JPH02109815A - Method for storing small sized electronic component - Google Patents
Method for storing small sized electronic componentInfo
- Publication number
- JPH02109815A JPH02109815A JP63262599A JP26259988A JPH02109815A JP H02109815 A JPH02109815 A JP H02109815A JP 63262599 A JP63262599 A JP 63262599A JP 26259988 A JP26259988 A JP 26259988A JP H02109815 A JPH02109815 A JP H02109815A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- small electronic
- electronic components
- tape body
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 claims abstract description 25
- 238000003860 storage Methods 0.000 claims abstract description 17
- 239000002390 adhesive tape Substances 0.000 claims abstract description 7
- 238000004804 winding Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 3
- 238000005452 bending Methods 0.000 abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、コンピューター等の電子機器に使用される
チップコンデンサ、セラミックコンデンサ、抵抗器等の
小型電子部品をテーピング包装する方法に係り、より詳
しくは帯状のテープ体に小型電子部品を貼着してリール
に巻取る方式の小型電子部品の収納方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a method of taping and packaging small electronic components such as chip capacitors, ceramic capacitors, and resistors used in electronic devices such as computers, and more specifically relates to a method of taping and packaging small electronic components such as chip capacitors, ceramic capacitors, and resistors used in electronic devices such as computers. The present invention relates to a method for storing small electronic components in which the small electronic components are attached to a tape body and wound onto a reel.
従来の技術
］ンピューター等の電子機器に使用されるダイオード、
コンデンサ、トランジスタ等のチップ化された電子部品
は、一般にキャリアテープと呼ばれる帯状のテープ体に
収納してリールに巻取る方式により包装されている。Conventional technology] Diodes used in electronic devices such as computers,
Chip-shaped electronic components such as capacitors and transistors are generally packaged by storing them in a band-shaped tape body called a carrier tape and winding it onto a reel.
この方式には、例えば紙製、あるいはプラスチック製の
テープに所定の大きざの収納ボックスとスプロケットホ
ールが等間隔に設けられたキャリアテープを用いる方法
がある。This method includes the use of a carrier tape made of paper or plastic, in which storage boxes and sprocket holes of a predetermined size are provided at equal intervals.
又、他の方法として、帯状のテープ体に多数の収納用孔
を穿設し、このテープ体の片面に粘着層付きのテープを
貼付けて底部を形成してなるテープを用い、収納孔より
露出した粘着層に電子部品を接着する方式がある（実開
昭５７−１５７１９９等）。Another method is to use a tape in which a large number of storage holes are formed in a band-shaped tape body, and a tape with an adhesive layer is pasted on one side of the tape body to form the bottom. There is a method of adhering electronic components to the adhesive layer (see Utility Model Application Publication No. 57-157199, etc.).
しかし、収納ボックス方式のキャリアテープによる場合
は、収納された小型電子部品が収納ボックスよりはみ出
たり、離脱し易い等の欠点があり、好ましくなかった。However, in the case of using a storage box type carrier tape, the small electronic components stored therein tend to protrude from the storage box or easily come off, which is not preferable.
また、粘着層付きのテープを用いたキャリアテープによ
り電子部品を収納する方式の場合は、電子部品が粘着層
に接着されるため、ボックス方式のような離脱や位置ず
れはなくなる。しかし、ボックス孔型のものも含めて、
これらのテーピング方式の適用範囲は、リード部分の短
かいものに限られ、ダイオードやトランジスター等のリ
ード部分の長いものには適用できないという欠点がある
。Furthermore, in the case of a system in which electronic components are housed with a carrier tape using a tape with an adhesive layer, the electronic components are adhered to the adhesive layer, so there is no separation or misalignment unlike in the box system. However, including box hole type ones,
The scope of application of these taping methods is limited to those with short lead portions, and there is a drawback that they cannot be applied to devices with long lead portions such as diodes and transistors.
リード部分の長い電子部品をテーピングする場合の方式
としては、例えばキャリアテープの幅を広くし、かつ厚
みを厚くして収納用孔を大きくする方法等が考えられる
が、リード部分は極細線で作られているため、孔の壁に
接触したり、隣りの部品のリード線どうしの接触により
容易に曲ったり変形し易く、そのため収納ボックスや収
納用孔を大きくしても、リード線の変形を防止すること
はできない。One possible method for taping electronic components with long leads is to make the carrier tape wider and thicker to make the storage hole larger. Because of this, it is easily bent or deformed due to contact with the wall of the hole or contact between lead wires of adjacent parts. Therefore, even if the storage box or storage hole is enlarged, the lead wires will not be deformed. I can't.
