JPH074223Y2 - Electronic component tape-shaped package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to an improvement of a tape-shaped package for storing and transporting electronic components in a storage recess.

[Prior Art] An example of a tape-shaped packaging body of a conventional electronic component of this type is described in
Shown in FIGS. Small electronic parts, especially chip-shaped electronic parts, have advanced into a wide range of various consumer and industrial equipment fields in accordance with the needs of the times, and are mass produced and used. Not to mention the importance of the manufacturing process of these chip-shaped electronic components, the packaging means must also prevent damage to the product during transportation, maintain accuracy, and save labor. It is one of those things. In addition, when these chip-shaped electronic components are incorporated in a circuit board, it is usual to use a chip mounter or the like that is automated for mass production, so it is necessary to devise a packaging suitable for automatic operation.

3 to 5, 4 is a cylindrical chip-shaped ceramic capacitor. The chip-shaped electronic components are the same in packaging, such as resistors and inductors. There are prismatic shapes, rectangular shapes, etc., but these packing means can be the same. Here, a case of a cylindrical chip-shaped ceramic capacitor (hereinafter referred to as an electronic component) will be described as a representative example of those small electronic components. Reference numeral 1 is a tape-shaped package, in which a carrier tape 5 and a cover tape 6 are laminated and adhered to form a pair. The carrier tape 5 is provided with a chip hole 2 that is a recess for housing the electronic component 4.

The electronic component 4 is placed in the chip hole 2 of the carrier tape 5.
Is continuously inserted by an automatic inserter (not shown), the cover tape 6 is overlapped and thermally bonded to the carrier tape 5 by hot melt processing, and the chip hole 2
Is closed to form the tape-shaped package 1.

In the above-mentioned hot melt processing, the cover tape 6 which is slightly narrower than the carrier tape 5 is laid on the carrier tape 5 in which the electronic component 4 is housed in the chip hole 2, and the cover tape 6 is formed.
An electric iron trowel (not shown) was applied from above, and the carrier tape 5 was continuously moved while applying heat and laminated and adhered to prevent mutual contact and drop of electronic components. That is, as shown in FIG. 3, the adhesive portion formed a three-line seal line. However, if the seal lines passing through both ends of the component accommodating concave portion are continuous in this manner, the peeling strength of the cover tape is too strong, and the cover tape is liable to break in the middle.

As described above, the electronic component 4 is independently housed in the chip hole 2 of the carrier tape 5, and as shown in FIG.
The reel (not shown) starts to be wound from the portion A, followed by the chip component mounting portion B, then the empty chip hole portion C, and finally the leader portion D to finish the winding. In part A and part C, the chip holes of about 10 pitches are left empty. When incorporated in a circuit board, it is pulled out from the reader D in the direction of the arrow and used. About 3000 electronic components are stored on a reel, and several reels are put together in a packaging box and transferred. In the case of incorporating the electronic component 4 into the circuit board, the cover tape 6 was peeled from the carrier tape 5 as shown by the arrow as shown in FIG. 5, and the electronic component 4 was taken out and used.

[Problems to be Solved by the Invention] In the above-mentioned conventional technique, the component accommodating recesses are provided in parallel at a predetermined interval so that the longitudinal direction of the component accommodating recesses is perpendicular to the longitudinal direction of the long carrier tape. ing. An electronic component is stored in the component storage recess of the carrier tape, a cover tape is placed on it, and an electric iron trowel is applied from above the cover tape along the longitudinal direction of the tape to continuously move and heat the carrier tape. And a cover tape were laminated and adhered to each other to form a tape-shaped package for electronic parts. For this reason, the laminated and bonded portion has three sealing lines as shown in FIG. 3, so that the electronic parts are prevented from falling or mutual adhesion. On the other hand, when this electronic component is taken out and mounted on a circuit board or the like, the peeling strength of the cover tape is too strong because the seal line passing through both ends of the component accommodating recess is continuous. In addition, there is a problem that the cover tape is easily cut on the way. Further, when all the three seal lines cross the component housing recess, both ends of the component housing recess are not adhered, and when the electronic component tape-shaped package is bent, a carrier tape and a cover tape are formed. A gap is created between the electronic components and the electronic component falls through the gap. Also,
Although it is not possible to make the seal line discontinuous by raising and lowering the electric iron, control is complicated and difficult, and the adhesive strength tends to vary.

In view of the above-mentioned problems of the prior art, an object of the present invention is to provide a tape-shaped electronic part that can solve the problems of the prior art by intermittently providing a seal line passing through both ends of a recess for storing parts. To provide a package.

[Means for Solving the Problems] An object of the present invention is to include a pair of long tapes to be laminated and bonded, and at least one of the tapes is provided with component accommodating recesses at a predetermined interval. The electronic parts are stored, the other tape is superposed on this tape, and these tapes are arranged along the longitudinal direction of the tape and along three lines passing through both ends and the central part of the above-mentioned component storage recess. In a tape-shaped electronic component packaging body that is sealed by sealing the component storage recess, the component storage recess is formed to be inclined with respect to the longitudinal direction of the tape, and the tape seals cross the component storage recess. It is achieved by an electronic component tape-shaped package characterized by being formed as described above.

