CN102887281A - Multiple multi-column type element carrying belt - Google Patents
Multiple multi-column type element carrying belt Download PDFInfo
- Publication number
- CN102887281A CN102887281A CN2012104295629A CN201210429562A CN102887281A CN 102887281 A CN102887281 A CN 102887281A CN 2012104295629 A CN2012104295629 A CN 2012104295629A CN 201210429562 A CN201210429562 A CN 201210429562A CN 102887281 A CN102887281 A CN 102887281A
- Authority
- CN
- China
- Prior art keywords
- carrying belt
- main body
- component carrier
- carrier tape
- multiple row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Packages (AREA)
Abstract
The invention discloses a multiple multi-column type element carrying belt which comprises a carrying belt main body, wherein in a unit length of the carrying belt main body, at least two concave cavities are formed along the width direction of the carrying belt main body; a sealing belt sticking part is arranged between the concave cavities; a base is arranged at the bottom of each concave cavity; and a sticking layer is arranged on the surface of the base. Compared with the conventional carrying belt in the prior art, the multiple multi-column type element carrying belt with the same length can at least carry electronic accessories with the quantity twice that that of the conventional carrying belt and package the electronic accessories and is more beneficial to the storage and the transportation of semiconductor package pieces; a plurality of columns of concave cavities are formed inside the carrying belt, and the bases and the sticking layers are arranged at the bottoms of the concave cavities, so that sealing belts are not needed; and the semiconductor package pieces can be simply packaged.
Description
Technical field
The present invention relates to the carrying belt that the electronic package such as a kind of semiconductor package part are used, particularly relate to a kind of multiple row component carrier tape.
Background technology
Semiconductor chip becomes the electronics unit accessory of producing all kinds of required by electronic product after encapsulating, because the first accessory of this electronics easily is subject to the external force damage when transportation and assembly line transmission, therefore for it is submitted to the client safely, need to adopt the packing of various ways to be used for holding the electronics original fitting, carrying belt is exactly one of packing of commonly using.Carrying belt is contained in the electronics unit accessory of encapsulated moulding in its inner cavity structure, and semiconductor package part just can be avoided external impacts and damage in transportation and transmission course like this.
The carrying belt structure as shown in Figures 1 and 2 in the prior art, for some semiconductor package parts responsive especially to external impacts, as adopt the semiconductor package part of QFP (square Flat type packaged technology), usually it is packed in the re-entrant cavity 14 of carrying belt 11, then be with 2 pairs of re-entrant cavities 14 to carry out encapsulation process at re-entrant cavity 14 tops with envelope, carrying belt 11 be wrapped on the spool 3 be supplied to the client again.The client needs to remove first the envelope that is used for sealing and is with 2 for semiconductor package part is assembled on the printed circuit board (PCB), takes out the semiconductor package part in the re-entrant cavity on the carrying belt 11.The aperture at carrying belt 11 edges is sprocket holes 12, sprocket hole 12 is used for the guiding device winding or unclamps carrying belt 11 and be with 12 for stickup or dismounting sealing with sealing, and the medium pore 13 of re-entrant cavity 14 bottoms setting is for the semiconductor package part of identifying opaque carrying belt inside on the carrying belt 11.In the prior art, in the element length of carrying belt 11, along carrying belt 11 Widths a re-entrant cavity 11 only is set, can not take full advantage of the width of carrying belt 11, therefore the quantity of a volume carrying belt 11 semiconductor package parts is very limited, and need to be used in conjunction with envelope with 12 effects that reach the packing semiconductor package part.
Summary of the invention
The purpose of this invention is to provide a kind of multiple row component carrier tape, overcome carrying belt packing semiconductor package part limited amount in the prior art, carrying belt utilizes inadequate shortcoming.
Technical scheme of the present invention is such: a kind of multiple row component carrier tape, comprise the carrying belt main body, and it is characterized in that: in the element length of described carrying belt main body, be provided with at least two re-entrant cavities along its Width.
