JP2001261060A - Parts feed tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a parts feed tape for easily feeding and removing parts, not generating damages to the parts and onto the tape and to be reused. SOLUTION: The parts feed tape is constituted of a carrier tape 1 with a plurality of storage sections 4a formed along the longitudinal direction and a top tape 2 covering the surface of the carrier tape. The top tape 2 is provided with recesses 3a engaged with the inside of the storage sections 4a and blocking at least a part of openings 9 of the storage sections 4a are formed on the positions corresponding to the storage sections 4a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply tape used for supplying electronic components to a component supply device of an automatic mounting machine.

[0002]

2. Description of the Related Art A component supply tape is composed of a carrier tape in which a storage portion for storing components is formed, and a top tape covering the surface of the storage portion in order to prevent the stored components from jumping out.

In the longitudinal direction of the carrier tape, feed holes are formed at equal pitches. When the component supply tape is set in the component supply device, the teeth of the wheel engage with the feed holes, and the component supply tape is moved. The carrier tape is conveyed to the component supply position at an equal pitch, and the carrier tape is peeled off at the component supply position, and the component is taken out from the storage portion that has been opened.

As such a component supply tape, for example, a component supply tape for packaging a semiconductor device as described below can be mentioned. Embossing (extrusion) is performed on a carrier tape made of vinyl chloride resin, and a plurality of storage sections are formed along the long side direction. A plurality of feed holes are formed on one side of the carrier tape in the longitudinal direction.

A semiconductor device is housed in a housing formed by embossing, and PET is applied so as to cover the upper surface of the housing.
(Polyethylene Tele-Phatarate) A top tape having a two-layer structure of a resin and a polyethylene resin is disposed.

Then, the top tape and the carrier tape are bonded by thermocompression bonding or an adhesive by a taping device, and the semiconductor device is packed with the carrier tape and the top tape, and a component supply tape for packing the semiconductor device is obtained.

The component supply tape is wound on a take-up reel and set in the component supply device as described above.
It is transported while peeling off the top tape from the carrier tape. At the component supply position, the semiconductor device that can be taken out is taken out and mounted on a mounting board.

[0008]

However, in the above-mentioned component supply tape, it is necessary to fix the carrier tape and the top tape by thermocompression bonding or an adhesive at the time of packing the semiconductor device. Since it is necessary to peel off the tape, the packaging and unpacking steps of the semiconductor device are complicated, and it is difficult to attach and detach the semiconductor device.

In addition, since the top tape and the carrier tape are fixed by thermocompression bonding or an adhesive, variations in the adhesive force may cause damage to the component supply tape when peeling off the top tape or hinder removal of the semiconductor device. There is.

Further, when the carrier tape and the top tape are fixed with an adhesive, a composition change occurs in an adhesive portion, and when the top tape is peeled off, the top tape or the carrier tape is formed due to stringing or uneven bonding of the adhesive. The parts supply tape cannot be reused because the parts are torn.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems and to provide a component supply tape which allows easy attachment and detachment of components, does not damage components and tapes, and can be reused.

[0012]

The component supply tape according to the present invention is characterized in that a recess is formed in the top tape so as to engage with the inside of the storage portion of the carrier tape and to close at least a part of the storage portion. I do.

According to the present invention, it is possible to realize a component supply tape in which components can be easily attached and detached, the components and the tape itself are not damaged, and the component supply tape can be reused.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component supply tape according to a first aspect of the present invention is a component supply tape in which the surface of the storage portion of a carrier tape having a storage portion for storing components is covered with a removable top tape. The top tape is characterized in that a concave portion is formed at a position corresponding to the storage portion, the concave portion being engaged with the inside of the storage portion and closing at least a part of an opening of the storage portion.

According to a second aspect of the present invention, in the component supply tape according to the first aspect, the carrier tape is pressed into the upper surface of the storage section by making the width of the opening of the storage section smaller than the width of the bottom section. The concave portion of the top tape is sandwiched.

