JPH0219269A - Electronic part collecting apparatus - Google Patents
Electronic part collecting apparatusInfo
- Publication number
- JPH0219269A JPH0219269A JP63161636A JP16163688A JPH0219269A JP H0219269 A JPH0219269 A JP H0219269A JP 63161636 A JP63161636 A JP 63161636A JP 16163688 A JP16163688 A JP 16163688A JP H0219269 A JPH0219269 A JP H0219269A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- chip
- band portion
- electronic component
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 230000005611 electricity Effects 0.000 abstract description 5
- 230000003068 static effect Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000000926 separation method Methods 0.000 abstract 2
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000004377 microelectronic Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品の供給、特にリードレスタイプの微小
電子部品の装着装置等への供給に適し現型、子部品集合
引に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the supply of electronic components, particularly to the gathering and pulling of current and sub-components suitable for supplying leadless type microelectronic components to a mounting device.
従来の技術
従来、第１１図〜第１３図に示すリードレスタイプの微
小電子部品（以下チップ部品という）の集合体において
、１は帯状長尺部（以下テープという）で、このテープ
１はチップ部品３をすきまを側壁との間にもたせて案内
収納できる収納穴１′が等間隔に配されておシ、かつテ
ープ１の収納穴１′を被覆するように両側にはテープ２
およびテープ２′が該テープ１を挟み込み熱圧着あるい
は機械的結合によシ固定されている。チップ部品３は上
記収納穴１′に１個づつ案内収納される状態にて、テー
プ１とテープ２，２／に沿って等間隔に積載されている
。2. Description of the Related Art Conventionally, in an assembly of leadless type microelectronic components (hereinafter referred to as chip components) shown in FIGS. Storage holes 1' for guiding and storing parts 3 with gaps between them and the side walls are arranged at equal intervals, and tapes 2 are provided on both sides so as to cover the storage holes 1' of tape 1.
A tape 2' is sandwiched between the tape 1 and fixed by thermocompression bonding or mechanical bonding. The chip components 3 are stacked at equal intervals along the tape 1 and the tapes 2, 2/, with each chip component 3 being guided and stored one by one in the storage hole 1'.
発明が解決しようとする課題
しかしながら上記のような構造では、チップ部品３を取
り出す為にテープ２か２′を剥離しなければならず、ま
た剥離時に静電気が起こり、チップ部品３の不良になっ
たり、剥離機構が複雑化する問題を有していた。Problems to be Solved by the Invention However, with the above structure, the tape 2 or 2' must be peeled off in order to take out the chip component 3, and static electricity may occur during peeling, resulting in the chip component 3 being defective. However, there was a problem in that the peeling mechanism became complicated.
課題を解決するための手段
上記課題を解決するため、本発明は、複数個の収納穴を
等間隔に有する第１の帯状長尺部と、この第１の帯状長
尺部の片側の面にあって前記収納穴の開口部を被覆可能
な第２の帯状長尺部からな電子部品を第２の帯状長尺部
の片面全体の接着剤にて固定してなるものである。Means for Solving the Problems In order to solve the above problems, the present invention provides a first belt-like elongate portion having a plurality of storage holes at equal intervals, and a first belt-like elongate portion on one side of the first belt-like elongate portion. The electronic component is made of a second elongated band portion that can cover the opening of the storage hole, and is fixed with an adhesive on the entire one side of the second elongated band portion.
作 用
本発明は上記構成により、被覆テープの削除及び剥離時
に発生する静電気を防ぐことができ、チップ部品の品質
の向上及び、コストダウンを提供するものである。Function The present invention, with the above configuration, can prevent static electricity generated when removing and peeling off the covering tape, thereby improving the quality of chip components and reducing costs.
