JP4822845B2 - Carrier tape, electronic component packaging body, and electronic component packaging method - Google Patents

Description

The present invention is primarily BGA (Ball Grid Array) and LGA (Land Grid Array) carrier tape accommodating the electronic components such as thin semiconductor device terminals for mounting are arranged on the lower surface typified like, and electronic components The present invention relates to a packaging body and a packaging method for electronic parts.

  2. Description of the Related Art In recent years, as electronic devices have become lighter, thinner, and smaller, electronic components such as semiconductor devices and chip components have been required to have a reduced mounting area on a printed wiring board (PWB) or the like. In order to meet this demand, for example, many BGA and LGA type thin semiconductor devices in which mounting terminals are arranged on the lower surface are employed as semiconductor devices.

  Generally, tape packaging using carrier tape, which is easy to handle and has good mounting efficiency for electronic components, is often used for packaging semiconductor devices. Since the electronic components can be protected from contamination, embossed taping packaging using an embossed carrier tape in which concave portions for storing electronic components called pockets are arranged has become mainstream.

  Furthermore, in order to suppress moisture absorption during transportation of thin electronic components, and to improve sealing performance and prevent jumping during mounting, a top cover tape is attached to the top surface of the embossed carrier tape so as to cover the recess (pocket). The method of doing is also taken (for example, refer patent document 1).

  FIG. 5A is a plan view for explaining the configuration of a conventional embossed carrier tape, and FIG. 5B is a cross-sectional view taken along line BB in FIG. 5A. Is shown in a stored state.

  As shown in FIGS. 5A and 5B, the embossed carrier tape 51 is provided with a plurality of recesses (pockets) 52 for storing electronic components arranged in the longitudinal direction. In addition, feed holes 53 are formed at predetermined intervals along the longitudinal direction at one end parallel to the longitudinal direction of the embossed carrier tape 51.

  After the semiconductor device 54 is accommodated in the recess 52 of the embossed carrier tape 51, a top cover tape 55 is attached to the upper surface of the embossed carrier tape 51 by thermocompression bonding or the like so as to cover the recess 52.

  The recess 52 is generally a rectangular parallelepiped, and in the conventional embossed taping packaging, the top cover tape 55 is bonded to the outer periphery of the recess 52 so that the recess 52 containing the semiconductor device 54 is sealed during transportation. Specifically, as shown in FIG. 5A, the bonding portion 56 has an X shape between the concave portions 52, and has a hexagonal shape at the outer peripheral portion of the concave portion 52.

  Normally, in embossed taping packaging, as shown in FIG. 6, the embossed carrier tape 51 with the top cover tape 55 attached is wound on a reel 61 and shipped in cardboard. When mounting the semiconductor device, the embossed carrier tape 51 is fed from the reel 61 using the feed hole 53 and the top cover tape 55 is peeled off to remove the semiconductor device 54 and mount it on a PWB or the like. However, in recent years, embossed taping packaging has been increasing as a shipment form of semiconductor devices.

However, in the above-described conventional embossed tape packaging, as shown in FIG. 5B, the top cover tape 15 floats above the recess 52 to form a space above the recess 52, and the top surface of the embossed carrier tape 51. And a gap is formed between the top cover tape 55 and the electronic component is moved by vibration or the like after being stored in the electronic component, and the electronic circuit portion of the semiconductor device 54 is damaged. there were. Further, when the terminal portion 54a of the semiconductor device 54 is damaged, there is a problem that the mounting reliability is affected.
JP-A-5-338617

In view of the above problems , the present invention can eliminate the space formed above the recess for storing the electronic component and the gap formed between the upper surface of the carrier tape and the top cover tape. It is an object of the present invention to provide a carrier tape that can be stored in a stable state, a packaging body for electronic components, and a packaging method for electronic components.

The carrier tape of the present invention is a carrier tape in which concave portions for storing electronic components are arranged along the longitudinal direction thereof, and the end portion is disposed on one side of the end portion parallel to the longitudinal direction. It has the notch for bending in the tape width direction orthogonal to a direction.

