JPH0741039A - Carrier tape containing electronic parts - Google Patents

Abstract

PURPOSE:To provide a carrier tape which favorably contains electronic parts having different parts thickness and length of leading wires. CONSTITUTION:Each double-sided adhesive of a carrier tape where electronic parts 4 with leading wires are stuck on the double-sided adhesive stuck on one side of a tape 1 at every specified interval and contained thereon is arranged at the upper and lower layers and a sheet of film or paper is interposed between the above adhesive layers to make a three-layer structure 3. In this way, since the thickness of the double-sided adhesive can be altered by the variation of the thickness of film or paper, even electronic parts having different thickness thereof and length of leading wires can be easily contained without damage of the leading wires.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape used for taping and packaging small electronic parts such as chip capacitors, ceramic capacitors and resistors used in electronic equipment such as computers, and more particularly to lead parts. The present invention relates to a carrier tape of a type in which an electronic component having the above is detachably attached to a strip-shaped tape body with a sprocket hole by an adhesive method and wound around a reel.

[0002]

2. Description of the Related Art Chiped electronic parts such as diodes, capacitors and transistors used in electronic devices such as computers are packaged by a method of storing them in a strip-shaped tape body generally called a carrier tape and winding them on a reel. ing. As a carrier tape used in this method, for example, a paper or plastic tape body provided with a storage box and a sprocket hole of a predetermined size, or a band-shaped tape body provided with a large number of storage holes are formed. , The bottom of which is formed by adhering a tape with an adhesive layer on one side of the tape body (Actually published No. 57-157199).
(See Japanese Patent Laid-Open Publication), a double-sided adhesive tape having a double-sided adhesive of arbitrary shape and size attached to one side of the strip-shaped tape body at regular intervals is known.

[0003]

Among the conventional carrier tapes described above, a carrier tape having a double-sided adhesive of arbitrary shape and size adhered to one side of a strip-shaped tape body at regular intervals has lead portions. When the parts are stored, they must be attached to the double-sided adhesive so that the lead parts are not bent or deformed. However, since the thickness of the double-sided adhesive is almost constant, in the case of this type of carrier tape, the thickness of the component and the length of the lead wire are limited due to the restriction of the thickness of the double-sided adhesive. There is an inconvenience that it cannot be applied to electronic parts having different thicknesses and lead wire lengths.

According to the present invention, the thickness of the double-sided adhesive is simplified in order to eliminate the inconvenience of the carrier tape formed by sticking the double-sided adhesive of arbitrary shape and size on one side of the above-mentioned strip-shaped tape body at regular intervals. It is intended to propose a carrier tape for accommodating electronic parts, which can be easily changed to an electronic part having a different thickness or lead wire length.

[0005]

SUMMARY OF THE INVENTION The present invention is a double-sided adhesive in which a release film or release paper is inserted so that electronic components having different thicknesses and lead wire lengths can be easily accommodated. The point is that a double-sided adhesive with a three-layer structure in which a release film or release paper of arbitrary thickness is sandwiched between two layers of double-sided adhesive on one side of a strip-shaped tape having sprocket holes A carrier tape for accommodating an electronic component, which is attached with the adhesive on both sides, and an electronic component can be attached and detached on the double-sided adhesive.

[0006]

The release film or release paper used in the present invention is not particularly limited, but has a thickness of 100 to 2
It is possible to use one having a diameter of 00 μm. Such an ultra-thin film or paper is selected and used according to the thickness of the electronic components to be stored and the length of the lead wire. That is, use thin film or paper for thin electronic components and electronic components with short lead wires, and thicker film or paper for electronic components with thick thickness and long lead wires. To use.

As a method of manufacturing such a double-sided adhesive having a three-layer structure of film or paper insertion, the double-sided adhesive can be easily manufactured by superposing the two-sided adhesive via the film or paper. Therefore, double-sided adhesive layers having various thicknesses can be obtained by using films or papers having different thicknesses. As the double-sided adhesive used, the lower layer on the tape body side and the upper layer on the electronic component side may be the same, but the double-sided adhesive on the lower layer is an adhesive effective for a release film or release paper, It is more effective to use an adhesive effective for electronic parts as the upper double-sided adhesive.

The double-sided adhesive having the three-layer structure is formed in an arbitrary shape and size according to the size and shape of the electronic component, and is adhered to the strip-shaped tape body at intervals. Since the electronic component is attached to the double-sided adhesive by floating from the tape body, it can be stored without affecting the lead portion.

As described above, according to the present invention, since the double-sided adhesive has a three-layer structure of film or paper insertion, the thickness of the double-sided adhesive can be easily changed depending on the thickness of the film or paper. The thickness of electronic components and the length of lead wires can be easily adjusted.

