JP2018177299A - Carrier tape, electronic component package using carrier tape, packaging device, packaging method, and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape that is capable of making difficult deformation of an electronic component.SOLUTION: A carrier tape 11 for mounting a plurality of electronic components 13 is provided with: a plurality of pockets 14 that are arranged in the longitudinal direction of the carrier tape 11 and used for mounting the electronic components 13; and a recess 15 that is disposed between the adjacent pockets 14. The recess 15 is always connected to two opposing side walls of the adjacent pockets 14.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a carrier tape, and more particularly to a carrier tape for housing electronic components such as semiconductor devices, resistors and capacitors, a package of electronic components using the carrier tape, a packing apparatus, a packing method, and a mounting method.

  In recent years, development of automatic driving technology for the purpose of driver assistance has been advanced in the automobile industry and the like. In the field of development of automatic operation technology, quality requirements of a defect rate of 1 ppm or less have been made for semiconductor devices used in the development and mass production, and the requirements are becoming more and more severe every year.

  Defective electrical characteristics in the manufacturing plant of semiconductor devices can be removed in the electrical characteristics inspection process, but defective appearance of semiconductor devices after being stored in a package includes those generated during transportation of semiconductor devices. Care must be taken as it is sent directly to the customer.

  In addition, semiconductor devices used in the automotive industry are mainly SOP (Small Outline Package) and QFP (Quad Flat Package). The outline is mainly square, and the SOP is solder from two sides and QFP from four sides. The lead terminal for bonding protrudes.

  On the other hand, in general, a so-called carrier tape package is widely used for packaging electronic components such as semiconductor devices using a carrier tape which is easy to handle and has a good mounting efficiency of the electronic components. In particular, an embossed carrier taping package using an embossed carrier tape in which concave pockets are arranged in a row for housing a semiconductor device is in the mainstream.

  FIG. 14 is a figure which shows the carrier tape of patent document 1. As shown in FIG. In the carrier tape of the same figure, the pockets 122 and the guard pockets 130 are alternately arranged. The pockets 122 are pockets for housing electronic components, and are formed at regular intervals along the longitudinal direction. The guard pockets 130 are alternately formed at regular intervals with the pockets 122 for the purpose of preventing one of the overlapping pockets 122 from getting caught in the other when wound on a winding reel.

  In the embossed carrier tape having such a structure, when the electronic component is accommodated and wound around the winding reel, the inner pocket 122 prevents the outer pocket 122 from being fitted.

JP 2003-332788 A

  However, in the prior art, there is a problem that the electronic component may be deformed. For example, when the electronic component provided with the lead terminal which protrudes from the side is accommodated in the pocket, deformation may occur in the lead terminal.

  Specifically, the side wall of the pocket is deformed by vibration or shock during transportation of the semiconductor device, causing a problem that the tip portion of the out lead of a part of the semiconductor device mounted inside is deformed by pressure. Do.

  Therefore, in view of the above problems, the present disclosure has an object to provide a carrier tape which makes it difficult to cause deformation of an electronic component, a package of electronic components using the carrier tape, a packing apparatus, a packing method, and a mounting method. Do.

  In order to solve the above-mentioned subject, a carrier tape concerning one mode of this indication is a carrier tape for carrying a plurality of electronic parts, and is arranged in a longitudinal direction of the carrier tape, and a plurality of electronic parts A plurality of pockets for mounting and recesses respectively arranged between adjacent pockets, wherein the recesses are constantly connected or temporarily connected to two opposing side walls of adjacent pockets. .

  Further, a package of electronic components according to an aspect of the present disclosure includes the carrier tape, the plurality of electronic components mounted in the plurality of pockets, and the openings of the plurality of pockets on which the electronic components are mounted. And a top cover tape covering the entire part.

  Furthermore, the packing device for an electronic component according to an aspect of the present disclosure includes a preparation unit for preparing the carrier tape, and a lead terminal protruding from a side surface in each of the plurality of pockets provided on the carrier tape. The electronic component includes a mounting portion for mounting the electronic component, a bonding portion bonding a top cover tape to the carrier tape, and a winding portion winding the carrier tape bonded to the top cover tape around a transport reel.

  Furthermore, the packing method of the electronic component according to an aspect of the present disclosure includes the preparing step of preparing the carrier tape, and the lead terminal protruding from the side surface in each of the plurality of pockets provided in the carrier tape. The method includes a mounting step of mounting an electronic component, a bonding step of bonding a top cover tape to the carrier tape, and a winding step of winding the carrier tape bonded to the top cover tape around a transport reel.

  In the electronic component mounting method according to one aspect of the present disclosure, the top cover tape is pulled from a portion of the package pulled out from the step of pulling out a portion of the package from being wound up on a transport reel. And removing the electronic component from the exposed opening and mounting the removed electronic component on a substrate.

  According to the carrier tape, the package of the electronic component using the carrier tape, the packing device, the packing method, and the mounting method according to the present disclosure, there is an effect that the electronic component is less likely to be deformed.

FIG. 1 is a view showing a configuration example of a carrier tape according to the first embodiment. FIG. 2 is a view showing an example of a carrier tape in which the side wall of the pocket is deformed by vibration or impact during transportation in FIG. FIG. 3 is a perspective view showing an example of the carrier tape package according to the first embodiment. FIG. 4: is a block diagram which shows the structural example of the packing apparatus which concerns on 1st Embodiment. FIG. 5 is a flowchart showing a specific example of the packing method in the packing apparatus according to the first embodiment. FIG. 6 is a block diagram showing a configuration example of the mounting apparatus according to the first embodiment. FIG. 7 is a flowchart showing a specific example of the mounting method in the mounting apparatus according to the first embodiment. FIG. 8 is a view showing a configuration example of a carrier tape according to a modification of the first embodiment. FIG. 9 is a view showing an example of the carrier tape 11 in which the side wall of the pocket is deformed by vibration or impact during transportation in FIG. FIG. 10 is a view showing a configuration example of a carrier tape according to the second embodiment. FIG. 11 is a view showing an example of the carrier tape 11 in which the side wall of the pocket is deformed by vibration or impact during transportation in FIG. FIG. 12 is a view showing a configuration example of a carrier tape according to a modification of the second embodiment. FIG. 13 is a view showing an example of the carrier tape 11 in which the side wall of the pocket is deformed by vibration or impact during transportation in FIG. FIG. 14 is a block diagram showing an example of the carrier tape package disclosed in Patent Document 1. As shown in FIG. FIG. 15 is a view showing an example in which the outlead of the electronic component is deformed in the general carrier tape.

