JPH0344437B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component lead wire cutting device for automatically inserting electronic component lead wires continuously supplied into lead wire insertion holes of a printed circuit board. It is something.

Conventional technology Conventionally, in this type of automatic insertion device,
In order to improve the productivity of printed circuit boards on which electronic components are mounted, it is necessary to insert the lead wires of the electronic components into the lead wire holes of the printed circuit board without error and quickly.

In conventional devices, a guide pin is provided that penetrates the lead wire hole of the printed circuit board from the side opposite to the side where the electronic component is inserted, and the guide pin guides the lead wire of the electronic component into the lead wire insertion hole of the printed circuit board. It is used to guide and insert electronic components.

In devices with this type of configuration, the mechanism for guiding electronic component lead wires to the lead wire insertion holes of the printed circuit board does not come into direct contact with the surface of the printed circuit board, which improves the mounting density of electronic components on the printed circuit board. can be done.

Hereinafter, a conventional automatic insertion machine for electronic components as described above will be described with reference to the drawings.

As shown in FIG. 6, in the radial type taping component 2, two lead wires 11 aligned in the same direction of an electronic component 10 are held at a constant interval by a mount tape 8 and an adhesive tape 9. ing.
In the figure, 1 is a feed hole provided by punching out the backing tape 8 and the adhesive tape 9, and the taping component 2 is fitted with a convex portion (not shown) of the feed mechanism of the insertion device into the feed hole 1, and It can be fed at any time by driving the feeding mechanism. Then, as shown in FIG.
The lead wire 11 is cut by a flat cutter 13 having an L-shaped tip 12 that slides in the direction, and a lead cutter 14 arranged horizontally and sliding in the D direction. Further, the backing tape 8 of the taped electronic component 2 and the adhesive tape (not shown) are cut by the flat cutter 13 and the tape cutter 15 which is arranged horizontally and slides in the E direction. Inside the flat cutter 13, a cylinder 16,
A piston 17 and a compression spring 18 are incorporated,
When air is supplied from the air inlet 19 of the flat cutter 13, the piston 17 slides so as to compress the compression spring 18, and the rod 20, which is provided integrally with the piston 17, protrudes from the cutting surface of the flat cutter 13 and becomes a base. When the paper tape 8 is held down and the air supply is cut off, the piston 17 is moved by the elastic force of the compression spring 18.
Slide in the opposite direction, and the rod 20 touches the flat cutter 13.
It is configured to be drawn in from the cut surface of the
The lead wire 11 of the taping component 2, the backing tape 8, and the adhesive tape 9, which are intermittently fed to this cutting surface, are cut at the same time. An example of the electronic component 10 after cutting is shown in FIGS. 8a to 8c.

The electronic component 10 with the lead wire 11 cut to a predetermined length is held in the insertion chuck 21 as shown in FIGS.
1 is inserted into the guide hole 23 of the lead wire guide plate 22. The lead wire guide plate 22 is composed of a set of two pieces, as shown in FIGS. 10 and 11, and can be combined or separated as necessary. When the two lead wire guide plates 22 are combined, a guide hole 23 is formed which is constricted at the center and widened at both ends. In this way, guide hole 2
3 is constricted at the center but widened at both ends, so the lead wire 11 can be easily inserted into the guide hole 23 even if the position of the lead wire 11 is slightly shifted. A printed circuit board 25 supported by a board guide 24 is located below the lead wire guide plate 22, and a guide pin 28 provided on a guide block 27 is inserted from below into the lead wire insertion hole 26 of the printed circuit board 25. Ru. Then, the tip of the guide pin 28 is inserted into the guide hole 23 of the lead wire guide plate 22 from the lower hole, and the first
As shown in Figure 3, the lead wire 11 and guide pin 2
8 at the center of the guide hole 23 of the lead wire guide plate 22. A recess 29 that is equal to or larger in diameter than the lead wire 11 is provided at the tip of the guide pin 28 .
inserted into. When the lead wire 11 is inserted into the recess 29, the lead wire guide plate 22 is disassembled to divide the guide hole 23 as shown in FIG. 11, and the electronic component 10 is pushed downward by the push rod 30. , the insertion chuck 21 is also separated from the electronic component 10. Therefore, the electronic component 10 moves downward while being held by the guide pin 28 and the push rod 30, and the lead wire 11 is inserted into the lead wire insertion hole 26 of the printed circuit board 25, and the insertion work is completed.

