JP2913644B2 - Electronic component assembly - Google Patents
Electronic component assemblyInfo
- Publication number
- JP2913644B2 JP2913644B2 JP63161636A JP16163688A JP2913644B2 JP 2913644 B2 JP2913644 B2 JP 2913644B2 JP 63161636 A JP63161636 A JP 63161636A JP 16163688 A JP16163688 A JP 16163688A JP 2913644 B2 JP2913644 B2 JP 2913644B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adhesive
- tape
- strip
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電子部品の供給、特にリードレスタイプの微
小電子部品の装着装置等への供給に適し現電子部品集合
引に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a supply of electronic components, and more particularly to a current electronic component assembly suitable for supplying leadless type microelectronic components to a mounting device or the like.
従来の技術 従来、第11図〜第13図に示すリードレスタイプの微小
電子部品（以下チップ部品という）の集合体において、
１は帯状長尺部（以下テープという）で、このテープ１
はチップ部品３をすきまを側壁との間にもたせて案内収
納できる収納穴１′が等間隔に配されており、かつテー
プ１の収納穴１′を被覆するように両側にはテープ２お
よびテープ２′が該テープ１を挟み込み熱圧着あるいは
機械的結合により固定されている。チップ部品３は上記
収納穴１′に１個づつ案内収納される状態にて、テープ
１とテープ2,2′に沿って等間隔に積載されている。2. Description of the Related Art Conventionally, in an assembly of leadless type microelectronic components (hereinafter referred to as chip components) shown in FIGS. 11 to 13,
Reference numeral 1 denotes a long strip (hereinafter referred to as a tape).
Are provided at regular intervals with storage holes 1 'for guiding and storing the chip components 3 with a gap between the side walls and the tape 2 and tape 2 on both sides so as to cover the storage holes 1' of the tape 1. 2 'is sandwiched between the tapes 1 and fixed by thermocompression bonding or mechanical bonding. The chip components 3 are stacked at equal intervals along the tape 1 and the tapes 2, 2 'in a state of being guided and stored one by one in the storage hole 1'.
発明が解決しようとする課題 しかしながら上記のような構造では、チップ部品３を
取り出す為にテープ２か２′を剥離しなければならず、
また剥離時に静電気が起こり、チップ部品３の不良にな
ったり、剥離機構が複雑化する問題を有していた。However, in the above-described structure, the tape 2 or 2 ′ must be peeled in order to remove the chip component 3.
In addition, static electricity is generated at the time of peeling, which causes a problem that the chip component 3 becomes defective and a peeling mechanism becomes complicated.
課題を解決するための手段 上記課題を解決するため、本発明は、電子部品を収納
する複数個の収納穴を有する第１の帯状長尺部と、前記
第１の帯状長尺部の片側の面にあって前記収納穴の開口
部を被覆可能な第２の帯状長尺部とからなり、前記収納
穴の側壁との間に隙間を持たせて電子部品を載置するよ
うに構成し、前記第１の帯状長尺部を第２の帯状長尺部
の片面両端の接着剤で固定するとともに、前記収納穴に
収納する電子部品の電極を除いた前記第２の帯状長尺部
の接着剤にて電子部品を固定するものである。Means for Solving the Problems In order to solve the above problems, the present invention provides a first strip-shaped long portion having a plurality of storage holes for storing electronic components, and a first strip-shaped long portion on one side of the first strip-shaped long portion. A second strip-shaped elongate portion that is on a surface and can cover the opening of the storage hole, and is configured to mount an electronic component with a gap between the second band-shaped elongated portion and a side wall of the storage hole, The first strip-shaped long portion is fixed with an adhesive on both ends of one surface of the second strip-shaped long portion, and the second strip-shaped long portion excluding the electrodes of the electronic components housed in the storage holes is bonded. An electronic component is fixed with an agent.
作用 本発明は上記構成により、被覆テープの削除及び剥離
時に発生する静電気を防ぐことができ、チップ部品の品
質の向上及び、コストダウンを提供するものである。Action The present invention can prevent static electricity generated when the covering tape is removed and peeled off by the above configuration, and provide an improvement in the quality of chip components and a cost reduction.
