JP2017152592A - Splicing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a splicing method capable of supplying components while preventing damage of a peeling blade of component exposing means in a partially peeling tape feeder.SOLUTION: A splicing tape T is adhesively attached and connected to only the surfaces of a tail portion of a preceding mounted carrier tape and a subsequent new carrier tape which confront a tape running path 21, thereby forming a splicing portion, and the width dimension B1 of the splicing tape T and the width dimension B2 of a recess portion 20c are set so that the width dimension B1 of the attached splicing tape T is smaller than the width dimension B2 of the recess portion 20c provided on a tape receiving face 20b of the tape running path 21 under a state where a part of the carrier tape 14 at the splicing portion is exposed by component exposing means 26 and located at a component suction position 5a.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a splicing method for connecting a carrier tape holding a component in a component supply device used in a component mounting apparatus.

  The tape feeder pitches a carrier tape holding a component to supply the component to a component suction position by a mounting head of a component mounting mechanism. In such a tape feeder, as a method of continuing to supply components without stopping the mounting operation, a new carrier tape (following tape) is added at the end of the preceding mounted carrier tape (leading tape). Tape splicing connected by a splicing tape is used.

  In this tape splicing method, an operator needs to perform complicated work every time the supply reel is replaced, and it has been desired to reduce these work loads. For this reason, a tape feeder of the so-called auto-loading method is used so that the carrier tape is automatically loaded and pitch-feeded only by setting the subsequent tape on the tape feeder without performing the tape splicing operation as a tape replenishment method. (For example, refer to Patent Document 1).

  Further, the carrier tape has a configuration in which a base tape that accommodates components is covered with a cover tape, and it is necessary to peel the cover tape to expose the components while being pitch-fed to the component suction position. The prior art disclosed in Patent Document 1 includes a component exposure means having a peeling blade, and a part of the cover tape is peeled from the carrier tape that is pitch-fed by inserting the peeling blade between the base tape and the cover tape. And the parts are exposed.

JP 2011-2111169 A

  However, it is not envisaged that a carrier tape that has been subjected to tape splicing is put into a partially peelable tape feeder in the prior art including Patent Document 1. For this reason, when the carrier tape spliced into the partly peelable tape feeder is erroneously introduced, there is a problem that the splicing tape may damage the peeling blade of the component exposing means.

  Accordingly, the present invention provides a splicing method capable of supplying components while preventing breakage of the peeling blade of the component exposing means in a partially peelable tape feeder.

  In the splicing method of the present invention, a component exposing means for exposing the component by peeling a part of the cover tape of the carrier tape that contains the component and covered with the cover tape, and sends the carrier tape to the component suction position In a component supply device comprising a tape running path, the last part of the preceding mounted carrier tape and the subsequent new carrier tape are connected by adhering the splicing tape only to the surface facing the tape running path. A splicing method, wherein the splicing tape is arranged so that a width of the splicing tape is smaller than a width of a recess provided in a tape receiving surface for receiving the carrier tape in the vicinity of a component suction position of the tape running path. Adhere to carrier tape.

  In the splicing method of the present invention, a component exposing means for exposing the component by peeling a part of the cover tape of the carrier tape that contains the component and covered with the cover tape, and sends the carrier tape to the component suction position A splicing method for connecting a tail portion of a previously installed carrier tape and a subsequent new carrier tape by adhering a splicing tape to a surface facing the tape running path in a component supply device including a tape running path The splicing tape is applied to the carrier tape so that the width of the splicing tape is smaller than the width of the recess provided on the tape receiving surface for receiving the carrier tape in the vicinity of the component adsorption position of the tape running path. Affixed to the surface facing the tape running path Serial In addition to splicing tape, stuck by adding splicing tape to a part of the opposite surface of the confronting surfaces.

  ADVANTAGE OF THE INVENTION According to this invention, the splicing method which can supply components can be provided, preventing damage to the peeling blade of a component exposure means in a partially peeling type tape feeder.

The top view of the component mounting apparatus with which the component supply apparatus of one embodiment of this invention is used The fragmentary sectional view of the component mounting apparatus with which the component supply apparatus of one embodiment of this invention is used Structure explanatory drawing of the components supply apparatus of one embodiment of this invention Explanatory drawing of the structure of the carrier tape used for the components supply apparatus of one embodiment of this invention, cover tape peeling, and splicing Explanatory drawing of the splicing method in the component supply apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, with reference to FIG. 1 and FIG. 2, the structure and function of the component mounting apparatus 1 in which the component supply apparatus (tape feeder) of this Embodiment is used are demonstrated. The component mounting apparatus 1 has a function of mounting a component such as a semiconductor chip on a substrate, and FIG. 2 partially shows an AA cross section in FIG. In the following description, the component supply device is described as a tape feeder.