(Findings that formed the basis of the present invention)
The inventor has found that the following problems occur with the carrier tape described in the "Background Art" section.

  FIG. 15 is a view showing an example in which the outlead of the electronic component is deformed in the general carrier tape. (A) of the figure is a top view, (b) is a side view. The carrier tape in the same figure is an embossed carrier tape and has perforations and pockets 122. Although only one pocket 122 is shown in FIG. 15, a plurality of pockets 122 are arranged at regular intervals in the longitudinal direction of the carrier tape. The pocket 122 in the figure accommodates the electronic component 113. The electronic component 113 is a semiconductor device having an array of out leads 117 protruding from the side, and in the figure, an example of a SOP (Small Outline Package) type IC (Integrated Circuit) is shown. The out leads 117 are also referred to as lead terminals and lead pins.

  The outer shape in a plan view of the pocket 122 in FIG. 15 is a rectangular shape having rounded four corners so that the electronic component 113 can be accommodated. In addition, the outer shape of the pocket 122 in a side view is a rectangular shape in which the lower two corners are rounded.

  However, part of the side wall of the pocket 122 may be deformed. A thick line pointed by an arrow M in FIG. 15 indicates an example of side wall deformation. A thick line and a thick broken line indicated by the arrow R indicate an example of the deformed outlead 117. Specifically, as shown in the plan view of FIG. 15A, the side wall of the pocket 122 may be deformed by vibration or shock during transportation of the electronic component. The amount of deformation W of the side wall depends on the length L of the side wall of the pocket 122 and the magnitude of vibration or impact during transportation. When the amount of deformation W becomes larger than the clearance in the longitudinal direction of the carrier tape of the pocket 122 and the electronic component 113, as indicated by an arrow R in FIG. A part is pushed and deformed.

  Further, the carrier tape of Patent Document 1 has the guard pocket 130 between the pockets 122, and suppresses the fitting of the pocket 122 at the time of winding on the reel, but can not suppress the side wall deformation.

  As a result of such side wall deformation, for example, the deformation of the outlead 117 in the vertical direction of the electronic component 113, the gap between the bottom of the electronic component 113 and the tip of the outlead 117 called so-called standoff, and the outlead 117 called coplanarity. This causes an abnormality in the displacement dimension of the connection portion of each out lead 117 from the reference plane to be arranged.

  When mounting the electronic component 113 on a printed wiring board (PWB: Printed Wiring Board), in particular, if vertical bending of the out lead 117 or floating of the out lead 117 (that is, nonuniformity of the lower surface of the out lead 117) occurs. Leading to poor solder connection.

  In order to solve such a problem, the carrier tape according to an aspect of the present disclosure is a carrier tape for mounting a plurality of electronic components, and is arranged in the longitudinal direction of the carrier tape, and the plurality of electronic components are arranged. A plurality of pockets for mounting and recesses respectively arranged between the adjacent pockets, the recesses are constantly connected or temporarily connected to the two opposing side walls of the adjacent pockets.

  According to this carrier tape, it is possible to prevent deformation of the electronic component and to significantly reduce the rate of generation of deformation. For example, when an electronic component having an arrangement of outleads, which are lead terminals protruding from the side, is accommodated in the pocket, deformation of the outlead can be made less likely to occur.

  Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

  In the following description, the electronic components defined in the present disclosure include active components, passive components, mechanical components and the like. Active components are represented by semiconductor devices, and include ICs, LSIs (Large Scale ICs), transistors, diodes, switching elements, and the like. Passive components include resistors, capacitors, coils, and the like. The mechanical parts include connectors, fuses, switches and the like. The electronic component in the present disclosure is not limited to the narrowly defined electronic component that interprets an object as a passive component.

  In the following description, substantially the same configuration may be denoted by the same reference numeral and description thereof may be omitted. Moreover, all the embodiments described below show one specific example. Furthermore, numerical values, shapes, materials, components, arrangement positions and connection shapes of the components, steps, order of steps, and the like shown in the following embodiments are merely examples, and the present disclosure is not limited.

  Furthermore, in the following description, the electronic component may be treated as a transparent body in some drawings for convenience of explanation. Moreover, although the electronic component placed in the pocket of the embossed carrier tape takes up an SOP product as an example, it is not limited to this, and other types of package products also fall within the scope of the present disclosure. is there.

  Moreover, although an electronic component is picked up and demonstrated as a package goods mounted in the pocket of embossed carrier tape, this is not limited, either, and other electronic which can be mounted in the pocket of embossed carrier tape as mentioned above Parts are also within the scope of the present disclosure.

First Embodiment
Hereinafter, a first embodiment of the present disclosure will be described.

  FIG. 1 is a view showing a configuration example of a carrier tape 11 according to the present embodiment. (A) of FIG. 1 is a plan view seen from the top surface side of the carrier tape 11, and (b) of FIG. 1 is a side view of the carrier tape 11. As shown in FIG.

  As shown in (a) of FIG. 1, the carrier tape 11 of the present embodiment is a so-called embossed carrier tape having a plurality of pockets 14, a plurality of recesses 15, and a plurality of feed holes 12.

  The plurality of pockets 14 are arranged in the longitudinal direction of the carrier tape 11 and formed in a concave shape which is sunk from one surface of the carrier tape 11 in order to mount a plurality of electronic components.

  The feed hole 12 is a hole which penetrates in the thickness direction on one end side in the width direction of the carrier tape 11. A plurality of feed holes 12 are provided at predetermined intervals in the longitudinal direction. The feed holes 12 are for guiding and conveying the carrier tape 11 in the longitudinal direction, and are formed at positions where they can be engaged with the feed pins of the conveyance device. The transport apparatus referred to here is, for example, a packing apparatus that mounts a plurality of electronic components 13 on a carrier tape 11 and packs the plurality of electronic components 13 from a carrier taping package, and mounts them on a substrate. Mounting device etc.