実 施 例 以下、本発明を実施例にもどづき、図面とともに説明
する。第１図〜第４図は本発明の一実施例に係るチップ
部品の集合体であり、図においてテープ１にはチップ部
品３のすきまを側壁との間にもたせており、かつテープ
１の収納穴１′とチップ部品３を片側からテープ２の接
着剤５で固定されている。チップ部品３は上記収納穴
１′に１個づつ案内収納される状態にて、テープ１とテ
ープ２に沿って等間隔に積層されている。またテープ１
および２にはチップ部品３の積載に対応して送り穴４が
設けられている。EXAMPLES Hereinafter, the present invention will be described with reference to the drawings by way of examples. 1 to 4 show an assembly of chip components according to an embodiment of the present invention. In the drawing, the tape 1 has a clearance between the chip components 3 and a side wall, and the tape 1 is stored. The hole 1 'and the chip component 3 are fixed from one side with the adhesive 5 of the tape 2. The chip components 3 are stacked at equal intervals along the tape 1 and the tape 2 in a state of being guided and stored one by one in the storage hole 1 ′. Also tape 1
And 2 are provided with feed holes 4 corresponding to the loading of chip components 3.
この構造によると、テープ１および２を巻き取れば部
品収納面積を大きく必要とせず、また等間隔に設けた送
り穴４を利用してチップ部品３を多数個連続して確実に
送ることが可能であり、チップ部品３の外部への装着に
際しては第12図のテープ２もしくは２′の剥離作業が削
除され、剥離時に発生する静電気を防ぐ事により、チッ
プ部品３の品質向上及びコストダウンになり、電子部品
の連続安定供給を可能にする電子部品集合体として有益
なものである。According to this structure, if the tapes 1 and 2 are wound up, a large component storage area is not required, and a large number of chip components 3 can be reliably fed continuously using the feed holes 4 provided at equal intervals. When the chip component 3 is mounted on the outside, the tape 2 or 2 'peeling operation shown in FIG. 12 is omitted, and static electricity generated at the time of peeling is prevented, thereby improving the quality of the chip component 3 and reducing the cost. This is useful as an electronic component assembly that enables continuous and stable supply of electronic components.
つぎに、本発明の他の実施例について第５図〜第10図
により説明する。この実施例において、チップ部品３′
および３″の電極６および６′が接着剤５′および５″
に付着することを防ぐ為に接着面に逃げを設けている。
この構造によると、チップ部品３′および３″の電極の
曲がりや電極への接着剤の付着による品質の低下を防ぐ
ことができ、電子部品の連続安定供給を可能にする電子
部品集合体として有益なものである。Next, another embodiment of the present invention will be described with reference to FIGS. In this embodiment, the chip component 3 '
And 3 "electrodes 6 and 6 'are adhesives 5' and 5".
A relief is provided on the adhesive surface to prevent it from adhering to the surface.
According to this structure, it is possible to prevent the bending of the electrodes of the chip components 3 'and 3 "and the deterioration of the quality due to the adhesion of the adhesive to the electrodes, and it is useful as an electronic component assembly that enables continuous and stable supply of electronic components. It is something.
発明の効果 以上のように、本発明によれば、チップ部品およびテ
ープが、接着剤により固定される為にチップ部品取出時
のテープ剥離作業の削除、および剥離の静電気を防ぐ事
により、チップ部品の品質向上及びコストダウンを提供
するものである。Effect of the Invention As described above, according to the present invention, the chip component and the tape are fixed by the adhesive, so that the tape peeling operation at the time of removing the chip component is eliminated, and the chip component is prevented from being statically discharged, thereby preventing the chip component from being removed. It is intended to provide quality improvement and cost reduction.
第１図は本発明の一実施例における電子部品集合体の平
面図、第２図は同断面図、第３図は接着剤が全面に付着
している同断面図、第４図は同斜視図、第５図は他の実
施例におけるテープの断面図、第６図はテープの接着剤
付着を示すテープの平面図、第７図はチップ部品の平面
図、第８図は他の実施例におけるテープの断面図、第９
図はテープの接着剤付着を示すテープの平面図、第10図
はチップ部品の平面図、第11図は従来例である電子部品
集合体の平面図、第12図は同断面図、第13図は同斜視図
である。 １……帯状長尺部、１′……収納穴、2,2″……帯状長
尺部、3,3′,3″……チップ部品、４……送り案内手
段、5,5′,5″……接着剤。FIG. 1 is a plan view of an electronic component assembly according to one embodiment of the present invention, FIG. 2 is a cross-sectional view of the same, FIG. 3 is a cross-sectional view of the same with adhesive applied to the entire surface, and FIG. FIG. 5, FIG. 5 is a sectional view of the tape in another embodiment, FIG. 6 is a plan view of the tape showing adhesion of the adhesive to the tape, FIG. 7 is a plan view of the chip component, and FIG. Sectional view of the tape in FIG.