According to a third aspect of the present invention, there is provided the component supply tape according to the first aspect, wherein the carrier tape and the top tape are provided at an engagement portion between an opening of the storage portion of the carrier tape and a recess of the top tape. Are formed so as to be engaged.

According to a fourth aspect of the present invention, in the component supply tape according to the first aspect, the accommodating portion of the carrier tape is formed by embossing. According to a fifth aspect of the present invention, there is provided the component supply tape according to the first aspect,
The concave portion of the top tape is formed by embossing.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 4 based on specific examples. (Embodiment 1) FIGS. 1 and 2 show a component supply tape in (Embodiment 1).

FIG. 1 is a plan view of the component supply tape, and FIG. 2 is a cross-sectional view taken along line AB. Here, a component supply tape for packaging semiconductor devices will be described as a specific example of the component supply tape.

The component supply tape comprises a carrier tape 1 having a plurality of storage portions 4a formed in the longitudinal direction, and a top tape 2 covering the surface thereof. Carrier tape 1
For example, a tape made of vinyl chloride resin is embossed to form a plurality of storage portions 4a along the longitudinal direction, and a plurality of feed holes 6 for transport are formed on one side of the carrier tape 1 in the longitudinal direction. You.

The top tape 2 is formed by embossing a tape made of, for example, vinyl chloride, which has higher mechanical strength than a conventionally used two-layered top tape of PET resin and polyethene resin. A plurality of recesses 3a are formed at positions corresponding to the storage portions 4a. The concave portion 3a engages with the inside of the storage portion 4a and
It is sufficient that at least a part of the opening 9 of the storage unit 4a is closed, and here, it is configured to cover the entire surface of the opening 9 of the storage unit 4a.

Then, the concave portion 3a of the top tape 2 is fitted into the storage portion 4a of the carrier tape 1 to engage the inside of the storage portion 4a with the concave portion 3a, and the opening 9 of the storage portion 4a is closed by the concave portion 3a. A component supply tape is formed.

The semiconductor device 5 is packed in the component supply tape after the semiconductor device 5 is stored in the storage section 4a.
a only needs to be inserted into the storage section 4a, and unpacking of the semiconductor device 5 only needs to be removed from the storage section 4a while pulling up the top tape 2 from the carrier tape 1.

By thus fixing the carrier tape 1 and the top tape 2 with a lid, the semiconductor device 5 can be easily attached and detached. In addition, the component supply tape can be used repeatedly until a defective insertion between the carrier tape 1 and the top tape 2 occurs, and the manufacturing process of the component supply tape can be simplified, so that the cost can be reduced.

Further, the deteriorated component supply tape can be separated into the carrier tape 1 and the top tape 2 each made of a single material because the carrier tape 1 and the top tape 2 are not fixed by thermocompression bonding or an adhesive. , Can be recycled. Therefore, reduction of industrial waste and cost can be realized.

When the top tape 2 is peeled off, the carrier tape 1 and the top tape 2 can be peeled more easily than when the carrier tape 1 and the top tape 2 are fixed by an adhesive or thermocompression bonding. Further, damage to the semiconductor device 5 can be prevented.

(Embodiment 2) FIG. 3 shows (Embodiment 2) of the present invention. In this (Embodiment 2), the storage section 4
The difference is that the shape of b is special, but the other configuration is the same as the above (Embodiment 1).

More specifically, the storage section 4b of the carrier tape 1
The width d1 of the opening is smaller than the width d2 of the bottom, and the side wall of the storage portion 4b is inclined. Also,
If the recess 3b of the top tape 2 is also formed so as to follow the slope of the side wall of the storage portion 4b, the top tape 2
When the concave portion 3b of the top tape 2 is pushed into the upper surface of the storage portion 4b, the outer peripheral surface of the concave portion 3b easily contacts the inner peripheral surface of the storage portion 4b, and the concave portion 3b of the top tape 2 pressed into the upper surface of the storage portion 4b It becomes easy to pinch.