リード線が僅かでも曲ったり、変形した電子部品は不良
品として処理されるため、特にリード線の長い電子部品
の場合は、リード線が曲ったり、変形しないようなテー
ピング方式が要求される。Electronic components whose lead wires are even slightly bent or deformed are treated as defective products, so especially in the case of electronic components with long lead wires, a taping method that prevents the lead wires from bending or deforming is required.
発明が解決しようとする課題
この発明は、前に述べたような実情よりみて、特にリー
ド部分の長い電子部品の収納に好適なキャリアテープに
よる収納方法を提案しようとするものである。Problems to be Solved by the Invention In view of the above-mentioned actual circumstances, the present invention seeks to propose a storage method using a carrier tape that is particularly suitable for storing electronic components with long lead portions.
課題を解決するための手段
この発明は、スプロケットホールを有する帯状のテープ
体に小型電子部品を該テープ体表面より若干浮かせて接
着することにより、リード部分に曲げや変形を生じさせ
ることなく収納し得る方法を提案するもので、その要旨
は、
■ スプロケットホールを有する帯状のテープ体に、該
テープ体を突出させて形成した該テープ体長さ方向に相
平行する左右一対の部品貼着台を等間隔に連続して設け
、かつ左右の貼着台間に窓孔を穿設し、該テープ体の裏
面に両面接着剤テープを貼付けて該テープ接着剤面を前
記窓孔より露出させた収納用テープを用い、前記左右一
対の貼着台上に小型電子部品を接着してリールに巻取る
方法と、
■ 上記と同じ帯状のテープ体に、該テープ体を突出さ
せて形成した断面凹形の部品貼着台を等間隔に連続して
設け、該貼着台の上面凹部に接着剤を充填した収納用テ
ープを用い、前記貼着台上に小型電子部品を接着してリ
ールに巻取る方法と、■ 上記と同じ帯状のテープ体に
、該テープ体を突出させて形成した断面凹形の部品貼着
台を等間隔に連続して設け、かつ該貼着台の上面凹部の
両サイドにピン孔を穿設し、該貼着台の上面凹部に接着
剤を充填した収納用テープを用い、前記貼着台上に小型
電子部品を接着してリールに巻取る方法でおる。Means for Solving the Problems The present invention is capable of storing small electronic components without bending or deforming the lead portion by adhering small electronic components to a band-shaped tape body having sprocket holes so as to be slightly raised above the surface of the tape body. This paper proposes a method for obtaining a tape body, and its gist is as follows: (1) A pair of left and right component attachment stands formed by protruding the tape body from a band-shaped tape body having sprocket holes and extending in parallel with each other in the length direction of the tape body are placed on the same side. For storage, a window hole is provided continuously at intervals, and a window hole is bored between the left and right adhesion tables, and a double-sided adhesive tape is pasted on the back side of the tape body, so that the adhesive side of the tape is exposed through the window hole. A method of adhering small electronic components onto the pair of left and right adhesion tables using tape and winding them onto a reel; A method in which component attaching tables are successively provided at regular intervals, a storage tape filled with adhesive is used in the recessed part of the upper surface of the attaching table, and small electronic components are adhered onto the attaching tables and wound onto a reel. and () Component adhesion tables with a concave cross section formed by protruding the tape body are provided continuously at equal intervals on the same strip-shaped tape body as above, and on both sides of the concave part of the top surface of the application base. This method uses a storage tape with a pin hole drilled therein and an adhesive filled in the recessed part of the upper surface of the adhering table, and the small electronic component is adhered onto the adhering table and wound onto a reel.
