JP2007015741A - Carrier tape for housing electronic component, and electronic component feeding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase the reliability of the electric connection in mounting an electronic component in mounting the electronic component. <P>SOLUTION: This carrier tape 1 for housing the electronic component is equipped with an embossing tape 2 and a cover tape 3. In this case, the embossing tape 2 has a bottom surface 2a<SB>1</SB>which covers a second main surface 100b of the electronic component 100 equipped with a first main surface 100a, the second main surface 100b on the opposite side the first main surface 100a, and a terminal 100c which is provided on the second main surface 100b side, and on which a pocket 2a for housing the electronic component 100 is formed. The cover tape 3 having an adhesive layer 3c adhering to at least a part of the first main surface 100a of the electronic component 100 closes the pocket 2a and is bonded to the embossing tape 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component storage carrier tape that can store electronic components, and an electronic component supply apparatus including the same.

  Conventionally, electronic components are housed in a carrier tape or the like and transported. Some carrier tapes are composed of an embossed tape having a pocket for storing electronic components, and a cover tape for covering the pockets to prevent the electronic components from popping out of the pockets.

  When storing electronic components in a pocket or taking out electronic components from a pocket, a vacuum catcher that sucks and holds electronic components is used, but in order to easily store and take out electronic components with the vacuum catcher, The pocket is formed slightly larger in length, width and depth than the electronic component.

  Further, the inner surface of the pocket is inclined inwardly toward the bottom surface side of the pocket, and the electronic component is supported by the inclined inner surface so that the terminals of the electronic component do not contact the bottom surface of the pocket.

  However, since the pocket is formed to be slightly larger than the electronic component, the electronic component may move with respect to the pocket due to vibration shock during transportation. As described above, the pocket supports the electronic component so that the terminal of the electronic component does not contact the bottom surface of the pocket. However, when a load is applied to the carrier tape during transportation, the pocket is distorted, and the bottom surface of the pocket. In some cases, the terminals of the electronic component may come into contact. As a result, the electronic component may move with respect to the pocket while the electronic component is in contact with the bottom surface of the pocket. The component material of the embossed tape may adhere to the terminal of the component. Adhesion of the constituent material of the embossed tape to the terminals is a factor that causes poor conduction between the terminals and the wiring board and poor insulation between the terminals when the electronic component is mounted, and is desirably suppressed.

  In addition, since the inner surface of the pocket is inclined, the electronic component and the inner surface of the pocket are in contact with each other with a line. In such a contact state, the electronic component moves relative to the pocket during transportation. As a result, the inner surface of the pocket may be scraped due to friction between the electronic component and the inner surface of the pocket, and dust generated by the scraping may adhere to the terminals of the electronic component. The adhesion of dust to the terminal is a factor that causes a conduction failure between the terminal and the wiring board when the electronic component is mounted in the same manner as described above, and is desirably suppressed.

  In addition, the technique which affixes an electronic component on the bottom tape provided so that the through-hole of a carrier tape may be plugged up and hold | maintains an electronic component is disclosed (refer patent document 1).

However, in this technique, since the terminal of the electronic component is in contact with the bottom tape, an adhesive or the like adheres to the terminal of the electronic component when the electronic component is peeled from the bottom tape. As described above, adhesion of the adhesive to the terminal is a factor that causes poor conduction between the terminal and the wiring board and poor insulation between the terminals when the electronic component is mounted, and is desirably suppressed.
JP 2004-231257 A

  The present invention has been made to solve the above problems. That is, an object of the present invention is to provide an electronic component storage carrier tape that can improve the reliability of electrical connection during mounting of an electronic component, and an electronic component supply device including the carrier tape.

  According to one aspect of the present invention, a first main surface, a second main surface opposite to the first main surface, and a terminal provided on the second main surface side are provided. An embossed tape having a bottom surface that covers the second main surface of the electronic component and having a recess for housing the electronic component, and an adhesive that adheres to at least a part of the first main surface of the electronic component There is provided a carrier tape for housing an electronic component, comprising: a cover tape that includes a layer, covers the recess, and is bonded to the embossed tape.

