JPS6127258B2 - - Google Patents
Info
- Publication number
- JPS6127258B2 JPS6127258B2 JP57233230A JP23323082A JPS6127258B2 JP S6127258 B2 JPS6127258 B2 JP S6127258B2 JP 57233230 A JP57233230 A JP 57233230A JP 23323082 A JP23323082 A JP 23323082A JP S6127258 B2 JPS6127258 B2 JP S6127258B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- double
- sided adhesive
- electronic components
- storage hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003860 storage Methods 0.000 claims description 46
- 239000000853 adhesive Substances 0.000 claims description 38
- 230000001070 adhesive effect Effects 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 33
- 239000002390 adhesive tape Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、コンピユーター等の電子機器に使
用されるチツプコンデンサ、セラミツクコンデン
サ、抵抗器等の小型電子部品を収納する方法に係
り、特に帯状のテープ体に穿設した多数の孔に両
面接着剤テープを用いて電子部品を貼着してリー
ルに巻取る方式の小型電子部品の収納方法に関す
る。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a method for storing small electronic components such as chip capacitors, ceramic capacitors, and resistors used in electronic equipment such as computers, and particularly relates to a method for storing small electronic components such as chip capacitors, ceramic capacitors, and resistors used in electronic devices such as computers. The present invention relates to a method for storing small electronic components in which the electronic components are pasted using double-sided adhesive tape into a large number of holes drilled in the paper and then wound onto a reel.
従来技術とその問題点
コンピユーター等の電子機器に使用されるチツ
プコンデンサ、セラミツクコンデンサ等の小型電
子部品は、主にコンピユーターの分野で使用され
るものであるため、その個数は膨大な量（億単
位）であり、業界では包装、保存に苦慮していた
が、最近ではこのような小型電子部品を一般にキ
ヤリアテープと呼ばれる帯状のテープ体に収納し
てリールに巻取る方式が採用されている。Prior art and its problems Small electronic components such as chip capacitors and ceramic capacitors used in electronic devices such as computers are mainly used in the field of computers, so the number of them is enormous (in billions). ), and the industry has struggled with packaging and storage, but recently a method has been adopted in which such small electronic components are generally stored in a band-shaped tape body called carrier tape and wound on a reel.
上記のキヤリアテープによる収納方法は、例え
ば帯状のテープ体（紙製、プラスチツク製等）に
所定の大きさの収納ボツクスとスプロケツトホー
ルが等間隔に設けられたキヤリアテープを用い、
このテープの収納ボツクスに小型電子部品単体を
収納してリールに巻取る方法がある。しかし、こ
の種のキヤリアテープによる場合は収納された小
型電子部品単体が収納ボツクスよりはみ出たり、
離脱し易い等の欠点があり好ましくなかつた。 The storage method using a carrier tape described above uses, for example, a carrier tape in which storage boxes of a predetermined size and sprocket holes are provided at equal intervals on a band-shaped tape body (made of paper, plastic, etc.).
There is a method of storing individual small electronic components in the storage box of this tape and winding it onto a reel. However, when using this type of carrier tape, the small electronic components stored may protrude from the storage box, or
It was not preferred because it had drawbacks such as easy separation.
上記の収納方法に替り、帯状のテープ体に多数
の収納用孔を穿孔し、このテープ体の片面に粘着
層付きのテープを貼付けて底部を形成してなるテ
ープを用い、収納孔より露出した粘着層に電子部
品を接着する方式が提案されてる（実開昭57−
157199等）。この粘着層付きのテープを用いたキ
ヤリアテープにより電子部品を収納する方式の場
合は、電子部品が粘着層に接着されるため前記の
ような離脱や位置ずれはなくなるが、電子部品の
取出しが不確実となるという難点がある。かかる
難点を解消するため、実開昭57−157199には、収
納孔の底部に透孔を設け、この透孔よりピン等を
使用して突き上げる方式により電子部品を取出す
方法が記載されている。しかし、この取出し方式
でか透孔とピンの位置合せ機構、ピンの上下動機
構等を備えた装置を必要とし、装置の複雑化をま
ぬがれない上、非能率的である。 Instead of the above-mentioned storage method, we use a tape consisting of a band-shaped tape body with a number of holes for storage, and a tape with an adhesive layer attached to one side of the tape body to form the bottom. A method of adhering electronic components to an adhesive layer has been proposed (Utility Model Application No. 57-
157199 etc.). In the case of a method of storing electronic components using a carrier tape using tape with an adhesive layer, the electronic components are adhered to the adhesive layer, eliminating the above-mentioned detachment and positional shift, but it is difficult to take out the electronic components. There is a problem with being certain. In order to overcome this difficulty, Japanese Utility Model Application No. 57-157199 describes a method for removing electronic components by providing a through hole at the bottom of the storage hole and pushing up the electronic component through the through hole using a pin or the like. However, this extraction method requires a device equipped with a mechanism for aligning the pin with the through hole, a mechanism for moving the pin up and down, etc., which inevitably complicates the device and is inefficient.
