JPH02219761A - Tape for receiving chiplike electronic part - Google Patents
Tape for receiving chiplike electronic partInfo
- Publication number
- JPH02219761A JPH02219761A JP1038741A JP3874189A JPH02219761A JP H02219761 A JPH02219761 A JP H02219761A JP 1038741 A JP1038741 A JP 1038741A JP 3874189 A JP3874189 A JP 3874189A JP H02219761 A JPH02219761 A JP H02219761A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- lead
- receiving
- main body
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001105 regulatory effect Effects 0.000 abstract description 3
- 230000000452 restraining effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は、リードが部品本体より突出した多数のチップ
状電子部品を略等間隔を存してベーステープに形成され
た収納部内に収納して、カバーテープで封入したチップ
状電子部品の収納テープに関する。DETAILED DESCRIPTION OF THE INVENTION (A) Industrial Application Field The present invention provides a method for storing a large number of chip-shaped electronic components whose leads protrude from the component body at approximately equal intervals in a housing formed in a base tape. The present invention relates to a storage tape for chip-shaped electronic components sealed with a cover tape.
（ロ）従来の技術
高周波トランジスタなど、比較的長いリードを持つチッ
プ状電子部品をテープに保持する技術が、特開昭５４−
１４９６３８号公報、特開昭５９−１４７４９８号公報
に開示されている。(b) Conventional technology A technology for holding chip-shaped electronic components with relatively long leads, such as high-frequency transistors, on tape was developed in JP-A-54-
It is disclosed in Japanese Patent Laid-open No. 149638 and Japanese Patent Application Laid-open No. 147498/1983.
斯る従来技術にあっては、テープの運搬等の取扱い中に
前記電子部品が粘着テープから剥がれて脱落したり、ま
た保持位置がずれ易いという欠点がある。Such conventional technology has the drawback that the electronic components are likely to peel off from the adhesive tape and fall off during handling such as transportation of the tape, or that the holding position is likely to shift.
また、エンボステープに前記電子部品を収納する技術が
、実開昭６３−１１１４６２号公報に開示されている。Further, a technique for housing the electronic components in an embossed tape is disclosed in Japanese Utility Model Application Publication No. 111462/1983.
この技術も、リード先端のカット面コーナ一部にはパリ
があるので、これがエンボスを形成する壁面に引っかか
り、取出しの際の邪魔となって、ときに取出せないこと
がある。In this technique, too, there is a burr at a part of the cut surface corner of the tip of the lead, which gets caught on the wall surface forming the embossing and becomes a hindrance when taking out the lead, sometimes making it impossible to take it out.
更に、特開昭６２−１８２０６３号公報に開示する技術
にあっては、電子部品本体であるモールドの外形面で位
置規制しているが、この外形にはモールドの成形時に金
型の合わせ面部に大きなバノが出易く、収納・取出しが
不安定となる欠点がある。Furthermore, in the technology disclosed in JP-A No. 62-182063, the position is regulated by the outer shape of the mold, which is the main body of the electronic component. The drawback is that large bags tend to come out, making storage and removal unstable.
くハ）発明が解決しようとする課題
そこで本発明は、テープ内に電子部品を位置ズレがなく
収納すると共に、確実に取出しができるようにすること
を目的とする。(c) Problems to be Solved by the Invention Therefore, an object of the present invention is to store electronic components in a tape without shifting their positions, and also to ensure that they can be taken out.
（ニ）課題を解決するための手段
そこで本発明は、リードが部品本体より突出した多数の
チップ状電子部品を略等間隔を存してベーステープに形
成された収納部内に収納して、カバーテープで封入した
チップ状電子部品の収納テープに於いて、前記リードの
幅方向を規制する壁面により、前記収納部内での前記電
子部品の位置を規制するようにしたものである。(d) Means for Solving the Problems Therefore, the present invention provides a method for storing a large number of chip-shaped electronic components whose leads protrude from the component main body in storage portions formed on a base tape at approximately equal intervals, and then covering them with a cover. In the storage tape for chip-shaped electronic components sealed with tape, the position of the electronic component within the storage section is restricted by a wall surface that restricts the width direction of the leads.
