JPH0738286A - Component supplying device - Google Patents

Component supplying device

Info

Publication number
JPH0738286A
JPH0738286A JP5176385A JP17638593A JPH0738286A JP H0738286 A JPH0738286 A JP H0738286A JP 5176385 A JP5176385 A JP 5176385A JP 17638593 A JP17638593 A JP 17638593A JP H0738286 A JPH0738286 A JP H0738286A
Authority
JP
Japan
Prior art keywords
component
tape
magnet
electronic component
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5176385A
Other languages
Japanese (ja)
Other versions
JP3356829B2 (en
Inventor
Shinji Morimoto
眞司 森本
Osamu Okuda
修 奥田
Hiroshi Ota
博 大田
Wataru Hirai
弥 平井
Hideyoshi Matsumura
栄喜 松村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP17638593A priority Critical patent/JP3356829B2/en
Publication of JPH0738286A publication Critical patent/JPH0738286A/en
Application granted granted Critical
Publication of JP3356829B2 publication Critical patent/JP3356829B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To provide a component supplying device achieving a stable supply by preventing electronic components housed in a tape-shaped component assembly from moving even if the component supplying device vibrates due to various kinds of shocks from an electronic component mounting machine. CONSTITUTION:A magnet 13 is provided on the carrier surface of a body part 5 of a parts supply device so that it is located on the reverse side of a tape- shaped component assembly 1 at a component take-out position 6, thus attracting and fixing electronic components 4 by magnetic force.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電子部品をプリント基板
に装着する電子部品装着機などに使用される部品供給装
置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply device used in an electronic component mounting machine for mounting electronic components on a printed circuit board.

【0002】[0002]

【従来の技術】従来、電子部品装着機に電子部品を供給
する部品供給装置は、図7に示すように、テープ状部品
集合体31が巻かれたリール32を保持部33で保持す
るとともに、駆動機構を介しテープ状部品集合体31を
引出して、収納された電子部品34を、本体部35のテ
ープ搬送面に沿って部品取出位置36に送り出し、電子
部品装着機に供給する。
2. Description of the Related Art Conventionally, as shown in FIG. 7, a component supply device for supplying electronic components to an electronic component mounting machine holds a reel 32 around which a tape-shaped component assembly 31 is wound by a holding portion 33, and The tape-shaped component assembly 31 is pulled out through the drive mechanism, and the stored electronic components 34 are sent to the component extraction position 36 along the tape transport surface of the main body 35 and supplied to the electronic component mounting machine.

【0003】ここで、図5に示すように、テープ状部品
集合体31を上面から抑えるテープ押さえ37には、カ
バーテープ38を分離する剥離部40を設けている。そ
して、カバーテープ38は巻取り部39において巻取ら
れる。
Here, as shown in FIG. 5, a peeling section 40 for separating the cover tape 38 is provided in the tape retainer 37 for holding the tape-shaped component assembly 31 from the upper surface. Then, the cover tape 38 is wound up by the winding section 39.