実施例
以下、本発明を実施例にもとづき、図面とともに説明す
る。第１図〜第４図は本発明の一実施例に係るチップ部
品の集合体であシ、図においてテープ１にはチップ部品
３をすきまを側壁との間にもたせており、かつテープ１
の収納穴１′とチップ部品３を片側からテープ２の接着
剤５で固定されている。チップ部品３は上記収納穴１′
に１個づつ案内収納される状態にて、テープ１とテープ
２に沿って等間隔に積載されている。またテープ１およ
び２にはチップ部品３の積載に対応して送り穴４が設け
られている。EXAMPLES Hereinafter, the present invention will be explained based on examples and with drawings. 1 to 4 show an assembly of chip components according to an embodiment of the present invention. In the figures, a tape 1 has a chip component 3 with a gap between it and the side wall, and the tape 1 has a gap between it and the side wall.
The storage hole 1' and the chip component 3 are fixed from one side with the adhesive 5 of the tape 2. The chip component 3 is placed in the storage hole 1'
They are stacked at equal intervals along tape 1 and tape 2, with the tapes being guided and stored one by one. Further, the tapes 1 and 2 are provided with feed holes 4 corresponding to the stacking of chip components 3.
この構造によると、テープ１および２を巻き取れば部品
収納面積を大きく必要とせず、また等間隔に設けた送り
穴４を利用してチップ部品３を多数個連続して確実に送
ることが可能であり、チップ部品３の外部への装着に際
しては第３図のテープ２もしくは２′の剥離作業が削除
され、剥離時に発生する静電気を防ぐ事により、チップ
部品３の品質向上及びコストダウンになシ、電子部品の
連続安定供給を可能にする電子部品集合体として有益な
ものである。According to this structure, if the tapes 1 and 2 are wound up, a large component storage area is not required, and a large number of chip components 3 can be reliably fed in succession by using the equally spaced feeding holes 4. Therefore, when attaching the chip component 3 to the outside, the work of peeling off the tape 2 or 2' shown in FIG. Furthermore, it is useful as an electronic component assembly that enables continuous and stable supply of electronic components.
つぎに、本発明の他の実施例について第６図〜第１０図
により説明する。この実施例において、チップ部品３′
およびｔの電極６およびＣが接着剤５′およびｄ′に付
着することを防ぐ為に接着面に逃げを設けている。この
構造によると、チップ部品３′およびｔの電極の曲がり
や電極への接着剤の付着による品質の低下を防ぐことが
でき、電子部品の連続安定供給を可能にする電子部品集
合体として有益なものである。Next, other embodiments of the present invention will be described with reference to FIGS. 6 to 10. In this embodiment, the chip component 3'
In order to prevent the electrodes 6 and C of and t from adhering to the adhesives 5' and d', a relief is provided on the adhesive surface. According to this structure, it is possible to prevent quality deterioration due to bending of the electrodes of chip parts 3' and t and adhesion of adhesive to the electrodes, and it is useful as an electronic component assembly that enables continuous and stable supply of electronic components. It is something.
発明の効果
以上のように、本発明によれば、チップ部品およびテー
プが、接着剤により固定される為にチップ部品取出時の
テープ剥離作業の削除、および剥離の静電気を防ぐ事に
よシ、チップ部品の品質向上及びコストダウンを提供す
るものである。Effects of the Invention As described above, according to the present invention, since the chip components and the tape are fixed with adhesive, it is possible to eliminate the tape peeling operation when taking out the chip components, and to prevent static electricity during peeling. This improves the quality of chip parts and reduces costs.
第１図は本発明の一実施例における電子部品集合体の平
面図、第２図は同断面図、第３図は接着剤が全面に付着
している同断面図、第４図は同斜視図、第５図は他の実
施例におけるテープの断面図、第６図はテープの接着剤
付着を示すテープの平面図、第７図はチップ部品の平面
図、第８図は他の実施例におけるテープの断面図、第９
図はテープの接着剤付着を示すテープの平面図、第１Ｑ
図はチップ部品の平面図、第１１図は従来例である電子
部品集合体の平面図、第１２図は同断面図、第１３図は
同斜視図である。
１・・・・・・帯状長尺部、１′・・・・・・収納穴、
２．２′・・・・・・帯状長尺部、３．３’、３’・・
・・・・チップ部品、４・・・・・・送シ案内手段、ｓ
、ｅｉ’、６ｆ！・・・・・・接着剤。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名耘
ポFig. 1 is a plan view of an electronic component assembly according to an embodiment of the present invention, Fig. 2 is a sectional view of the same, Fig. 3 is a sectional view of the same with adhesive attached to the entire surface, and Fig. 4 is a perspective view of the same. 5 is a cross-sectional view of the tape in another embodiment, FIG. 6 is a plan view of the tape showing adhesive adhesion to the tape, FIG. 7 is a plan view of the chip component, and FIG. 8 is another embodiment. 9th cross-sectional view of the tape in
The figure is a plan view of the tape showing adhesive adhesion to the tape, 1st Q.