The electronic component package of the present invention includes a carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction, and an electronic component stored in the recess, the carrier tape comprising: One end of the end portion parallel to the longitudinal direction has a notch for bending the end portion in the tape width direction perpendicular to the longitudinal direction.

In the electronic component packaging method of the present invention, the electronic component is stored in the concave portion of the carrier tape in which the concave portions for storing the electronic component are arranged along the longitudinal direction, and the opening of the concave portion is covered. After the top cover tape is attached to the upper surface of the carrier tape, the carrier tape and the top cover tape are attached along the notch provided on one side of the end of the carrier tape parallel to the longitudinal direction. The tape is bent in the tape width direction perpendicular to the longitudinal direction.

  According to the present invention, it is possible to eliminate the space formed above the recess for storing electronic components and the gap formed between the top surface of the carrier tape and the top cover tape. Therefore, after the electronic component is stored, damage to the electronic component (for example, damage to the electronic circuit portion of the semiconductor device) due to movement of the electronic component due to vibration or the like and fitting into the gap can be prevented. Further, it is possible to prevent an adsorption error at the time of mounting due to the electronic component fitted in the gap being stored while being tilted. Further, when the semiconductor device is housed as an electronic component, it is possible to avoid damage to the terminal portion of the semiconductor device and affect mounting reliability. From the above, it is possible to improve the reliability during transportation of electronic components and the adsorption yield during mounting.

(Embodiment 1)
1A is a plan view for explaining the configuration of an embossed carrier tape according to Embodiment 1 of the present invention, FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. FIG. 2B is a cross-sectional view taken along the line B-B in FIG. 1A and shows a state in which a semiconductor device is housed as an electronic component on an embossed carrier tape.

  As shown in FIGS. 1A, 1B, and 1C, the embossed carrier tape 11 has a plurality of recesses (pockets) 12 for storing electronic components, which are formed by pressure forming and pressing at regular intervals along the longitudinal direction. They are arranged by molding or vacuum forming. In addition, feed holes 13 are formed at predetermined intervals along the longitudinal direction at one end parallel to the longitudinal direction of the embossed carrier tape 11.

  Further, after the semiconductor device 14 is accommodated in the recess 12 on the embossed carrier tape 11, a top cover tape 15 is attached to the upper surface of the embossed carrier tape 11 by thermocompression bonding or the like so as to cover the recess 12.

  As shown in FIG. 1A, the adhesive portion 16 of the top cover tape 15 extends on both sides of the recess 12 along both end portions parallel to the longitudinal direction of the embossed carrier tape 11. In addition, although the adhesion part 16 is shown by the linear shape, of course, a shape is not restricted to this. Moreover, although the shape of the recessed part 12 is a rectangular parallelepiped, for example, of course, it is not restricted to a rectangular parallelepiped.

  In the first embodiment, the end of the embossed carrier tape 11 opposite to the end provided with the feed hole 13 is provided with a bent portion for bending the end in the tape width direction perpendicular to the longitudinal direction. ing. In the example shown in FIG. 1A, notches 17 at regular intervals, generally called perforations, are provided as bent portions. The notch 17 may be provided on the upper surface of the embossed carrier tape 11, or may be provided on the lower surface, or may be penetrated. In addition to the notch, for example, a bent portion may be provided by a method of thinning a part so as to be easily bent. In addition to continuously extending the cuts 17, a predetermined length of cut portions (a portion where cuts at a constant interval continue) are provided at predetermined intervals along the longitudinal direction of the embossed carrier tape 11. Also good. Further, the number of bent portions is not limited to one, and for example, two or more bent portions may be provided adjacent to each other.

