JPH092410A - Carriage device for electronic parts, and manufacture of electronic parts therewith - Google Patents

Abstract

PURPOSE: To improve accuracy in positioning and identifying electronic parts and to prevent projection and defective mounting of parts by a method wherein the electronic parts are fixed firm with a sticking tape to a lead frame. CONSTITUTION: A sticking tape 13, with sticking material applied to one side thereof, is stuck to the reverse side of a lead frame 12, on which through holes 10 for a package and positioning through holes 11 doubling as a means for feeding are arranged regularly in a fixed positional correlation, so that the sticking material is exposed through the through holes 10. A positioning pin is projected through a through hole 11 corresponding to a through hole 10 for the package, and the package 1 is stuck to the lead frame 12 with accuracy in sticking kept with pin hole criterion. Then, die pond resin is applied to the inside of the package 1 and a chip 14 is mounted thereon. After the resin is dried, the chip 14 and the package 1 are welded together with wires 15. The package 1 is covered with a lid 7 with temporary welding applied, and the package 1 is separated, with picking made to the sticking tape 13 through the through holes 10 from the bottom side of the lead frame.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for an electronic component such as a SAW filter used in the field of communication equipment and a method for manufacturing an electronic component using the carrier.

[0002]

2. Description of the Related Art SA for manufacturing conventional electronic components
The W filter will be described as an example.

In recent years, SAW filters have grown significantly due to the expansion of demand in the field of communication equipment. Above all, SAW filters are becoming smaller and surface mounting is rapidly developing due to the trend of light, thin, short and small communication devices. In addition, the package outer shape of the surface mount SAW filter covers a wide variety of products.

A manufacturing method in the SAW filter assembling process will be described below. First, the package 1 shown in FIG. 3 is reloaded into a carrier having a hole 2 for housing the package 1 as shown in FIG. Next, by a die bonder process, holes 2 provided in the carrier as shown in FIG.
Then, the package 1 is recognized by the positioning unit 4, the die bonder resin is applied to the inside of the package 1, and the chip 5 is attached. After that, a wire bond process
As shown in FIG. 5, the package 1 is recognized by the hole 2 and the positioning unit 6, and the wire electrode is connected to the chip 5. Next, as shown in FIG. 12, a lid called a lid 7 was tentatively welded to the package 1 to perform seam welding to obtain a SAW filter.

[0005]

According to the above method,
Particularly in the surface mount type SAW filter, the package 1, the hole 2 of the carrier and the positioning unit 4,
Since the clearance is provided between the hole 2 and the hole 6
Since the package moves in the inside, positioning becomes difficult, and there are problems such as popping out of the package 1 and defective mounting of components mounted in the package 1.

Therefore, an object of the present invention is to provide an electronic component carrying device which can perform positioning with high accuracy, and an electronic component manufacturing method using the carrying device.

[0007]

In order to achieve this object, the present invention provides a lead frame having a plurality of through holes and a plurality of feed holes provided so as to correspond to the through holes, and a lead frame of the lead frame. On the back surface, comprising an adhesive tape attached so that the adhesive portion is exposed from the through hole, a component is fixed to the through hole portion, and a transport device for an electronic component that transports using the feed hole, The component is processed by using this transport device, and then the component is separated from the lead frame by applying pressure to the component from the back surface of the lead frame through an adhesive tape.

[0008]

According to this method, since the components are fixed to the lead frame by the adhesive tape, the positioning and the recognition of the components can be performed with high accuracy, so that the protrusion of the components and the mounting failure can be prevented, and the productivity can be improved. Can be improved.

Further, the lead frame can be shared even for parts of other types.

[0010]

An embodiment of the present invention will be described below with reference to the drawings.

First, FIG. 2 shows a lead frame 12 in which the through holes 10 for the package and the through holes 11 for both positioning and feeding are regularly arranged in the longitudinal direction in a fixed positional relationship.