また本発明は、リードが部品本体より突出した多数のチ
ップ状電子部品を略等間隔を存してベーステープに形成
された収納部内に収納して、カバーテープで封入したチ
ップ状電子部品の収納テープに於いて、前記収納部を、
前記部品本体を収納する本体収納部と、該本体収納部に
連通し前記部品本体より突出したリードを収納するリー
ド収納部とから構成し、前記リード収納部には前記リー
ドの先端部が当接しないようなリード逃し部を形成した
ものである。Further, the present invention provides storage of chip-shaped electronic components in which a large number of chip-shaped electronic components whose leads protrude from the component body are stored at approximately equal intervals in a storage section formed on a base tape, and the chip-shaped electronic components are sealed with a cover tape. In the tape, the storage section is
It is composed of a main body storage part that stores the component body, and a lead storage part that communicates with the main body storage part and stores the lead that protrudes from the component body, and the tip of the lead comes into contact with the lead storage part. A lead relief part is formed to prevent the lead from leaking.
（＊）作用
チップ状電子部品の収納部内の位置は、該電子部品本体
より突出したリードの幅方向を規制する壁面により規制
され、ベーステープに形成された収納部内に位置ズレな
く収納される。(*) The position of the active chip-shaped electronic component in the housing is regulated by a wall surface that regulates the width direction of the leads protruding from the electronic component body, and the electronic component is housed in the housing formed on the base tape without any displacement.
また前記収納部を形成するリード収納部のリード逃し部
によって、前記電子部品のリード先端部が該収納部を形
成する壁面に当接することが防止される。Further, the lead relief portion of the lead storage portion forming the storage portion prevents the lead end portion of the electronic component from coming into contact with the wall surface forming the storage portion.
（へ）実施例
以下本発明の一実施例について図に基づき説明する。先
ずテープ（１）は、ベーステープ（２）とカバーテープ
（３）とから成り、該ベーステープ（２）はチップ状電
子部品、例えば高周波トランジスタ（４〉を収納する収
納部り５〉が略等間隔を存して形成されている。(f) Example Hereinafter, an example of the present invention will be described based on the drawings. First, the tape (1) is composed of a base tape (2) and a cover tape (3). They are formed at equal intervals.
前記トランジスタ（４）は、第２図に示すように円筒形
状の部品本体（６）と、該本体（６）の円筒外側部に突
設した互いに直交する４本のり一ド（７）とから成る。As shown in FIG. 2, the transistor (4) consists of a cylindrical component body (6) and four mutually orthogonal ropes (7) protruding from the outside of the cylinder of the body (6). Become.
次に該トランジスタ（４）を複数収納する前記テープ（
１）について説明する。前記収納部（５）は、大きく分
けて前記部品本体（６）を収納する本体収納部（８）と
、前記各リード（７）を収納するリード収納部（９）と
から成る。前記本体収納部（８）は、前記部品本体（６
）にできるパリ（１０）を考慮して収納されたときにあ
る程度の余裕をもった間隔が保てるように形成される。Next, the tape (
1) will be explained. The storage section (5) is roughly divided into a main body storage section (8) that stores the component main body (6), and a lead storage section (9) that stores the leads (7). The main body storage section (8) contains the component main body (6).
) is formed so that a certain amount of spacing can be maintained when stored, taking into account the space (10) that can be created.
また該本体収納部（８）に連通ずる前記各リード収納部
（９）は、前記リード（７）と平行な対向する壁面（１
１）（１２）により形成きれ、両壁面（１１）（１２）
は、収納部（５）内に前記トランジスタ（４）が収納さ
れたときに、該収納部（５）内での位置ズレが起こらな
いように前記各リード（７）を規制するものである。Further, each of the lead storage parts (9) communicating with the main body storage part (8) has an opposing wall surface (1) parallel to the leads (7).
1) Completed formation by (12), both wall surfaces (11) (12)
This is to restrict each lead (7) so that when the transistor (4) is housed in the housing part (5), the leads (7) will not be misaligned in the housing part (5).
