JPS632361A - Electronic device - Google Patents

Abstract

PURPOSE:To obtain an electronic device of package structure in which the deformation of an external connection terminal can be reduced by forming the end of the terminal near the surface to become a lower surface at the time of mounting. CONSTITUTION:The external connection terminal of an IC 1a is so disposed as to be filled in the cutout 5 of an IC 1b. The depth and the width of the cutout 5 are determined according to the thickness and the length of an external connection terminal 4 so that the terminal 4 is not contacted with the upper package 2 in the above state. As a result, even if many ICs 1 are laminated in a magazine case 11, the terminal 4 is not contacted except the inner wall of the case 11. An excess force is not applied to the terminal 4, and undesired deformation of the terminal 4 is reduced.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor integrated circuit (hereinafter referred to as IC).
The present invention relates to electronic devices such as electronic devices, and particularly to techniques suitable for application to surface-mounted electronic devices.

[Conventional technology]

With the improvement of device technology, ICs have become increasingly smaller, and surface-mounted ICs have come to be frequently used as a shape that can increase the mounting area.

Regarding the above-mentioned surface-mount IC, please refer to "Electronic Materials" (198
It is described in February 2010, Issue 1, Industrial PL Inquiry Committee, pages 33-35). The outline is P of the single-sided mounting type.
In the LCC and SOG, the external connection terminal provided on the side surface of the sealing body is formed in a 5-shape.

The inventors of the present invention have studied efficient transportation of the surface-mounted IC and reduction of deformation of external connection terminals during transportation. Although the following is not a publicly known technique, it is a technique studied by the present inventors, and the outline thereof is as follows.

That is, when the surface-mounted ICs are transported, they are stored in a magazine case in sequence in the horizontal direction. Above surface mount IC
In this case, the external connection terminals protrude from the side surface of the sealing body, and the tips thereof are formed in a J-shape. Contact with the stopper.

[Problems to be Solved by the Invention] If the above-mentioned contact occurs, the external connection terminal is easily deformed because it is made of a thin copper plate or the like. Therefore, when surface mounting,
If the external connection terminals are not placed on the prescribed circuit pattern, soldering defects are more likely to occur.In order to reduce these accidents, methods such as taping the external connection terminals were considered. Or the workability is not good.

Therefore, we considered stacking surface-mounted ICs vertically and storing them in a magazine case. However, with this method,
Since the external connection terminal is formed in a 5-shape, its tip comes into contact with the side surface of the IC sealing body disposed below.

In this case, the external connection terminals do not come into contact with each other, but they do come into contact with the sealing body, so the inventors have found that the above deformation is more likely to occur.

Based on these circumstances, the inventors realized that undesired deformation of the external connection terminals could be reduced by preventing contact between the external connection terminals and the sealing body, and came to propose the present invention.

An object of the present invention is to provide an electronic device with a package structure that can reduce deformation of external connection terminals.

The above and other objects and novel features of the present invention will become apparent from the present specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the tips of the external connection terminals are formed in close proximity to the first main surface of the sealed body of the one-sided mount type IC, in other words, the surface that becomes the bottom surface during mounting. This is a 5-shaped external connection terminal that protrudes from one side of the sealing body. A cutout portion may be formed on the second main surface of the sealing body that opposes the lower surface, in other words, on the upper surface of the sealing body.

This notch is formed at a position where, when ICs are stacked in a magazine, an external connection terminal of an IC placed on the upper side comes into contact with the IC.

[Effect]

According to the above-mentioned means, even if surface-mounted ICs are stacked and stored in a cylindrical magazine case, the ICs placed on the top
The external connection terminals of the IC are disposed within the cutout, and do not come into contact with the external connection terminals of the IC placed below, as well as its sealing body, so that unnecessary force is not applied to the external connection terminals during transportation. do not have. And undesired deformation of the external connection terminal is reduced. The object of the present invention can be achieved.

[Embodiment 1] Hereinafter, a first embodiment of an electronic device to which the present invention is applied will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of an electronic device (surface-mounted WIC) to which the present invention is applied, and FIG. 2 is a sectional view of essential parts showing a form in which the devices are stacked and stored in a magazine case.

The feature of this embodiment is that a notch is formed around the outer periphery of the upper package of the surface-mounted IC to avoid contact with external connection terminals.

In the surface-mounted ICI, 2 is an upper package and 3 is a lower package, which correspond to the sealed body in the present invention. And upper package 2 and lower package 3
The external connection terminal 4 is made to protrude outside the sealing body from a position corresponding to the boundary between the two. The tip of the external connection terminal 4 is
As shown in FIG. 2, it is deformed into a substantially 5-shape, and is provided in a 3ζ5 shape overflowing the first main surface of the sealing body, in other words, the lower surface.

What should be noted here is that a notch 5 is formed on the second main surface of the package opposite to the first main surface, that is, on the outer periphery of the upper package 2, and when ICIs are stacked, the external connection terminal 4 The upper package 2 is prevented from coming into contact with the upper package 2.

