direction perpendicular to the X-axis direction and the Y-axis direction is referred to as the Z-axis direction. Further, the left / right, front / rear, and up / down of the electronic component mounting device 10 may be described using the X-axis direction, the Y-axis direction, and the Z-axis direction.

The electronic component mounting device 10 executes the work of mounting the die 92 (see FIG. 2) on the substrate 13. The substrate 13 is, for example, a printed circuit board. The main body 11 has a cover 12, a base 46, a device pallet 70, and the like. The main body 11 has a substantially box shape, and houses the transport device 20, the mounting head moving device 22, the mounting head 24 (see FIG. 2), and the like above the base 46. A storage portion 86 (see FIG. 2) is provided below the front side of the base 46 in the Y-axis direction. The storage unit 86 is a space into which a part of the die supply device 30 is inserted. The cover 12 is attached to a part of the upper surface of the main body 11.

The liquid agent supply device 26 is fixed above the device pallet 70 fixed to the base 46. The die feeding device 30 includes a main frame 100, a wafer accommodating device 102, and the like. A plurality of wafers 90 (see FIG. 2) are housed inside the wafer storage device 102. The wafer 90 is, for example, one that has been diced after the dicing sheet 93 is attached, and a plurality of dies 92 (an example of electronic components) are attached to the dicing sheet 93. The plurality of wafers 90 are housed in the wafer accommodating device 102 with the mounting surface of the die 92 substantially parallel to the X-axis direction and the Y-axis direction. The die supply device 30 takes out one of the plurality of wafers 90 stored in the wafer storage device 102 and sends it out above the main frame 100. The operating device 15 is attached to the front surface of the main body 11 in the Y direction. The operation device 15 has, for example, a display screen for displaying information such as an operating status of the electronic component mounting device 10. Further, the operation device 15 has an operation switch that receives operations and settings necessary for the electronic component mounting device 10.

Further, as shown in FIG. 2, in addition to the above-described configuration, the die supply device 30 includes a pickup head moving device 106, a pickup head 105, a wafer holding frame 118, a die thrusting device 103 (see FIG. 3), and the like. It is held above the main frame 100. The die supply device 30 is a device that picks up the die 92 of the wafer 90 and passes the picked up die 92 to the mounting head 24. The pickup referred to here means, for example, that the die 92 attached to the dicing sheet 93 is sucked by the suction nozzle 142 (see FIG. 5) of the die supply device 30 described later and peeled off from the dicing sheet 93.

The pickup head moving device 106 includes a pair of Y-axis direction guide rails 134 extending in the Y-axis direction, an X-axis direction guide rail 135 extending in the X-axis direction, a clamp 139, and the like. The pair of Y-axis direction guide rails 134 are arranged apart from each other with a predetermined interval provided in the X-axis direction. The X-axis direction guide rail 135 is bridged over a pair of Y-axis direction guide rails 134. The X-axis direction guide rail 135 is guided by a pair of Y-axis direction guide rails 134 and moves to an arbitrary position in the Y-axis direction using an electromagnetic motor (not shown) as a drive source. A slider 138 is attached to the X-axis direction guide rail 135. A pickup head 105 is attached to the slider 138. The slider 138 is configured so that the pickup head 105 can be attached and detached, and different types of pickup heads 105 can be attached. The slider 138 and the pickup head 105 are guided by an X-axis direction guide rail 135 using an electromagnetic motor (not shown) as a drive source, and move to an arbitrary position in the X-axis direction. Therefore, the slider 138 and the pickup head 105 can be moved to arbitrary positions in the Y-axis direction and the X-axis direction by the Y-axis direction guide rail 134 and the X-axis direction guide rail 135.

The pickup head 105 has, for example, a nozzle holder 141 (see FIG. 5), a suction nozzle 142 (see FIG. 5), a nozzle elevating device 105A (see FIG. 6), and a reversing device 105B (see FIG. 6). The nozzle holder 141 has a rod shape and holds the suction nozzle 142 at the tip. As shown in FIG. 5, the suction nozzle 142 has a nozzle body 143 and an elastic member 144. As shown in FIG. 7, the nozzle body 143 has a tubular portion 143A and a lower end portion 143B. The tubular portion 143A has a cylindrical shape extending in the Z-axis direction. The lower end portion 143B is provided at the lower end of the tubular portion 143A.