一方、この種の電子部品は一般に接着剤で仮付
けしてからはんだ付け等により本取付けが行なわ
れる。しかるに、前記したようなキヤリアテープ
を含め、電子部品をキヤリアテープに収納する方
式は一般に部品単体がそのままテープに収納され
ているのみであるから、電子機器等に取付ける場
合はキヤリアテープから取出した後で仮付けのた
めの接着手段を施さなければならなかつた。すな
わち、キヤリアテープから取出した部品単体に接
着剤を塗布あるいは両面接着剤を貼着するか、ま
たは機器側にあらかじめ接着剤を塗布あるいは両
面接着剤を貼着して仮付けする方法がとられる。 On the other hand, this type of electronic component is generally temporarily attached with an adhesive and then permanently attached by soldering or the like. However, in the method of storing electronic components on carrier tape, including the carrier tape mentioned above, generally the individual components are simply stored on the tape, so when installing them on electronic equipment etc., after removing them from the carrier tape. Therefore, it was necessary to apply adhesive means for temporary attachment. That is, a method is used in which a single component taken out from a carrier tape is coated with an adhesive or a double-sided adhesive is applied, or an adhesive is applied or a double-sided adhesive is applied on the device side in advance and the component is temporarily attached.
そこで、このような作業を省略し、仮付け作業
の簡易迅速化をはかる方法として、電子部品に接
着剤を転写付着せしめて取出すことが可能なテー
プが提案されている（特開昭54−143396）。この
テープは構造的には所定の開孔を有する紙テープ
と接着剤塗布テープを相重ねてつくられたもので
あつて、開孔内に接された部品を取出すとその部
品に接着剤が付着するようになつている。しか
し、このテープの場合、仮に吸引方式、チヤツキ
ング方式、突き上げ方式等により部品を取出すに
しても、電子部品を接着する開孔は接着剤塗布テ
ープで底部全面が閉塞されているため、電子部品
の離脱が容易に行なえない欠点があり、また、テ
ープにスプロケツトホール等もないため、仮にこ
のようなテープをリール等に巻取り、また巻戻し
て電子部品を取出す方法をとる場合に、巻取り、
巻戻し作業が円滑にできないのみならず、電子部
品の収納、取出し、仮付け等の自動化も難しく、
実用性に欠ける。 Therefore, as a method of omitting such work and simplifying and speeding up the temporary attachment work, a tape has been proposed that can transfer adhesive onto electronic components and then take them out (Japanese Patent Application Laid-Open No. 143396-1982). ). Structurally, this tape is made by layering paper tape with predetermined openings and adhesive-coated tape, and when a part that is in contact with the opening is removed, the adhesive adheres to that part. It's becoming like that. However, in the case of this tape, even if the component is removed using a suction method, chucking method, push-up method, etc., the opening for attaching the electronic component is completely blocked at the bottom by adhesive-coated tape, so the electronic component cannot be removed. The drawback is that it cannot be easily removed, and the tape does not have sprocket holes. ,
Not only is it difficult to rewind smoothly, but it is also difficult to automate the storage, removal, and temporary attachment of electronic components.
Lacks practicality.
