JP3536431B2 - Manufacturing method of electronic components - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component such as a SAW filter used in the field of communication equipment. 2. Description of the Related Art A conventional method for manufacturing an electronic component is described as SA.
The W filter will be described as an example. [0003] In recent years, SAW filters have grown significantly due to increasing demand in the field of communication equipment. Above all, SAW filters have been rapidly reduced in size and surface mounted due to the tendency of communication devices to be light and thin. Further, the package outer shape of the surface mount SAW filter covers a wide variety. Hereinafter, a manufacturing method in the SAW filter assembling process will be described. First, the package 1 shown in FIG. 3 is transferred to a carrier having holes 2 for accommodating the package 1 as shown in FIG. Next, FIG.
As shown in FIG. 4, the package 1 is recognized by the holes 2 provided in the transport carrier and the positioning unit 4, and a die bonder resin is applied inside the package 1 and the chip 5 is attached. Thereafter, the package 1 is recognized by the hole 2 and the positioning unit 6 as shown in FIG. Next, as shown in FIG. 12, a lid called a lid 7 was temporarily welded to the package 1 to perform seam welding to obtain a SAW filter. [0006] According to the above method,
In particular, in a surface mount type SAW filter, the package 1, the hole 2 of the carrier and the positioning unit 4,
Because there is a clearance between the hole 2 and the hole 2,
In such a case, the positioning of the package 1 is difficult due to the movement of the package, and the package 1 has a problem such as popping out or a defective mounting of components mounted in the package 1. SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing an electronic component which can perform positioning with high accuracy. [0008] According to an aspect of the present invention in order to accomplish this objective a plurality of through holes, a frame having a plurality of feed holes provided so as to correspond to the through hole, the frame The back surface of the electronic component is provided with an adhesive tape attached so that the adhesive portion is exposed from the through-hole, a component is fixed to the through-hole portion, and the electronic component is conveyed using the perforation hole. This is a transfer device that processes components using the transfer device, and then applies pressure to the components from the back surface of the frame via an adhesive tape to separate the components from the frame . According to this method, the component is wrapped with the adhesive tape.
Since the frame is fixed to the frame , positioning and recognition of the component can be performed with high accuracy, so that it is possible to prevent a component from jumping out or a mounting defect, thereby improving productivity. [0010] Further, the frame can be shared by parts of other types. An embodiment of the present invention will be described below with reference to the drawings. First, FIG. 2 shows a frame 12 in which a through hole 10 for a package and a perforated hole 11 having both positioning and feeding are regularly arranged in a longitudinal direction in a fixed positional relationship. Here, the through hole 10 for the package is the feed hole 1.
1 and respectively correspond, feeding holes 11 must be packaged for hole 10 and the same number or more in order to perform positioning. In this embodiment, the perforation hole 11 is a through hole 10 for a package.
One more is provided. In addition, the package through hole 10
Are provided at the same pitch as the feed holes 11. In addition, full
The frame 12 is made of stainless steel having excellent heat resistance and usually has a thickness of about 0.50 mm or more. The width between the package through holes 10 is about 1.8 mm in order to give the frame 12 strength. It is desirable to make it above.
In this embodiment, 25 mm × 20 in consideration of storage.
The frame 12 having a size of 0 mm was used. Further, the through hole 10 for the package is larger than the size of the package 1 in order to securely fix the package 1 of the SAW filter as shown in FIG. 3 to be used, and the entire back surface (adhesion surface) of the package 1 is adhered. It is fixed by the tape 13. [0015] Next, bonded from one end to the other end of the frame 12 so as adhesive from package hole 10 an adhesive tape 13 provided on one side on the adhesive material on the rear surface of the frame 12 are exposed adhesive tape 13 Disconnect. Here, it is important that the adhesive tape 13 has a width that covers the package through-hole 10 and does not cover the feed hole 11. As the base material of the adhesive tape 13, a material having excellent heat resistance, such as polyimide, is used.
Those having a thickness of about 025 mm are preferred. If the thickness is more than this, the shrinkage due to heat becomes large, and the variation in the sticking accuracy of the SAW filter becomes large, which is not preferable. The adhesive is preferably a silicon-based material that does not easily generate harmful gas. [0016] and then paste the adhesive tape 13 to the distal end of the frame 12 as shown in FIG. 1, cutting the adhesive tape 13 at attachment cutter to the rear of the frame 12 while pulling the adhesive tape 13. Here, the adhesive tape 13 must be attached so as not to wrinkle. In addition, since the adhesive tape 13 is pulled and attached, it is preferable to use an adhesive tape 13 having a small expansion.
In this example, a material having an elongation of about 20% was used. It is also possible to use an adhesive tape 13 having a large adhesive force even if the elongation is large. Thereafter, in a package preparation step, FIG.
The frame 12 on which the adhesive tape 13 is attached as shown in FIG.
In order to attach the package 1 to the package 1, one positioning pin is protruded into the corresponding feed hole 11 at the front of the package through hole 10, and the side of the frame 12 opposite to the side where the feed hole 11 is provided is pressed. Depending on the pin hole ( feed