The lower end portion 143B has a rectangular shape when viewed from above in the Z-axis direction. The lower end portion 143B has a plate shape having a predetermined thickness in the vertical direction. The size of the lower end portion 143B in a plan view is, for example, slightly smaller than the size of the die 92 in a plan view (see FIG. 8). The nozzle body 143 is formed with an intake passage 143D that penetrates the tubular portion 143A and the lower end portion 143B in the Z-axis direction. The intake port 143E, which is the opening at the lower end of the intake passage 143D, is formed substantially in the center of the lower surface of the lower end portion 143B (see FIG. 8).

The elastic member 144 is attached to the lower surface of the lower end portion 143B. The elastic member 144 is made of, for example, rubber. The material of the elastic member 144 is not limited to rubber, and other elastic materials such as urethane may be used. As shown in FIGS. 7 and 8, the elastic member 144 has an annular shape formed along the outer circumference of the rectangular lower end portion 143B. The elastic member 144 has a rectangular frame shape in a plan view. An inner wall 144A surrounding the X-axis direction and the Y-axis direction is formed in the elastic member 144. The intake port 143E is arranged at the center of the elastic member 144 in a plan view. The elastic member 144 comes into contact with the upper surface of the die 92 to form a closed space surrounded by the inner wall 144A, the lower end portion 143B, and the die 92.

Further, the die supply device 30 includes a positive / negative pressure supply device 104 (see FIG. 6) that supplies positive pressure or negative pressure to the suction nozzle 142. The positive / negative pressure supply device 104 supplies, for example, a positive pressure or a negative pressure according to the outside air pressure at the place where the electronic component mounting device 10 is installed to the suction nozzle 142. The suction nozzle 142 is supplied with negative pressure from the positive / negative pressure supply device 104 through the intake passage 143D to create a negative pressure in the space surrounded by the elastic member 144 or the like. As a result, the suction nozzle 142 sucks and holds the die 92 via the elastic member 144. Further, the suction nozzle 142 supplies a slight positive pressure from the positive / negative pressure supply device 104 through the intake passage 143D to make the space surrounded by the elastic member 144 or the like positive pressure. The suction nozzle 142 releases the suction and releases the die 92 held. Further, the nozzle elevating device 105A is a device for elevating and lowering the nozzle holder 141 and the suction nozzle 142 up and down along the Z-axis direction. The reversing device 105B is, for example, a device that rotates the nozzle holder 141 about a rotation axis along the Y-axis direction and flips the nozzle holder 141 and the suction nozzle 142 up and down.

Further, as shown in FIG. 2, the clamp 139 is attached to the front surface of the X-axis direction guide rail 135 of the pickup head moving device 106. The clamp 139 grips the wafer 90 accommodated in the wafer accommodating device 102. The wafer holding frame 118 is arranged on the upper surface of the main frame 100. The clamp 139 grips, for example, the wafer 90 whose upper and lower positions in the Z-axis direction are the same among the plurality of wafers 90 housed in the wafer accommodating device 102. The clamp 139 moves rearward while gripping the wafer 90 as the X-axis direction guide rail 135 moves rearward. When the clamp 139 moves to the position of the wafer holding frame 118, the clamp 139 releases the grip of the wafer 90. The wafer 90 is placed inside the wafer holding frame 118. The die feeding device 30 has a fixing device 107 (see FIG. 6) for fixing the wafer 90. The fixing device 107 fixes the wafer 90 placed inside the wafer holding frame 118. The die thrusting device 103 is arranged below the wafer holding frame 118. The details of the die thrusting device 103 will be described later.

The conveyor device 20 includes conveyor devices 40 and 42. Each of the conveyor devices 40 and 42 is arranged side by side in the Y-axis direction to form a rail along the X-axis direction. Each of the conveyor devices 40 and 42 conveys the substrate 13 in the X-axis direction using an electromagnetic motor (not shown) as a drive source. Further, each of the conveyor devices 40 and 42 is provided with a fixing device (not shown) for fixing the substrate 13 at a predetermined working position.