Next, the electronic component packaging method according to the first embodiment will be described.
First, the semiconductor device 14 is accommodated in the recess 12 of the embossed carrier tape 11, and a top cover tape 15 is attached to the upper surface of the embossed carrier tape 11 so as to cover the opening of the recess 12. Before winding on a reel (not shown) by a taping machine (not shown), the embossed carrier tape 11 and the top cover tape along the notch 17 as shown in FIG. 15 is wound around a reel while being mechanically bent in the tape width direction. Here, the bending angle is set so as not to affect the mounting on the mounting machine.

  In this way, the embossed carrier tape 11 and the top cover tape 15 are bent at the notch 17 and the slack of the top cover tape 15 is pulled, so that the space formed above the concave portion as shown in FIG. And a gap formed between the top surface of the embossed carrier tape and the top cover tape can be eliminated (FIGS. 1B and 1C).

  As a material for the embossed carrier tape, for example, a resin obtained by kneading carbon into a resin such as polystyrene or polypropylene is used. Since the resin is a thermoplastic resin, the embossed carrier tape is heated to about 100 ° C., and then the mold is pressed and punched to form a thickness of about 0.1 mm to 0.3 mm. Next, while heating the tape base material having a predetermined width thus formed, it is pushed into a convex or concave mold with air or the like to create a pocket (concave portion) 12. Similarly, the feed hole 13 is created. The equipment top cover tape is generally made of polyethylene terephthalate or the like, and has a structure in which an adhesive layer or the like is laminated.

(Embodiment 2)
2A is a plan view for explaining the configuration of the embossed carrier tape according to Embodiment 2 of the present invention, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. FIG. 2 shows a state where a semiconductor device is housed as an electronic component. However, the same members as those described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The embossed carrier tape 11 according to the second embodiment is characterized in that it has a groove portion 21 for adhering the top cover tape 15 along its longitudinal direction. That is, in the example shown in FIGS. 2A and 2B, the groove portion for bonding the top cover tape between the bonding portion 16 and the recess 12 on the side opposite to the side where the feed hole 13 of the embossed carrier tape 11 is provided. 21 is provided. In addition to extending the grooves continuously, for example, grooves having a predetermined length may be provided at regular intervals along the longitudinal direction of the embossed carrier tape 11. Further, the number of groove portions is not limited to one.

Next, the electronic component packaging method according to the second embodiment will be described.
First, the semiconductor device 14 is accommodated in the recess 12 of the embossed carrier tape 11, and a top cover tape 15 is attached to the upper surface of the embossed carrier tape 11 so as to cover the opening of the recess 12. Prior to winding on a reel (not shown) by a taping machine (not shown), the top cover tape 15 is further bonded to the bottom of the groove 21 by a pressing jig (not shown) installed in the taping machine, for example, as shown in FIG. Then, the slack of the top cover tape 15 is drawn into the groove portion 21 and then wound on a reel.

  By adhering the top cover tape 15 to the groove portion 21 in this way, the space formed above the concave portion as shown in FIG. 5B and the upper surface of the embossed carrier tape and the top cover tape are formed. A gap formed between them can be eliminated (FIG. 2B).

  Here, the groove portion 21 is provided between the adhesive portion 16 and the concave portion 12 on the side opposite to the side where the feed hole 13 of the embossed carrier tape 11 is provided, but each concave portion along the longitudinal direction of the embossed carrier tape 11 is provided. A groove 21 may be provided between 12. FIG. 3A is a plan view for explaining the configuration of the embossed carrier tape in this case. 3B is a cross-sectional view taken along line AA in FIG. 3A, and FIG. 3C is a cross-sectional view taken along line BB in FIG.

  As shown in FIG. 3, the top cover tape 15 is bonded to, for example, the bottom of the groove 21 provided between the recesses 12 along the longitudinal direction of the embossed carrier tape 11, and the slack of the top cover tape 15 is reduced to the groove 21. The space formed above the concave portion as shown in FIG. 5B and the gap formed between the top surface of the embossed carrier tape and the top cover tape can be eliminated. (FIG. 3B). Note that the number of grooves is not limited to one.

