JP2006256685A - Packaging tape for chip part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging tape which can prevent jumping that a chip part protrudes from a pocket of the packaging tape and from which the chip part can be taken out stably at a factory or the like of a user, even if the chip part stored in the packaging tape becomes a thin type. <P>SOLUTION: In the packaging tape for the chip part, wherein the chip part is stored in the pocket of a bottom tape having many pockets and a top taper 12 is adhered on the bottom tape 11, an adhering part 15 is arranged only at the periphery of upper and lower two sides 13a, 13b of the pocket 13 parallel to the transporting direction or only at the periphery of the four corners of the pocket. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a chip component packaging tape, and more particularly, to a chip component in which a chip component is stored in the pocket of a bottom tape having a plurality of pockets, and the chip tape is packaged by bonding the top tape to the bottom tape. It relates to packaging tape.

  Chip parts such as chip resistors produced in a factory are generally packaged in the packaging tape and shipped from the production factory. The chip parts shipped from the production factory are peeled off from the top tape at the factory of the customer, and the chip parts are taken out from each pocket and mounted on a circuit board or the like by a mounter or the like.

As a packaging tape for such chip parts, various proposals have been made for the shape of the bonding portion when the top tape is bonded to the bottom tape.
Japanese Patent No. 2740619 JP-A-4-31260

  Conventionally, a two-tooth pattern is generally employed for the shape of the adhesive portion when the top tape is thermocompression bonded to the bottom tape having a pocket. That is, generally, two continuous long adhesive portions are arranged outside the upper and lower sides of the pocket in parallel with the feeding direction of the long tape. For this reason, in the space between the adjacent pockets, that is, in the space between the left and right sides of the adjacent pockets, the bottom tape and the top tape are generally not formed with an adhesive portion.

  However, with recent downsizing and thinning of electronic devices, chip parts tend to be increasingly smaller and thinner. For this reason, there is a problem of jumping in which the chip component stored in the pocket protrudes from the pocket into an unadhered space between the pockets due to vibration during storage or transportation, particularly in the case of a thin chip component. . If the chip part protrudes from the pocket of the packaging tape, inconveniences such as inconsistency in the take-out position of the automatic machine occur when the chip part is taken out from the packaging tape at the factory of the customer.

  By the way, in Patent Literatures 1 and 2, two continuous long adhesive portions are disposed outside the upper and lower sides of the pocket, and an adhesive portion is also provided in the space between the pockets. An adhesive pattern is disclosed that surrounds with an adhesive. In this case, the problem of protruding (jumping) from the pocket of the chip component stored in the packaging tape is completely prevented. However, if two continuous long adhesive parts are arranged and an adhesive part is also provided between the pockets, and the outer periphery of the pocket is surrounded by the adhesive part, the top tape will be removed when the top tape is peeled off at the customer's factory, etc. There is a problem that the tape is easily cut.

  The present invention has been made in view of the above-described circumstances, and even if the chip component housed in the packaging tape is thinned, the chip component can be prevented from jumping out of the pocket of the packaging tape, and is top in the factory of the customer. An object of the present invention is to provide a packaging tape that can prevent chip breakage and stably take out chip components.

  In order to solve the above problems, a packaging tape for chip parts of the present invention is a packaging of chip parts in which the chip parts are accommodated in the pockets of the bottom tape having a large number of pockets, and the top tape is bonded to the bottom tape. The tape is characterized in that adhesive portions are disposed only on the outer peripheral portions of the upper and lower sides of the pocket parallel to the tape feeding direction.

  Here, the adhesive portion is arranged in such a manner that a long portion parallel to the tape feeding direction and a short portion perpendicular to the direction surround the outer peripheral portions of the upper and lower sides of the pocket. A character-shaped pattern is preferred.

  Further, the packaging tape for chip parts of the present invention is the packaging tape for chip parts in which the chip parts are accommodated in the pockets of the bottom tape having a plurality of pockets, and the top tape is bonded to the bottom tape. The adhesive portion is disposed only on the outer peripheral portion of this.

  Here, it is preferable that the bonding portion is a substantially L-shaped pattern including a short side parallel to the tape feeding direction and a short side perpendicular thereto. Further, the adhesive portion may be a circular adhesive portion.