In a specific embodiment of the present invention, described along being provided with envelope band paste section between the concave shaped space of carrying belt Width setting.
In another specific embodiment of the present invention, described re-entrant cavity bottom is provided with pedestal, and described base-plates surface is provided with adhesive linkage.
Further, described re-entrant cavity bottom is provided with medium pore, and described pedestal is provided with the perforate corresponding with the medium pore position.
In another specific embodiment of the present invention, described carrying belt body rim is provided with sprocket hole.
In another specific embodiment of the present invention, the macromolecule resin complex that described carrying belt main material is surface resistivity E5～E11ohm/sq, described carrying belt body width is a kind of among 8mm, 12mm, 16mm, the 24mm.
The advantage of technical scheme provided by the present invention is, the multiple row component carrier tape of equal length is compared with the carrying belt in the routine techniques, at least packed after can loading the above electronic components of twice more, more be conducive to storage and transport semiconductor package part than the single-row carrying belt of conventional formula.At the inner row re-entrant cavity that forms of carrying belt, and by establishing in addition pedestal and adhesive linkage in the re-entrant cavity bottom, need not to use the envelope band, also can simply pack semiconductor package part.
Description of drawings
Fig. 1 is carrying belt structural representation in the prior art;
Fig. 2 is prior art carrying belt structural plan schematic diagram;
Fig. 3 is structural plan of the present invention schematic diagram;
Fig. 4 is element length structural representation of carrying belt of the present invention;
Fig. 5 is an element length encapsulated semiconductor of carrying belt of the present invention package structure schematic diagram.
The specific embodiment
The invention will be further described below in conjunction with embodiment, but not as a limitation of the invention.
The structure of specific embodiments of the invention is such, see also Fig. 3, the edge of carrying belt main body 102 is provided with continuous sprocket hole 112, sprocket hole 112 is used for guiding device and twines or unclamp carrying belt main body 102 and be used for pasting or remove sealing with the envelope band, in order to take full advantage of the width of carrying belt main body 102, in an element length of carrying belt main body 102, be provided with at least two re-entrant cavities 104 along its Width, structure when only having enumerated two re-entrant cavities 104 among the figure, the width that in fact, can reach as required carrying belt main body 102 arranges three, four or more re-entrant cavity 104.The envelope band paste section 111 that is used for the sealing of envelope band between the re-entrant cavity 104 that carrying belt main body 102 Widths arrange, carrying belt main body 102 both sides of the edge are provided with envelope band paste section 111A, 111B equally, and envelope is that re-entrant cavity 104 numbers of carrying belt main body 102 Width settings add 1 with the number of paste section.Semiconductor package part is packed into behind the re-entrant cavity, adopts envelope as shown in Figure 1 to be with 2 to carry out sealed package, can protect in the re-entrant cavity electronics unit accessory such as semiconductor package part to avoid external impacts and impaired, and the carrying belt main body 102 after the sealing is twined and is loaded on the spool 3.
The structure of another specific embodiment of the present invention is such, see also Fig. 4 and Fig. 5, the edge of carrying belt main body 102 is provided with continuous sprocket hole 112, sprocket hole 112 is used for the guiding device winding or unclamps carrying belt main body 102, in order to take full advantage of the width of carrying belt main body 102, in an element length of carrying belt main body 102, be provided with at least two re-entrant cavities 104 along its Width, structure when only having enumerated two re-entrant cavities 104 among the figure, the width that in fact, can reach as required carrying belt main body 102 arranges three, four or more re-entrant cavity 104.Described re-entrant cavity 104 bottoms are provided with pedestal 108, and re-entrant cavity 104 bottoms are provided with the medium pore 106 be used to the semiconductor package part of identifying opaque carrying belt inside, and described pedestal 108 is provided with the perforate corresponding with the medium pore position.Described pedestal 108 surfaces are provided with adhesive linkage 110, and adhesive linkage 110 can adopt double faced adhesive tape, and double faced adhesive tape is stronger than another side with the adhesion of the one side of pedestal bonding, when preventing from taking out the unit such as the electronics of partly leading packaging part accessory this double faced adhesive tape are together taken out from pedestal.Adopt the carrying belt of this structure when packing the unit such as the electronics of partly leading packaging part accessory, not need the envelope band, transmitting support 130 by semiconductor package part is sent to semiconductor package part to be packaged 120 in the re-entrant cavity 104, adhesive linkage 110 says that semiconductor package part 120 sticks, by this way semiconductor package part 120 is fixed, can not adopt envelope as shown in Figure 1 to be with 12 to seal, reach the purpose to the electronics such as semiconductor package part unit accessory Simple fast packing, the carrying belt main body 102 after the packing is twined to be loaded in and can be supplied to the client to use on the spool 3.