[Operation] According to the electronic component tape package configured as described above, the seal lines passing through both ends of the component housing recess can be formed intermittently. Therefore, the adhesive strength due to the heat fusion does not become too strong or too weak, and an appropriate adhesive strength can be generally obtained, so that the laminated adhesion that ensures the seal and is easy to peel off can be performed.

[Embodiment] An embodiment of the electronic component tape-shaped package of the present invention will be described below with reference to FIGS. 1 and 2A and 2B.

In FIG. 1, reference numeral 4 is an electronic component. As described in the conventional example, the electronic component package of the present invention can be applied to various small electronic components in the same form. Describe. The electronic component 4 is a chip hole 2 provided on a long carrier tape 5 and serving as a component accommodating recess.
Is stored in. After storage, a cover tape 6 (shown by hatching) forming a pair with the carrier tape 5 is laminated and adhered to the carrier tape 5, and the chip hole 2 is closed to form an electronic component tape-shaped package. The width of the cover tape 6 is made narrower than that of the carrier tape 5, and the cover tape 6 is adhered so as not to block the feed hole 3 or to protrude from the carrier tape 5. Therefore, the feed hole 3 of the carrier tape 5
There is no cover tape 6 in the part with. The feed hole 3
Is pierced so that it can be set in the automatic insertion machine that automatically inserts the electronic component 4 into the chip hole 2 of the carrier tape 5 or in the feeding mechanism of the automatic mounting machine when the electronic component 4 is incorporated in the circuit board. ing. In this embodiment, the feed hole 3
Is provided on one side of the carrier tape 5, but it may be provided on both ends.

In the above electronic component tape-shaped package, the chip hole 2 which is a recess for accommodating the electronic component 4 is provided in a form inclined by an angle θ of 0 ° <θ <90 ° with respect to the longitudinal direction of the carrier tape 5. The chip holes 2 are formed at predetermined intervals in the longitudinal direction of the carrier tape 5. FIG. 2A is a diagram for explaining the inclination angle θ of the chip hole 2, in which the line parallel to the longitudinal direction of the carrier tape 5 is the X axis and the line orthogonal to this is the Y axis, and the left side of the chip hole 2 is shown. Is an example in the case where the angle θ with the Y axis is approximately 23 °. If the same angle θ is selected within the range of 0 ° <θ <90 °, even if the seal line 7 of the electronic component 4 is formed by three lines passing through both ends and the center of the chip hole 2, 2-line seal line 7 passing through
Continues as shown in FIG.

That is, even if the carrier tape 5 is continuously moved in the state where the two sealing lines 7 passing through the both ends of the chip hole 2 are pressed with the heating tape (not shown) onto the cover tape 6, the chip lines are Since the pressure of the trowel is not applied to the portion of the hole 2, it is formed in a dotted line shape. The seal line 7 passing through the central portion of the chip hole 2 has a shorter dotted line shape. The carrier tape 5 and the cover tape 6 are laminated and adhered by a plurality of discontinuous seal lines 7 which are thin as a whole. Therefore, it is possible to provide a tape-like package for electronic parts, which is not too strong or too weak in adhesive strength due to heat fusion, is sealed with a moderate adhesive strength, is easy to peel off, and has a reliable seal. It has an effect.

Although the above embodiment describes the embossed type packaging body in which the chip hole 2 is provided in the carrier tape 5,
A carrier tape having a considerable thickness, a package body of a type in which a recess is formed as a component storage portion, or the like has a similar effect as long as it is a package body made of a pair of long tapes that are laminated and used. is there. Also, the effect is the same when the inclination angle θ of the component accommodating recess is 360 °>θ> 270 ° as shown in FIG. 2 (b). However, θ is 0 ° (360 °), 90 °, 1
There is no effect at 80 ° and 270 °. Second quadrant and third
Considering the quadrant, the case of the fourth quadrant of FIG. 2B and the first quadrant of FIG. 2A may be applied.

[Advantages of the Invention] As can be seen from the above description, according to the present invention, the component accommodating recesses are formed to be inclined with respect to the longitudinal direction of the tape, and the sealing lines of the tapes are intermittently cut across the component accommodating recesses. Therefore, since an appropriate adhesive force with little variation can be obtained by heat fusion, there is an effect that it is possible to provide an electronic component tape-shaped package which is easily peeled off and which is surely sealed.

[Brief description of drawings]

FIG. 1 is a plan view showing an electronic component tape-shaped package according to an embodiment of the present invention, FIGS. 2 (a) and 2 (b) are explanatory views of the same embodiment, and FIGS. FIG. 5 is a plan view showing a conventional example of an electronic component tape-shaped package, and FIG. 5 is a transverse sectional view of the conventional example. 2 ... Chip hole, 4 ... Electronic component, 5 ... Carrier tape, 6 ... Cover tape, 7 ... Seal line

Claims (1)

[Scope of utility model registration request] 1. A pair of long tapes that are laminated and bonded together, wherein at least one tape is formed with component storage recesses at predetermined intervals, and electronic components are stored in the component storage recesses, and the other tape is The tapes are overlapped with each other, and these tapes are sealed along the longitudinal direction of the tape and along the three lines passing through both ends and the central portion of the component accommodating recess, and the component accommodating recess is closed. In the electronic component tape package, the electronic component is characterized in that the component storage recess is formed to be inclined with respect to the longitudinal direction of the tape, and the tape seals are formed so as to cross the component storage recess. Parts tape-shaped package.