【0004】さらに図6に示すように、テープ押さえ3
7にはシャッタ43が備えられており、図6(a)
(b)のように電子部品吸着時にシャッタ43を開き、
次に、図6(c)(d)のようにテープ状部品集合体3
1が送られる際に、テープ状部品集合体31に収納され
た電子部品34が飛び出さないように、シャッタ先端4
4で電子部品34を上面から抑えながらテープ状部品集
合体31と同期してシャッタ43が動くように構成され
ている。なお、図7における42は電子部品装着機の部
品供給部に部品供給装置を固定するクランパである。
Further, as shown in FIG. 6, the tape holder 3
7 is provided with a shutter 43, as shown in FIG.
As shown in (b), the shutter 43 is opened when the electronic component is picked up,
Next, as shown in FIGS. 6C and 6D, the tape-shaped component assembly 3
In order to prevent the electronic components 34 stored in the tape-shaped component assembly 31 from popping out when 1 is sent, the shutter tip 4
4, the shutter 43 is configured to move in synchronization with the tape-shaped component assembly 31 while suppressing the electronic component 34 from the upper surface. Reference numeral 42 in FIG. 7 is a clamper for fixing the component supply device to the component supply unit of the electronic component mounting machine.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、前記従
来例のような構成では、電子部品吸着時にシャッタ43
が開くため、シャッタ43の動作による振動、あるいは
吸着直前の電子部品装着機などからの部品供給装置への
衝撃による振動などで、テープ状部品集合体31の中で
電子部品34が暴れ、電子部品装着機の電子部品吸着を
不安定にさせる。また、図6(e)のように、シャッタ
先端44が動作する範囲のテープ押さえ37の開口部4
5は電子部品34が暴れないように狭くしているため、
さらに、テープ押さえ37から電子部品34側にシャッ
タ先端44がはみ出ても電子部品供給に悪影響をおよぼ
すために、動作するシャッタ43の部品精度やテープ押
さえ37との組立て精度が厳しいなどの課題があった。
However, in the structure as in the above-mentioned conventional example, the shutter 43 is held at the time of picking up electronic components.
The electronic component 34 in the tape-shaped component assembly 31 violates due to vibration caused by the operation of the shutter 43, or vibration caused by a shock from the electronic component mounting machine or the like to the component supply device immediately before suctioning. Makes the electronic parts adsorption of the mounting machine unstable. Further, as shown in FIG. 6E, the opening 4 of the tape retainer 37 in the range in which the shutter tip 44 operates.
Since 5 is made narrow so that the electronic component 34 does not run away,
Further, even if the shutter tip 44 protrudes from the tape retainer 37 to the electronic component 34 side, it adversely affects the supply of electronic components, and thus there are problems such as the precision of the components of the shutter 43 that operates and the precision of assembly with the tape retainer 37 being severe. It was

【0006】本発明は、このような課題を解決すること
のできる部品供給装置を提供せんとするものである。
The present invention aims to provide a component supply device which can solve such problems.

【0007】[0007]

【課題を解決するための手段】この課題を解決するため
に本発明は、マグネットを、部品取出位置での、あるい
はカバーテープを分離する剥離位置から前記部品取出位
置までのテープ状部品集合体の裏側に位置するように、
部品供給装置の本体部の搬送面に備えたものである。
In order to solve this problem, the present invention provides a tape-shaped component assembly in which a magnet is provided at a component removal position or from a peeling position for separating a cover tape to the component removal position. So that it is located on the back side,
This is provided on the carrying surface of the main body of the component supply device.

【0008】また、前記マグネットを、前記部品取出位
置に設けられた第一のマグネットと、前記部品取出位置
以前に設けられた第二のマグネットとに分割配置し、前
記電子部品装着機からの駆動力を受取り、前記第一のマ
グネットを本体部の搬送面から離す機構を備えたもので
ある。
Further, the magnet is divided into a first magnet provided at the component taking-out position and a second magnet provided before the component taking-out position, and driven from the electronic component mounting machine. A mechanism for receiving a force and separating the first magnet from the transport surface of the main body is provided.

【0009】[0009]

【作用】この課題解決手段による作用は次のようにな
る。部品取出位置でのテープ状部品集合体の裏側に位置
するように、マグネットを部品供給装置の本体部の搬送
面に備えることにより、電子部品を磁力により吸引固定
しているために、部品吸着時にシャッタが開いても種々
の振動に対して、電子部品の暴れを防止することとな
る。
The operation of this means for solving problems is as follows. A magnet is provided on the transfer surface of the main body of the component supply device so that it is located on the back side of the tape-shaped component assembly at the component extraction position, so that electronic components are attracted and fixed by magnetic force. Even if the shutter is opened, it is possible to prevent the electronic parts from being violent against various vibrations.

【0010】また、前記マグネットを、カバーテープを
分離する剥離位置から部品取出位置までのテープ状部品
集合体の裏側に位置するように本体部の搬送面に備えれ
ば、カバーテープが電子部品を上面から抑えていない範
囲で、電子部品を磁力により前記本体部側に吸引してい
るため、テープ状部品集合体送り時にシャッタがなくと
も電子部品の飛び出しも防止でき、部品精度、組立て精
度の厳しいシャッタが省略でき、部品供給装置としても
構造簡略化が可能となる。
If the magnet is provided on the conveying surface of the main body so as to be located on the back side of the tape-shaped component assembly from the peeling position for separating the cover tape to the component unloading position, the cover tape can store electronic components. Since electronic parts are attracted to the main body side by magnetic force within the range not restrained from the top surface, the electronic parts can be prevented from jumping out even when there is no shutter when the tape-shaped parts assembly is fed, and the parts accuracy and assembly accuracy are severe. The shutter can be omitted, and the structure of the component supply device can be simplified.