  In FIG. 1, a substrate transport mechanism 2 is disposed in the center of the base 1a in the X direction (substrate transport direction). The board transport mechanism 2 transports the board 3 carried in from the upstream side, and positions and holds the board 3 on a mounting stage set for executing a component mounting operation. Component supply units 4 are arranged on both sides of the board transport mechanism 2, and a plurality of tape feeders 5 are mounted in parallel on each component supply unit 4. The tape feeder 5 pitches the carrier tape containing the components in the tape feeding direction, that is, the direction from the outside of the component supply unit 4 toward the substrate transport mechanism 2, so that the component by the mounting head of the component mounting mechanism described below Supply parts to the suction position.

  A Y-axis moving beam 7 provided with a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a, and the Y-axis moving beam 7 is similarly provided with a linear drive mechanism. Two X-axis moving beams 8 are coupled so as to be movable in the Y direction. A mounting head 9 is mounted on each of the two X-axis moving beams 8 so as to be movable in the X direction. The mounting head 9 is a multiple-type head having a plurality of holding heads. At the lower end of each holding head, as shown in FIG. Is installed.

  By driving the Y-axis moving beam 7 and the X-axis moving beam 8, the mounting head 9 moves in the X direction and the Y direction. As a result, the two mounting heads 9 mount the substrate 3 positioned on the substrate transport mechanism 2 by picking up and holding the component by the suction nozzle 9 a from the component suction position of the tape feeder 5 of the corresponding component supply unit 4. Mount on the point. The Y-axis moving beam 7, the X-axis moving beam 8, and the mounting head 9 constitute a component mounting mechanism 10 that moves and mounts the component on the substrate 3 by moving the mounting head 9 that holds the component.

  A component recognition camera 6 is disposed between the component supply unit 4 and the board transport mechanism 2. When the mounting head 9 that has taken out a component from the component supply unit 4 moves above the component recognition camera 6, the component recognition camera 6 captures and recognizes the component held by the mounting head 9. Mounted on the mounting head 9 are substrate recognition cameras 11 that are positioned on the lower surface side of the X-axis moving beam 8 and move together with the mounting head 9. As the mounting head 9 moves, the substrate recognition camera 11 moves above the substrate 3 positioned by the substrate transport mechanism 2 and images and recognizes the substrate 3. In the component mounting operation on the substrate 3 by the mounting head 9, the mounting position correction is performed in consideration of the component recognition result by the component recognition camera 6 and the substrate recognition result by the substrate recognition camera 11.

  As shown in FIG. 2, a carriage 12 in which a plurality of tape feeders 5 are mounted in advance on a feeder base 12 a is set in the component supply unit 4. The position of the carriage 12 is fixed in the component supply unit 4 by clamping the feeder base 12a to a fixed base provided on the base 1a. The carriage 12 holds a supply reel 13 for storing a carrier tape 14 holding components in a wound state. The carrier tape 14 drawn out from the supply reel 13 is pitch-fed by the tape feeder 5 to the component suction position 5a by the suction nozzle 9a.

  Next, the configuration and function of the tape feeder 5 will be described with reference to FIG. In FIG. 3, an attachment locking portion 20 a extending to the lower surface side is provided at an upstream end portion of the main body frame 20. When setting the tape feeder 5 to the carriage 12, the mounting locking portion 20a is engaged with the end portion of the feeder base 12a. Thereby, the tape feeder 5 is mechanically fixed to the carriage 12 and electrically connected thereto.

  The main body frame 20 is provided with a tape running path 21 that communicates from a tape inlet 21a opened at an upstream end (left side in FIG. 3) to a downstream end. The tape running path 21 guides and sends the carrier tape 14 that is fed from the supply reel 13 and introduced from the tape introduction port 21a to the component suction position 5a. The tape detection sensor 23 detects the carrier tape 14 in the tape running path 21.

  As shown in FIG. 4A, the carrier tape 14 mainly includes a base tape 14a in which component pockets 14b for storing components P to be supplied are provided at a predetermined pitch. In the base tape 14a, sprocket holes 14c are formed at a predetermined pitch to engage with the sprocket feed claws for feeding the carrier tape 14 to the tape. Further, a cover tape 14d is attached to cover the component pocket 14b in a range where the component pocket 14b is provided on the upper surface of the base tape 14a. That is, the carrier tape 14 has a configuration in which the component P is accommodated and covered with the cover tape 14d.

  In the process of supplying the carrier tape 14 to the component suction position 5a by the tape feeder 5, the cover tape 14d is peeled from the base tape 14a to expose the component P so that the component P can be taken out from the component pocket 14b. Cover tape peeling is performed by the component exposure means 26 described below.