  As described above, in the second embodiment, when the embossed carrier tape 11 having the top cover tape 15 adhered to the upper surface of the embossed carrier tape 11 and the top cover tape 15 bonded to the groove portion 21 is placed horizontally. By attaching the top cover tape 15 to the groove portion 21 so that the lowermost portion of the top cover tape 15 in the groove portion 21 is lower than the upper surface of the embossed carrier tape 11, the slack of the top cover tape 15 is added to the groove portion 21. By pulling in, the space formed above the recess as shown in FIG. 5B and the gap formed between the top surface of the embossed carrier tape and the top cover tape can be eliminated.

  In the second embodiment, the top cover tape 15 is adhered only to the bottom of the groove portion 21, but the location where the adhesive portion 16 a is provided in the groove portion 21 is not limited to the bottom portion of the groove portion 21, and the embossed carrier tape 11 is disposed horizontally. It is only necessary that the lowermost portion of the top cover tape 15 in the groove portion 21 can be bonded to a position lower than the upper surface of the embossed carrier tape 11.

  2 (a) and 3 (a), the adhesive portion 16 is not limited to the case where it is provided on both sides of the concave portion 12 in a shape extending in the longitudinal direction of the embossed carrier tape 11, but for example, A shape surrounding the peripheral edge may be used.

  Further, the groove portion 21 is not limited to the shape extending in the longitudinal direction of the embossed carrier tape 11, and it is only necessary that the slack of the top cover tape 15 can be pulled by bonding the top cover tape 15 to the groove portion.

(Embodiment 3)
4A is a plan view for explaining the configuration of an embossed carrier tape according to Embodiment 3 of the present invention, and FIG. 4B is a cross-sectional view taken along line AA in FIG. FIG. 2 shows a state where a semiconductor device is housed as an electronic component. However, the same members as those described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The top cover tape 15 according to the third embodiment is characterized in that it is composed of a base material (heat-shrinkable material) that at least partially heat-shrinks. That is, in the example shown in FIGS. 4A and 4B, the substantially central portion of the top cover tape 15 is configured by a heat shrinkable portion 41 that thermally shrinks, and the heat shrinkable portion 41 is formed on the embossed carrier tape 11. It extends along the longitudinal direction. In addition, as a heat contraction part, Saran resin (polyvinyl chloride) is used, for example.

  Note that two or more heat shrinking portions 41 may be provided in parallel along the longitudinal direction of the embossed carrier tape 11. In addition to continuously extending the heat-shrinkable portions, for example, heat-shrinkable portions having a predetermined length along the longitudinal direction of the embossed carrier tape 11 may be provided at regular intervals. Further, the portion constituted by the heat shrinkage portion 41 is not limited to the substantially central portion of the top cover tape 15, and the heat shrinkage portion 41 only needs to be provided between the adhesive portions 16.

Next, a method for packing electronic components according to the third embodiment will be described.
First, the semiconductor device 14 is accommodated in the recess 12 of the embossed carrier tape 11, and a top cover tape 15 is attached to the upper surface of the embossed carrier tape 11 so as to cover the opening of the recess 12. Before being wound on a reel (not shown) by a taping machine (not shown), for example, by a heating jig (not shown) installed in the taping machine, the heat shrinking portion 41 is partially heated at a temperature that does not adhere to the embossed carrier tape 11 and thermally contracted. (FIG. 4B) After the slack of the top cover tape 15 is eliminated, the tape is wound around a reel.

  Thus, by using at least a part of the top cover tape 15 as a heat-shrinkable material, the space formed above the concave portion as shown in FIG. 5B and the upper surface of the embossed carrier tape described above. And the gap formed between the top cover tape and the top cover tape can be eliminated (FIG. 4B).

  As shown in FIG. 4A, the adhesive portion 16 is not limited to being provided on both sides of the recess 12 in a shape extending in the longitudinal direction of the embossed carrier tape 11, and for example, surrounds the peripheral portion of the recess 12. Any shape may be used.