  In addition, a plurality of pockets 14 are provided in the longitudinal direction at predetermined central portions of the carrier tape 11 in the width direction of the carrier tape 11 at predetermined intervals. The pocket 14 is sunk in the direction opposite to the top surface in the thickness direction.

  In addition, the size of the pocket 14 is formed to have a margin in any of the width direction, the length direction, and the thickness direction than the electronic components 13 stored therein. The shape of the pocket 14 is formed in accordance with the outer shape of the electronic component 13. The outer shape in a plan view of the pocket 14 in FIG. 1 is a rectangular shape having rounded four corners so that the electronic component 13 can be accommodated. Moreover, the external shape in the side view of the pocket 14 is a rectangular shape with two rounded lower corners.

  Here, the gap between the electronic component 13 to be placed and the pocket 14 may be set in consideration of the moving accuracy of the device used for inserting and removing and the processing accuracy of the forming maker of the carrier tape 11. Specifically, the clearance between the side wall of the pocket 14 and the tip of the out lead 17 of the SOP which is the electronic component 13 may be about 0.1 mm to 0.5 mm.

  Each of the plurality of recesses 15 is disposed between each adjacent pocket 14. The recess 15 is formed to be always connected or temporarily connected to two opposing side walls of the adjacent pocket 14. In the present embodiment, the former, that is, the configuration in which the concave portion 15 is "always connected" to the side wall will be described. The latter will be described in the second embodiment.

  Further, in the present embodiment, the recessed portion 15 is formed between the peripheral portions of the adjacent pockets 14. The recess 15 is formed to be connected to the peripheral edge of the adjacent pocket 14 as shown in (b) of FIG.

  In FIG. 1A, the recess 15 is provided so as to extend in the longitudinal direction of the carrier tape 11 between two opposing side walls of the adjacent pockets 14, and is always connected with the two side walls. That is, the longitudinal end of the side wall parallel to the longitudinal direction of the recess 15 and the side wall perpendicular to the longitudinal direction of the pocket 14 are always connected. Thereby, the strength of the side wall of the pocket 14 is increased and it becomes difficult to deform.

  Also, the side wall of the pocket 14 has an opening at the connection point between the pocket 14 and the recess 15. The space in the recess 15 is connected to the space in the pocket 14 by an opening. In addition, the area of the opening is the same size as the cross-sectional area of the space in the recess 15 cut by a plane orthogonal to the longitudinal direction of the carrier tape 11. The area and cross-sectional area of the opening are each d × S in FIG. d is the depth inside the recess 15; S is the width inside the recess 15 in the width direction of the carrier tape 11.

  Further, the installation position of the concave portion 15 is not limited to the illustrated portion, and it may be provided with a width such that the stored electronic component 13 does not protrude from the pocket 14. Further, the depth d of the recess 15 is smaller than the depth D of the pocket 14. The distance b between the surface of the carrier tape 11 and the outer bottom surface of the recess 15 is smaller than the distance B between the surface of the carrier tape 11 and the outer bottom surface of the pocket 14. The depth d of the recess 15 may be set to such a depth that the tip of the out lead 17 of the electronic component 13 does not get on.

  The recess 15 may be formed by the same method as the forming of the pocket 14 when the carrier tape 11 is formed. Also. In the taping apparatus of the electronic component 13 using the carrier tape 11, you may form by press processing.

  Next, the effect of this embodiment and the mechanical mechanism that brings about the effect will be described with reference to FIG.

  FIG. 2 is a view showing an example of the carrier tape 11 in which the side wall of the pocket 14 is deformed by vibration or impact during transportation in FIG. FIG. 2A is a plan view seen from the top surface side of the carrier tape 11, and FIG. 2B is a side view of the pocket 14 of the carrier tape 11. A thick line pointed by an arrow A in FIG. 2 indicates an example of side wall deformation. The electronic component 13 indicated by the arrow C indicates an example in which the mounting position of the electronic component 13 in the pocket 14 is slightly floated by the side wall deformation.

  As shown in the plan view of FIG. 2A, the side walls of the pocket 14 may be deformed by vibration or shock during transport of the carrier tape 11 on which the electronic component 13 is mounted. The amount of deformation W of the side wall depends on the length L of the side wall of the pocket and the magnitude of vibration and impact during transportation. Since the carrier tape 11 is provided with the recess 15 as shown in FIG. 2, the length L of the side wall of the pocket 14 is shorter than that in FIG. The amount of deformation W decreases because the strength of the side wall is increased and it becomes difficult to deform by always connecting the concave portion 15 with the two mutually opposed side walls of the adjacent pockets 14.

  As a result, the deformation amount W does not become larger than the clearance in the longitudinal direction of the pocket 14 and the carrier tape 11 of the electronic component 13 and the out lead 17 becomes difficult to be pushed by the deformed portion of the side wall of the pocket 14 Is hard to occur. Further, even if the mounting position of the electronic component 13 floats up slightly as the arrow C points, since the out lead 17 is not deformed, solder connection failure is not generated when the electronic component 13 is mounted on the printed wiring board.

  Here, the shape of the carrier tape 11 shown in the present embodiment may be used as necessary while taking into consideration the degree of difficulty in manufacturing the pocket 14, the manufacturing cost, the package outer shape, the gap position and the like.

  In addition, as a raw material of the carrier tape 11, resin, such as a polystyrene, A-PET (polyethylene terephthalate), polycarbonate, a polypropylene, may be used, and it can use properly according to a use. For example, a resin material for which transparency is required is used for appearance inspection application after taping packaging. In order to prevent electrical failure of the ESD sensitive ESD device, a resin material into which a conductive material such as carbon powder is mixed is used. Furthermore, a resin material in which a conductive material is applied to the surface of the carrier tape 11 is used for the purpose of preventing electrical failure.

  The thickness of the carrier tape 11 is often 0.2 mm to 0.4 mm, for example, in view of manufacturing difficulty and material cost.

  In addition, as a shaping | molding method of the pocket 14 and the recessed part 15, it can shape | mold by the method of sending out and shape | molding the raw material resin sheet heated alternately. Further, as other forming methods, it can be manufactured by various production methods such as a vacuum forming method of forming by vacuum pressure, a pressure forming method of forming by high pressure air, a press forming method of forming by a punch type and a die type.