  A sprocket drive mechanism 22 having sprockets 23A and 23B arranged in series is arranged on the downstream side of the tape running path 21. Feed claws (not shown) are formed on the outer periphery of the sprockets 23A and 23B at a constant pitch, and the drive of the sprockets 23A and 23B is controlled by the feeder control board 24. A control operation by the feeder control board 24 is performed according to an operation input from an operation panel 25 disposed on the upper surface of the main body frame 20. The sprocket drive mechanism section 22 intermittently rotates the sprockets 23A and 23B with the sprocket holes 14c of the carrier tape 14 meshing with the feed claws formed at a constant pitch on the outer circumferences of the sprockets 23A and 23B. 14 is pitch-fed to the component suction position 5a.

  On the upper surface of the tape running path 21 in the vicinity of the upstream side of the component suction position 5a, component exposure means 26 having a peeling blade 27 is mounted. The component exposing means 26 has a function of exposing the component P by peeling a part of the cover tape 14d. The component exposing means 26 has a structure in which a peeling blade 27 is mounted on a gate-shaped cross-section member whose lower surface is opened with a posture in which the cutting edge is directed in the tape feeding direction on the upper surface of the carrier tape 14 (BB in FIG. 2). FIG. 5 showing a cross section). As shown in FIG. 4 (b), the carrier tape 14 sent along the tape running path 21 (arrow a) passes through the peeling blade 27 in a predetermined posture, so that the cover tape is covered by the cutting edge of the peeling blade 27. Part of 14d is peeled off.

  That is, the cutting edge of the peeling blade 27 is in a position where the adhesive interface between the cover tape 14d and the base tape 14a can be peeled on the upper surface of the carrier tape 14, and the carrier tape 14 is fed to the downstream side, whereby the cover tape 14d Of these, the area covering the component pocket 14b is partially peeled off and is folded on the base tape 14a. As a result, the component P in the component pocket 14b is exposed, and the component can be taken out at the component suction position 5a.

  The mounting of the carrier tape 14 in the tape feeder 5 is performed by feeding the carrier tape 14 inserted from the tape inlet 21a to the component exposure means 26 on the downstream side by manual operation. Then, a part of the cover tape 14d is peeled off and folded by the peeling blade 27 disposed in the component exposing means 26, so that the component P stored in the component pocket 14b is exposed in the take-out opening 26a, and the mounting head The component P is taken out by the nine suction nozzles 9a.

  In the process of continuously taking out the component P, if the previous mounted carrier tape 14 (1) is out of components, the end of the carrier tape 14 (1) and a new carrier tape 14 (2 The splicing operation is performed to connect the top part of the) with the tape (see the splicing part S shown in FIG. 3).

  In this splicing operation, as shown in FIG. 4C, the carrier tape 14 is in a state in which the end of the already mounted carrier tape 14 (1) and the beginning of the new carrier tape 14 (2) are abutted. A splicing tape T having a predetermined length is adhered to the lower surface 14e (the surface opposite to the surface to which the cover tape 14d is adhered). As a result, the already-mounted carrier tape 14 (1) and the new carrier tape 14 (2) are integrally connected, and additional replenishment of the carrier tape 14 is performed.

  In the splicing work in the tape feeder 5 shown in the present embodiment, the splicing tape T is attached only to the lower surface 14e of the carrier tape 14, that is, the surface facing the tape receiving surface 20b constituting the tape running path 21. Thus, the already mounted carrier tape 14 (1) and the new carrier tape 14 (2) are connected.

  Further, the width dimension B1 and the recess 20c of the splicing tape T are set so that the width dimension B1 of the splicing tape T to be used is narrower than the width dimension B2 of the recess 20c provided on the tape receiving surface 20b constituting the tape running path 21. The width dimension B2 is preset. That is, the splicing tape T is set so that the width of the splicing tape T is smaller than the width of the recess 20c provided in the tape receiving surface 20b that receives the carrier tape 14 in the vicinity of the component suction position 5a of the tape running path 21. Is attached to the carrier tape 14.

  FIG. 5A shows a cross section taken along the line BB in FIG. 2, that is, a cross section in the vicinity of the component suction position 5 a of the tape running path 21. As shown in FIG. 5A, a recess 20c having a width dimension B2 is formed on the tape receiving surface 20b for receiving the carrier tape 14 in the vicinity of the component suction position 5a. In the splicing operation, as described above, the surface (the lower surface 14e) that faces the tape running path 21 between the trailing end of the previously mounted carrier tape 14 (1) and the subsequent new carrier tape 14 (2). Connection is made by attaching the splicing tape T only to.

  FIG. 5B shows the carrier tape 14 in which the splicing tape T is adhered to the lower surface 14e of the base tape 14a in this way to form the splicing portion S, that is, 14 (1) of the preceding already mounted carrier tape. The carrier tape 14 in which the splicing tape T is pasted and connected only to the lower surface 14e facing the tape traveling path 21 is connected to the tail portion of the carrier tape 14 (2) and the subsequent carrier tape 14 (2) by the component exposing means 26. A state is shown in which a part is exposed and located in the vicinity of the component suction position 5a.