Here, the package through hole 10 is the through hole 11.
Correspondingly, the number of through holes 11 must be equal to or larger than the number of package through holes 10 for positioning. In this embodiment, the through hole 11 is smaller than the package through hole 10 by one.
There are many. The package through holes 10 are provided at the same pitch as the through holes 11. Further, the lead frame 12 is made of stainless steel having excellent heat resistance, and usually has a thickness of about 0.50 mm or more. The width between the package through holes 10 is set so that the lead frame 12 has strength. It is desirable that the thickness is about 1.8 mm or more. In this embodiment, 25 mm × considering storage.
The lead frame 12 having a size of 200 mm was used.

Further, the package through hole 10 is made larger than the size of the package 1 in order to securely fix the SAW filter package 1 as shown in FIG. 3, and the entire back surface (bonding surface) of the package 1 is adhered. It is fixed by the tape 13.

Then, an adhesive tape 13 having an adhesive material on one side is provided on the back surface of the lead frame 12 for the package through hole 1
The lead tape 12 is attached from one end to the other end so that the adhesive material is exposed from 0, and the adhesive tape 13 is cut. Here, it is important that the adhesive tape 13 has a width that covers the package through hole 10 and does not cover the through hole 11. Further, as the base material of the adhesive tape 13,
Use a material with excellent heat resistance, such as polyimide,
Usually, a material having a thickness of about 0.025 mm is preferable. If the thickness is more than this range, the shrinkage due to heat becomes large and the attachment accuracy of the SAW filter becomes large, which is not preferable. Further, the adhesive material is preferably a silicon-based material that is less likely to generate harmful gas.

Next, as shown in FIG. 1, the lead frame 12
Adhesive tape 13 is attached to the tip of the adhesive tape 13, and the adhesive tape 13 is pulled up to the rear part of the lead frame 12 and the adhesive tape 13 is cut with a cutter. Here, the adhesive tape 13 must be attached so as not to wrinkle. Further, since the adhesive tape 13 is pulled and attached, it is preferable to use the adhesive tape 13 having a small elongation. In this example, a material having an elongation of about 20% was used. It is also possible to use the adhesive tape 13 having a large elongation and a large adhesive force.

Then, in the package preparation process, as shown in FIG.
In order to attach the package 1 to the lead frame 12 to which the adhesive tape 13 has been attached, one positioning pin is projected into the corresponding through hole 11 in the front part of the package through hole 10 and the lead frame 12 By pressing the side surface on the side opposite to the side on which the through hole 11 is provided, the pin hole (through hole 11) standard attachment accuracy is achieved. Here, it is necessary to set the reference of the package 1 once before attaching the package 1 to the lead frame 12. At this point, the lead frame 12 having the sticking accuracy with reference to the pin hole and having the “zero” protrusion of the package can be formed. Further, since the package through hole 10 has a certain size, the lead frame 12 can be commonly used even in SAW filters of other types.

Next, in the die bonder process, as shown in FIGS. 5, 6 and 7, the die bond resin 16 is applied to the inside of the package 1 to mount the chip 14. This is because the sticking accuracy is based on the pin hole in the package preparation process.
It is not necessary to recognize the pop-out prevention unit or the package 1 side.

Next, a lead frame 12 is subjected to a drying process.
The resin containing 16 is placed in a drying oven to dry the resin 16.

Next, the chip 14 and the package 1 are connected to the wire 15 by a wire bonding process as shown in FIGS.
Weld with. In this step as well, the lead frame 12 provides the attachment accuracy with reference to the pin hole, so that the positioning of the package 1 and the pop-out prevention unit are unnecessary. Further, there is no problem even if the number of recognition points on the package 1 side is reduced as compared with the conventional one.

After that, a lid temporary fixing step is performed as shown in FIG.
0, as shown in FIG. 11, a lid called a lid 7 is attached to the package 1 to temporarily weld two portions of the lid 7 so that the lid 7 does not move. This positions the lid 7 on the package 1. Here, since the lid 7 does not pop out and the quality is stable, appearance inspection is unnecessary. If the lid 7 is insufficiently temporarily fixed, the lid 7 may adhere to the roller electrode during seam welding, and welding cannot be performed well.

The package 1 is separated from the adhesive tape 13 by poking the adhesive tape 13 with four needles into the one package through hole 10 from the bottom surface of the lead frame 12 after the above steps. On the other hand, in the lead frame 12 to which the entire package 1 has been transferred, the pins are dropped from the top into the lead through hole 10 for the package, and a part of the adhesive tape 13 is peeled from the lead frame 12.