  In addition, although the above forming methods were mentioned as an example by the problem of material cost and the advantage in manufacture, in this embodiment, it does not restrict to this manufacturing method, It combines after forming with different materials and different manufacturing methods. It does not matter at all.

  Moreover, about the item which is not demonstrated by this embodiment, you may use the material based on the standard generally widely unified. For example, the width dimension of the carrier tape 11, the feed hole 12, the installation position of the pocket 14 and the like are IEC 60286-3 issued by the International Electrotechnical Commission and JIS C 0806-3 issued by the Japanese Standards Association, and these standards conformed. There is no problem with using materials.

  Next, a package for packing the electronic component 13 in the pocket 14 of the carrier tape 11 and a packing method will be described with reference to FIGS. 1 and 3.

  FIG. 3: is a perspective view which shows an example of the carrier taping package 19 containing a package which concerns on this embodiment. In the figure, the carrier taping package 19 includes a transport reel 16 and a package wound around the transport reel 16. The package includes a carrier tape 11, a plurality of electronic components 13 mounted in the plurality of pockets 14, and a top cover tape 18 covering the entire opening of the plurality of pockets 14 in which the electronic components 13 are mounted.

  A specific packing method, that is, the packing method of packing the electronic component 13 in the pocket 14 of the carrier tape 11 is as follows.

  First, as shown in FIG. 1B, the electronic component 13 is placed in the pocket 14 of the carrier tape 11 in a predetermined direction. The predetermined direction is, in many cases, the direction in which the solder connection end face of the out lead 17 is downward in accordance with the mounting direction of the printed circuit board.

  Next, after the electronic component 13 is stored in the pocket 14, the top cover tape 18 is placed on the top surface side of the carrier tape 11 so as to cover the opening above the pocket 14. Further, the both ends of the carrier tape 11 are continuously thermocompression bonded by the thermocompression bonding apparatus, and the package is completed.

  The top cover tape 18 is generally formed to be narrower than the width of the carrier tape 11. The top cover tape 18 covers the entire opening of the plurality of pockets 14 and does not cover the perforations 12. The main purpose thereof is to prevent the electronic components 13 stored in the pocket 14 from falling off or contaminating the outside air.

  The material of the top cover tape 18 is preferably a resin material that can be easily heat-pressed with the carrier tape 11, and a material mainly made of polyethylene terephthalate (PET) is used. The thickness of the top cover tape 18 is preferably about 50 μm. Further, it is desirable that the top cover tape 18 be transparent enough to allow the electronic component 13 to be transparently identified in order to facilitate visual inspection of the package.

  In addition, joining with the carrier tape 11 and the top cover tape 18 is not restricted to thermocompression bonding, and it does not matter even if it joins using other materials, such as an adhesive agent.

  Further, as shown in FIG. 3, the carrier taping package 19 of the present embodiment is formed on the transport reel 16 for facilitating storage and transportation of the package adhered to the top cover tape 18 on the upper surface of the carrier tape 11. It is a package wound up in a plurality of roll shapes, and stored in a cardboard or the like in this state and shipped.

  The carrier taping package 19 may be packaged in an aluminum laminate bag or the like together with a dehumidifying desiccant such as silica gel or vacuum-packed with vacuum suction, in order to shield the electronic component 13 from external moisture.

  Thereafter, the carrier taping package 19 is transported to the destination in a state of being enclosed and packaged in a transport case such as a cardboard box or a plastic case.

  During shipping and transportation, various impact stress loads and vibration stress are applied to the package in the process of transporting the package to the destination. These dimensions include the transportation and transportation distance to the destination, handling methods, load and shock resistance of packaging materials such as cardboard, carrier tapes, and other materials, resistance specifications for impact damage to electronic components 13 and lead terminals, etc. It is greatly affected.

  However, if the embossed carrier tape 11 of the present embodiment is used, as described above, it is possible to suppress deformation failure of the terminal portion of the electronic component represented by the out lead of the electronic component.

  Next, a packing apparatus for electronic parts using the carrier tape 11 according to the present embodiment and a packing method thereof will be described.

  FIG. 4 is a block diagram showing a configuration example of the packing device 20 according to the first embodiment. Moreover, FIG. 5 is a flowchart figure which shows the specific example of the packing method in the packing apparatus 20 which concerns on 1st Embodiment.

  The packing apparatus 20 of FIG. 4 includes a preparing unit 21, a mounting unit 22, an arranging unit 23, an adhering unit 24, a winding unit 25, and a package delivery unit 26.

  The preparation unit 21 prepares the carrier tape 11, the top cover tape 18, and the electronic component 13 (S1). For example, the preparation unit 21 may prepare the molded carrier tape 11 and place it on the work table, or heat the resin sheet of the raw material to alternately mold and deliver the pocket 14 and the recess 15. Thus, the carrier tape 11 may be formed and disposed on the work bench.

  The mounting unit 22 mounts the electronic component 13 having the connection terminal protruding from the side surface on each of the plurality of pockets 14 provided in the carrier tape 11 (S2).

  The placement unit 23 places the top cover tape 18 on the carrier tape 11 after the electronic component 13 is mounted (S3).

  The bonding unit 24 bonds the carrier tape 11 and the top cover tape 18 (S4). The bonding may be performed using an adhesive or by thermocompression bonding. In this way, the package is made one by one.

  The winding unit 25 winds the carrier tape 11 to which the top cover tape 18 is adhered to the transport reel 16 (S5).

  The package carry-out section 26 carries out the transport reel 16 on which the carrier tape 11 carrying the specified number of electronic components 13 mounted thereon is taken up as the carrier taping package 19 (S7).

  Next, a mounting apparatus for mounting an electronic component placed on the carrier tape 11 according to the present embodiment on a printed wiring board and a mounting method thereof will be described.

  FIG. 6 is a block diagram showing a configuration example of the mounting apparatus 30 according to the first embodiment. FIG. 7 is a flowchart showing a specific example of the mounting method in the mounting apparatus 30 according to the first embodiment.

  The mounting apparatus 30 of FIG. 6 includes a package preparing unit 31, a drawing unit 32, a peeling unit 33, a removing unit 34, a substrate loading unit 35, an arranging unit 36, and a substrate unloading unit 37. The package preparation unit 31 prepares the carrier taping package 19 (S11). For example, the package preparation unit 31 sets the transport reel 16 of the carrier taping package 19 on the reel shaft, and engages the feed hole 12 of the carrier tape 11 with the feed pin.