Problems to be Solved by the Invention However, when using such a taping component insertion method, a recess 29 into which the tip of the lead wire 11 is fitted is provided at the tip of the guide pin 28 so that the lead wire 11 does not separate from the guide pin 28. Therefore, it is necessary to set the outer diameter of the guide pin 28 to the lead wire 1.
1, the lead wire insertion hole 26 of the printed circuit board 25 through which the guide pin 28 is passed is considerably larger than the outside diameter of the lead wire 11. 2
6, there was a problem in that a large gap was created and soldering defects were likely to occur. Furthermore, since the lead wire insertion hole 26 becomes larger, the conductive pattern around it also needs to be larger, resulting in a problem that the mounting density of the printed circuit board 25 is reduced.

In view of the above-mentioned drawbacks, the present invention cuts the tip of the lead wire of an electronic component into a sharp shape at a predetermined position, thereby ensuring that the tip of the lead wire fits into the small recess provided at the tip of the guide pin. An object of the present invention is to provide a lead wire cutting device for an electronic component that can cut the lead wire in a manner that allows the lead wire to be cut in such a manner that the guide pin itself can be thinned accordingly, and can solve the above-mentioned problems.

Means for Solving the Problems In order to achieve this object, the electronic component lead wire cutting device of the present invention has a mechanism for feeding out the electronic component fixed to the taping member, and a main body side of the lead wire of the predetermined electronic component. a lead wire holder equipped with a lead guide plate for correcting the electronic component to a predetermined position; a tape cutting section for cutting a taping member for fixing the electronic component; and a tape cutting section for correcting the taping member side of the electronic component lead wire to a predetermined position. and a lead wire cutting section that cuts the tip of the lead wire of the electronic component held at the predetermined position into a tapered shape using a conical cutting cutter.

Effect With this configuration, even if the electronic component is fixed to the taping member at a slight deviation from the predetermined position, the lead wire is corrected to the predetermined position and then cut, so the tip of the lead wire is always attached to the electronic component. It can be cut into a tapered shape so as to fit accurately into the recess at the upper end of the guide pin of the automatic insertion device.

In addition, by tapering the tip of the lead wire, the guide pin can be made thinner for automatic insertion of electronic components (see Figure 13), and the insertion hole can also be made smaller, thereby reducing the conductivity around it. The pattern is also smaller, allowing high-density mounting of electronic components on printed circuit boards.

Embodiment An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing the entire lead wire cutting device for electronic components in one embodiment of the present invention. In Fig. 1, a convex part (not shown) of the feeding mechanism of the radial type taping part feeding mechanism is inserted into the feeding hole 1 of the taping part.
It can be fed at any time by fitting it in and driving the feeding mechanism. Then, the electronic component 10 of the sent taping component 2 is shifted from the predetermined position to the position shown by the solid line in FIG. The lead wire 11 is held by moving the object to a predetermined position indicated by a broken line with the lead wire 11 in between. Next, the taping member of the electronic component is cut as shown in FIG. 3 by the tape cutter 4 sliding in the direction of arrow A and the tape cutter 5 sliding in the direction of arrow B by an external force such as an air cylinder.
Next, the taping member side of the lead wire 11 is held between the lead wire guide plates 6 and moved to a predetermined position shown by the solid line in FIG.
As shown in FIG. 5, the tip of the lead wire is cut into a tapered shape.