発明の目的
この発明は、従来の前記諸問題を解決するため
になされたもので、キヤリアテープから取出した
部品単体に対する仮付け用接着剤の塗布または貼
着作業、あるいは機器側にあらかじめ接着剤を塗
布または貼着する作業を省略でき、仮付け作業の
簡易迅速化がはかられる上、電子部品を容易にし
かもスムースに取出すことが可能な小型電子部品
の収納方法を提案することを目的とするものであ
る。Purpose of the Invention The present invention has been made to solve the above-mentioned conventional problems. The purpose of the present invention is to propose a storage method for small electronic components that can omit the work of applying or pasting, simplify and speed up the temporary attachment work, and also enable easy and smooth removal of electronic components. It is something.
発明の構成
この発明に係る電子部品の収納方法は、等間隔
に穿孔して設けた多数の収納孔とスプロケツトホ
ールを有する帯状のテープ体に両面接着剤テープ
を貼付けてなるキヤリアテープを用いて小型電子
部品を収納する方法において、前記テープ体の片
面に該テープ体の収納孔より小さい幅を有する両
面接着剤テープを前記収納孔のテープ幅方向両端
部に空孔が形成されるように貼付けて両面接着剤
を収納孔より露出させた収納用テープを用い、前
記収納孔内に露出する両面接着剤に小型電子部品
単体を貼着してリールに巻取ることを特徴とし、
また前記両面接着剤テープの両面接着剤にあらか
じめ切込みを入れた収納用テープを用い、各収納
孔より露出する切込み入り接着剤面に小型電子部
品単体を貼着してリールに巻取ることを特徴とす
るものである。Structure of the Invention A method for storing electronic components according to the present invention uses a carrier tape made by pasting double-sided adhesive tape on a band-shaped tape body having a large number of storage holes and sprocket holes punched at equal intervals. In the method for storing small electronic components, a double-sided adhesive tape having a width smaller than the storage hole of the tape body is attached to one side of the tape body so that holes are formed at both ends of the tape width direction of the storage hole. A storage tape with double-sided adhesive exposed through the storage hole is used, and a single small electronic component is affixed to the double-sided adhesive exposed in the storage hole and wound onto a reel,
The double-sided adhesive tape is also characterized by using a storage tape in which notches are made in advance in the double-sided adhesive of the double-sided adhesive tape, and individual small electronic components are affixed to the notched adhesive surface exposed from each storage hole and wound onto a reel. That is.
以下、この発明方法を図面に基づいて説明す
る。第１図はこの発明に係る小型電子部品収納用
テープ（以下キヤリアテープという）の一部を示
す平面図、第２図〜第４図は同上テープの断面構
造を拡大して示す縦断面図である。 The method of this invention will be explained below based on the drawings. Fig. 1 is a plan view showing a part of the tape for storing small electronic components (hereinafter referred to as carrier tape) according to the present invention, and Figs. 2 to 4 are longitudinal sectional views showing enlarged cross-sectional structures of the same tape. be.
すなわち、この発明に係るキヤリアテープは、
中央部に等間隔に穿孔して設けた多数の収納孔１
―１と、側端部にスプロケツトホール１―２を有
するテープ体１の片面に、前記収納孔１―１より
小さい幅を有し、テープ状はくり紙２―１の片面
に両面接着剤２―２が貼着された両面接着剤テー
プ２を前記収納孔１―１のテープ幅方向両端部に
空孔１―１ａが形成されるように貼付けて両面接
着剤２―２を収納孔１―１内に露出させる。 That is, the carrier tape according to the present invention is
Numerous storage holes drilled at equal intervals in the center 1
-1 and a tape body 1 having a sprocket hole 1-2 at the side end, which has a width smaller than the storage hole 1-1, and a double-sided adhesive on one side of a tape-shaped release paper 2-1. The double-sided adhesive tape 2 with 2-2 attached thereto is pasted so that holes 1-1a are formed at both ends in the tape width direction of the storage hole 1-1, and the double-sided adhesive 2-2 is attached to the storage hole 1. - Expose within 1.