【0011】さらに、マグネットを、部品取出位置に設
けられた第一のマグネットと、部品取出位置以前に設け
られた第二のマグネットとに分割配置し、電子部品装着
機の吸着ノズルが部品取出位置上の電子部品に当接した
直後に、電子部品装着機から駆動力を与え、第一のマグ
ネットを前記本体部の搬送面から離す構成、および、取
り出し方式とすることで、電子部品の吸着がさらに容易
となる。
Further, the magnet is divided into a first magnet provided at the component taking-out position and a second magnet provided before the component taking-out position, and the suction nozzle of the electronic component mounting machine is placed at the component taking-out position. Immediately after contacting the upper electronic component, a driving force is applied from the electronic component mounting machine to separate the first magnet from the conveying surface of the main body, and by adopting the take-out method, the electronic component is attracted. It will be even easier.

【0012】[0012]

【実施例】以下、本発明の一実施例を図面に基づき説明
する。図1が本実施例の部品供給装置である。図示のよ
うに電子部品4を基材テープに所定間隔に収納し、か
つ、電子部品4の上面にカバーテープ8を有するテープ
状部品集合体1が巻回されたリール2を保持部3で保持
するとともに、電子部品装着機からの駆動力により、駆
動機構を介してテープ状部品集合体1を所定ピッチずつ
引出して、収納された電子部品4を本体部5のテープ搬
送面に沿って所定の部品取出位置6に送り出し、電子部
品装着機に供給する。ここで、テープ状部品集合体1を
上面から抑えるテープ押さえ7には、カバーテープ8を
分離する剥離部10を設けている。そして、カバーテー
プ8は巻取り部9で巻取られる。図中の12は電子部品
装着機の部品供給部に部品供給装置を固定するクランパ
である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a component supply device of this embodiment. As shown in the drawing, the electronic component 4 is housed in the base tape at a predetermined interval, and the reel 2 around which the tape-shaped component assembly 1 having the cover tape 8 on the upper surface of the electronic component 4 is wound is held by the holding portion 3. At the same time, the tape-shaped component assembly 1 is pulled out by a predetermined pitch via the drive mechanism by the driving force from the electronic component mounting machine, and the stored electronic components 4 are moved along the tape transport surface of the main body portion 5 in a predetermined manner. It is sent to the component take-out position 6 and supplied to the electronic component mounting machine. Here, the tape retainer 7 that holds the tape-shaped component assembly 1 from the upper surface is provided with a peeling portion 10 that separates the cover tape 8. Then, the cover tape 8 is wound by the winding section 9. Reference numeral 12 in the figure denotes a clamper for fixing the component supply device to the component supply unit of the electronic component mounting machine.

【0013】これらの構成は前述の従来例と同じ構成で
ある。本実施例の特徴とするところは、本体部5のテー
プ搬送面にマグネット13を設けたことにある。図2は
その要部拡大図を示し、マグネット13は、カバーテー
プ8の剥離部10から部品取出位置6までの範囲で、す
なわち、テープ状部品集合体1の電子部品4が上面から
カバーテープ8で抑えられていない範囲に位置し、電子
部品4を吸引している。このため電子部品装着機が吸着
するまで、種々の振動があっても電子部品4は暴れたり
しない。さらに、シャッタが電子部品4を抑えていなく
とも、テープ状部品集合体1の送り時にも電子部品4が
飛び出たりしないのである。
These configurations are the same as the above-mentioned conventional example. A feature of this embodiment is that the magnet 13 is provided on the tape transport surface of the main body 5. FIG. 2 shows an enlarged view of an essential part of the magnet 13, and the magnet 13 is in the range from the peeling portion 10 of the cover tape 8 to the component take-out position 6, that is, the electronic component 4 of the tape-shaped component assembly 1 is from the upper surface to the cover tape 8. It is located in a range that is not suppressed by and sucks the electronic component 4. Therefore, the electronic component 4 does not violate even if various vibrations occur until the electronic component mounting machine picks it up. Further, even if the shutter does not hold down the electronic component 4, the electronic component 4 does not jump out even when the tape-shaped component assembly 1 is fed.