作 用
第１図はこの発明の請求項１に対応する小型電子部品収
納用テープ（以下キャリアテープという）の一部を示す
平面図、第２図は第１図■−■線上の縦断正面図、第３
図は第１図■−■線上の縦断側面図、第４図は同じく請
求項２に対応するキャリアテープの一部を示す平面図、
第５図は第４図ｖ−■線上の縦断側面図、第６図は同じ
く請求項２に対応するキャリアテープの変形例の一部を
示す平面図、第７図は請求項３に対応するキャリアテー
プの一部を示す平面図、第８図は第７図■−■線上の縦
断側面図、第９図は請求項３に対応するキャリアテープ
の変形例の一部を示す平面図である。Operation FIG. 1 is a plan view showing a part of the tape for storing small electronic components (hereinafter referred to as carrier tape) corresponding to claim 1 of the present invention, and FIG. 2 is a longitudinal sectional front view taken along the line ■-■ in FIG. , 3rd
The figure is a longitudinal sectional side view taken along the line ■-■ in FIG. 1, and FIG. 4 is a plan view showing a part of the carrier tape corresponding to claim 2.
FIG. 5 is a longitudinal cross-sectional side view taken along the line v-■ in FIG. FIG. 8 is a plan view showing a part of the carrier tape, FIG. 8 is a vertical cross-sectional side view taken along the line ■-■ in FIG. 7, and FIG. 9 is a plan view showing a part of a modified example of the carrier tape corresponding to claim 3. .
すなわち、第１図〜第３図に示すキャリアテープは、側
端部にスプロケットホール（３）を有するテープ体（１
）のほぼ中央部に、該テープ体を裏面側から突出させて
艮ざ方向に相平行する左右一対の部品貼着台（２）を形
成し、さらにこの左右貼着台の間を打法いて窓孔（４）
を設け、該テープ体の裏面に両面接着剤テープ（５）を
貼付けて該テープ接着剤面を前記窓孔（４）より露出さ
せた構造となしたものである。That is, the carrier tape shown in FIGS. 1 to 3 has a tape body (1) having a sprocket hole (3) at the side end.
), a pair of left and right component attachment tables (2) are formed in which the tape body protrudes from the back side and are parallel to each other in the wrapping direction, and furthermore, between these left and right attachment tables, Window hole (4)
A double-sided adhesive tape (5) is attached to the back side of the tape body so that the adhesive surface of the tape is exposed through the window hole (4).
上記貼着台（２）はこの上に接着する小型電子部品（６
）のリード線（６−１）がテープ体表面に接触しない高
さに突設する。The above-mentioned adhesion table (2) is attached to the small electronic parts (6) to be adhered thereon.
) The lead wire (6-1) is provided protrudingly at a height that does not contact the surface of the tape body.
なお、両面接着剤テープ（５）は、テープ状剥離紙の片
面に両面接着剤が貼着された構造となっているものを使
用することができる。Note that the double-sided adhesive tape (5) may have a structure in which a double-sided adhesive is adhered to one side of a tape-like release paper.
リールに巻取られた上記キャリアテープに小型電子部品
（６）を収納する場合は、キャリアテープを巻戻しなが
ら該テープの貼着台（２）上に小型電子部品（６）を載
せ、窓孔（４はり露出している両面接着剤に該電子部品
を接着し、別のリールに巻取って収納する。When storing a small electronic component (6) on the carrier tape wound on a reel, place the small electronic component (6) on the tape adhesion stand (2) while rewinding the carrier tape, and insert the small electronic component (6) into the window hole. (4) Glue the electronic component to the exposed double-sided adhesive, wind it up on another reel, and store it.
このようにしてテーピング包装された小型電子部品を使
用する際は、再び該テープをリールから巻戻し、例えば
チャッキング方式により部品をつかみ、両面接着剤テー
プ（５）の剥離紙を剥離しながら取出す。When using a small electronic component that has been taped and packaged in this way, the tape is rewound from the reel again, the component is gripped by, for example, a chucking method, and the release paper of the double-sided adhesive tape (5) is peeled off and taken out. .
次に、第４図および第５図に示すキャリアテープは、前
記キャリアテープの貼着台の窓孔（４）の部分を凹ませ
た構造の貼着台となしたもので、テープ体（１）を裏面
側から突出させて断面凹形の貼着台（１２）を形成し、
この貼着台の凹部（１２−１）に接着剤（粘着剤＞
（１５）を充填したものでおる。Next, the carrier tape shown in FIG. 4 and FIG. ) protrudes from the back side to form an adhesion stand (12) with a concave cross section,
Adhesive (adhesive>
Filled with (15).