  Further, the packaging tape for chip parts of the present invention includes a bottom tape in which a plurality of pockets for accommodating chip parts are formed, a top tape for covering the openings of the pockets, the bottom tape, and the top tape. The adhesive tape is a packaging tape for a chip part, wherein the adhesive portion is provided on the outer periphery of the upper and lower sides of the pocket or on the outer periphery of the four corners of the pocket, and the upper and lower sides of each pocket. It is characterized by having a portion that extends inward from the extension line and is formed without adhering between adjacent pockets.

  According to the packaging tape for chip parts of the present invention, the adhesive portions are disposed only on the outer peripheral portions of the upper and lower sides of the pocket parallel to the tape feeding direction, or the adhesive portions are disposed only on the outer peripheral portions of the four corners of the pocket. Therefore, even between adjacent pockets, that is, between the left and right sides of adjacent pockets, the gap caused by deformation caused by vibration between the bottom tape and the top tape is significantly reduced. be able to. Thereby, even if the chip component is thinned to about 0.1 mm, for example, the protrusion (jumping) to the space between the adjacent pockets of the chip component can be prevented.

  In addition, since the area of the adhesive portion is discretely arranged only on the outer peripheral portions of the upper and lower sides of the pocket or only on the outer peripheral portions of the four corners of the pocket, the area of the adhesive portion is limited. It is possible to prevent problems such as the top tape being cut off in the middle, and to take out stable chip parts from the packaging tape.

  Accordingly, an easy-to-use chip component packaging tape that can prevent the jumping of the stored chip component and stably peel off the top tape is provided.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected to the member or element which has the same function, and the duplicate description is abbreviate | omitted.

  FIG. 1 shows a packaging tape for chip parts according to an embodiment of the present invention. This packaging tape accommodates chip parts (electronic parts) such as chip resistors, capacitors, inductors, and semiconductor elements in the pockets of the bottom tape 11 having a large number of pockets (embossed patterns) 13, and the top tape 12 is placed on the top tape 12. The adhesive tape 15 is bonded to the upper surface of the bottom tape 11 by thermocompression bonding or the like.

  The bottom tape 11 is provided with a number of feed holes 14, and the chip component is stored in the pocket 13 while feeding the long bottom tape 11 in the longitudinal direction of the tape, and then the top tape 12 is placed on the bottom tape 11. It is bonded and fixed to the upper surface by thermocompression bonding, and chip parts are packaged. Here, the bottom tape 11 is made of a plastic material, and the top tape 12 is made of a thermocompressible resin film.

  The bonding portion 15 is formed by joining the bottom tape 11 and the top tape 12 by thermocompression bonding. As shown in FIG. 1B, the upper and lower sides 13a and 13b of the pocket parallel to the tape feeding direction are formed. It is discretely formed only on the outer periphery. That is, the adhesive portion 15 is formed as a pattern including a long portion 15a parallel to the tape feeding direction and two short portions 15b extending inwardly from both ends of the long portion 15a. The connecting portion between the long portion 15a and the short portion 15b preferably has an arc shape as shown.

  Here, the adhesive portion 15 is U-shaped so that a long portion 15a parallel to the tape feeding direction and a short portion 15b perpendicular to the tape feeding direction at both ends surround the upper and lower sides 13a and 13b of the pocket. It is arranged in a type or U shape. And the short part 15b is extended inward rather than the extension line | wire of the up-and-down two sides 13a and 13b of a pocket. The extent extending inward from the extension line is preferably about 1/3 to 1/5 of the length of the left and right sides 13c and 13d of the pocket.

  For this reason, even between the left and right sides 13c and 13d of the adjacent pockets, the gap caused by deformation caused by vibration between the bottom tape and the top tape can be remarkably reduced. As a result, even if the chip component is thinned to about 0.1 mm or less, for example, the protrusion (jumping) to the space 19 between the adjacent pockets 13 and 13 of the chip component can be prevented.