【0014】図3は本発明の他の実施例の部品供給装置
の要部拡大図である。図3において、11は部品取出位
置6に配置された第一のマグネット、14は部品取出位
置6位前に配置された第二のマグネットであり、前記第
一のマグネット11にはレバー15が連結されている。
さらに、本体部5にはピン18によりL状の駆動レバー
17が回動自在に設けられ、レバー15と駆動レバー1
7とは連結部16で回動可能に連結されている。そし
て、駆動レバー17に電子部品装着機からの駆動力が加
われば、第一のマグネット11が本体部5の搬送面から
離れる構成となっている。なお図中の19は前記駆動力
が解除されたときの第一のマグネット11を復帰させる
スプリング、20は第一のマグネット11の初期位置を
決めるストッパピン、21は吸着ノズルである。
FIG. 3 is an enlarged view of the essential parts of a component supply device according to another embodiment of the present invention. In FIG. 3, 11 is a first magnet arranged at the component taking-out position 6, 14 is a second magnet arranged 6th before the component taking-out position, and a lever 15 is connected to the first magnet 11. Has been done.
Further, an L-shaped drive lever 17 is rotatably provided on the main body portion 5 by a pin 18, and the lever 15 and the drive lever 1 are
7 is rotatably connected to the connecting portion 16. When the driving force from the electronic component mounting machine is applied to the drive lever 17, the first magnet 11 is separated from the carrying surface of the main body 5. In the figure, 19 is a spring for returning the first magnet 11 when the driving force is released, 20 is a stopper pin for determining the initial position of the first magnet 11, and 21 is an adsorption nozzle.

【0015】つぎに図3および図4で、本実施例の部品
供給装置を用いた電子部品取り出し方法について説明す
る。ここで、電子部品装着機の吸着ノズル21が、部品
供給装置の部品取出位置6に搬送された電子部品4に当
接したときに、電子部品装着機が駆動レバー17に駆動
力を与えると、連結部16、レバー15を介して、部品
取出位置6にある電子部品4を磁力により吸引していた
第一のマグネット11を、図4のように電子部品4から
離すことによりマグネット11の吸引力を解き、吸着ノ
ズル21は電子部品4を取り出しできる。
Next, referring to FIG. 3 and FIG. 4, a method for taking out electronic components using the component supply apparatus of this embodiment will be described. Here, when the suction nozzle 21 of the electronic component mounting machine abuts the electronic component 4 conveyed to the component taking-out position 6 of the component supply device, when the electronic component mounting machine applies a driving force to the drive lever 17, As shown in FIG. 4, the first magnet 11 that has attracted the electronic component 4 at the component extraction position 6 by magnetic force via the connecting portion 16 and the lever 15 is separated from the electronic component 4 as shown in FIG. Then, the suction nozzle 21 can take out the electronic component 4.

【0016】[0016]

【発明の効果】以上の実施例の説明より明らかなよう
に、本発明は部品取出位置でのテープ状部品集合体の裏
側に位置するように、マグネットを部品供給装置の本体
部の搬送面に備えたことにより、電子部品が磁力により
吸引固定され、部品吸着時にシャッタが開いても、種々
の振動に対して電子部品の暴れを防止できるので、電子
部品装着機への安定供給が実現できる。
As is apparent from the above description of the embodiments, the present invention places the magnet on the conveying surface of the main body of the component supply device so that it is located on the back side of the tape-shaped component assembly at the component extraction position. Since the electronic components are magnetically attracted and fixed by the magnetic force, and even if the shutter is opened when the components are attracted, it is possible to prevent the electronic components from violating against various vibrations, so that stable supply to the electronic component mounting machine can be realized.