In above-mentioned two specific embodiments of the present invention, carrying belt main body 102 width are any one width among 8mm, 12mm, 16mm, the 24mm.In order to prevent that electronics unit accessory is subject to electrostatic breakdown, what carrying belt main body 102 materials adopted is that surface resistivity is the macromolecule resin complex of E5～E11ohm/sq.
Claims (7)
1. a multiple row component carrier tape comprises carrying belt main body (102), it is characterized in that: in the element length of described carrying belt main body (102), be provided with at least two re-entrant cavities (104) along its Width.
2. multiple row component carrier tape according to claim 1 is characterized in that: described along being provided with envelope band paste section (111) between the concave shaped space (104) of carrying belt Width setting.
3. multiple row component carrier tape according to claim 1 and 2 is characterized in that: described re-entrant cavity (104) bottom is provided with pedestal (108), and described pedestal (108) surface is provided with adhesive linkage (110).
4. multiple row component carrier tape according to claim 3 is characterized in that: described re-entrant cavity (104) bottom is provided with medium pore (106), and described pedestal (108) is provided with the perforate corresponding with the medium pore position.
5. multiple row component carrier tape according to claim 3, it is characterized in that: described carrying belt main body (102) edge is provided with sprocket hole (112).
6. multiple row component carrier tape according to claim 3, it is characterized in that: described carrying belt main body (102) material is the macromolecule resin complex of surface resistivity E5～E11ohm/sq,
7. multiple row component carrier tape according to claim 3 is characterized in that: described carrying belt body width is a kind of among 8mm, 12mm, 16mm, the 24mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104295629A CN102887281A (en) | 2012-11-01 | 2012-11-01 | Multiple multi-column type element carrying belt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104295629A CN102887281A (en) | 2012-11-01 | 2012-11-01 | Multiple multi-column type element carrying belt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102887281A true CN102887281A (en) | 2013-01-23 |
Family
ID=47530997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104295629A Pending CN102887281A (en) | 2012-11-01 | 2012-11-01 | Multiple multi-column type element carrying belt |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102887281A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097561A (en) * | 2014-05-09 | 2015-11-25 | 东部Hitek株式会社 | Method of Packaging Semiconductor Devices and Apparatus for Performing the Same |
| CN106275830A (en) * | 2016-10-17 | 2017-01-04 | 中国科学院宁波材料技术与工程研究所 | Product for purity material is packed |
| CN107176321A (en) * | 2016-03-11 | 2017-09-19 | 上海安缔诺科技有限公司 | A kind of new volume to volume smart card module encapsulating structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1135066A (en) * | 1997-07-15 | 1999-02-09 | Shin Etsu Polymer Co Ltd | Embossed carrier tape |
| US5890599A (en) * | 1990-09-25 | 1999-04-06 | R.H. Murphy Company | Tray for integrated circuits |
| CN2493553Y (en) * | 2001-06-05 | 2002-05-29 | 玮锋工业股份有限公司 | Single-row integrated type component carrying band |
| JP2003095321A (en) * | 2001-09-26 | 2003-04-03 | Rohm Co Ltd | Carrier tape for electronic component, and taping electronic component |