  The bonding portion 15 is formed as a discrete (intermittent) pattern along the tape feeding direction. That is, the adjacent adhesive part has a part formed without adhering between the pockets in the flow direction of the tape. As described above, this is greatly different from the conventional packaging tape provided with a continuous adhesive pattern on both the upper and lower sides of a large number of pockets. Further, if there is an adhesive pattern that is perpendicular to the tape feeding direction (peeling direction), i.e., across the tape, the tape is very easily cut off. However, in the wrapping tape of the present invention, there is no continuous adhesive portion pattern across the tape, so that it surrounds the upper and lower sides 13a and 13b of the pocket more than the extended lines of the upper and lower sides 13a and 13b by a short distance. Since it only extends inward, it is easy to peel off the top tape when the chip part is taken out from the packaging tape.

  The chip component housed in the pocket 13 is generally a chip resistor or the like having a thickness of about 0.25 to 0.6 mm. However, in the packaging tape of the present invention, the electrode is applied to, for example, a polyimide film having a thickness of 0.1 mm or less. So-called jumping can be prevented even with a thin film resistor or the like provided with a thin film resistor.

  FIG. 2 shows an iron and a tooth pattern for thermocompression bonding the top tape 12 to the bottom tape 11. That is, the iron 16 is provided with a tooth pattern 17 having an adhesive portion pattern composed of a long portion and a short portion extending inward from both ends thereof, and the iron 16 is heated to a high temperature with a heater, and the tooth shape heated thereby. By pressing 17 against the joint surface between the bottom tape 11 and the top tape 12, an adhesive portion 15 surrounding the upper and lower sides 13a and 13b of the pocket by thermocompression shown in FIGS. 1 (a) and 1 (b) is formed. .

  When packaging chip components on the packaging tape, first, a bottom tape 11 having a large number of pockets and a top tape 12 made of a thermocompression bonding film are prepared. Then, a chip part to be packaged is placed in the pocket 13 of the bottom tape 11, the top tape 12 is joined to the upper surface of the bottom tape 11, and the tooth mold 17 of the heated iron 16 is placed on the upper and lower sides of the pocket 13. By pressing the outer peripheral portion of the adhesive portion 15, the adhesive portion 15 is formed by thermocompression bonding. As a result, the chip component is sealed in the pocket 13.

  Next, the bottom tape 11 is fed in the longitudinal direction of the tape using the feed hole 14, and similarly, the chip component is placed in the pocket 13, the top tape 12 is joined onto the bottom tape 11, and the tooth mold 17 of the iron 16 is used. The process of thermocompression bonding using is repeated. Thereby, as shown in FIG. 3, the packaging tape in which the chip component 18 was accommodated in each pocket 13 of the bottom tape 11 is formed. The packaging tape is wound up in a reel shape and shipped from a chip component production factory.

  With this packaging tape, it is possible to prevent the chip component from protruding (jumping) due to vibration during transportation, etc., and when the chip component is taken out from the packaging tape at the factory of the customer, a problem of tape breakage occurs. The top tape can be peeled off stably.

  In the example shown in FIG. 2, the iron 16 includes three sets of U-shaped teeth 17, and three pockets can be thermocompression bonded at the same time. Alternatively, an appropriate plurality of them may be thermocompression bonded simultaneously. Moreover, you may form an adhesion part by adhesion methods other than thermocompression bonding.

  FIG. 4 shows an example of an adhesive pattern of another embodiment of the present invention. In this embodiment, the adhesive portions are disposed only on the outer peripheral portions of the four corners of the pocket.

  That is, in FIG. 4A, an adhesive portion pattern 21 having two short sides orthogonal to the outer peripheral portions of the four corners of the pocket 13 is provided. The bonding portion pattern 21 includes a portion 21a parallel to the tape feeding direction and a vertical portion 21b, and the vertical portion 21b particularly extends inward from the extension lines of the upper and lower sides 13a and 13b of the pocket 13. It is preferable.

  In the bonding portion pattern 21, it is preferable that a connection portion between a portion 21 a parallel to the tape feeding direction and a portion 21 b perpendicular to the tape feed direction has an arc shape (having a radius of curvature) as illustrated. This radius of curvature is increased, and a 1/4 circle-shaped adhesive portion pattern 24 shown in FIG. Further, the ratio of the lengths of the parallel portion 21a and the vertical portion 21b is not necessarily 1: 1 as shown in the figure, but may be an L-shaped bonding portion pattern in which one is long and the other is short.