With this configuration, the carrier tape 1 and the top tape 2 can be fixed more firmly than the above (Embodiment 1). (Embodiment 3) FIG. 4 shows (Embodiment 3) of the present invention.

In this (Embodiment 3), the storage sections 4c,
The configuration is different from that described above (Embodiment 1) in that the projections and depressions are formed in the engaging portions between 4d and recesses 3c and 3d.

As shown in FIG. 4A, a projection 7a is formed at the opening of the storage portion 4c at the engagement portion between the opening of the storage portion 4c of the carrier tape 1 and the concave portion 3c of the top tape 2. The concave portion 3c is formed with a concave portion 7b which engages with the convex portion 7a.

With this configuration, the carrier tape 1 and the top tape 2 can be more firmly fixed than in the first embodiment. In addition, as shown in FIG.
The same effect can be obtained even if the concave portion 8a is formed in the opening of the storage portion 4d and the convex portion 8b engaging with the concave portion 8a is formed in the concave portion 3d.

Further, the concave and convex portions in the third embodiment may be formed in the engaging portion between the storage portion 4b and the concave portion 3b configured in the same manner as in the second embodiment. In each of the above embodiments, the concave portion 3 formed in the top tape 2 is used.
Although a to 3d cover the entire surface of the opening of the accommodating portions 4a to 4d of the carrier tape 1, the concave portions 3a to 3d have been described.
d should just be comprised so that at least one part of the opening part of the storage parts 4a-4d may be closed.

[0034]

As described above, according to the component supply tape of the present invention, at least a part of the opening is engaged with the opening of the storage portion at a position corresponding to the storage portion of the carrier tape of the top tape. By forming a concave portion for closing the cover and forming the concave portion as a lid-type component supply tape fitted into the storage portion, the component can be easily attached and detached.

Further, the component supply tape can be used repeatedly until a defective insertion of the carrier tape and the top tape occurs. Further, since the carrier tape and the top tape are not fixed by thermocompression bonding or an adhesive, they can be separated into a carrier tape and a top tape each made of a single material, and can be recycled.

Further, since the top tape can be easily peeled, damage to the component supply tape and the component can be prevented as compared with the case of the adhesive fixing.

[Brief description of the drawings]

FIG. 1 is a plan view of a component supply tape according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AB shown in FIG.

FIG. 3 is a sectional view of a component supply tape according to the second embodiment of the present invention.

FIG. 4 is a sectional view of a component supply tape according to a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Top tape 3 Concave part 4 Storage part 5 Semiconductor device 6 Feed hole 9 Opening

Continued on front page F term (reference) 3E067 AA12 AB41 AC04 AC11 BA26A BC07A BC10A EE59 EE60 FA01 FC01 GD10 3E096 AA03 BA08 BB05 CA15 CB02 DA17 DC02 FA16 FA26 FA27 GA07

Claims (5)

[Claims] 1. A component supply tape in which a surface of said storage portion of a carrier tape having a storage portion for storing components is covered with a removable top tape, wherein said top tape is located at a position corresponding to said storage portion. A component supply tape formed with a concave portion that engages inside the storage portion to close at least a part of an opening of the storage portion. 2. The carrier tape according to claim 1, wherein the width of the opening of the storage portion is smaller than the width of the bottom portion so as to clamp the recess of the top tape pressed into the upper surface of the storage portion. Parts supply tape. 3. The component supply according to claim 1, wherein an uneven portion for engaging the carrier tape and the top tape is formed at an engagement portion between the opening of the storage portion of the carrier tape and the concave portion of the top tape. tape. 4. The component supply tape according to claim 1, wherein said accommodating portion for said carrier tape is formed by embossing. 5. The component supply tape according to claim 1, wherein the concave portion of the top tape is formed by embossing.