  In this state, since the splicing tape T is stuck only on the surface (the lower surface 14e) facing the tape running path 21, the peeling operation of peeling a part of the cover tape 14d by the peeling blade 27 is hindered. There is no. Therefore, problems such as breakage of the cutting edge of the peeling blade 27 due to accidental peeling of the splicing tape T by the peeling blade 27 do not occur.

  Further, as described above, the width dimension B1 of the splicing tape T and the width dimension B2 of the recess 20c are set so that the width dimension B1 of the splicing tape T is narrower than the width dimension B2 of the recess 20c provided on the tape receiving surface 20b. Therefore, the splicing tape T is accommodated in the recess 20c in a state where the splicing portion S is located in the vicinity of the component suction position 5a. Therefore, the carrier tape 14 is stably received by the tape receiving surface 20b on the tape receiving surface 20b regardless of the presence of the splicing tape T on the lower surface 14e.

  In the above-described example, the surface on which the splicing tape T is adhered to the base tape 14a is shown as being limited to the lower surface 14e facing the tape receiving surface 20b of the tape running path 21, but an additional surface is provided on the opposite surface of the lower surface 14e. If a tape adhering space can be secured, a splicing tape may be partially added to the opposite surface of the lower surface 14e. That is, as shown in FIG. 5 (c), the peeling operation of the cover tape 14d by the part of the upper surface 14f that is the opposite surface of the lower surface 14e to which the splicing tape T located in the recess 20c is attached, that is, the peeling blade 27 is performed. A splicing tape T * is added and adhered to the uninhibited part.

  In the example shown here, an example is shown in which the splicing tape T * is added and attached to the portion of the base tape 14a where the cover tape 14d is not attached. Thus, the splicing part S with more stable connection strength can be formed by adding and adhering the splicing tape T * to the surface opposite to the surface on which the splicing tape T is adhered.

  As described above, in the tape feeder 5 and the splicing method shown in the present embodiment, the trailing portion of the preceding mounted carrier tape 14 (1) and the subsequent new carrier tape 14 (2) are used for tape running. A splicing tape T is attached and connected only to the surface facing the path 21 to form a splicing portion S. The splicing portion S is a component in which a part of the carrier tape 14 is exposed by the component exposing means 26. The splicing tape T so that the width dimension B1 of the adhered splicing tape T is narrower than the width dimension B2 of the recess 20c provided in the tape receiving surface 20b of the tape running path 21 in the state of being located at the suction position 5a. The width dimension B1 and the width dimension B2 of the recess 20c are set.

  Thereby, in the partially peelable tape feeder 5 having the component exposing means 26 having the peeling blade 27, a component supply device and a splicing method capable of supplying the component P while preventing the breakage of the peeling blade 27 are realized. .

  The splicing method of the present invention has an effect that it is possible to provide a splicing method capable of supplying components while preventing damage to the peeling blade of the component exposure means in a partially peelable tape feeder. It is useful in the technical field where parts are supplied by a carrier tape that is housed and covered with a cover tape.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 4 Component supply part 5 Tape feeder 14 Carrier tape 14c Sprocket hole 14d Cover tape 20 Main body frame 20b Tape receiving surface 20c Recess 21 Tape traveling path 26 Component exposure means 27 Peeling blade T Splicing tape P Component

Claims (2)

A component comprising component exposing means for exposing the component by peeling a part of the cover tape of the carrier tape covered with the cover tape and containing the component, and a tape running path for sending the carrier tape to the component suction position In the supply device, a splicing method of connecting the last part of the preceding carrier tape and the subsequent new carrier tape by attaching the splicing tape only to the surface facing the tape traveling path,
The splicing tape is attached to the carrier tape so that the width of the splicing tape is smaller than the width of the recess provided on the tape receiving surface that receives the carrier tape in the vicinity of the component suction position of the tape running path. , Splicing method. A component comprising component exposing means for exposing the component by peeling a part of the cover tape of the carrier tape covered with the cover tape and containing the component, and a tape running path for sending the carrier tape to the component suction position In the supply device, a splicing method for connecting the last part of the preceding carrier tape and the subsequent new carrier tape by attaching the splicing tape to the surface facing the tape traveling path,
Affixing the splicing tape to the carrier tape so that the width of the splicing tape is smaller than the width of the recess provided in the tape receiving surface for receiving the carrier tape in the vicinity of the component adsorption position of the tape running path,
Furthermore, in addition to the splicing tape that is attached to the surface facing the tape running path, a splicing tape is additionally attached to a part of the surface opposite to the facing surface.

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