また前記リード収納部（９）の先端部には、前記壁面（
１１）（１２）間の間隔が拡開した略円状の逃し部（１
３）が形成されている。これによりトランジスタ（４）
が収納された場合に、リード（７）先端のカット面が収
納部（５）を形成する壁面に当接することが防止される
。Further, the tip of the lead storage portion (9) is provided with the wall surface (
11) A substantially circular relief part (1) with a widened interval between (12)
3) is formed. This results in transistor (4)
When the lead (7) is stored, the cut surface of the tip of the lead (7) is prevented from coming into contact with the wall surface forming the storage part (5).
しかも、収納部（５）に該トランジスタ（４）が収納さ
れて、該トランジスタ（４）がいずれかの逃し部（１３
）に寄った場合でも（第５図参照）、そこに位置するリ
ード（７）の先端は前記壁面（１１）（１２）及び逃し
部（１３）を形成する壁面に当接しないように、また該
トランジスタ（４）が片寄った逃し部（１３）に相対向
する側の逃し部（１３）に於いてもそこに位置するり一
ド〈７）の先端部はその逃し部（１３）内にあるように
、また部品本体（６）周側面が収納部（５）を形成する
壁面に当接しないように、前記各壁面（１１）（１２）
により各リード（７）の移動を規制できる寸法とするこ
とが望ましい。Moreover, the transistor (4) is housed in the housing part (5), and the transistor (4) is connected to any one of the escape parts (13).
) (see Figure 5), the tip of the lead (7) located there should be careful not to come into contact with the walls (11), (12) and the wall forming the relief part (13). Also in the relief part (13) on the side opposite to the relief part (13) where the transistor (4) is biased, the tip of the guide (7) located there is also placed in the relief part (13). The respective wall surfaces (11) and (12) are arranged so that the circumferential side surface of the component body (6) does not come into contact with the wall surface forming the storage section (5).
It is desirable that the dimensions are such that the movement of each lead (7) can be restricted.
なお、（１４）は前記テープ（１）を所定ピッチずつ間
欠的に送るための係合孔であり、供給リールに巻かれた
該テープを送りピンが前記係合孔（１４）に係合して所
定ピッチずつ送るように構成される。Note that (14) is an engagement hole for intermittently feeding the tape (1) at a predetermined pitch, and a feeding pin engages the tape wound on the supply reel with the engagement hole (14). It is configured to feed the paper by a predetermined pitch.
そして送りの際、前記カバーテープ（３）が剥離され、
収納部（５）内のトランジスタ（４）が取出し具により
取出され、プリント基板上に順次装着される。この場合
、収納部内でのトランジスタ（４）の位置ズレがなく、
部品本体（６）の周側面のパリ（１０）が収納部（５）
の壁面に当接することもなく、またリード（７）の先端
部が逃し部（１３）により収納部（５）の壁面に引掛る
こともないから、取出し具による取出しが確実である。Then, during feeding, the cover tape (3) is peeled off,
The transistors (4) in the storage section (5) are taken out by a take-out tool and sequentially mounted on a printed circuit board. In this case, there is no misalignment of the transistor (4) within the housing,
The edge (10) on the peripheral side of the component body (6) is the storage part (5)
Since the lead (7) does not come into contact with the wall of the housing part (5), and the tip of the lead (7) does not get caught on the wall of the storage part (5) by the relief part (13), the lead can be taken out reliably using the take-out tool.
（ト）発明の効果
以上のように本発明は、リードの幅方向を規制する壁面
により、テープの収納部内でのチップ状電子部品の位置
を規制するようにしたから、テープ内で位置ズレが防止
でき、部品本体が収納部内壁に当接せず該本体にパリが
あっても該パリによる取出不良は防止される。(G) Effects of the Invention As described above, the present invention uses the wall surface that regulates the width direction of the leads to regulate the position of the chip-shaped electronic component within the tape housing, thereby preventing misalignment within the tape. Even if the main body of the component does not come into contact with the inner wall of the storage portion and there is a burr on the main body, defective removal due to the burr is prevented.
また前記収納部にはリード逃し部を形成したから、該電
子部品のリード先端部が当接せず引掛ることがないから
、該収納部からの電子部品の取出しの邪魔となることが
ない。Further, since the lead relief portion is formed in the storage portion, the leading end portion of the lead of the electronic component does not come into contact with the electronic component and is not caught, so that it does not interfere with the removal of the electronic component from the storage portion.