| CN101544294A (en) * | 2008-03-27 | 2009-09-30 | 3M创新有限公司 | Electronic-device packaging device, electronic-device packaging method and packaging equipment thereof |
| CN101765553A (en) * | 2007-07-31 | 2010-06-30 | 3M创新有限公司 | Non-nesting component carrier tape |
-
2012
- 2012-11-01 CN CN2012104295629A patent/CN102887281A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5890599A (en) * | 1990-09-25 | 1999-04-06 | R.H. Murphy Company | Tray for integrated circuits |
| JPH1135066A (en) * | 1997-07-15 | 1999-02-09 | Shin Etsu Polymer Co Ltd | Embossed carrier tape |
| CN2493553Y (en) * | 2001-06-05 | 2002-05-29 | 玮锋工业股份有限公司 | Single-row integrated type component carrying band |
| JP2003095321A (en) * | 2001-09-26 | 2003-04-03 | Rohm Co Ltd | Carrier tape for electronic component, and taping electronic component |
| CN101765553A (en) * | 2007-07-31 | 2010-06-30 | 3M创新有限公司 | Non-nesting component carrier tape |
| CN101544294A (en) * | 2008-03-27 | 2009-09-30 | 3M创新有限公司 | Electronic-device packaging device, electronic-device packaging method and packaging equipment thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097561A (en) * | 2014-05-09 | 2015-11-25 | 东部Hitek株式会社 | Method of Packaging Semiconductor Devices and Apparatus for Performing the Same |
| CN107176321A (en) * | 2016-03-11 | 2017-09-19 | 上海安缔诺科技有限公司 | A kind of new volume to volume smart card module encapsulating structure |
| CN106275830A (en) * | 2016-10-17 | 2017-01-04 | 中国科学院宁波材料技术与工程研究所 | Product for purity material is packed |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101190920B1 (en) | Stacked semiconductor package and method of manufacturing thereof | |
| CN104555091A (en) | Tape and reel cover tape to improve die sticking issues | |
| KR20010098728A (en) | Semiconductor devices manufacturing method and tray using method | |
| CN102887281A (en) | Multiple multi-column type element carrying belt | |
| TW201731067A (en) | Reduced-height memory system and method | |
| CN106373934A (en) | Semiconductor package and method of manufacturing the same | |
| US9972561B2 (en) | QFN package with grooved leads | |
| US11362025B2 (en) | Tape carrier assemblies having an integrated adhesive film | |
| JP2018002211A (en) | Packing method of semiconductor device | |
| CN112018055B (en) | Electromagnetic shielding heat dissipation packaging structure and preparation method thereof | |
| CN102769009A (en) | Semiconductor packaging piece | |
| US6474476B1 (en) | Universal carrier tray | |
| JP4822845B2 (en) | Carrier tape, electronic component packaging body, and electronic component packaging method | |
| CN204361107U (en) | Photosensor package structure | |
| CN109920779B (en) | Preparation method of electromagnetic shielding layer of packaged product and packaged product | |
| CN103640789A (en) | Carrier tape device for storing electronic components | |
| CN211520398U (en) | Sandwich type carrier band | |
| CN111128918B (en) | Chip packaging method and chip | |
| JP5968827B2 (en) | Semiconductor package and manufacturing method thereof | |
| CN103354226B (en) | Stack packaged device | |
| JP2006306403A (en) | Manufacturing method of semiconductor device | |
| CN204217320U (en) | The storage belt of belt carrier and electronic component | |
| CN106516422B (en) | Electronic building brick winding belt package structure and method to pack electronic building brick | |
| CN205312214U (en) | Jumbo size integrated circuit packaging structure | |
| JP2018177299A (en) | Carrier tape, electronic component package using carrier tape, packaging device, packaging method, and mounting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130123 |