ここで、収納孔１―１より小さい幅を有する両
面接着剤テープを使用し、該テープを前記収納孔
のテープ幅方向両端部に空孔１―１ａが形成され
るように貼付けたのは、収納孔１―１内に露出す
る両面接着剤面に接着された電子部品単体を取出
す際に、帯状の両面接着剤がその電子部品単体に
付着した状態で容易に切れるようにするためと、
もう１つは電子部品単体を取出し易くするためで
ある。すなわち、収納孔底部を完全に塞いでしま
うと前記従来技術の欠点のところで述べたごとく
電子部品単体が取出しにくい。しかし、収納孔の
幅方向両端部に空孔１―１ａを設けることによ
り、両面接着剤テープ２が収納孔１―１内に山形
に曲がつて浮き上がり易くなるため、収納孔１―
１内の電子部品が離脱し易くなる。従つて、この
発明では収納孔１―１の幅方向両端部に空孔１―
１ａが形成されたキヤリアテープを用いて電子部
品を収納する方法をとつたのである。 Here, a double-sided adhesive tape having a width smaller than that of the storage hole 1-1 was used, and the tape was pasted so that holes 1-1a were formed at both ends of the storage hole in the tape width direction. In order to easily cut the electronic component with the band-shaped double-sided adhesive attached to the electronic component when removing the electronic component bonded to the double-sided adhesive surface exposed in the storage hole 1-1.
The other reason is to make it easier to take out individual electronic components. That is, if the bottom of the storage hole is completely blocked, it will be difficult to take out the electronic component as a single electronic component, as described in the section regarding the drawbacks of the prior art. However, by providing the holes 1-1a at both ends in the width direction of the storage hole, the double-sided adhesive tape 2 tends to bend into a mountain shape and float up inside the storage hole 1-1.
The electronic components inside 1 become easily detached. Therefore, in this invention, holes 1-1 are provided at both ends in the width direction of the storage hole 1-1.
A method was adopted in which electronic components were housed using a carrier tape on which 1a was formed.
またこの発明では、前記両面接着剤２―２の切
れをさらによくするために、第３図および第４図
に示すごとく、収納孔１―１より露出する両面接
着剤２―２に切込み５を入れることを特徴とす
る。この切込み５は、第３図に示すごとく収納孔
１―１の露出部分に入れるか、または第４図に示
すごとくランダムに入れることができる。 In addition, in this invention, in order to further improve the cutting ability of the double-sided adhesive 2-2, as shown in FIGS. 3 and 4, a cut 5 is formed in the double-sided adhesive 2-2 exposed from the storage hole 1-1. It is characterized by the fact that it can be inserted. The notches 5 can be placed in the exposed portion of the storage hole 1-1 as shown in FIG. 3, or randomly as shown in FIG.
この発明に係る前記キヤリアテープの製造方法
は第５図にその一例を示すごとく、あらかじめ穿
孔機により、あるいはプレス成形機等に穿孔用刃
物を取付けて収納孔１―１およびスプロケツトホ
ール１―２を穿孔してなるテープ体１をリール１
―３に巻付けておき、また両面接着剤テープ２に
ついても同様にリール２―３に巻付けておき、両
リールからそれぞれテープ体１および両面接着剤
テープ２を巻戻しながら相重ねて貼付け、一体に
なつたものを別のリール（図面省略）に巻取る。 As shown in FIG. 5, an example of the method for manufacturing the carrier tape according to the present invention is as follows. A tape body 1 made by perforating a reel 1
-3, and the double-sided adhesive tape 2 is similarly wound around the reel 2-3, and the tape body 1 and the double-sided adhesive tape 2 are unwound from both reels and pasted on top of each other. The combined material is wound onto another reel (not shown).
また、両面接着剤２―２に切込みを入れる方法
としては、第６図にその一例を示すごとく両面接
着剤テープ２をテープ体１に貼付けた後で切断装
置６等により収納孔１―１の露出部分に切込み５
を入れる方法を用いることができる。また、第７
図に示すごとく両面接着剤テープ２をテープ体１
に貼付ける前に切断装置６等によりランダムに切
込み５を入れる方法を用いることができる。 Further, as a method for making cuts in the double-sided adhesive 2-2, as shown in FIG. 6, an example is shown in FIG. Notch 5 in exposed part
You can use the method of inserting . Also, the seventh
As shown in the figure, attach double-sided adhesive tape 2 to tape body 1.
It is possible to use a method in which cuts 5 are randomly made using a cutting device 6 or the like before pasting on the paper.