また、＠６図に示すキャリアテープは、中央部に接着剤
充填用凹部（１２−２＞を形成した貼着台（１３）を有
するものである。つまり、接着材充填用凹部は第４図に
示す溝状のみに限らず、第６図に示すように円形の凹部
（１２−２＞にしてもよいのである。In addition, the carrier tape shown in Figure @6 has an adhesion base (13) in which an adhesive filling recess (12-2>) is formed in the center.In other words, the adhesive filling recess is as shown in Figure 4. It is not limited to the groove shape shown in FIG. 6, but may also be a circular recess (12-2>) as shown in FIG.
上記の接着剤充填方式のキャリアテープに小型電子部品
を収納する場合は、リールに巻取られた当該キャリアテ
ープを巻戻しながら貼着台（１２）（１３）に小型電子
部品（６）を載せ、凹部に充填された接着剤（１５）に
て接着して別のリールに巻取る。When storing small electronic components in the above-mentioned adhesive-filled carrier tape, place the small electronic component (6) on the adhesion table (12) (13) while unwinding the carrier tape wound onto the reel. Then, the recess is bonded with an adhesive (15) filled in the recess and wound onto another reel.
このようにしてテーピング包装された小型電子部品を使
用する際は、再び該テープをリールがら巻戻し、例えば
吸引方式等により部品を取出す。When using a small electronic component wrapped in tape in this manner, the tape is rewound again from the reel and the component is taken out by, for example, a suction method.
第７図および第８図に示すキャリアテープは、前記第４
図および第５図に示すキャリアテープの貼着台に小型電
子部品取出用ピン孔（１４）！穿設した構造である。The carrier tape shown in FIG. 7 and FIG.
A pin hole (14) for taking out small electronic components is provided on the carrier tape attachment stand shown in the figure and Figure 5! It is a perforated structure.
また、第９図に示すキャリアテープは、前記第６図に示
すキャリアテープの貼着台の接着剤充填用凹部（１２−
２＞の両サイドに上記と同じピン孔（１４）を穿設した
ものである。Further, the carrier tape shown in FIG. 9 has an adhesive filling recess (12-
2>, the same pin holes (14) as above are bored on both sides.
上記ピン孔付きキャリアテープの場合も、小型電子部品
をテーピング包装する場合は、貼着台の凹部（１２−１
）（１２−２）に充填した接着剤（１５）に小型電子部
品（６）を接着せしめてリールに巻取る。In the case of the above-mentioned carrier tape with pin holes, when taping and packaging small electronic components, it is necessary to use the concave part (12-1
) A small electronic component (6) is adhered to the adhesive (15) filled in (12-2) and wound onto a reel.
このピン孔付きキャリアテープの場合、部品の取出しに
際しては、チャッキング方式や吸引方式とピン孔（１４
）より部品を突上げて取出す方式を併用することができ
る。In the case of this carrier tape with pin holes, when taking out parts, there are two methods: chucking method, suction method, and pin holes (14
) can be used in conjunction with the method of pushing up and taking out the parts.
なお、この発明のキャリアテープの材質としては、特に
限定するものではないが、強度、加工性、コスト等を考
慮するとプラスチックが好適である。The material for the carrier tape of the present invention is not particularly limited, but plastic is preferred in consideration of strength, workability, cost, etc.
発明の詳細
な説明したごとく、この発明方法によれば、次に記載す
る効果を奏する。As described in detail, the method of this invention provides the following effects.
請求項１，２．３に記載の方法によれば、帯状のテープ
体に小型電子部品を浮かして収納することができるので
、部品どうしの干渉が全くなくなるだけでなく、リード
部分が長い部品であってもそのリード部分が曲ったり変
形するようなことが皆無となる。したがって、従来のよ
うなリード部分の曲がり等による不良品の発生はほとん
どなくなる。According to the method described in claims 1 and 2.3, small electronic components can be stored floating on the strip-shaped tape body, so not only is there no interference between components, but also components with long lead portions can be stored. Even if there is, there will be no bending or deformation of the lead part. Therefore, the occurrence of defective products due to bending of lead portions, etc., as in the conventional case, is almost eliminated.