【0017】また、マグネットを、カバーテープを分離
する剥離位置から部品取出位置までのテープ状部品集合
体の裏側に位置するように本体部の搬送面に備えれば、
カバーテープが電子部品を上面から抑えていない範囲で
前記電子部品を磁力により本体部側に吸引しているた
め、テープ状部品集合体送り時にシャッタがなくとも前
記電子部品の飛び出しも防止できるので、部品精度、組
立て精度の厳しいシャッタが省略でき、部品供給装置と
しても構造簡略化が可能となるのである。
Further, if the magnet is provided on the conveying surface of the main body so as to be located on the back side of the tape-shaped component assembly from the peeling position for separating the cover tape to the component removal position,
Since the cover tape attracts the electronic component to the main body side by magnetic force in a range where the electronic component is not suppressed from the upper surface, it is possible to prevent the electronic component from jumping out even without a shutter when feeding the tape-shaped component assembly. It is possible to omit a shutter having strict component precision and assembly precision, and it is possible to simplify the structure of the component supply device.

【0018】さらに、マグネットを、部品取出位置に設
けられた第一のマグネットと、部品取出位置以前に設け
られた第二のマグネットとに分割配置し、電子部品装着
機の吸着ノズルが部品取出位置上の電子部品に当接した
直後に、電子部品装着機から駆動力を与え、前記第一の
マグネットを本体部の搬送面から離す構成、および、取
り出し方式とすることで、電子部品の吸着がさらに容易
となるのである。
Further, the magnet is divided into a first magnet provided at the component take-out position and a second magnet provided before the component take-out position, and the suction nozzle of the electronic component mounting machine is placed at the component take-out position. Immediately after contacting the upper electronic component, a driving force is applied from the electronic component mounting machine to separate the first magnet from the conveying surface of the main body, and the extraction method is adopted, so that the electronic component can be attracted. It will be even easier.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の部品供給装置の斜視図FIG. 1 is a perspective view of a component supply device according to an embodiment of the present invention.

【図2】(a)は同要部を拡大した上面図 (b)は同断側面図FIG. 2 (a) is an enlarged top view of the relevant part, and FIG. 2 (b) is a side view of the same.

【図3】本発明の他の実施例の部品供給装置の要部を拡
大した断側面図
FIG. 3 is an enlarged sectional side view of a main part of a component supply device according to another embodiment of the present invention.

【図4】図3の部品供給装置の作用を示す断側面図FIG. 4 is a sectional side view showing the operation of the component supply apparatus of FIG.

【図5】従来例の部品供給装置の要部を拡大した断側面
FIG. 5 is a sectional side view showing an enlarged main part of a conventional component supply device.

【図6】(a)は従来例の部品供給装置のシャッタ部の
上面図 (b)は同断側面図 (c)は同上面図 (d)は同断側面図 (e)は同横断面図
FIG. 6A is a top view of a shutter portion of a conventional component supply device, FIG. 6B is a side view of the same, and FIG. 6C is a top view of the same, and FIG. 6D is a side view of the same.

【図7】従来例の部品供給装置の斜視図FIG. 7 is a perspective view of a conventional component supply device.

【符号の説明】 1 テープ状部品集合体 2 リール 3 保持部 4 電子部品 5 本体部 6 部品取出位置 7 テープ押さえ 8 カバーテープ 9 巻取り部 10 剥離部 13 マグネット[Explanation of reference numerals] 1 tape-like component assembly 2 reel 3 holding portion 4 electronic component 5 main body portion 6 component extraction position 7 tape retainer 8 cover tape 9 winding portion 10 peeling portion 13 magnet