FIG. 10 is a plan view of a tape showing adhesive adhesion of the tape, FIG. 10 is a plan view of a chip component, FIG. 11 is a plan view of a conventional electronic component assembly, FIG. The figure is the same perspective view. 1 ... strip-shaped long part, 1 '... storage hole, 2, 2 "... strip-shaped long part, 3, 3', 3" ... chip parts, 4 ... feed guide means, 5, 5 ', 5 ″ …… Adhesive.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 宮宅 裕之 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭50−98783（ＪＰ，Ａ) 実開 昭60−109393（ＪＰ，Ｕ) 実開 昭57−157199（ＪＰ，Ｕ) 実開 昭54−126574（ＪＰ，Ｕ) 実開 平２−99770（ＪＰ，Ｕ) 実開 平２−90268（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) B65D 67/00 - 79/02 B65D 81/18 - 81/30 B65D 81/38 B65D 85/00 - 85/84 H05K 3/30 H05K 13/00 - 13/04 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroyuki Miyake 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References -109393 (JP, U) Actually open 57-157199 (JP, U) Actually open 1974-126574 (JP, U) Actually open 2-99770 (JP, U) Actually open 2-90268 (JP, U (58) Fields surveyed (Int.Cl. 6 , DB name) B65D 67/00-79/02 B65D 81/18-81/30 B65D 81/38 B65D 85/00-85/84 H05K 3/30 H05K 13/00-13/04
Claims (3)
る第１の帯状長尺部と、前記第１の帯状長尺部の片側の
面にあって前記収納穴の開口部を被覆可能な第２の帯状
長尺部とからなり、前記収納穴の側壁との間に隙間を持
たせて電子部品を載置するように構成し、前記第１の帯
状長尺部を第２の帯状長尺部の片面両端の接着剤で固定
するとともに、前記収納穴に収納する電子部品の電極を
除いた前記第２の帯状長尺部の接着剤にて電子部品を固
定する電子部品集合体。A first strip-shaped elongate portion having a plurality of storage holes for accommodating an electronic component; and an opening of the storage hole on one surface of the first strip-shaped elongate portion. A second band-shaped elongate portion, and the electronic component is placed with a gap between the second band-shaped elongate portion and the side wall of the storage hole. An electronic component assembly that is fixed with an adhesive on both ends of one surface of the elongated portion and that fixes the electronic component with the adhesive of the second strip-shaped elongated portion excluding electrodes of the electronic component to be stored in the storage holes.
納する電子部品の電極を除いた中央部の帯状の接着剤で
ある特許請求の範囲第１項記載の電子部品集合体。2. The electronic component assembly according to claim 1, wherein the adhesive for fixing the electronic component is a band-shaped adhesive at a central portion excluding electrodes of the electronic component housed in the housing holes.
納する電子部品の電極を除いた個々の収納穴の中央のみ
の接着剤である特許請求の範囲第１項記載の電子部品集
合体。3. The electronic component assembly according to claim 1, wherein the adhesive for fixing the electronic component is an adhesive only at the center of each of the storage holes excluding the electrodes of the electronic component stored in the storage hole. body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161636A JP2913644B2 (en) | 1988-06-29 | 1988-06-29 | Electronic component assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161636A JP2913644B2 (en) | 1988-06-29 | 1988-06-29 | Electronic component assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0219269A JPH0219269A (en) | 1990-01-23 |
| JP2913644B2 true JP2913644B2 (en) | 1999-06-28 |
Family
ID=15738956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63161636A Expired - Lifetime JP2913644B2 (en) | 1988-06-29 | 1988-06-29 | Electronic component assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2913644B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018020794A (en) * | 2016-08-02 | 2018-02-08 | 信越ポリマー株式会社 | Punch tape |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0299770U (en) * | 1988-07-05 | 1990-08-08 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54126574U (en) * | 1978-02-24 | 1979-09-04 | ||
| JPS57157199U (en) * | 1981-03-30 | 1982-10-02 | ||
| JPS60109393U (en) * | 1983-12-27 | 1985-07-25 | 富士通株式会社 | carrier tape |
-
1988
- 1988-06-29 JP JP63161636A patent/JP2913644B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018020794A (en) * | 2016-08-02 | 2018-02-08 | 信越ポリマー株式会社 | Punch tape |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0219269A (en) | 1990-01-23 |
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