  According to another aspect of the present invention, there is provided an electronic component supply comprising a reel and the carrier tape for storing an electronic component according to any one of claims 1 to 4 wound around the reel. An apparatus is provided.

  According to the electronic component storing carrier tape of one aspect of the present invention and the electronic component supply apparatus according to another aspect, the electronic component is difficult to move with respect to the concave portion, so that the terminal of the electronic component and the bottom surface of the concave portion are rubbed. Thus, the reliability of electrical connection at the time of mounting an electronic component can be improved.

  Embodiments of the present invention will be described below. FIG. 1 is a schematic vertical sectional view of an electronic component storage carrier tape in which an electronic component according to the present embodiment is stored, and FIG. 2 is an electronic component storage in which the electronic component according to the present embodiment is stored. It is a typical top view of a carrier tape. 3A to 3D are schematic plan views of the back surface side of the cover tape according to the present embodiment, and FIG. 4 is a schematic perspective view of the electronic component supply device according to the present embodiment. FIG.

  As shown in FIGS. 1 and 2, a carrier tape 1 for storing electronic components (hereinafter simply referred to as “carrier tape”) includes an embossed tape 2 made of, for example, polystyrene (PS) or the like.

  The embossed tape 2 is formed with, for example, a pocket 2a as a recess for storing the electronic component 100 such as a semiconductor device. A plurality of pockets 2 a are formed at predetermined intervals along the longitudinal direction of the embossed tape 2. The number of pockets 2a is not limited to a plurality and may be one.

The pocket 2a includes a bottom surface 2a ₁ that covers a second main surface 100b to be described later, an inner surface 2a ₂ that is inclined inward toward the bottom surface 2a ₁ side, and the like. Vent holes in the bottom surface 2a ₁ of the pocket 2a (not shown) is formed.

The pocket 2a includes a first main surface 100a, a second main surface 100b opposite to the first main surface 100a, and, for example, a ball-type terminal 100c provided on the second main surface 100b. the second main surface 100b of the electronic component 100 is an electronic component 100 so as to be covered by the bottom surface 2a ₁ is housed a. In addition, the terminal 100c should just be provided in the 2nd main surface 100b side, and does not necessarily need to be provided in the 2nd main surface 100b. Further, the terminal 100c is not limited to the ball type, and may be, for example, a pin type or a lead frame type.

Electronic component 100 is held by a cover tape 3 which will be described later, not only the terminal 100c is in the non-contact with the bottom surface 2a _1, the entire electronic component 100 to the bottom surface 2a ₁ and the inner surface 2a ₂ Contactless. The terminal 100c is in contact with the bottom surface 2a _1, also a part of the electronic component 100 may be in contact with the inner surface 2a ₂ of the pocket 2a.

  A plurality of feed holes 2 b are formed at predetermined intervals along the longitudinal direction of the embossed tape 2 at both ends in the width direction of the embossed tape 2. The feed hole 2 b is used when the embossed tape 2 or the carrier tape 1 is fed in the electronic component 100 storing process or taking-out process.

  A cover tape 3 is provided on the surface side of the embossed tape 2 so as to close the pocket 2a. The cover tape 3 is made of, for example, polyethylene terephthalate (PET). The cover tape 3 is formed to have substantially the same length as the embossed tape 2, but the cover tape 3 may be divided for each pocket 2a as long as the pocket 2a is closed.

  The width of the cover tape 3 is smaller than the width of the embossed tape 2, and both end edges in the width direction of the cover tape 3 are located between the feed holes 2b formed in the embossed tape 2 and the pockets 2a. Both end edges in the width direction of the cover tape 3 are joined to the embossed tape 2 by thermocompression bonding. The embossed tape 2 and the cover tape 3 are not limited to thermocompression bonding, and may be joined by, for example, an adhesive. Moreover, in this Embodiment, the embossed tape 2 and the cover tape 3 are joined also by the adhesion layer 3c mentioned later.