  The drawer portion 32 pulls out a part of the package from the state of being taken up by the transport reel 16. Specifically, the lead-out portion 32 draws a part of the carrier tape 11 from the transport reel 16 through the feed hole 12 by the drive of the feed pin (S12).

  The peeling section 33 peels the top cover tape 18 from the carrier tape 11 in one direction in a part of the pulled out package (S13), and exposes the opening of the pocket 14 of the carrier tape 11.

  The extraction unit 34 extracts the electronic component 13 from the exposed opening (S14).

  The substrate carry-in unit 35 carries in the printed wiring board and places it on the work bench.

  The placement unit 36 places the taken out electronic component 13 on the printed wiring board of the workbench (S15). The arrangement referred to here is, for example, bonding at a predetermined position of the printed wiring board.

  The board carry-out unit 37 carries out the printed wiring board on which the required number of electronic components 13 are arranged to the apparatus of the next process (yes in S16). The mounting method of FIG. 7 corresponds to one printed wiring board. An apparatus subsequent to the board unloading unit 37 is an apparatus for mounting another electronic component on a printed wiring board, or a reflow apparatus for soldering.

  In the above mounting method, when the carrier tape 11 is provided with the recess 15 for connecting the pockets 14, deformation of the out leads 17 of the electronic component 13 is less likely to occur due to vibration or shock during transportation, and printing after mounting is performed. Poor connection between the wiring board and the electronic component 13 is less likely to occur.

  In high-density mounting where a large number of parts are mounted in a limited space, it is necessary to supply a large number of parts in a dense manner, so the carrier taping package 19 is more efficient in the mounting process than tray packaging and magazine tube packaging. And speed can be realized.

  As described above, the carrier tape according to the first embodiment is the carrier tape 11 for mounting the plurality of electronic components 13 and is arranged in the longitudinal direction of the carrier tape 11 and the plurality of electronic components 13 are arranged. The plurality of pockets 14 for mounting and the recess 15 respectively disposed between the adjacent pockets, the recess 15 is constantly connected with two mutually opposing side walls of the adjacent pockets, or temporarily Connecting.

  According to this, it is possible to make the deformation of the electronic component less likely to occur and to significantly reduce the rate of occurrence of the deformation. For example, deformation of the electronic component due to side wall deformation of the pocket 14 can be made less likely to occur.

  Here, the recess 15 may be provided to extend in the longitudinal direction between the two side walls, and may be always connected with the two side walls.

  According to this, since the recess 15 is always connected to the two opposing side walls of the adjacent pocket 14, it is possible to make it difficult to change the electronic component caused by the side wall deformation of the pocket 14.

  Here, the depth (d) of the recess 15 may be shallower than the depth (D) of the pocket 14.

  According to this, the electronic component 13 can be accommodated in the pocket 14 without the out lead 17 of the electronic component 13 running on the recess 15.

  Here, the side wall of the pocket 14 may have an opening at the connection point between the pocket 14 and the recess 15, and the space in the recess 15 may be connected to the space in the pocket 14 by the opening.

  Here, the area of the opening may be the same size as the cross-sectional area of the space in the recess 15 cut by a plane orthogonal to the longitudinal direction of the carrier tape 11.

  According to this, the pocket 14 and the recess 15 can be easily formed as embossing simultaneously or sequentially.

  The electronic component package according to the first embodiment includes the carrier tape 11, the plurality of electronic components 13 mounted in the plurality of pockets 14, and the plurality of pockets 14 in which the electronic components 13 are mounted. And a top cover tape 18 covering the entire opening.

  Furthermore, the packing apparatus 20 according to the first embodiment includes the preparation unit 21 for preparing the carrier tape 11 and the electronic component 13 having the lead terminal protruding from the side surface in each of the plurality of pockets 14 provided on the carrier tape 11. And a bonding unit 24 for bonding the top cover tape 18 to the carrier tape 11, and a winding unit 25 for winding the carrier tape 11 bonded to the top cover tape 18 onto the transport reel 16. .

  In the electronic component packing method according to the first embodiment, a preparation step of preparing the carrier tape 11 and an out lead which is a lead terminal protruding from the side surface to each of the plurality of pockets 14 provided in the carrier tape 11 A mounting step of mounting the electronic component 13 having the number 17, a bonding step of bonding the top cover tape 18 to the carrier tape 11, and a winding step of winding the carrier tape 11 bonded to the top cover tape 18 around the transport reel 16. And.

  Furthermore, in the mounting method of the electronic component according to the first embodiment, the step of pulling out a part of the package from being wound up on the transport reel 16 and peeling off the top cover tape 18 from the part of the drawn package The steps of exposing the opening of the pocket 14, removing the electronic component 13 from the exposed opening, and mounting the removed electronic component 13 on a substrate are included.

  Although the carrier tape 11 is described as an example in the present embodiment, the present invention is not limited to this example, and can be widely applied to other examples in which the basic concept of the present disclosure is common. Instead of the carrier tape, for example, a punch carrier type such as plastic and paper may be used. Moreover, although the semiconductor device is mentioned as an example as the electronic component 13 accommodated, it is not limited to it, It applies to small parts other than semiconductor devices, small parts, such as resistors and capacitors, and other small articles No matter what.

  Further, although the carrier tape 11 exemplified in the present embodiment is a continuous tape because of the advantage in manufacturing, it is not always necessary to be continuous, and individual tapes formed by different materials or different manufacturing methods are processed in a later step. It does not matter if it is united and prepared.

  Furthermore, according to the carrier tape 11 of the present embodiment, the package and the packing method thereof, and the mounting method thereof, the mounting shape of the external shape and volume of the electronic component to be stored, the transportation and transportation distance to the conveyance destination, and the electronic component Depending on the conditions such as the generation of evolution of, it may be used properly as needed.

(Modification of the first embodiment)
Hereinafter, modifications of the first embodiment will be described.

  In this modification, the package of the electronic component using the carrier tape, the packing method, the mounting method of the electronic component using the same, and the other application examples are substantially the same as those in the first embodiment. The description is omitted.

  Further, in the description of the present embodiment, components having substantially the same functions as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and the repeated description will be omitted.