又、小型電子部品は接着剤により固定するので、容易に
はみ出たり、離脱することがないだけでなく、接着剤が
付着した状態で部品をキャリアテープから取出すことが
できるので、仮付けのための接着手段をほどこす必要が
なくなり、仮付（プ作業の簡易迅速化がはかられる。In addition, since small electronic components are fixed with adhesive, they not only do not stick out or come off easily, but also the components can be removed from the carrier tape with the adhesive still attached, making it easy to use for temporary attachment. There is no need to apply adhesive means, making temporary attachment work easier and faster.
ざらに、小型電子部品の収納、取出し、仮付は作業を自
動化することも可能で、電子機器の組立て、製造時間の
短縮化にも大きな効果を奏する。In addition, it is possible to automate the storage, removal, and temporary attachment of small electronic components, which has a significant effect on shortening the assembly and manufacturing time of electronic devices.
このように、この発明に係る収納方法は、リード部分の
長い小型電子部品でも、部品を全く傷めずに収納するこ
とができるのみならず、取出し、仮着は等の面において
も大なる効果を奏し、コンピューター等電子機器の製造
業界にもたらす効果は甚大である。As described above, the storage method according to the present invention not only allows small electronic components with long leads to be stored without damaging them at all, but also has great effects in terms of removal, temporary attachment, etc. This will have a tremendous effect on the manufacturing industry of computers and other electronic devices.
第１図はこの発明の請求項１に対応する小型電子部品収
納用テープの一部を示す平面図、第２図は第１図■−■
線上の縦断正面図、第３図は第１図■−■線上の縦断側
面図、第４図は同じく請求項２に対応するキャリアテー
プの一部を示す平面図、第５図は第４図ｖ−■線上の縦
断側面図、第６図は同じく請求項２に対応するキャリア
テープの変形例を示す平面図、第７図は請求項３に対応
するキャリアテープの一部を示す平面図、第８図は第７
図■−■線上の縦断側面図、第９図は請求項３に対応す
るキャリアテープの変形例の一部を示す平面図である。
１・・・テープ体 ２．１２．１３・・・貼
着台３・・・スプロケットホール ４・・・窓孔５・・
・両面接着剤テープ ６・・・小型電子部品１２−１
．１２−２・・・凹部 １５・・・接着剤！王
！
−〜
７−一
＼FIG. 1 is a plan view showing a part of a tape for storing small electronic components according to claim 1 of the present invention, and FIG.
3 is a longitudinal sectional front view along the line shown in FIG. 1, FIG. 4 is a plan view showing a part of the carrier tape corresponding to claim 2, and FIG. 6 is a plan view showing a modified example of the carrier tape corresponding to claim 2; FIG. 7 is a plan view showing a part of the carrier tape corresponding to claim 3; Figure 8 is the 7th
FIG. 9 is a longitudinal sectional side view taken along the line 1--2, and a plan view showing a part of a modified example of the carrier tape according to claim 3. 1...Tape body 2.12.13...Adhesive stand 3...Sprocket hole 4...Window hole 5...
・Double-sided adhesive tape 6...Small electronic components 12-1
．． 12-2... Concavity 15... Adhesive! king
! −～ 7-1＼
Claims (1)
部品を接着して収納する方法において、前記テープ体に
、該テー体を突出させて形成した該テープ体長さ方向に
相平行する左右一対の部品貼着台を等間隔に連続して設
け、かつ左右の部品貼着台間に窓孔を穿設し、該テープ
体の裏面に両面接着剤テープを貼付けて該テープ接着剤
面を前記窓孔より露出させた収納用テープを用い、前記
左右一対の貼着台上に小型電子部品を接着してリールに
巻取ることを特徴とする小型電子部品の収納方法。 ２ スプロケットホールを有する帯状のテープ体に小型電子
部品を接着して収納する方法において、前記テープ体に
、該テープ体を突出させて形成した断面凹形の部品貼着
台を等間隔に連続して設け、該貼着台の上面凹部に接着
剤を充填した収納用テープを用い、前記貼着台上に小型
電子部品を接着してリールに巻取ることを特徴とする小
型電子部品の収納方法。 ３ スプロケットホールを有する帯状のテープ体に小型電子
部品を接着して収納する方法において、前記テープ体に
、該テープ体を突出させて形成した断面凹形の部品貼着
台を等間隔に連続して設け、かつ該貼着台の上面凹部の
両サイドにピン孔を穿設し、該貼着台の上面凹部に接着
剤を充填した収納用テープを用い、前記貼着台上に小型
電子部品を接着してリールに巻取ることを特徴とする小
型電子部品の収納方法。[Scope of Claims] 1. In a method of adhering and storing small electronic components in a band-shaped tape body having sprocket holes, the tape body is provided with a tape body formed by protruding from the tape body and parallel to each other in the longitudinal direction of the tape body. A pair of left and right component attachment tables are provided consecutively at equal intervals, and a window hole is bored between the left and right component attachment tables, and a double-sided adhesive tape is attached to the back side of the tape body. A method for storing small electronic components, characterized in that the small electronic components are adhered onto the pair of left and right adhesion tables using a storage tape whose surface is exposed through the window