次に、リールに巻取られたこの発明のキヤリア
テープを用い小型電子部品を収納する場合は、そ
の巻取られたキヤリアテープを巻戻しながら該テ
ープの収納孔１―１内に小型電子部品を入れて両
面接着剤２―２の上に貼着し、これを別のリール
に巻取つて収納する。このようにして収納された
小型電子部品を使用する場合は、再び該テープを
リールから巻戻し、例えばチヤツキング方式によ
り部品をつかみ、両面接着剤テープ２のはくり紙
２―１をはくりしながら取出す。この際、収納孔
１―１内の両面接着剤２―２に接着している電子
部品単体をチヤツキングして上方向の力を加える
と、両面接着剤テープ２は収納孔１―１内に山形
に盛り上がることにより両面接着剤２―２が切れ
て部品に付着したまま簡単に取出すことができ
る。 Next, when storing a small electronic component using the carrier tape of the present invention wound onto a reel, the small electronic component is placed into the storage hole 1-1 of the tape while unwinding the wound carrier tape. Put it in, stick it on top of the double-sided adhesive 2-2, wind it up on another reel, and store it. When using small electronic components stored in this way, rewind the tape from the reel again, grasp the component using the chucking method, and peel off the release paper 2-1 of the double-sided adhesive tape 2. Take it out. At this time, if you apply an upward force by chucking the electronic component adhered to the double-sided adhesive 2-2 in the storage hole 1-1, the double-sided adhesive tape 2 will form a chevron shape in the storage hole 1-1. By rising up, the double-sided adhesive 2-2 breaks and can be easily taken out while remaining attached to the component.
また、両面接着剤に切込み５が入つている場合
は、両面接着剤２―２の切れが非常に良好となる
ため、より小さいチヤツキング力で電子部品単体
を取出すことができる。 Further, when the double-sided adhesive has the notches 5, the double-sided adhesive 2-2 can be cut very easily, so that a single electronic component can be taken out with a smaller chucking force.
発明の効果
以上説明したごとく、この発明方法によれば、
両面接着剤が付着した状態で電子部品をキヤリア
テープから取出すことができるので、仮付けのた
めの接着手段をほどこす必要がなくなり、仮付け
作業の簡易迅速化がはかられる効果を奏する。Effects of the invention As explained above, according to the method of the invention,
Since the electronic component can be taken out from the carrier tape with the double-sided adhesive attached, there is no need to apply adhesive means for tacking, and the tacking work can be simplified and speeded up.
また、使用するキヤリアテープは両面接着剤テ
ープが収納孔のテープ幅方向両端部に空孔が形成
されるように貼付けられて両面接着剤が収納孔よ
り露出しているので、両面接着剤に接着された小
型電子部品単体が取出し易く、またその取出しに
際しては、両面接着剤テープのはくり紙をはくり
しながら取出す方法を採用することができるの
で、より簡単にかつ確実に部品を取出すことがで
きる。また、両面接着剤に切込みを入れることに
より、両面接着剤の切れが非常に良好となる効果
を有するので、小さいチヤツキング力あるいは吸
引力で小型電子部品単体を取出すことができる効
果を有する。従つて、この発明方法によれば、小
型電子部品の収納、取出しおよび仮付け作業を自
動化することが可能で、電子機器の組立て、製造
時間の大幅短縮をはかることができ、コンピユー
ター等電子機器の製造業界にもたらす効果は極め
て大きい。 In addition, the carrier tape used is pasted so that holes are formed at both ends of the tape width direction of the storage hole, and the double-sided adhesive is exposed from the storage hole, so the double-sided adhesive tape is attached to the storage hole. It is easy to take out single small electronic components that have been removed, and since it is possible to take out the parts by peeling off the paper on the double-sided adhesive tape, it is possible to take out the parts more easily and reliably. can. Further, by making a cut in the double-sided adhesive, the double-sided adhesive can be cut very easily, so that a single small electronic component can be taken out with a small chucking force or suction force. Therefore, according to the method of this invention, it is possible to automate the work of storing, taking out, and temporarily attaching small electronic components, and it is possible to significantly shorten the assembly and manufacturing time of electronic devices, and to improve the efficiency of electronic devices such as computers. The effects on the manufacturing industry are extremely large.