  Note that, in the present modification, only portions different from the first embodiment will be described, and the same contents as the first embodiment will not be repeatedly described.

  FIG. 8 is a view showing a configuration example of a carrier tape 11 according to a modification of the first embodiment. FIG. 8A is a plan view seen from the top surface side of the carrier tape 11, and FIG. 8B is a side view of the pocket 14 of the carrier tape 11. As shown in FIG.

  In the present modification, a recess 15 is formed between the peripheral portions of adjacent pockets 14. As shown in FIG. 8B, the concave portion 15 connects the peripheral portions of the adjacent pockets 14 on both sides of the side wall surface of the pocket 14 in the width direction (direction orthogonal to the longitudinal direction) of the carrier tape 11. It is formed in the form.

  The difference between this modification and the first embodiment is that in this modification, two recesses 15 are arranged in parallel in the width direction of the carrier tape 11 between the adjacent pockets 14.

  In FIG. 8A, two recesses 15 are arranged in parallel between the left pocket 14 and the center pocket 14, and two recesses 15 are formed between the center pocket 14 and the right pocket 14. The case where it arranges in parallel is illustrated.

  Further, the installation position of the concave portion 15 is not limited to the illustrated portion, and it may be provided with a width such that the stored electronic component 13 does not protrude from the pocket 14. Further, the depth of the concave portion 15 may be set to a depth that does not cause the tip of the out lead 17 of the electronic component 13 to get on.

  The recess 15 may be formed by the same method as the forming of the pocket 14 when the carrier tape 11 is formed. Also. In the taping apparatus of the electronic component 13 using the carrier tape 11, you may form by press processing.

  Next, the effect of this modification and the mechanical mechanism that brings about the effect will be described with reference to FIG.

  FIG. 9 is a view showing an example of the carrier tape 11 in which the side wall of the pocket is deformed by vibration or impact during transportation in FIG. FIG. 9A is a plan view seen from the top surface side of the carrier tape 11, and FIG. 9B is a side view of the pocket 14 of the carrier tape 11. A thick line indicated by an arrow A in FIG. 9 indicates an example of side wall deformation. The electronic component 13 indicated by the arrow C indicates an example in which the mounting position of the electronic component 13 in the pocket 14 is slightly floated by the side wall deformation.

  As shown in the plan view of FIG. 9A, the side wall of the pocket may be deformed by vibration or shock during transportation of the electronic component 13. The amount of deformation W of the side wall depends on the length L of the side wall of the pocket and the magnitude of vibration and impact during transportation. As shown in FIG. 8, by providing two parallel recessed portions 15 between the side walls of the pockets 14 where the carrier tape 11 adjoins, the length L of the side wall portions of the pockets 14 is further shortened as compared with FIG. The deformation amount W also decreases.

  As a result, the deformation amount W does not become larger than the clearance in the longitudinal direction of the pocket 14 and the carrier tape 11 of the electronic component 13 and the out lead 17 becomes difficult to be pushed by the deformation portion of the pocket side wall portion. It is hard to occur.

  According to this modification, as shown in FIG. 9, the two recesses 15 are arranged in parallel in the width direction of the carrier tape 11, so that the length L of the side wall of the pocket 14 is greater than that of the first embodiment. Can be shortened, so that the deformation amount W can be further suppressed as compared with the first embodiment.

  In the actual carrier tape 11, two parallel concave portions 15 may be arranged adjacent to each other in the width direction of the carrier tape 11, and the pattern may be repeated in the longitudinal direction of the carrier tape 11. 1 and 8 may be combined so that one concave portion 15 and two parallel concave portions 15 are disposed adjacent to each other in the width direction of the carrier tape 11 and the pattern may be repeated in the longitudinal direction of the carrier tape 11. Furthermore, it may be a pattern in which three or more juxtaposed recesses 15 are arranged adjacent to each other in the width direction of the carrier tape 11, and the pattern may be repeated in the longitudinal direction of the carrier tape 11.

  As described above, according to the carrier tape, the package of electronic parts and the packing method of the embodiment and the variation thereof, the transportation is performed when the electronic parts are stored in the pocket of the carrier tape. When the side wall of the pocket is deformed due to internal vibration or impact, the length L of the wall of the pocket is shortened by providing the recess 15, and the clearance between the pocket 14 and the carrier tape 11 of the electronic component 13 in the longitudinal direction The deformation amount W does not become larger than the above, and the deformation of the out lead 17 can be made less likely to occur by being partially pressed by the deformation portion of the pocket side wall portion.

  As described above, in the carrier tape 11 according to the modification of the first embodiment, the plurality of concave portions 15 are provided in the direction orthogonal to the longitudinal direction between the two side walls.

  According to this, the strength of the side wall of the pocket 14 can be further increased as compared with the case where there is one recess 15 between the two side walls. As a result, it is possible to make the deformation of the electronic component less likely to occur, and to significantly reduce the rate of occurrence of the deformation.

  In FIG. 1 of the first embodiment and FIG. 8 of the modification, the side wall of the pocket 14 may not have an opening at the connection point between the pocket 14 and the recess 15. In addition, the area of the opening may be different from the cross-sectional area of the space in the recess 15 cut by a plane orthogonal to the longitudinal direction of the carrier tape 11.

Second Embodiment
The second embodiment will be described below.

  In the present embodiment, the package of the electronic component using the carrier tape, the packing method, the mounting method of the electronic component using the same, and the other application examples are substantially the same as the first embodiment. The description is omitted.

  Further, in the description of the present embodiment, components having substantially the same functions as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and the repeated description will be omitted.

  Note that, in the present embodiment, only portions different from the first embodiment will be described, and the repetitive description will be omitted for the same contents as the first embodiment.

  FIG. 10 is a view showing a configuration example of the carrier tape 11 according to the present embodiment. FIG. 10A is a plan view seen from the top surface side of the carrier tape 11, and FIG. 10B is a side view of the pocket 14 of the carrier tape 11.

  In the present embodiment, the recess 15 is formed between the peripheral portions of the adjacent pockets 14. As shown in FIG. 10B, the recess 15 is formed so as not to be connected to the respective peripheral edge portions of the adjacent pockets 14 on both sides of the side wall surface of the pocket 14 in the width direction of the carrier tape 11.