The mounting head moving device 22 has the same configuration as the pickup head moving device 106. The mounting head moving device 22 has a pair of Y-axis direction guide rails 50 extending in the Y-axis direction, an X-axis direction guide rail 52 extending in the X-axis direction, and the like. The pair of Y-axis direction guide rails 50 are arranged apart from each other with a predetermined interval provided in the X-axis direction. The X-axis direction guide rail 52 is bridged over a pair of Y-axis direction guide rails 50. The X-axis direction guide rail 52 is guided by a pair of Y-axis direction guide rails 50 and moves to an arbitrary position in the Y-axis direction. A slider 54 is attached to the X-axis direction guide rail 52. A mounting head 24 is attached to the slider 54. The slider 54 is configured so that the mounting head 24 can be attached and detached, and different types of mounting heads 24 can be mounted. The slider 54 and the mounting head 24 are guided by the guide rail 52 in the X-axis direction and move to an arbitrary position in the X-axis direction. Therefore, the slider 54 and the mounting head 24 can be moved to arbitrary positions in the Y-axis direction and the X-axis direction by the Y-axis direction guide rail 50 and the X-axis direction guide rail 52. The mounting head 24 includes a nozzle holder (not shown), a suction nozzle, a nozzle elevating device, and the like. The mounting head 24, for example, sucks and holds the die 92 supplied from the pickup head 105 of the die feeding device 30, and executes a work of mounting the die 92 on the substrate 13. The nozzle holder has a rod shape and holds a suction nozzle at the tip. The suction nozzle is supplied with a negative pressure by a positive / negative pressure supply device (not shown) to suck and hold the die 92, and when a slight positive pressure is supplied, the holding die 92 is released.

The liquid agent supply device 26 has a liquid agent tray 74 at the rear end. The liquid agent tray 74 stores the liquid agent. The liquid agent to be stored is, for example, creamy solder, flux, adhesive or the like. A nozzle station 76 is arranged between the transfer device 20 and the device pallet 70. The nozzle station 76 houses a replacement suction nozzle for the mounting head 24.

Next, the die thrusting device 103 will be described with reference to FIGS. 3 to 5. The die projecting device 103 includes a base 151, a pair of Y-axis direction guide rails 152, a Y moving table 153, a pair of X-axis direction guide rails 154, an X moving table 156, a die projecting main body portion 157, and the like. The base 151 is fixed to the main frame 100. The pair of Y-axis direction guide rails 152 are arranged apart from each other with a predetermined interval provided in the X-axis direction. The Y moving table 153 is guided by a pair of Y-axis direction guide rails 152 and moves to an arbitrary position in the Y-axis direction using an electromagnetic motor (not shown) as a drive source. A pair of X-axis direction guide rails 154 are provided on the upper surface of the Y moving table 153. The pair of X-axis direction guide rails 154 are arranged apart from each other with a predetermined interval provided in the Y-axis direction. The X-moving table 156 is guided by a pair of X-axis direction guide rails 154 and moves to an arbitrary position in the X-axis direction using an electromagnetic motor (not shown) as a drive source. The die protrusion main body 157 has a substantially cylindrical shape and is fixed to the X moving table 156. Therefore, the die protrusion main body 157 can be moved to arbitrary positions in the Y-axis direction and the X-axis direction by the Y-axis direction guide rail 152 and the X-axis direction guide rail 154. A push-up tool 158 is attached to the upper part of the die protrusion main body 157.

The push-up tool 158 extends along the Z-axis direction, for example, and has a substantially quadrangular prism shape. The push-up tool 158 is formed with a vent 159 (see FIG. 5) inside. Therefore, the push-up tool 158 has a hollow box shape. As shown in FIG. 8, for example, the upper surface 158A of the push-up tool 158 is formed of a plane having a larger area than the elastic member 144 and the die 92 in a plan view. For example, in the case of a rectangular die 92, the upper surface 158A is formed by a rectangular plane longer than the longitudinal direction of the die 92 in a plan view.

Further, the upper surface 158A of the push-up tool 158 is inclined at a predetermined angle. The upper surface 158A is inclined at a predetermined angle with respect to, for example, the plane of the dicing sheet 93 arranged above the push-up tool 158 (in the present embodiment, the plane along the X-axis direction and the Y-axis direction). As will be described later, the die thrusting device 103 moves the Y moving table 153 and the X moving table 156, and arranges the push-up tool 158 so that the nozzle body 143 and the die 92 are arranged at the center of the upper surface 158A. Then, the push-up tool 158 brings the inclined upper surface 158A into contact with the dicing sheet 93 from below, and pushes up the dicing sheet 93 and the die 92 upward. The suction nozzle 142 sucks the die 92 pushed up by the push-up tool 158 from above, and picks up the die 92. Thereby, the peelability of the die 92 with respect to the dicing sheet 93 can be improved. Therefore, as the inclination angle of the upper surface 158A, for example, it is possible to set a highly peelable angle at which the die 92 can be picked up satisfactorily by performing a pickup test of the die 92 in advance. The criteria for determining a good pickup here are, for example, whether the success rate of the pickup can be increased, the working speed of the pickup can be shortened, or the negative pressure required for the pickup (load of the positive / negative pressure supply device 104) can be reduced. Which standard can be adopted.