  Further, the heat shrinkable portion 41 is not limited to the shape extending in the longitudinal direction of the embossed carrier tape 11, and it is sufficient that the slack of the top cover tape 15 can be pulled by shrinking.

  In the first to third embodiments, the embossed carrier tape, the top cover tape, and the semiconductor device are taken as an example. However, the present invention can also be applied to a punch carrier type such as plastic or paper, or a chip component other than the semiconductor device. The effect is obtained.

The carrier tape, the top cover tape, and the electronic component packaging method according to the present invention can eliminate the slack of the top cover tape, and can improve the reliability of the electronic components during transportation and the adsorption yield during mounting. It is useful for embossed taping packaging for packaging a thin semiconductor device having a mounting terminal disposed on the lower surface.

(A) is a top view for demonstrating the structure of the embossed carrier tape in Embodiment 1 of this invention, (b) is AA sectional drawing in (a), (c) is BB in (a). Cross section (A) is a top view for demonstrating the structure of the embossed carrier tape in Embodiment 2 of this invention, (b) is AA sectional drawing in (a). (A) is a top view for demonstrating the structure of the embossed carrier tape in the other example of Embodiment 2, (b) is AA sectional drawing in (a), (c) is B in (a). -B sectional view (A) is a top view for demonstrating the structure of the embossed carrier tape in Embodiment 3 of this invention, (b) is AA sectional drawing in (a). (A) is a top view for demonstrating the structure of the conventional embossed carrier tape, (b) is BB sectional drawing in (a). Perspective view of conventional embossed taping packaging

Explanation of symbols

11, 51 Embossed carrier tape 12, 52 Recessed part 13, 53 Feed hole 14, 54 Semiconductor device 15, 55 Top cover tape 16, 56 Adhesive part 17 Notch 21 Groove part 41 Thermal contraction part 54a Terminal part 61 Reel

Claims (15)

A carrier tape in which concave portions for storing electronic components are arranged along the longitudinal direction,
A carrier tape having a notch for bending the end portion in a tape width direction perpendicular to the longitudinal direction on one side of the end portion parallel to the longitudinal direction. The notch was provided at the end opposite to the end provided with the feed hole.
The carrier tape according to claim 1. A plurality of the cuts were formed adjacent to each other.
The carrier tape according to claim 1 or 2, characterized by the above-mentioned. The cut is a perforated cut.
The carrier tape according to any one of claims 1 to 3, wherein the carrier tape is provided. The notch was provided on the upper surface of the carrier tape.
The carrier tape according to claim 4. The notch is provided on the lower surface of the carrier tape.
The carrier tape according to claim 4. The notch was provided through the carrier tape from the upper surface to the lower surface.
The carrier tape according to claim 4. A carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction;
An electronic component housed in the recess,
The carrier tape has a cut on one side of the end parallel to the longitudinal direction for bending the end in the tape width direction perpendicular to the longitudinal direction.
An electronic component package characterized by the above. The notch was provided at the end opposite to the end provided with the feed hole.
The package of electronic parts according to claim 8 characterized by things. A plurality of the cuts were formed adjacent to each other.
10. The electronic component package according to claim 8 or 9, wherein: The cut is a perforated cut.
The package of electronic components according to claim 8, wherein the electronic component package is characterized in that: The notch was provided on the upper surface of the carrier tape.
The package of electronic parts according to claim 11 characterized by things. The notch is provided on the lower surface of the carrier tape.
The package of electronic parts according to claim 11 characterized by things. The notch was provided through the carrier tape from the upper surface to the lower surface.
The package of electronic parts according to claim 11 characterized by things. Electronic parts are stored in the recesses of the carrier tape in which recesses for storing electronic components are arranged along the longitudinal direction, and a top cover tape is attached to the upper surface of the carrier tape so as to cover the openings of the recesses. After that, the carrier tape and the top cover tape are bent in the tape width direction perpendicular to the longitudinal direction along a notch provided on one side of the end of the carrier tape parallel to the longitudinal direction. A method for packing electronic parts.

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