11 is a plan view of a conventional electronic component assembly, FIG. 12 is a sectional view thereof, and FIG. 13 is a perspective view thereof. 1...Band-like long part, 1'...Storage hole,
2.2'...band-like long part, 3.3', 3'...
...Chip parts, 4...Feeding guide means, s
,ei',6f! ······glue. Name of agent: Patent attorney Toshio Nakao and one other person
Claims (4)
部と、この第１の帯状長尺部の片側の面にあって前記収
納穴の開口部を被覆可能な第２の帯状長尺部からなり、
前記収納穴の側壁との間にすき間を持たせて電子部品を
載置するよう構成し、第１の帯状長尺部と電子部品を第
２の帯状長尺部の片面全体の接着剤にて固定してなる電
子部品集合体。(1) A first strip-shaped elongated portion having a plurality of storage holes at equal intervals, and a second strip-shaped elongated portion that is located on one side of the first strip-shaped elongated portion and can cover the openings of the storage holes. Consists of a long belt-like part,
The electronic component is placed with a gap between it and the side wall of the storage hole, and the first elongated band portion and the electronic component are bonded together with adhesive on the entire one side of the second elongated band portion. An assembly of fixed electronic parts.
の片面両端の接着剤と、収納穴に対応する個所の接着剤
にて固定してなる特許請求の範囲第１項記載の電子部品
集合体。(2) Claim 1, in which the first elongated band portion and the electronic component are fixed with an adhesive on one side and both ends of the second elongated band portion, and an adhesive at a location corresponding to the storage hole. An assembly of electronic parts as described in Section 1.
の片面の両端部と中央部を接着剤にて固定してなる特許
請求の範囲第１項記載の電子部品集合体。(3) An electronic component assembly according to claim 1, wherein the first elongated band portion and the electronic component are fixed to both ends and the central portion of one side of the second elongated band portion using an adhesive. body.
か一方に機械送り可能な送り案内手段を設けた特許請求
の範囲第１項記載の電子部品集合体。(4) The electronic component assembly according to claim 1, wherein one of the first elongated band portion and the second elongated band portion is provided with a feed guide means that can be mechanically fed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161636A JP2913644B2 (en) | 1988-06-29 | 1988-06-29 | Electronic component assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161636A JP2913644B2 (en) | 1988-06-29 | 1988-06-29 | Electronic component assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0219269A true JPH0219269A (en) | 1990-01-23 |
| JP2913644B2 JP2913644B2 (en) | 1999-06-28 |
Family
ID=15738956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63161636A Expired - Lifetime JP2913644B2 (en) | 1988-06-29 | 1988-06-29 | Electronic component assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2913644B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0299770U (en) * | 1988-07-05 | 1990-08-08 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018020794A (en) * | 2016-08-02 | 2018-02-08 | 信越ポリマー株式会社 | Punch tape |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54126574U (en) * | 1978-02-24 | 1979-09-04 | ||
| JPS57157199U (en) * | 1981-03-30 | 1982-10-02 | ||
| JPS60109393U (en) * | 1983-12-27 | 1985-07-25 | 富士通株式会社 | carrier tape |
-
1988
- 1988-06-29 JP JP63161636A patent/JP2913644B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54126574U (en) * | 1978-02-24 | 1979-09-04 | ||
| JPS57157199U (en) * | 1981-03-30 | 1982-10-02 | ||
| JPS60109393U (en) * | 1983-12-27 | 1985-07-25 | 富士通株式会社 | carrier tape |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0299770U (en) * | 1988-07-05 | 1990-08-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2913644B2 (en) | 1999-06-28 |
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