Further, a plurality of through holes 161 are formed on the upper surface 158A. The through hole 161 is formed so as to penetrate the upper surface 158A along the Z-axis direction, for example. The through hole 161 has a circular shape in a plan view seen from above in the Z-axis direction, for example. The shape and number of the through holes 161 shown in FIGS. 4 and 5 are examples and can be changed as appropriate. For example, the through hole 161 may be elliptical in a plan view.

The vent 159 of the push-up tool 158 is connected to the positive / negative pressure supply device 104 (see FIG. 6). When the push-up tool 158 is supplied with negative pressure into the vent 159 from the positive / negative pressure supply device 104, the dicing sheet 93 is sucked into the upper surface 158A through the through hole 161. As a result, the dicing sheet 93 and the die 92 can be fixed on the upper surface 158A. Further, when the positive pressure is supplied from the positive / negative pressure supply device 104 into the vent 159, the push-up tool 158 releases the suction to the upper surface 158A of the dicing sheet 93. The positive / negative pressure supply device 104 that supplies the negative pressure to the suction nozzle 142 and the positive / negative pressure supply device 104 that supplies the negative pressure to the push-up tool 158 may be different devices.

(Control configuration of electronic component mounting device 10)
Next, the control configuration of the electronic component mounting device 10 will be described with reference to FIG. As shown in FIG. 6, the electronic component mounting device 10 includes a control device 200 in addition to the above configuration. The control device 200 includes a CPU 201, a RAM 202, a storage device 204, and the like. The storage device 204 is configured by combining, for example, a ROM and a hard disk, and stores various program PGs and data necessary for controlling the electronic component mounting device 10. The control device 200 controls each part of the electronic component mounting device 10 by executing the program PG stored in the storage device 204 by the CPU 201. The respective parts referred to here are the die supply device 30, the transfer device 20, the mounting head moving device 22, the mounting head 24, and the like described above. The RAM 202 is used as a working memory for temporarily storing data such as when the program PG is executed by the CPU 201. In the following description, the control by the control device 200 may be described by the device name. For example, "the conveyor device 40 conveys the substrate 13" means that "the control device 200 executes the program PG in the CPU 201 to control the drive of the conveyor device 40. Thereby, the conveyor device 40 controls the control device 200." The substrate 13 is conveyed based on the control of the above.

(Control of mounting work)
The electronic component mounting device 10 mounts the die 92 on the substrate 13 according to the above configuration. Next, the content of control of the mounting work by the electronic component mounting device 10 will be described. FIG. 9 is a flowchart showing the control contents of the mounting work. The following processing order, processing contents, processing number, and the like described with reference to FIG. 9 are examples. For example, when the power is turned on, the control device 200 reads the program PG from the storage device 204 and starts the system. When the control device 200 receives a control program (so-called recipe) from the management computer of the production line in which the electronic component mounting device 10 is arranged after starting the system, the control device 200 performs mounting work on the substrate 13 based on the received control program. Run. This control program includes, for example, information such as the type of the substrate 13, the number of sheets to be produced, and the mounting position of the die 92.

When the control device 200 starts the mounting work, the conveyor devices 40 and 42 are controlled in step 11 of FIG. 9 (hereinafter, simply referred to as S) 11 to carry in the substrate 13. The conveyor devices 40 and 42 convey the substrate 13 in the X-axis direction to the work position where the mounting work is performed, and fix the substrate 13 at the work position. Further, the die supply device 30 fixes the wafer 90 on the main frame 100 (between the wafer holding frames 118) and supplies the die 92 in accordance with the loading of the substrate 13 based on the control of the control device 200. Make preparations.

Next, the die supply device 30 drives the die projecting device 103 to move the push-up tool 158 below the desired die 92 among the plurality of dies 92 provided on the wafer 90 (S13). The desired die 92 is, for example, a die 92 arranged at a position designated by the above-mentioned control program, and is a die 92 to be mounted on the substrate 13. As shown in FIG. 10, the die supply device 30 pushes the die 92 upward by the push-up tool 158. Further, the die supply device 30 supplies negative pressure from the positive / negative pressure supply device 104 into the vent 159 in accordance with the push-up of the push-up tool 158. The push-up tool 158 pushes up the dicing sheet 93 and the die 92 while sucking the dicing sheet 93 through the through hole 161 (S13). A part of the dicing sheet 93 is pushed up by the push-up tool 158. The die 92 is arranged on the upper surface 158A of the push-up tool 158 via the dicing sheet 93, and is tilted along the upper surface 158A. Further, the die supply device 30 moves the pickup head 105 above the push-up die 92 in accordance with the push-up work by the push-up tool 158. Further, the mounting head moving device 22 moves the mounting head 24 to a supply position where the die 92 is supplied by the pickup head 105 based on the control of the control device 200.