  The cover tape 3 has a rectangular opening 3a smaller than the first main surface 100a at a position corresponding to the pocket 2a, one end facing the corner of the opening 3a, and the other end from the first main surface 100a. A perforation 3b located outside is formed. The cover tape 3 does not have to be formed with the opening 3a and the perforation 3b.

  As long as the opening 3a is smaller than the first main surface 100a, the opening 3a is not limited to a rectangular shape, and may be formed in a polygonal shape or a circular shape other than the rectangular shape. Further, one end of the perforation 3b may not be formed at the corner of the opening 3a as long as it faces the opening 3a. Moreover, you may form a notch instead of perforation 3b or with perforation 3b.

  An adhesive layer 3 c that adheres to at least a part of the first main surface 100 a is formed on the back surface side of the cover tape 3. The adhesive layer 3c is composed of at least one of, for example, a rubber-based adhesive, a plastic-based adhesive, and an ultraviolet curable adhesive. When the adhesive layer 3c is composed of an ultraviolet curable adhesive, the adhesive force can be weakened by irradiating the adhesive layer 3c with ultraviolet rays.

  The adhesive layer 3c is formed in a band shape. Specifically, the adhesive layer 3c has a width smaller than the width of the first main surface 100a, is located at substantially the center of the cover tape 3, and extends from approximately one end to the other end in the longitudinal direction of the cover tape 3. Is formed. Thereby, the adhesion layer 3c adheres at the two opposing portions of the first main surface 100a.

  For example, the adhesive layer 3c may be formed in a thin strip shape as shown in FIG. 3A, and is not limited to the strip shape, but is a mesh as shown in FIGS. 3B to 3D. It may be formed in a hanging shape, a ball shape, and a ball zigzag shape.

  If the adhesive layer 3c is formed at the contact portion between the cover tape 3 and the first main surface 100a, the contact portion between the embossed tape 2 and the cover tape 3 (the portion between the pocket 2a and the pocket 2a) is not necessarily required. It does not have to be formed. The width of the adhesive layer 3c may be larger than the width of the first main surface 100a.

  Such a carrier tape 1 is transported in a state of being incorporated in an electronic component supply apparatus 10 as shown in FIG. The electronic component supply apparatus 10 includes a carrier tape 1, a reel 11 that winds up the carrier tape 1, an end tape 12 that is attached to the tip of the carrier tape 1 and fixes the carrier tape 1, and the like. The end tape 12 is made of, for example, polypropylene (PP) with an adhesive.

  Hereinafter, an electronic component storage step for storing the electronic component 100 in the carrier tape 1 and a carrier tape winding step for winding the carrier tape 1 in which the electronic component 100 is stored on the reel 11 will be described. FIG. 5 is a schematic process diagram of the electronic component housing step and the carrier tape winding step according to the present embodiment. FIG. 6A is a schematic process diagram of another electronic component housing process according to the present embodiment, and FIG. 6B is a schematic process of another carrier tape winding process according to the present embodiment. It is a process diagram.

  First, the embossed tape 2 in which the pocket 2a is formed and the cover tape 3 in which the opening 3a and the perforation 3b are not formed and the adhesive layer 3c is formed are prepared.

Next, the embossed tape 2 and the cover tape 3 are aligned. Then, as shown in FIG. 5, the opening / perforation forming mechanism 21 opens the opening 3a and the perforation 3b while feeding the embossed tape 2 and the cover tape 3 by a predetermined pitch using the feed hole 2b. to form a second main surface 100b to house the electronic component 100 in the pocket 2a so as to be positioned on the bottom surface 2a ₁ side by the vacuum catcher 22. 6A, the first main surface 100a of the electronic component 100 is adhered to the adhesive layer 3c of the cover tape 3 in which the opening 3a and the perforation 3b are formed. The pocket 2a may be put on the electronic component 100 from the main surface 100b side. In this case, the bottom surface 2a ₁ is located on the upper side. Further, a cover tape 3 in which the opening 3a and the perforation 3b are formed in advance may be prepared. However, in this case, the alignment between the embossed tape 2 and the cover tape 3 becomes difficult. It is preferable to form the opening 3a and the perforation 3b before the joining step of the embossed tape 2 and the cover tape 3.