hole, and the tape is wound onto a reel. 2. A method of gluing and storing small electronic components on a band-shaped tape body having sprocket holes, in which component attachment stands each having a concave cross-section formed by protruding the tape body are arranged at regular intervals on the tape body. A method for storing small electronic components, characterized in that the small electronic components are adhered onto the adhesive base and wound onto a reel using a storage tape filled with an adhesive in the recessed part of the upper surface of the adhesive base. . 3. A method of gluing and storing small electronic components on a band-shaped tape body having sprocket holes, in which component attachment stands each having a concave cross-section formed by protruding the tape body are arranged at regular intervals on the tape body. A pin hole is formed on both sides of the recessed part of the upper surface of the adhering table, and a small electronic component is placed on the adhering table using a storage tape filled with adhesive in the recessed part of the upper surface of the adhering table. A method for storing small electronic components, which is characterized by gluing them together and winding them onto a reel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63262599A JPH0613327B2 (en) | 1988-10-18 | 1988-10-18 | How to store small electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63262599A JPH0613327B2 (en) | 1988-10-18 | 1988-10-18 | How to store small electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02109815A true JPH02109815A (en) | 1990-04-23 |
| JPH0613327B2 JPH0613327B2 (en) | 1994-02-23 |
Family
ID=17378035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63262599A Expired - Lifetime JPH0613327B2 (en) | 1988-10-18 | 1988-10-18 | How to store small electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0613327B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06219412A (en) * | 1993-01-19 | 1994-08-09 | Norie Shiyouji | Electronic part housing method, and housing tape therefor |
| WO1998052845A1 (en) * | 1997-05-21 | 1998-11-26 | Nissho Corporation | Conveyor belt for electronic parts |
| US5964352A (en) * | 1996-05-30 | 1999-10-12 | Nissho Corporation | Carrier band of electronic parts |
| US6101790A (en) * | 1997-07-23 | 2000-08-15 | Matsushita Electric Industrial Co., Ltd | Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts |
| US6142306A (en) * | 1997-05-21 | 2000-11-07 | Nissho Corporation | Carrier band of electronic parts |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63281968A (en) * | 1987-05-15 | 1988-11-18 | Hitachi Ltd | Taping form of resin molded part |
-
1988
- 1988-10-18 JP JP63262599A patent/JPH0613327B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63281968A (en) * | 1987-05-15 | 1988-11-18 | Hitachi Ltd | Taping form of resin molded part |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06219412A (en) * | 1993-01-19 | 1994-08-09 | Norie Shiyouji | Electronic part housing method, and housing tape therefor |
| US5964352A (en) * | 1996-05-30 | 1999-10-12 | Nissho Corporation | Carrier band of electronic parts |
| WO1998052845A1 (en) * | 1997-05-21 | 1998-11-26 | Nissho Corporation | Conveyor belt for electronic parts |
| EP1002740A1 (en) * | 1997-05-21 | 2000-05-24 | Nissho Corporation | Carrier band of electronic parts |
| US6142306A (en) * | 1997-05-21 | 2000-11-07 | Nissho Corporation | Carrier band of electronic parts |
| US6101790A (en) * | 1997-07-23 | 2000-08-15 | Matsushita Electric Industrial Co., Ltd | Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts |
| US6250051B1 (en) | 1997-07-23 | 2001-06-26 | Matsushita Electric Industrial Co., Ltd. | Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0613327B2 (en) | 1994-02-23 |
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