The control device 200 raises the push-up tool 158 to a predetermined push-up position, and when the push-up tool 158 completes pushing up the die 92, the control device 200 controls the pickup head 105 to lower the suction nozzle 142 (S15). The control device 200 may lower the suction nozzle 142 of the pickup head 105 during the push-up by the push-up tool 158. In this case, the working time can be shortened by executing the pushing up and the lowering in parallel. Alternatively, the control device 200 may start the lowering of the suction nozzle 142 first and then raise the push-up tool 158.

As shown in FIG. 11, the pickup head 105 lowers the suction nozzle 142 and brings the elastic member 144 into contact with the upper surface of the die 92 to elastically deform it. The elastic member 144 is sandwiched between the lower end portion 143B (see FIG. 7) of the nozzle body 143 and the die 92 and elastically deformed in the Z-axis direction. In other words, the pickup head 105 of the present embodiment lowers the suction nozzle 142 to a position where the elastic member 144 is elastically deformed by the die 92.

Further, the control device 200 controls the positive / negative pressure supply device 104 to supply the negative pressure from the positive / negative pressure supply device 104 to the suction nozzle 142. The nozzle body 143 of the suction nozzle 142 sucks the die 92 via the elastic member 144 (S17). The timing of supplying the negative pressure from the positive / negative pressure supply device 104 is not particularly limited. For example, the positive / negative pressure supply device 104 may start supplying the negative pressure in accordance with the lowering of the suction nozzle 142 to shorten the working time. Alternatively, the positive / negative pressure supply device 104 may start supplying the negative pressure after the lowering of the suction nozzle 142 is completed.

Next, the control device 200 controls the pickup head 105 to raise the suction nozzle 142 while sucking and holding the die 92 by the suction nozzle 142 (S19). As shown in FIG. 12, the elastic member 144 expands as the suction nozzle 142 rises, and gradually returns to its original shape. Further, the die 92 is gradually peeled off from one end as the suction nozzle 142 rises. For example, as shown in FIG. 12, when the upper surface 158A is inclined upward from the front to the rear, the die 92 is sequentially peeled from the front side (the lower end side of the inclination of the upper surface 158A). In this case, the die 92 is peeled off from the dicing sheet 93 with a straight line along the left-right direction as a boundary portion. Note that FIG. 12 shows the degree of bending of the die 92, etc., larger than the actual angle so that the peeled state can be more easily understood.

Here, in the conventional electronic component peeling device, for example, the die 92 is vertically sandwiched between the convex protruding portion and the suction nozzle 142, and the suction nozzle 142 is oriented in the Z-axis direction (direction orthogonal to the plane of the dicing sheet 93). By raising the die 92, the die 92 was peeled off from the dicing sheet 93. In this case, a load is applied to the die 92 according to the adhesive area of the sticking surface stuck to the dicing sheet 93. That is, the peeling operation is such that the die 92 is peeled off from the dicing sheet 93 on the surface.

On the other hand, in the die supply device 30 of the present embodiment, as shown in FIG. 12, the die 92 is sequentially peeled from the dicing sheet 93 from the lower end (for example, the front end) of the upper surface 158A. Therefore, the die 92 applies the load applied when it is pulled up by the suction nozzle 142 to only one side (one side along the left-right direction) in the inclination direction (front-back direction). That is, a peeling operation such as peeling the die 92 from the dicing sheet 93 with a line can be performed. Thereby, when the die 92 is peeled from the dicing sheet 93, the load applied to the die 92 can be reduced. As a result, cracking and bending of the die 92 due to peeling can be suppressed.

As shown in FIG. 13, the control device 200 raises the suction nozzle 142 to a position where the die 92 is completely peeled off from the dicing sheet 93, and the suction nozzle 142 picks up the die 92 (S19). The control device 200 executes mounting of the die 92 picked up by the suction nozzle 142 (S21). The pickup head 105 drives the reversing device 105B (see FIG. 6) under the control of the control device 200, reverses the nozzle holder 141 and the suction nozzle 142, and supplies the picked-up die 92 to the supply position. The control device 200 controls the mounting head 24 and sucks the die 92 of the suction nozzle 142 by the suction nozzle of the mounting head 24 at the supply position.

The control device 200 controls the mounting head moving device 22 to move the mounting head 24 above the liquid agent tray 74 of the liquid agent supplying device 26, and lowers the suction nozzle (die 92) of the mounting head 24. The mounting head 24 applies a liquid agent to the bumps of the die 92. The control device 200 moves the mounting head 24 to the upper part of the substrate 13 and mounts the die 92 at a desired mounting position by the mounting head 24 (S21).