───────────────────────────────────────────────────── フロントページの続き (72)発明者 平井 弥 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 松村 栄喜 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ya Hirai 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Eiki Matsumura, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 電子部品を基材テープに所定間隔に収納
し、かつ前記電子部品の上面にカバーテープを有するテ
ープ状部品集合体を保持する保持部と、前記保持部から
前記テープ状部品集合体を引き出し、所定ピッチずつ部
品取出位置に断続搬送する駆動部と、前記テープ状部品
集合体の搬送時に上面から抑え、かつ前記部品取出位置
より前で前記テープ状部品集合体から前記カバーテープ
を分離する剥離機構を備えたテープ押さえと、前記カバ
ーテープを巻取る巻取り部と、前記テープ状部品集合体
を搬送する面を有する本体部と、電子部品装着機の部品
供給部への位置決め固定部とを備えた部品供給装置であ
って、前記部品取出位置の前記テープ状部品集合体の裏
側に位置するように、前記本体部の搬送面にマグネット
を設けたことを特徴とする部品供給装置。
1. A holding part for housing electronic parts in a base tape at predetermined intervals and holding a tape-shaped part assembly having a cover tape on the upper surface of the electronic part, and the tape-shaped part assembly from the holding part. A drive unit that pulls out the body and intermittently conveys the tape-shaped component assembly at a predetermined pitch to the tape-shaped component assembly, and holds the cover tape from the tape-shaped component assembly before the component removal position. A tape retainer having a separating mechanism for separating, a winding section for winding the cover tape, a main body section having a surface for conveying the tape-shaped component assembly, and positioning and fixing to a component supply unit of an electronic component mounting machine. And a magnet provided on the carrying surface of the main body so as to be located on the back side of the tape-shaped component assembly at the component removal position. Parts supply device.
【請求項2】 マグネットを、カバーテープを分離する
剥離位置から部品取出位置まで設けたことを特徴とする
請求項1に記載の部品供給装置。
2. The component supply device according to claim 1, wherein a magnet is provided from a peeling position for separating the cover tape to a component taking-out position.
【請求項3】 本体部に回動自在に設けられ、電子部品
装着機からの駆動力を受取る駆動レバーと、前記駆動レ
バーの駆動力と反発させるスプリングと、前記駆動レバ
ーと連結し、搬送面と反対側に設けたレバーと、前記レ
バーに結合したマグネットを備え、駆動レバーが電子部
品装着機からの駆動力を受けた際に、前記マグネットを
前記搬送面から離すように構成したことを特徴とする請
求項1または2に記載の部品供給装置。
3. A conveying surface, which is rotatably provided on the main body and receives a driving force from an electronic component mounting machine, a spring for repelling the driving force of the driving lever, and the driving lever, And a magnet coupled to the lever, the magnet being separated from the transport surface when the driving lever receives a driving force from the electronic component mounting machine. The component supply device according to claim 1 or 2.
【請求項4】 マグネットを、部品取出位置に設けられ
た第一のマグネットと、カバーテープを分離する剥離位
置から部品取出位置直前までに設けられた第二のマグネ
ットとに分割配置し、電子部品装着機からの駆動力を受
けた際に、第一のマグネットを前記搬送面から離すこと
を特徴とする請求項2または3に記載の部品供給装置。
4. An electronic component, wherein a magnet is divided into a first magnet provided at a component taking-out position and a second magnet provided from a peeling position at which a cover tape is separated to immediately before a component taking-out position. The component supply device according to claim 2 or 3, wherein the first magnet is separated from the transport surface when a driving force from the mounting machine is received.
【請求項5】 電子部品装着機の電子部品を吸着する吸
着ノズルが、部品取出位置上の前記電子部品に当接した
直後に、駆動レバーに駆動力を与え、マグネットを搬送
面から離れさせることを特徴とする請求項3に記載の部
品供給装置。
5. Immediately after the suction nozzle for sucking the electronic component of the electronic component mounting machine contacts the electronic component on the component take-out position, a driving force is applied to the drive lever to separate the magnet from the conveying surface. The component supply device according to claim 3.
JP17638593A 1993-07-16 1993-07-16 Component supply device and component supply method Expired - Fee Related JP3356829B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17638593A JP3356829B2 (en) 1993-07-16 1993-07-16 Component supply device and component supply method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17638593A JP3356829B2 (en) 1993-07-16 1993-07-16 Component supply device and component supply method

Publications (2)

Publication Number Publication Date
JPH0738286A true JPH0738286A (en) 1995-02-07
JP3356829B2 JP3356829B2 (en) 2002-12-16

Family

ID=16012726

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3356829B2 (en)

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JPH10163684A (en) * 1996-12-02 1998-06-19 Taiyo Yuden Co Ltd Parts supply device
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WO2002003771A1 (en) * 2000-06-30 2002-01-10 Matsushita Electric Industrial Co., Ltd. Part feeder
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US7131478B2 (en) 2000-06-30 2006-11-07 Matsushita Electric Industrial Co., Ltd. Component supply system
JP2003121369A (en) * 2001-08-09 2003-04-23 Matsushita Electric Ind Co Ltd Polarity-inspecting method for chip-type electronic component
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JP2009212194A (en) * 2008-03-03 2009-09-17 Panasonic Corp Tape feeder
JP2009212193A (en) * 2008-03-03 2009-09-17 Panasonic Corp Tape feeder
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