In other words, even if the electronic component 10 is misaligned with respect to the taping member due to a load applied during transportation, the top and bottom of the chucking portion of the lead wire 11 are held by the lead wire guide plates 3 and 6 to ensure proper lead. The feature is that the wire 11 is straightened so that it can be cut. In particular, the guide pin of the automatic electronic component insertion device is made thinner, and the tip of the lead wire 11 is cut with the conical cutting cutter 7 so that the sharp end of the lead wire 11 is securely fitted into the recess at the tip. You will be able to do that.

The configuration of this conical cutting cutter 7 may be the same as that disclosed in Japanese Patent Application Laid-Open No. 59-227200, which was previously filed by the applicant of the present invention.
Further, other configurations may be used, and generally known configurations can be used.

Effects of the Invention As described above, the electronic component lead wire cutting device of the present invention is a device that cuts the tip of the lead wire of a radially taped electronic component into a tapered shape, and the electronic component is fixed when it is deviated from the predetermined position of the taping member. Even if the electronic component is cut, the electronic component can be cut with a pointed tip by correcting the position so that it will always fit into the recess of the guide pin of the automatic electronic component insertion device, and the electronic component will always be held in the same position after cutting. Therefore, when automatically inserting electronic components, it is extremely advantageous when inserting the lead wire into the insertion hole of a printed circuit board because the sharp end of the lead wire can be fed into a predetermined position. It can be made smaller and has a great practical effect in high-density mounting on printed circuit boards.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an example of a lead wire cutting device for electronic components according to an embodiment of the present invention; FIG.
3, 4, and 5 are partially cutaway front views showing the process in which the lead wire of a radial taping component is cut by the electronic component lead wire cutting device shown in FIG. The figure is a perspective view of a general radial taping part, Figure 7 is a partially cutaway perspective view of a conventionally used lead wire cutting device for electronic components, and Figure 8
Figures a to c are front views of electronic components cut by the electronic component lead wire cutting device shown in Figure 7, and Figure 9 is a partial cross-sectional view of a conventional electronic component automatic insertion device. FIGS. 10 and 11 are perspective views showing the operation of a conventional automatic insertion device for electronic components, respectively, and FIG. 12 is a perspective view showing the operation of the automatic insertion device for electronic components shown in FIG. FIG. 13 is a partially cutaway front view showing a state in which the lead wires are in contact with each other, and FIG. 13 shows a state in which the lead wires of an electronic component cut by the electronic component lead wire cutting device shown in FIG. It is a partially cutaway front view shown. 1... Sprocket hole, 2... Taping parts, 3...
Lead wire guide plate, 4... Tape cutter, 5...
Tape cutter, 6... Lead wire guide plate, 7...
Conical cutting cutter, 8... Mounting tape, 9... Adhesive tape, 10... Electronic component, 11... Lead wire, 12... Protruding piece, 13... Flat cutter, 14...
...Lead cutter, 15...Tape cutter, 1
6...Cylinder, 17...Piston, 18...Compression spring, 19...Air inlet, 20...Rod, 2
1...Insertion chuck, 22...Lead wire guide plate,
23... Guide hole, 24... Board guide, 25...
Printed circuit board, 26...Lead wire insertion hole, 27...
...Guide block, 28...Guide pin, 29...
...Recess, 30...Push rod.

Claims (1)

[Claims] 1. A mechanism for feeding out a taping member to which a plurality of electronic components are attached at regular intervals, a lead wire holding section equipped with a lead wire guide plate for correcting the main body side of the electronic component lead wire to a predetermined position, and the above-mentioned A tape cutting section that cuts the taping member that fixes the electronic component, a lead wire guide plate that straightens the taping member side of the lead wire of the electronic component to a predetermined position, and the electronic component that is held in the predetermined position by the conical cutting cutter. A lead wire cutting device for electronic components that has a lead wire cutting section that cuts the tip of the lead wire of the component into a tapered shape.