Further, when the suction nozzle 142 is raised to a position where the die 92 is completely peeled off from the dicing sheet 93, the control device 200 lowers the push-up tool 158 (S21). The push-up tool 158 descends to a position away from the dicing sheet 93. In other words, once the push-up tool 158 rises to the push-up position, the push-up tool 158 maintains the push-up position until the pickup by the suction nozzle 142 is completed.

Therefore, the control device 200 of the present embodiment raises the push-up tool 158 to a push-up position for pushing up the dicing sheet 93 (an example of an adhesive sheet) and the die 92 (an example of an electronic component). The control device 200 pushes the push-up tool 158 into the push-up position (for example, FIGS. 12 and 13) while moving the pickup head 105 (an example of the suction device) in the direction away from the dicing sheet 93 (upward in the present embodiment). Hold in position). According to this, the control device 200 separates the pickup head 105 from the push-up tool 158 (upper surface 158A) in a state where the position of the push-up tool 158 is fixed to the push-up position. As a result, the die 92 can be stably peeled off from the dicing sheet 93 by fixing the push-up tool 158 to the push-up position. The control device 200 may lower the push-up tool 158 in accordance with the rise of the suction nozzle 142 without holding the push-up tool 158 in the push-up position. Further, the control device 200 may start the descent of the push-up tool 158 from the push-up position after raising the suction nozzle 142 to the position shown in FIG. That is, the push-up tool 158 may be started to be lowered after the nozzle body 143 has been raised.

Next, the control device 200 determines whether or not all the dies 92 have been mounted on the substrate 13 (S23). When the control device 200 determines that the mounting work has not been completed (S23: NO), the control device 200 re-executes the work from S13. As a result, the next die 92 mounting work is started. At this time, the die supply device 30 of the present embodiment precedes during the work period of the work of supplying the die 92 to the mounting head 24 by the pickup head 105 and the work of mounting the die 92 on the substrate 13 by the mounting head 24. Then, the push-up work of the next die 92 is started (S13). The transport device 20 controls the die supply device 30 to move the push-up tool 158 below the die 92 to be mounted next, and performs the push-up operation.

Therefore, the control device 200 of the present embodiment starts the push-up work of the die 92 to be pushed up next by the push-up tool 158 during the work period in which the work of supplying the die 92 sucked by the pickup head 105 is being executed (S13). .. According to this, the control device 200 executes the next push-up operation of the die 92 in advance during the work period in which the supply operation of the die 92 is executed by the pickup head 105. As a result, the cycle time required to execute each of the push-up, suction, and supply operations can be shortened.

On the other hand, when the control device 200 determines that all the dies 92 have been mounted on the board 13 (S23: YES), the control device 200 carries out the board 13 for which the mounting work has been completed (S25). For example, a reflow device and a substrate inspection device are arranged on the downstream side of the electronic component mounting device 10 on the production line. The reflow device is, for example, a device that reflows creamy solder and solder-bonds the die 92 to the substrate 13. The substrate inspection device is, for example, an apparatus that captures an image of the substrate 13 with a camera to analyze and inspect the mounting state. The conveyor devices 40 and 42 carry the substrate 13 to such a downstream device. Further, when there is a mounting operation for the next board 13, the control device 200 restarts the process shown in FIG. 9 in accordance with the unloading of the board 13 and executes the loading of the next board 13 (S11).

Here, as described above, the pickup head 105 of the present embodiment forms an annular shape surrounding the intake port 143E for sucking air and the intake port 143E, and forms a closed space by coming into contact with the die 92 and is elastic. It has a deformable elastic member 144. According to this, the pickup head 105 can execute the intake air by the intake port 143E in a state where the elastic member 144 that is elastically deformed is in close contact with the die 92. The pickup head 105 can attract the die 92 by creating a negative pressure in the space inside the elastic member 144.

Further, in the control device 200 of the present embodiment, the suction nozzle 142 of the pickup head 105 is lowered to a position where the elastic member 144 comes into contact with the die 92 and elastically deforms, and the die 92 is sucked by the pickup head 105. According to this, the elastic member 144 comes into contact with the inclined die 92 from above and elastically deforms according to the inclination angle of the die 92. The elastic member 144 contracts more toward the upper end from the lower end of the upper surface 158A (an example of an inclined surface), and is deformed according to the inclination angle of the upper surface 158A. The elastic member 144 expands while sucking the die 92 as the suction nozzle 142 rises. As a result, the die 92 can be appropriately peeled from the dicing sheet 93 in order from the lower end of the upper surface 158A due to the elastic deformation of the elastic member 144.