第１図はこの発明に係る小型電子部品収納用テ
ープの一部を示す平面図、第２図〜第４図は同上
テープの断面構造を拡大して示す縦断面図、第５
図は同上テープの製造方法の一例を示す斜視図、
第６図および第７図は同上テープの両面接着剤に
切込みを入れる方法の一例を示す概略説明図であ
る。
１…テープ体、１―１…収納孔、１―１ａ…空
孔、１―２…スプロケツトホール、２…両面接着
剤テープ、２―１…はくり紙、２―２…両面接着
剤、５…切込み。
FIG. 1 is a plan view showing a part of the tape for storing small electronic components according to the present invention, FIGS. 2 to 4 are longitudinal sectional views showing an enlarged cross-sectional structure of the same tape, and
The figure is a perspective view showing an example of the method for manufacturing the same tape.
FIGS. 6 and 7 are schematic explanatory diagrams showing an example of a method of making incisions in the double-sided adhesive of the same tape. 1... Tape body, 1-1... Storage hole, 1-1a... Hole, 1-2... Sprocket hole, 2... Double-sided adhesive tape, 2-1... Release paper, 2-2... Double-sided adhesive, 5...Notch.
Claims (1)
法において、等間隔に穿孔て設けた多数の収納孔
とスプロケツトホールを有するテープ体の片面
に、前記テープ体の収納孔より小さい幅を有する
両面接着剤テープを前記収納孔のテープ幅方向両
端部に空孔が形成されるように貼付けて両面接着
剤を収納孔より露出させた収納用テープを用い、
前記収納孔内に露出する両面接着剤に小型電子部
品単体を貼着してリールに巻取ることを特徴とす
る小型電子部品の収納方法。 ２ 帯状のテープ体に小型電子部品を収納する方
法において、等間隔に穿孔して設けた多数の収納
孔とスプロケツトホールを有するテープ体の片面
に、前記テープ体の収納孔より小さい幅を有しか
つ両面接着剤に切込みを入れた両面接着剤テープ
を前記収納孔のテープ幅方向両端部に空孔が形成
されるように貼付けて両面接着剤を収納孔より露
出させた収納用テープを用い、前記収納孔内に露
出する両面接着剤に単体を貼着してリールに巻取
ることを特徴とする小型電子部品の収納方法。[Scope of Claims] 1. In a method for storing small electronic components in a strip-shaped tape body, a tape body having a plurality of housing holes and sprocket holes punched at equal intervals has a housing hole on one side of the tape body. Using a storage tape in which a double-sided adhesive tape having a smaller width is pasted so that holes are formed at both ends in the tape width direction of the storage hole so that the double-sided adhesive is exposed from the storage hole,
A method for storing small electronic components, characterized in that a single small electronic component is attached to a double-sided adhesive exposed in the storage hole and wound onto a reel. 2. A method for storing small electronic components in a band-shaped tape body, in which one side of a tape body having a large number of equally spaced housing holes and sprocket holes has a width smaller than the housing holes in the tape body. In addition, using a storage tape in which a double-sided adhesive tape with a notch cut in the double-sided adhesive is pasted so that holes are formed at both ends in the tape width direction of the storage hole, and the double-sided adhesive is exposed from the storage hole. A method for storing small electronic components, characterized in that the electronic components are adhered to a double-sided adhesive exposed in the storage hole and wound onto a reel.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57233230A JPS59124220A (en) | 1982-12-30 | 1982-12-30 | Method of encasing small-sized electronic part |
| DE19833327612 DE3327612C2 (en) | 1982-12-30 | 1983-07-30 | Carrier tape for holding small electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57233230A JPS59124220A (en) | 1982-12-30 | 1982-12-30 | Method of encasing small-sized electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59124220A JPS59124220A (en) | 1984-07-18 |
| JPS6127258B2 true JPS6127258B2 (en) | 1986-06-24 |
Family
ID=16951789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57233230A Granted JPS59124220A (en) | 1982-12-30 | 1982-12-30 | Method of encasing small-sized electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59124220A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608256U (en) * | 1983-06-27 | 1985-01-21 | 松下電器産業株式会社 | Taping packaging tool for chip-shaped electronic components |
| JPH0532999Y2 (en) * | 1985-08-07 | 1993-08-23 |
-
1982
- 1982-12-30 JP JP57233230A patent/JPS59124220A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59124220A (en) | 1984-07-18 |
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