Then, a part of the peeled adhesive tape 13 is grasped and pulled to be completely peeled from the lead frame 12. The peeled adhesive tape 13 is collected and should not be cut in the middle. Therefore, when the package 1 is separated from the adhesive tape 13 with four needles from the bottom surface of the lead frame 12 into one package through hole 10, tape tearing by the needles must not occur. Also lead frame 1
Since No. 2 is used again in the carrier attaching step, there is no adhesive residue on the adhesive tape 13.

Finally, in the seam welding process, the edges of the package 1 and the lid 7 are welded. Here, the edges must be completely welded to maintain hermeticity.

The SAW filter as shown in FIG. 12 is completed by performing the above steps. The lead frame 12 used in the present embodiment has recesses at both ends, and when the adhesive tape 13 is attached to the recesses, the tip end of the lead frame 12 when viewed from above as shown in FIG. It is important that the lead frame 12 does not protrude and the rear end does not protrude the line connecting A and B of the lead frame 12. This is because, if the adhesive tape 13 is stuck outside the above range, the adhesive tape 13 may be caught at the leading end when the lead frame 12 is conveyed, and the adhesive tape 13 may be stuck at the rear end. This is because there is a possibility that the lead frame 12 and the adhesive tape 13 may be entangled with each other. For this reason, it is desirable that the width of the recess be larger than the width of the adhesive tape 13.

Further, although the SAW filter has been shown as an example in the present embodiment, it is effective in an electronic component which requires highly accurate positioning and processing.

[0026]

As described above, according to the present invention, since the components are fixed to the lead frame by the adhesive tape, positioning,
Since the parts can be recognized with high accuracy, it is possible to prevent the parts from popping out and mounting defects, and improve the productivity.

Further, the lead frame can be shared even for parts of other types.

[Brief description of drawings]

FIG. 1 is a top view of a lead frame to which an adhesive tape is attached according to an embodiment of the present invention.

FIG. 2 is a top view of a lead frame according to an embodiment of the present invention.

FIG. 3 is a perspective view of a package according to an embodiment of the present invention.

FIG. 4 is a top view of a lead frame having a package adhered thereto according to an embodiment of the present invention.

FIG. 5 is a perspective view of a package coated with a silicone resin according to an embodiment of the present invention.

FIG. 6 is an exploded perspective view of a chip and a package according to an embodiment of the present invention.

FIG. 7 is a top view of a package after a die bonder process according to an embodiment of the present invention.

FIG. 8 is a perspective view of a package that has completed a wire bonding process according to an embodiment of the present invention.

FIG. 9 is a top view of a lead frame that has completed a wire bonding process according to an embodiment of the present invention.

FIG. 10 is an exploded perspective view of a SAW filter according to an embodiment of the present invention.

FIG. 11 is a top view of the lead frame after the lid temporary fixing step in the embodiment of the present invention.

FIG. 12 is a perspective view of a SAW filter according to an embodiment of the present invention.

FIG. 13 is a top view of a conventional transport carrier.

FIG. 14 is a top view of a transport carrier and a positioning unit in a conventional die bonder process.

FIG. 15 is a top view of a transport carrier and a positioning unit in a conventional wire bonding process.

[Explanation of symbols]

 1 Package 10 Through Hole for Package 11 Through Hole 12 Lead Frame 13 Adhesive Tape

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Haruo Yoshioka 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A lead frame having a plurality of through holes and a plurality of feed holes provided so as to correspond to the through holes, and an adhesive portion is exposed from the through holes on a back surface of the lead frame. A transfer device for electronic parts, comprising: an adhesive tape attached, fixing parts to the through holes, and transferring the parts using the feed holes. 2. The through hole is larger than the bottom surface of the component.
A transport device for the electronic component described. 3. An adhesive tape is attached to a back surface of a lead frame having a plurality of through holes and a plurality of feed holes provided so as to correspond to the through holes such that an adhesive portion is exposed from the through holes. Then, a method of manufacturing an electronic component, in which the component is fixed to the through hole, processed, and thereafter, pressure is applied to the component from the back surface of the lead frame through an adhesive tape to separate the component from the lead frame.