  In addition, the installation position of the recessed part 15 is not limited to the location shown in figure.

  The difference between the present embodiment and the first embodiment is that the recess 15 is not always connected with two mutually opposing side walls of the adjacent pockets 14 but is temporarily connected. Here, the temporary connection corresponds to a state in which the carrier tape is wound up so that the pocket protrudes to the center side of the winding. That is, the recess 15 is connected by contacting the two side walls in a state where the carrier tape 11 is wound up. On the other hand, in the state in which the carrier tape 11 linearly extended, the concave portions 15 are separated by a distance p without being connected to the side walls of the adjacent pockets 14.

  Further, the distance p in FIG. 10, that is, the distance p between the pocket 14 and the recess 15 in the state in which the carrier tape 11 is linearly extended, the pocket 14 contacts the recess 15 in the state in which the carrier tape 11 is wound. Is set to For example, in the state where the carrier tape 11 is wound up, the pocket 14 and the recess 15 which are closer to the inner peripheral side than the outer peripheral side are more likely to contact with each other. The above-mentioned distance p should just be a distance which the pocket 14 and recessed part 15 of the innermost periphery contact at least.

  Next, the effect of this embodiment and the mechanical mechanism that brings about the effect will be described with reference to FIG.

  FIG. 11 is a view showing an example of the carrier tape 11 in which the side wall of the pocket 14 is deformed by vibration or impact during transportation in FIG. FIG. 11A is a plan view seen from the top surface side of the carrier tape 11, and FIG. 11B is a side view of the pocket 14 of the carrier tape 11. A thick line indicated by an arrow A in FIG. 11 indicates an example of side wall deformation.

  As shown in the plan view of (a) of FIG. 11, the side wall of the pocket portion is deformed by vibration or impact during transportation of the electronic component 13. The amount of deformation W of the side wall depends on the length L of the side wall of the pocket and the magnitude of vibration and impact during transportation. The concave portion 15 is formed at a position not connected to the side wall of the adjacent pocket 14 in a state where the carrier tape 11 linearly extends, and the side wall of the pocket 14 and the concave portion 15 are in close proximity. On the other hand, when the carrier tape 11 is wound around the transport reel 16, the side wall of the pocket 14 contacts the recess 15. This contact suppresses deformation of the side wall of the pocket 14.

  As a result, the deformation amount W does not become larger than the clearance in the longitudinal direction of the pocket 14 and the carrier tape 11 of the electronic component 13, and the out lead 17 is less likely to be pushed to the deformed portion of the pocket side wall. It becomes difficult to do.

  As described above, in the carrier tape 11 according to the second embodiment, the recess 15 is provided so as to extend in the direction orthogonal to the longitudinal direction. The temporary connection of the recess 15 to the two opposing side walls of the adjacent pocket 14 corresponds to the state in which the carrier tape 11 is wound so that the pocket 14 protrudes to the center side of the winding. That is, the recess 15 connects the two side walls in a state in which the carrier tape 11 is wound up. Further, the recess 15 is separated from the two side walls in a state where the carrier tape 11 is linearly extended.

  That is, in the state where the carrier tape 11 extends in a straight line, the side walls of the pocket and the side walls of the recess are close to each other so as not to be connected, and the side walls of the recess 15 and the pocket 14 Contact. This suppresses deformation. For example, even when the electronic component 13 is transported to the pocket 14 of the carrier tape 11 with the electronic component 13 being stored, the side wall of the pocket is deformed due to vibration or shock during transportation, and the terminal of the electronic component is deformed. It can be difficult to do.

  Furthermore, in other words, the recess 15 increases the strength of the side wall of the pocket 14 because the two side walls are connected in a temporary connection, that is, in a wound state. Therefore, side wall deformation due to vibration or impact during transportation is less likely to occur, and the occurrence rate of deformation of the electronic component 13 can be significantly reduced. For example, the deformation of the out lead 17 of the electronic component 13 due to the side wall deformation of the pocket 14 can be made less likely to occur.

  Here, the distance b between the surface of the carrier tape 11 and the outer bottom surface of the recess 15 may be smaller than the distance B between the surface of the carrier tape 11 and the outer bottom surface of the pocket 14.

  According to this, the winding radius is not increased by the presence of the recess 15.

(Modification of the second embodiment)
Hereinafter, a modification of the second embodiment will be described.

  In this modification, a package of an electronic component using a carrier tape, a packing method, an electronic component mounting method using the same, and other applications are substantially the same as the first and second embodiments. Therefore, the description is omitted.

  In the description of the present embodiment, components having substantially the same functions as those of the first and second embodiments will be denoted by the same reference numerals as those of the first and second embodiments, and the repetitive description will be omitted. Do.

  Note that, in the present modification, only portions different from the second embodiment will be described, and the same contents as the second embodiment will not be repeatedly described.

  FIG. 12 is a view showing a configuration example of a carrier tape 11 according to a modification of the second embodiment. 12 (a) is a plan view seen from the top surface side of the carrier tape 11, and FIG. 12 (b) is a side view of the pocket 14 of the carrier tape 11. As shown in FIG.

  The difference between this modification and the second embodiment is that, in this modification, two recesses 15 are formed in parallel in the longitudinal direction of the carrier tape 11 between the adjacent pockets 14.

  The distance q in FIG. 12, that is, the distance p between two adjacent recesses 15 in a state in which the carrier tape 11 is linearly extended, allows the two recesses 15 to contact with each other in a state in which the carrier tape 11 is wound. Set to distance. For example, in the state where the carrier tape 11 is wound up, the concave portions 15 located closer to the inner peripheral side than the outer peripheral side are more likely to contact with each other. The above distance q may be a distance such that at least the concave portions 15 on the innermost circumference are in contact with each other.

  Next, the effect of the present modification and the mechanical mechanism that brings about the effect will be described using FIG.

  FIG. 13 is a view showing an example of the carrier tape 11 in which the side wall of the pocket is deformed by vibration or impact during transportation in FIG. FIG. 13 (a) is a plan view seen from the top surface side of the carrier tape 11, and FIG. 13 (b) is a side view of the pocket 14 of the carrier tape 11. As shown in FIG. A thick line pointed by an arrow A in FIG. 13 indicates an example of side wall deformation.