  After that, in a state where the pocket 2a is closed by the cover tape 3, for example, both end edges in the width direction of the cover tape 3 are thermocompression bonded to the embossed tape 2 by a thermocompression bonding mechanism 23 such as a heater. Join. This completes the electronic component storage process. Note that the opening 3 a and the perforation 3 b may be formed in the cover tape 3 after the electronic component 100 is stored in the carrier tape 1.

  After the electronic component 100 is stored in the carrier tape 1, the reel 11 is rotated, and the carrier tape 1 is wound around the reel 11 so that the pocket 2a is positioned inside. This completes the carrier tape winding process. The carrier tape 1 is wound around the reel 21 so that the pocket 2a is located on the inside. However, as shown in FIG. 6B, the carrier tape 1 is wound around the reel 21 so that the pocket 2a is located outside. May be. In this case, the protection effect of the electronic component 100 from external impact during transportation can be improved.

  Hereinafter, an electronic component removing process for removing the electronic component 100 from the carrier tape 1 will be described. FIG. 7A and FIG. 7B are schematic process diagrams of the electronic component take-out process according to the present embodiment.

  First, the carrier tape 1 is pulled out from the reel 11 and the carrier tape 1 is flattened. As shown in FIG. 7A, the vacuum catcher 24 opens the first surface 100a of the electronic component 100 through the opening 3a. To adsorb.

  Thereafter, the vacuum catcher 24 is raised while holding the electronic component 100. Here, the opening 3a is smaller than the first main surface 100a of the electronic component 100. However, since the perforation 3b facing the opening 3a is formed in the cover tape 3, when the vacuum catcher 24 is raised, FIG. As shown in (b), the cover tape 3 is broken along the perforations 3b by the electronic component 100 being pushed up. Thereby, the opening 3a is widened, and the electronic component 100 is taken out from the carrier tape 1.

  Here, the adhesive layer 3a is adhered to the first main surface 100a of the electronic component 100. Since this adhesive force is lower than the suction force of the vacuum catcher 24, the electronic component 100 can be easily Part 100 can be removed.

  When the opening 3a and the perforation 3b are not formed in the cover tape 3, the cover tape 3 is peeled from the embossed tape 2 and the electronic component 100 is taken out. Here, since the adhesive layer 3c is formed on the cover tape 2, if the cover tape 3 is peeled off, the electronic component 100 is likely to adhere to the cover tape 3, but the adhesive layer 3c is made of, for example, an ultraviolet curable adhesive. In this case, the adhesive force can be weakened by irradiating the adhesive layer 3c with ultraviolet rays before the cover tape 3 is peeled off, so that the electronic component 100 can be prevented from sticking to the cover tape 3.

In the present embodiment, an adhesive layer 3 c that adheres to at least a part of the first main surface 100 a of the electronic component 100 is formed on the cover tape 3, and the cover tape 3 is bonded to the embossed tape 2. Therefore, even when a vibration shock or the like is applied to the carrier tape 1 during transportation, the electronic component 100 is difficult to move with respect to the pocket 2a. Thus, distorted pocket 2a is due to an impact or the like during transportation, even when the terminal 100c of the electronic component 100 has had contact with the bottom surface 2a ₁ of the pocket 2a, a bottom surface 2a ₁ of the terminal 100c and the pocket 2a Rubbing can be suppressed. Further, since the electronic component 100 is hard to move relative to the pockets 2a, it is also possible to suppress the rubbing of the inner surface 2a ₂ and the electronic component 100 of the pocket 2a. Therefore, the reliability of electrical connection when the electronic component 100 is mounted can be improved.

In this embodiment, since the pockets 2a has a bottom surface 2a _1, it can prevent the dust from adhering to the terminal 100c. Further, in the present embodiment, since the terminal 100c of the electronic component 100 is in the non-contact state with respect to the bottom surface 2a _1, more rubbing the bottom 2a ₁ of the terminal 100c and the pocket 2a of the electronic component 100 more Can be reduced.