Hole 11) The standard sticking accuracy is provided. Here, it is necessary to determine the standard of the package 1 once before attaching the package 1 to the frame 12. At this time, the frame 12 having the sticking accuracy on the basis of the pin hole and the protrusion of the package is “zero” is formed. In addition, since the package through-hole 10 has a certain size, the frame 12 can be used in common for SAW filters of other types. Next, in a die bonding step, a die bond resin 16 is applied to the inside of the package 1 to mount the chip 14 as shown in FIGS. 5, 6 and 7. This is because the bonding accuracy based on the pin hole is determined in the package preparation process.
The protrusion prevention unit and the package 1 need not be recognized. Next, in a drying step, the magazine housing the frame 12 is placed in a drying furnace to dry the resin 16. Next, the chip 14 and the package 1 are connected to the wire 15 by a wire bonding process as shown in FIGS.
Weld with. Also in this process, since the frame 12 provides the sticking accuracy on the basis of the pin hole, the unit for positioning the package 1 and preventing the package 1 from popping out is unnecessary. There is no problem even if the number of recognition points on the package 1 side is reduced as compared with the related art. Thereafter, the lid is temporarily fixed, and FIG.
As shown in FIG. 11, the package 1 is covered with a lid called a lid 7 and two places of the lid 7 are temporarily welded so that the lid 7 does not move. This positions the lid 7 on the package 1. Here, since the lid 7 does not protrude and the quality is stable, the appearance inspection is unnecessary. Here, if the lid 7 is insufficiently temporarily fixed, the lid 7 adheres to the roller electrode when performing seam welding, and welding cannot be performed well. The package 1 is peeled from the adhesive tape 13 by squeezing the adhesive tape 13 with four needles from the bottom surface of the frame 12 having passed through the above steps into one package through hole 10 with four needles. On the other hand, frame, which was transferred all the packages 1
The arm 12 lowers the pin from the top into the leading package through-hole 10 and peels off a part of the adhesive tape 13 from the frame 12. Then, a part of the peeled adhesive tape 13 is grasped and pulled to completely peel it off the frame 12. The peeled adhesive tape 13 is collected and must not be cut off in the middle. Therefore, when the package 1 is peeled from the adhesive tape 13 with four needles from one bottom of the frame 12 to one package through hole 10, the tape must not be broken by the needles. Further, since the frame 12 is used again in the carrier attaching step, the adhesive tape 13 must not have adhesive residue. Finally, in the seam welding step, the edges of the package 1 and the lid 7 are welded. Here, the rim must be completely welded to maintain hermeticity. By performing the above steps, a SAW filter as shown in FIG. 12 is completed. The frame 12 used in this embodiment has concave portions at both ends, and the adhesive tape 1
When the frame 3 is attached, as shown in FIG. 1, the front end does not protrude from the frame 12 when the frame 12 is viewed from above, and the rear end does not protrude from the line connecting A and B of the frame 12. It is important to do so. This is because, when the adhesive tape 13 is pasted out of the above range and adhered, the adhesive tape 13 may be entangled when transporting the frame 12 at the front end, and at the rear end, This is because there is a risk of entanglement with the next frame 12 or the adhesive tape 13. Therefore, it is desirable that the width of the concave portion is larger than the width of the adhesive tape 13. In this embodiment, the SAW filter is described as an example. However, the present invention is effective for an electronic component that needs to be positioned and processed with high accuracy. As described above, according to the present invention, since the components are fixed to the frame by the adhesive tape, the positioning and the recognition of the components can be performed with high precision, so that the components are prevented from jumping out and mounting defects. And productivity can be improved. Further, the frame can be shared by parts of other types.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view of a frame to which an adhesive tape according to one embodiment of the present invention is attached. FIG. 2 is a top view of a frame according to one embodiment of the present invention. FIG. 4 is a perspective view of a package according to one embodiment of the present invention. FIG. 4 is a top view of a frame to which a package according to one embodiment of the present invention is adhered. FIG. 5 is a perspective view of a package coated with a silicon-based resin according to one embodiment of the present invention. 6 is an exploded perspective view of a chip and a package according to one embodiment of the present invention. FIG. 7 is a top view of the package after a die bonder process according to one embodiment of the present invention. FIG. 9 is a perspective view of the completed package. FIG. 9 is a top view of the frame after the wire bonding step in one embodiment of the present invention. FIG. 10 is an exploded view of the SAW filter in one embodiment of the present invention. FIG. 11 is a top view of a frame after a lid temporary fixing step in one embodiment of the present invention. FIG. 12 is a perspective view of a SAW filter in one embodiment of the present invention. FIG. 13 is a top view of a conventional carrier. FIG. 14 is a top view of a carrier and a positioning unit in a conventional die bonder process. FIG. 15 is a top view of a carrier and a positioning unit in a conventional wire bonding process. Sprocket holes 12 Frame 13 Adhesive tape

Continuing from the front page (72) Inventor Haruo Yoshioka 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. References: Japanese Utility Model Application Hei 5-89204 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/50 B65B 15/04 H05K 13/02

Claims (1)

(57) [Claim 1] A heat-resistant device having a plurality of through holes for fixing a component, the plurality of through holes being larger than the bottom surface of the component, and a plurality of feed holes provided corresponding to the through hole. on the back of the sexual frame, resistance
A heat-sensitive adhesive tape is attached so that the adhesive portion is exposed from the through-hole, and then the component is fixed to the through-hole, processing is performed, and then pressure is applied to the component from the back surface of the frame via the adhesive tape. And manufacturing the electronic component by separating the component from the frame.