  As shown in the plan view of FIG. 13A, the side wall of the pocket may be deformed by vibration or shock during transportation of the electronic component. In this modification, compared with FIG. 11, two recesses 15 are formed in parallel in the longitudinal direction of the carrier tape 11 between the adjacent pockets 14, so the strength of the recesses 15 is increased, and the side walls of the pockets 14 are formed. Deformation is further suppressed, and the deformation amount W can be further suppressed.

  The actual carrier tape 11 may have a structure in which two juxtaposed recesses 15 are arranged adjacent to each other in the longitudinal direction of the carrier tape 11 and may have a pattern repeated in the longitudinal direction of the carrier tape 11 in combination with the second embodiment. The pattern in which one concave portion 15 and two parallel concave portions 15 are arranged adjacent to each other in the longitudinal direction of the carrier tape 11 may be a pattern repeating in the longitudinal direction of the carrier tape 11 or further in the longitudinal direction of the carrier tape 11 It may be a pattern repeated in the longitudinal direction of the carrier tape 11 in a structure in which three or more parallel recesses 15 are arranged adjacent to each other.

  According to the carrier tape, the package of the electronic component, and the packing method of the embodiment and the variation thereof, the side wall of the pocket and the side wall of the recess approach each other so that they are not connected, and the winding reel is wound multiple times In this state, deformation is suppressed by the side walls of the recess coming into contact with each other, and even when the electronic component is stored in the pocket of the carrier tape, the side wall of the pocket is deformed by vibration or shock during transportation. By doing this, it is possible to make the terminal portion of the electronic component less likely to be deformed.

  As described above, in the carrier tape 11 according to the modification of the second embodiment, a plurality of recessed portions 15 are provided in the longitudinal direction between the side walls of the adjacent pockets 14 facing each other.

  According to this, the strength of the recess 15 can be increased and the strength of the sidewall of the pocket 14 can be increased as compared with the case where there is one recess 15 between the two side walls.

  Here, the concave portions 15 adjacent to each other among the plurality of concave portions 15 arranged between the side walls facing each other of the adjacent pockets are connected in a state in which the carrier tape 11 is wound up, and the carrier tape 11 linearly extends And may be separated.

  According to this, it is possible to further increase the strength of the recess 15 in a state in which the carrier tape 11 is wound up, and to further increase the strength of the side wall of the pocket 14.

  The present disclosure is useful in a carrier tape for housing electronic components such as semiconductor devices, resistors and capacitors, a package of electronic components using the same, a method of packaging the same, and a method of mounting electronic components packaged using the same. It is.

DESCRIPTION OF SYMBOLS 11 Carrier tape 12 Feed hole 13 Electronic component 14 Pocket 15 Concave part 16 Reel for transportation 17 Out lead 18 Top cover tape 19 Carrier tape package 20 Packing device 21 Preparation part 22 Mounting part 23 Placement part 24 Bonding part 25 Winding part 26 Packaging Body unloading portion 30 Mounting device 31 Package preparation portion 32 Extraction portion 33 Peeling portion 34 Extraction portion 35 Substrate loading portion 36 Placement portion 37 Substrate unloading portion 113 Electronic component 117 Out lead 122 Pocket 130 Guard pocket

Claims (14)

Carrier tape for mounting multiple electronic components,
A plurality of pockets, arranged in the longitudinal direction of the carrier tape, for mounting the plurality of electronic components;
And recessed portions respectively disposed between adjacent pockets,
The carrier tape which always connects or temporarily connects two mutually opposing side walls of the adjacent pocket. The carrier tape according to claim 1, wherein the recess is provided to extend in the longitudinal direction between the two side walls, and is always connected to the two side walls. The carrier tape according to claim 2, wherein a plurality of the recesses are provided in a direction perpendicular to the longitudinal direction between the two side walls. The carrier tape according to claim 2, wherein a depth of the recess is shallower than a depth of the pocket. The side wall of the pocket has an opening at the connection point between the pocket and the recess,
The carrier tape according to any one of claims 2 to 4, wherein the space in the recess is connected to the space in the pocket by the opening. The area of the opening is the same size as the cross-sectional area of the space in the recess cut in a plane orthogonal to the longitudinal direction of the carrier tape.
The carrier tape according to claim 5. The recess is provided to extend in a direction orthogonal to the longitudinal direction,
The temporary connection corresponds to the state in which the carrier tape is wound so that the pocket protrudes toward the center of the winding,
2. The carrier tape according to claim 1, wherein the recess connects the two side walls in a state in which the carrier tape is wound up, and separates the carrier tape from the two side walls in a linearly extended state. The carrier tape according to claim 7, wherein the distance between the carrier tape surface and the outer bottom surface of the recess is smaller than the distance between the carrier tape surface and the outer bottom surface of the pocket. The carrier tape according to claim 7 or 8, wherein a plurality of the concave portions are provided side by side in the longitudinal direction between mutually opposing side walls of the adjacent pockets. Adjacent ones of the plurality of recesses arranged between the opposing side walls of the adjacent pockets are connected to each other in a state in which the carrier tape is wound, and the carrier tapes are separated in a linearly extended state. The carrier tape according to Item 9. The carrier tape according to any one of claims 1 to 9.
The plurality of electronic components mounted in the plurality of pockets;
And a top cover tape covering the entire opening of the plurality of pockets on which the electronic component is mounted. A preparation unit for preparing the carrier tape according to any one of claims 1 to 10.
A mounting portion for mounting the electronic component having a lead terminal protruding from a side surface on each of the plurality of pockets provided on the carrier tape;
A bonding portion for bonding a top cover tape to the carrier tape;
And a winding unit configured to wind the carrier tape bonded to the top cover tape onto a transport reel. A preparation step of preparing a carrier tape according to any one of claims 1 to 10.
A mounting step of mounting the electronic component having a lead terminal projecting from a side surface on each of the plurality of pockets provided on the carrier tape;
Bonding a top cover tape to the carrier tape;
And winding the carrier tape bonded to the top cover tape on a transport reel. Pulling out a part of the package according to claim 11 from the state of being taken up by a transport reel;
Peeling off the top cover tape from a portion of the package pulled out to expose the opening of the pocket;
Removing the electronic component from the exposed opening;
Mounting the taken out electronic component on a substrate.

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