Incidentally, the die supply device 30 is an example of an electronic component peeling device. The die 92 is an example of an electronic component. The dicing sheet 93 is an example of an adhesive sheet. The upper surface 158A is an example of an inclined surface. The pickup head 105 and the suction nozzle 142 are examples of a suction device. The treatments S13 to S17 are an example of the adsorption step. The treatment of S19 is an example of the peeling step.

As described above, according to the present embodiment described above, the following effects are obtained.
In one aspect of this embodiment, the push-up tool 158 is arranged below the dicing sheet 93 to which the die 92 is attached. The push-up tool 158 is provided with an upper surface 158A having a predetermined angle with respect to the dicing sheet 93. The control device 200 attracts the die 92 pushed up by the push-up tool 158 by the pickup head 105 (see S13, S15, S17, and FIG. 11). The control device 200 separates the die 92 from the dicing sheet 93 by moving the pickup head 105 that has attracted the die 92 in a direction away from the dicing sheet 93 (upward in this embodiment).

According to this, the push-up tool 158 has an upper surface 158A inclined with respect to the dicing sheet 93, and the upper surface 158A pushes up the dicing sheet 93 and the die 92 from below. The dicing sheet 93 and the die 92 are in an inclined state along the upper surface 158A. The suction nozzle 142 sucks the die 92 in an inclined state by the upper surface 158A, and moves upward in the sucked state. By moving the suction nozzle 142 upward, the die 92 is peeled from the dicing sheet 93 in order from the lower end of the upper surface 158A. Thereby, when the die 92 is peeled from the dicing sheet 93, the load applied to the die 92 can be reduced. The die 92 can be appropriately peeled by suppressing cracking and bending of the die 92 due to peeling.

Needless to say, the present disclosure is not limited to the above-described embodiment, and various improvements and changes can be made without departing from the spirit of the present disclosure.
For example, the control device 200 attracts the die 92 pushed up by the push-up tool 158 by the pickup head 105 (S13, S15, S17). However, the control device 200 may first attract the die 92 by the pickup head 105 (S15, S17) and then push up the die 92 by the push-up tool 158 (S13). As a result, the pickup head 105 and the die 92 can be pushed up with the die 92 sandwiched between the upper and lower parts.
Further, the suction nozzle 142 does not have to be provided with the elastic member 144. For example, the suction nozzle 142 may pick up the die 92 by bringing the lower end portion 143B into direct contact with the die 92.
The shapes of the lower end portion 143B and the elastic member 144 described above are examples. For example, as shown in FIG. 14, the elastic member 144 may be formed in an annular shape. Further, the lower end portion 143B may be formed in a disk shape according to the size and shape of the elastic member 144. In the example shown in FIG. 14, the die 92 has a substantially square shape in a plan view. The elastic member 144 is arranged around the intake port 143E and is arranged so as to surround the intake port 143E. The pickup head 105 brings the elastic member 144 into contact with the die 92, for example, with the intake port 143E and the center position of the die 92 aligned.

Here, as shown in FIG. 8, by forming the shape of the elastic member 144 into a rectangle in accordance with the shape of the die 92 in a plan view, when the die 92 shown in FIG. 12 is peeled off from one side, one side is formed. An external force can be applied more evenly to the die 92 along the line. On the other hand, in the configuration shown in FIG. 14, the elastic member 144 is annular and the intake port 143E is arranged in the center of the elastic member 144. As a result, when the air is taken in from the intake port 143E and the negative pressure is supplied into the elastic member 144, the negative pressure (pressure value) in the elastic member 144 can be made more uniform.

Further, in the above embodiment, the elastic member 144 is provided below the nozzle body 143 in order to bring the suction nozzle 142 into close contact with the tilted die 92, but other methods may be used. For example, the suction nozzle 142 may include a floating mechanism that rotates the lower end portion 143B of the nozzle body 143 with respect to the tubular portion 143A. The floating mechanism is, for example, a ball bearing at the lower end of the tubular portion 143A that rotates the lower end portion 143B with respect to the tubular portion 143A about a rotation axis along the X-axis direction. Further, the floating mechanism may include, for example, an urging member (such as a spring) that returns the rotated lower end portion 143B to the original position (for example, a horizontal position). In the suction nozzle 142 having such a configuration, by bringing the lower end portion 143B into contact with the die 92 and rotating the suction nozzle 142, the lower end portion 143B can be rotated according to the inclination angle of the die 92. Then, the suction nozzle 142 can suck the die 92 in close contact with the die 92 in a state where the lower end portion 143B is tilted. The lower end portion 143B returns from the tilted state (rotated state) to the initial position (for example, the horizontal position) by the urging member as the suction nozzle 142 rises. The picked-up die 92 is in a horizontal state. In such a configuration, the elastic member 144 becomes unnecessary. The suction nozzle 142 may be configured to include both the elastic member 144 and the floating mechanism described above.