第１１５０は本発明の実施例を示すテープの要部斜視図
、第２図は高周波トランジスタの斜視図、第３図はカバ
ーテープが剥離されている状態であって前記トランジス
タが収納された状態を示すテープ平面図、第４図はテー
プの要部断面図、第５図は前記トランジスタがある逃し
部に寄った場合のテープ平面図を夫々示す。
（１）・・・テープ、 （４）・・・高周波トランジス
タ、（５）・・・収納部、 （７）・・・リード、 （
８）・・・本体収納部、 （９）・・・リード収納部、
（１１）（１２）・・・壁面、（１３）・・・逃し部
。1150 is a perspective view of a main part of a tape showing an embodiment of the present invention, FIG. 2 is a perspective view of a high frequency transistor, and FIG. 3 is a state in which the cover tape is peeled off and the transistor is housed. FIG. 4 is a sectional view of a main part of the tape, and FIG. 5 is a plan view of the tape when the transistor is near a certain relief part. (1)...tape, (4)...high frequency transistor, (5)...storage section, (7)...lead, (
8)...Body storage section, (9)...Lead storage section,
(11) (12)...Wall surface, (13)...Relief portion.
Claims (2)
子部品を略等間隔を存してベーステープに形成された収
納部内に収納して、カバーテープで封入したチップ状電
子部品の収納テープに於いて、前記リードの幅方向を規
制する壁面により、前記収納部内での前記電子部品の位
置を規制するようにしたことを特徴とするチップ状電子
部品の収納テープ。(1) A storage tape for chip-shaped electronic components, in which a large number of chip-shaped electronic components with leads protruding from the main body of the component, are stored at approximately equal intervals in storage areas formed on the base tape, and sealed with a cover tape. A storage tape for chip-shaped electronic components, characterized in that the position of the electronic component within the storage section is restricted by a wall surface that restricts the width direction of the leads.
子部品を略等間隔を存してベーステープに形成された収
納部内に収納して、カバーテープで封入したチップ状電
子部品の収納テープに於いて、前記収納部を、前記部品
本体を収納する本体収納部と、該本体収納部に連通し前
記部品本体より突出したリードを収納するリード収納部
とから構成し、前記リード収納部には前記リードの先端
部が当接しないようなリード逃し部を形成したことを特
徴とするチップ状電子部品の収納テープ。(2) A large number of chip-shaped electronic components with leads protruding from the component body are housed at approximately equal intervals in the storage areas formed on the base tape, and the chip-shaped electronic component storage tape is sealed with a cover tape. The storage section includes a main body storage section that stores the component main body, and a lead storage section that communicates with the main body storage section and stores a lead that protrudes from the component main body, and the lead storage section includes: A storage tape for chip-shaped electronic components, characterized in that a lead relief part is formed so that the tip of the lead does not come into contact with the tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1038741A JPH02219761A (en) | 1989-02-17 | 1989-02-17 | Tape for receiving chiplike electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1038741A JPH02219761A (en) | 1989-02-17 | 1989-02-17 | Tape for receiving chiplike electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02219761A true JPH02219761A (en) | 1990-09-03 |
Family
ID=12533743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1038741A Pending JPH02219761A (en) | 1989-02-17 | 1989-02-17 | Tape for receiving chiplike electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02219761A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5913425A (en) * | 1997-12-08 | 1999-06-22 | Peak International, Inc. | Component carrier having anti-reflective pocket |
| US6016917A (en) * | 1997-04-24 | 2000-01-25 | Peak International, Inc. | Component carrier having a pocket including a pedestal |
| WO2018189783A1 (en) * | 2017-04-10 | 2018-10-18 | 株式会社芝浦電子 | Packaging body |
-
1989
- 1989-02-17 JP JP1038741A patent/JPH02219761A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6016917A (en) * | 1997-04-24 | 2000-01-25 | Peak International, Inc. | Component carrier having a pocket including a pedestal |
| US6168026B1 (en) | 1997-04-24 | 2001-01-02 | Paek International, Inc. | Component carrier having high strength pocket |
| US5913425A (en) * | 1997-12-08 | 1999-06-22 | Peak International, Inc. | Component carrier having anti-reflective pocket |
| WO2018189783A1 (en) * | 2017-04-10 | 2018-10-18 | 株式会社芝浦電子 | Packaging body |
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