  In FIG. 4B, an adhesive portion pattern 22 including three circular adhesive portions 22 a, 22 b, and 22 c disposed on the outer periphery of the four corners of the pocket 13 is provided. The circular bonded portion 22 is disposed at a position substantially the same as the bonded portion pattern 21 shown in FIG. It is preferable that the circular adhesive portion 22a disposed on the inner side is positioned inward of the extended lines of the upper and lower sides 13a and 13b of the pocket 13. The size of each circular adhesive portion needs to have sufficient adhesive strength so that the bottom tape and the top tape do not peel during transportation or the like.

  Thereby, the protrusion (jumping) prevention effect from the pocket of the chip component accommodated can be heightened. The adhesive patterns 21 and 22 are not continuous patterns of the prior art, but are dispersed patterns and are not continuous patterns in a direction perpendicular to the tape feeding direction, but are intermittent patterns. It is possible to satisfactorily prevent problems such as the top tape being cut off in the middle of peeling, and to take out stable chip components from the packaging tape.

  In FIG. 4 (c), a relatively large circular bonding portion 23 is disposed on the outer periphery of the four corners of the pocket 13. In this case, compared to the case of FIGS. 4 (a) and 4 (b), there is no adhesive portion located inward of the extension lines of the upper and lower sides 13a and 13b of the pocket 13, and therefore, it is particularly thin. The effect of preventing jumping of parts is inferior, but other effects are considered to be the same.

  In the above description, the term “adhesion” naturally includes those bonded by thermocompression bonding or pressure bonding. Moreover, although the example which forms a bottom tape with a plastic material was described, you may make it form with a paper material.

  Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.

(A) is a partially transparent perspective view of the packaging tape of the chip component by one Embodiment of this invention, (b) is a top view of the principal part. It is a perspective view which shows the shape of the iron for adhesion part formation, and its tooth | gear part. It is a partial top view of the packaging tape which shows the state which packaged the chip components. It is a top view which shows the various adhesion part patterns by other embodiment of this invention.

Explanation of symbols

11 Bottom tape 12 Top tape 13 Pockets 13a, 13b, 13c, 13d Side of pocket 14 Feed hole 15 Adhesive part (pattern)
15a, 15b Adhesive part pattern portion 16 Iron 17 Tooth mold 18 Chip component 19 Space 21, 22, 23, 24 Adhesive part pattern

Claims (6)

In the packaging tape of the chip component in which the chip component is stored in the pocket of the bottom tape having a large number of pockets, and the top tape is bonded to the bottom tape,
A packaging tape for chip parts, characterized in that adhesive portions are arranged only on the outer peripheral portions of the upper and lower sides of the pocket parallel to the tape feeding direction.   The adhesive portion is arranged such that a long portion parallel to the tape feeding direction and a short portion perpendicular to the direction surround the outer peripheral portions of the upper and lower sides of the pocket. Item 1. A packaging tape for a chip part according to Item 1. In the packaging tape of the chip component in which the chip component is stored in the pocket of the bottom tape having a large number of pockets, and the top tape is bonded to the bottom tape,
A packaging tape for chip parts, characterized in that adhesive portions are arranged only at the outer peripheral portions of the four corners of the pocket.   4. The chip part packaging tape according to claim 3, wherein the adhesive portion includes a short side parallel to the tape feeding direction and a short side perpendicular thereto.   4. The chip part packaging tape according to claim 3, wherein the adhesive part is a circular adhesive part.   A chip component provided with a bottom tape in which a plurality of pockets for accommodating chip components are formed, a top tape for covering the opening of the pocket, and an adhesive portion between the bottom tape and the top tape. In the packaging tape, the adhesive portion is provided on the outer peripheral portion of the upper and lower sides of the pocket or the outer peripheral portion of the four corners of the pocket, and extends inward from the extension lines of the upper and lower sides of each pocket, A packaging tape for chip parts, characterized by having a portion formed without adhering between adjacent pockets.

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