Further, the control device 200 lowered the suction nozzle 142 to a position where the elastic member 144 was elastically deformed, but stopped the lowering of the suction nozzle 142 at a position where the elastic member 144 and a part of the upper surface of the die 92 came into contact with each other. You may.
Further, the control device 200 started the next push-up operation of the die 92 during the work period in which the die 92 is supplied by the pickup head 105, but it does not have to be started. For example, the control device 200 may start moving the push-up tool 158 after the mounting work of the die 92 on the substrate 13 by the mounting head 24 is completed.

Further, although not particularly mentioned in the above embodiment, the die supply device 30 may include a mechanism for changing the direction of the push-up tool 158. For example, the die feeding device 30 may include a rotating device capable of rotating the push-up tool 158 around a rotating axis along the Z-axis direction.
Further, in the above description, the case where the die supply device 30 is adopted as the electronic component peeling device of the present disclosure has been described, but the present invention is not limited to this. For example, the electronic component mounting device 10 may be configured to directly pick up the die 92 of the wafer 90 by the mounting head 24. For example, the wafer 90 may have a configuration in which the die 92 is arranged with the bump surface facing downward. In this case, the die feeding device 30 does not have to include the pickup head 105. Then, the electronic component mounting device 10 may pick up the die 92 pushed up by the pushing tool 158 by the mounting head 24. In this case, the electronic component mounting device 10 is an example of the electronic component peeling device of the present disclosure. The mounting head 24 is an example of a suction device.

30 Die supply device (electronic component peeling device), 92 die (electronic component), 93 dicing sheet (adhesive sheet), 105 pickup head (adsorption device), 142 suction nozzle (suction device), 143E intake port, 144 elastic member, 158 push-up tool, 158A top surface (inclined surface), 200 control device.

Claims (6)

A push-up tool that is arranged below the pressure-sensitive adhesive sheet to which the electronic component is attached, is provided with an inclined surface having a predetermined angle with respect to the pressure-sensitive adhesive sheet, and pushes up the pressure-sensitive adhesive sheet and the electronic component by the inclined surface.
An adsorption device that adsorbs the electronic components and
The electronic component pushed up by the push-up tool is sucked by the suction device, or the electronic component sucked by the suction device is pushed up by the push-up tool, and then the suction device that sucks the electronic component is adhered. A control device that separates the electronic component from the adhesive sheet by moving it away from the sheet.
Electronic component peeling device equipped with. The adsorption device is
The intake port that takes in air and
An elastic member that forms an annular shape surrounding the intake port, forms a closed space by contacting with the electronic component, and is elastically deformable.
The electronic component peeling device according to claim 1. The control device is
The electronic component peeling device according to claim 2, wherein the suction device is lowered to a position where the elastic member comes into contact with the electronic component and elastically deforms, and the electronic component is sucked by the suction device. The control device is
A method 1 to claim 1, wherein the push-up tool is raised to a push-up position for pushing up the pressure-sensitive adhesive sheet and the electronic component, and the push-up tool is held at the push-up position while the suction device is moved in a direction away from the pressure-sensitive adhesive sheet. The electronic component peeling device according to any one of claims 3. The control device is
Any one of claims 1 to 4, wherein the pushing-up operation of the electronic component to be pushed up next by the pushing tool is started during the work period in which the work of supplying the electronic component sucked by the suction device is being executed. The electronic component stripping device described in the section. A push-up tool that is arranged below the pressure-sensitive adhesive sheet to which the electronic component is attached, is provided with an inclined surface having a predetermined angle with respect to the pressure-sensitive adhesive sheet, and pushes up the pressure-sensitive adhesive sheet and the electronic component by the inclined surface.
An adsorption device that adsorbs the electronic components and
It is a method of peeling an electronic component in an electronic component peeling device provided with.
A suction step in which the electronic component pushed up by the push-up tool is sucked by the suction device, or the electronic component sucked by the suction device is pushed up by the push-up tool.
A peeling step of peeling the electronic component from the pressure-sensitive adhesive sheet by moving the suction device that sucks the electronic component in a direction away from the pressure-sensitive adhesive sheet.
A method of peeling electronic components including.

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