  When the cover tape 3 is peeled from the embossed tape 2, static electricity is generated, which may cause destruction of the electronic component 100 and sticking of the electronic component 100 to the cover tape 3. Further, when the cover tape 3 is peeled off from the embossed tape 2, the electronic component 100 may protrude from the pocket 2a. That is, the thermocompression of the cover tape 3 is performed while the embossing tape 2 and the cover tape 3 are moved by a predetermined pitch while the position of the thermocompression bonding mechanism 23 is fixed. May not move by a predetermined pitch, a part that has been thermocompression-bonded in part may be thermocompression-bonded (twice). Since the twice thermocompression-bonded portion has a larger pressure than the once heat-bonded portion, the cover tape 3 is caught when the cover tape 3 is peeled off from the embossed tape 2. Then, the embossed tape 2 moves due to this catch, and the electronic component 100 pops out from the embossed tape 2. On the other hand, in this embodiment, since the opening 3a and the perforation 3b are formed in the cover tape 3, the electronic component 100 can be taken out from the carrier tape 1 without peeling off the cover tape 3. Thereby, destruction of the electronic component 100 and sticking of the electronic component 100 to the cover tape 3 can be suppressed, and jumping out of the electronic component 100 from the pocket 2a can be suppressed.

  At the time of the electronic component housing process, there is a possibility that the adhesive layer 3c may not be adhered to the first main surface 100a only by joining both end edges in the width direction of the cover tape 3 to the embossed tape 2. On the other hand, since the carrier tape 1 is wound around the reel 11 in the present embodiment, the cover tape 3 is pulled when being wound, and the adhesive layer 3c is reliably adhered to the first main surface 100a. it can.

  The present invention is not limited to the description of the above embodiment, and the structure, material, arrangement of each member, and the like can be appropriately changed without departing from the gist of the present invention.

It is a typical vertical sectional view of the carrier tape for electronic component storing in which the electronic component concerning an embodiment was stored. It is a typical top view of the carrier tape for electronic component accommodation in which the electronic component which concerns on embodiment was accommodated. (A)-(d) is a typical top view of the back surface side of the cover tape which concerns on embodiment. It is a typical perspective view of the electronic component supply apparatus which concerns on embodiment. It is a typical process figure of the electronic component storage process and carrier tape winding process which concern on embodiment. (A) is a schematic process diagram of another electronic component housing step according to the embodiment, and (b) is a schematic process diagram of another carrier tape winding step according to the embodiment. (A) And (b) is a typical process figure of the electronic component taking-out process which concerns on embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Carrier tape for electronic component storage, 2 ... Embossed tape, 2a ... Pocket, 2a ₁ ... Bottom surface, 3 ... Cover tape, 3a ... Opening, 3b ... Perforation, 3c ... Adhesive layer, 10 ... Electronic component supply apparatus, 11 Reel, 100 ... electronic component, 100a ... first main surface, 100b ... second main surface, 100c ... terminal.

Claims (5)

The second main surface of the electronic component comprising a first main surface, a second main surface opposite to the first main surface, and a terminal provided on the second main surface side. An embossed tape having a bottom surface for covering and formed with a recess for housing the electronic component;
And a cover tape that has an adhesive layer that adheres to at least a part of the first main surface of the electronic component, closes the recess, and is joined to the embossed tape. Carrier tape.   The carrier tape for storing an electronic component according to claim 1, wherein the electronic component is held on the cover tape via the adhesive layer so that the terminal is not in contact with the bottom surface.   The cover tape includes an opening that is formed on the electronic component and is smaller than the first main surface of the electronic component, and at least one of a perforation and a notch whose one end faces the opening. The carrier tape for storing electronic components according to claim 1 or 2, wherein   The carrier tape for storing an electronic component according to any one of claims 1 to 3, wherein the terminal of the electronic component has a ball shape. With reel,
An electronic component supply apparatus comprising: the electronic component storing carrier tape according to claim 1 wound around the reel.

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