Since the tape body has a sprocket hole, the tape body can be automatically fed by using this sprocket hole, and the tape feed can be controlled by detecting the position of the hole with a photoelectric tube or the like. It is possible, and the double-sided adhesive having a three-layer structure of arbitrary shape and size can be attached to the tape body with considerable accuracy.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view showing a part of a carrier tape according to the present invention, FIG. 2 is an enlarged vertical side view showing an adhesive agent of the same carrier tape, and FIG. FIG. 2 is an enlarged vertical sectional side view showing a state in which different electronic components with leads are attached, (A) shows a case of an electronic component having a large component thickness, and (B) shows a case of an electronic component having a thin component thickness. In the figure, 1 is a tape body, 2 is a sprocket hole, 3 is a double-sided adhesive having a three-layer structure, 3-1 is a lower-side double-sided adhesive, 3-2 is an upper-side double-sided adhesive, 3-3 is a release film or release paper. Reference numeral 4 is an electronic component with a lead portion, 4-1 is an electronic component having a thick component thickness, and 4-2 is an electronic component having a thin component thickness.

That is, the carrier tape according to the present invention is a tape body 1 having a sprocket hole 2 at a side end portion.
The double-sided adhesive 3 having a three-layer structure is adhered to the tape substantially at the center of the tape 3 at regular intervals. The double-sided adhesive 3 having a three-layer structure is shown in FIG. A lower layer double-sided adhesive 3-1 to be adhered to the upper layer, an uppermost layer double-sided adhesive 3-2 to which the electronic component 4 is adhered, and a release film or release paper 3-3 sandwiched between the upper and lower side double-sided adhesives. It consists of

The double-sided adhesive 3 having a three-layer structure is shown in FIG.
As shown in (A) and (B), a thick double-sided adhesive 3A is obtained by using a thick release film or release paper 3-3a, and a thick release film or release paper 3-3b is used. Thus, a thin double-sided adhesive 3B is obtained. Therefore, by attaching the double-sided adhesive 3A in the case of the electronic component 4-1 having a large component thickness and by attaching the double-sided adhesive 3B in the case of the electronic component 4-2 having a thin component thickness, the lead portion is not affected at all. Can be glued.

When the carrier tape is wound on a reel (not shown), the double-sided adhesive 3 comes into contact with the back surface of the tape body 1. However, by peeling the back surface of the tape body 1, the double-sided adhesive is adhered. The agent does not transfer to the back surface of the tape body.

When the lead taped electronic component 4 is to be housed in a carrier tape wound on a reel, while the carrier tape is being rewound, the electronic component 4 is adhered to the double-sided adhesive 3 of the tape and wound on another reel. Take and store.

When using the electronic component 4 thus tape-packaged, the tape can be rewound from the reel again, and the component can be taken out by, for example, a chucking method or a suction method. At this time, since the electronic component 4 is taken out together with the three-layer double-sided adhesive agent 3, temporary attachment of the component can be easily performed.

[0017]

As described above, according to the present invention, the thickness of the double-sided adhesive can be variously changed by selecting the thickness of the film to be inserted into the double-sided adhesive. It can be easily applied to different electronic parts with lead parts, and is extremely excellent as a carrier tape of a system in which a double-sided adhesive of arbitrary shape and size is attached to one side of a strip-shaped tape body at regular intervals.

[Brief description of drawings]

FIG. 1 is a perspective view showing a part of a carrier tape according to the present invention.

FIG. 2 is a vertical cross-sectional side view showing the adhesive of the carrier tape in an enlarged manner.

FIG. 3 is an enlarged vertical side view showing a state in which electronic components with leads having different component thicknesses are attached to a carrier tape, FIG. 3A showing an electronic component having a large component thickness;
Shows the case of electronic parts with thin parts.

[Explanation of symbols]

 1 Tape body 2 Sprocket hole 3 Double-sided adhesive of 3 layer structure 3-3a Thick release film or release paper 3-3b Thick release film or release paper 3A Thick double-sided adhesive 3B Thin double-sided adhesive 4 Electronic Components with Leads 4-1 Electronic Components with Thick Components 4-2 Electronic Components with Thin Components

Claims (1)

[Claims] 1. A double-sided adhesive having a three-layer structure in which a release film or release paper having an arbitrary thickness is sandwiched between two upper and lower double-sided adhesives on one side of a strip-shaped tape having sprocket holes. A carrier tape for accommodating electronic parts, characterized in that the electronic parts can be attached to and detached from the double-sided adhesive agent by being attached at intervals.