In other words, the surface mount type ICI has f# as shown in FIG.
'The magazines are sequentially stored in a J-shaped magazine case 11. Taking ICIs a and 1b as an example, the external connection terminal of ICI a is arranged so as to be fitted into the cutout 5 of ICI b. The depth and width of the cut portion 5 are:
This is determined by taking into consideration the thickness and length of the external connection terminal 4, and is designed to prevent the external connection terminal 4 from coming into contact with the upper package 2 in the above situation.

As a result, even if a large number of ICIs are stacked in the magazine case 11 as shown in FIG. 2, the external connection terminals 4 do not come into contact with anything other than the inner wall surface of the magazine case 11. External connection terminal 4
No extra force is applied to each external connection terminal 4.
Undesired deformation of the is reduced.

The size of the cross section of the hollow part of the magazine case 11 is as follows:
It is formed to match the planar shape of the ICI. Therefore,
If the ICI is stacked and stored as shown in Figure 2, the ICI
There is almost no lateral displacement of the external connection terminals 4, thereby reducing inconveniences such as the external connection terminals 4 being crushed.

The above storage method has a major advantage in addition to reducing deformation of the external connection terminal 4.

That is, the side surface of the external connection terminal 4 contacts the inner surface of the magazine case 11 with substantially uniform force.

Therefore, if the magazine case 11 is made of a conductive material, such as synthetic resin mixed with carbon, each external connection terminal 4 can be made to have the same potential.

As a result, it is possible to reduce electrostatic damage during transporting the ICI, and in combination with the reduction in deformation of the external connection terminal 4, the ICI
CI defects can be significantly reduced.

The IC having the above-mentioned sealed body structure has the following effects.

ill Arrange the external connection terminals of the surface mount IC on the lower surface of the lower package, and form a notch around the outer periphery of the upper package corresponding to the other side surface that opposes this lower surface. Since there is no contact between the external connection terminals and the upper package when the ICs are stacked, unnecessary force is not applied to the external connection terminals when the ICs are stacked. This has the effect of reducing

(21) According to +13 above, it is possible to accurately arrange a predetermined external connection terminal on a predetermined circuit pattern when mounting the above-mentioned IC, and it is possible to obtain the effect that accidents such as soldering defects are reduced.

13+ According to +13 above, it is possible to obtain the effect of reducing appearance defects that tend to occur during transportation of ICs.

(4) Since the external connection terminals of the IC are in almost uniform contact with the inner surface of the magazine case, by forming the magazine case to be electrically conductive, the external connection terminals can be used as traps with the same potential, and the static electricity of the IC can be reduced. This has the effect of reducing destruction.

(5) According to (11) above, since ICs can be stacked and stored in a magazine case, automatic mounting of ICs becomes easy;
This effect can be obtained.

[Embodiment 2] Next, a second embodiment of the present invention will be described with reference to FIG.

Note that the differences between this embodiment and the first embodiment described above lie in the shape of the sealing body and the formation position of the external connection terminal.

The surface-mounted IC 21 belongs to the SOJ type, and the upper package 22 and the lower package 23 are formed in a longitudinal shape. The external connection terminal 24 is formed in a 5-shape in the same manner as described above, and its tip end is connected to the lower package 2.
It is located on the lower side of 3.

On the other hand, as shown in the figure, a longitudinal cutout 25 is formed on the upper surface of the upper package 22 at a position where the external connection terminal 24 comes into contact during stacking. When the ICs 21 are stacked, the external connection terminals 24 are fitted into the cutouts 25.

Therefore, as described in the first embodiment, when the IC 21 is housed in a magazine case (not shown), deformation of the external connection terminal 24 is reduced.

The IC shown in this embodiment has the same effects as the first embodiment described above, as well as the following effects.

Regardless of the shape of the sealing body of 1611c, if the external connection terminal is arranged on the lower surface of the lower baggage, a cutout part should be formed in the E-side package to avoid contact with the external connection terminal. This allows ICs to be stacked and transported without deforming the external connection terminals.

[Embodiment 3] Next, a third embodiment of the present invention will be described with reference to FIG.

Note that the shape of the sealing body shown in this example is the same as that of the above ICs 1 and 2.
IC1 may be applied to any of IC1 for convenience of explanation.
Explain by applying it to ``1-ro''.

That is, when ICs are stacked as shown in each of the above embodiments, it is expected that each IC will be slightly shifted in the lateral direction. In particular, when the magazines are stored in the magazine case 11 and laid down on their sides, they tend to shift relative to each other.

In addition, 2 to 3 pieces when taken out from the magazine case 11,
Alternatively, it is also possible to stack more ICIs.

In such a case, it is preferable to prevent the structure C1 from collapsing, since there will be no unnecessary friction and deformation of the external connection terminal 4 will be reduced.

Therefore, the upper package 2 is inserted into the side surface of the lower package 3, and a stepped portion 31 is formed to reduce the positional deviation between the two. By forming the step portion 31, lateral positional displacement of the stacked ICIs is almost eliminated.

Therefore, by forming the step portion 31 described in this embodiment on the IC described in each of the above embodiments, the following effects can be achieved.

(7) The protruding part of the upper package of another IC is inserted into the step formed on the side surface of the lower package, the lateral positional deviation of the IC, and the friction between the packages are reduced, so the magazine case can be easily removed from the magazine case. The ICs can be stacked with the ICs exposed, and the ICs can be easily handled.

(8) The above (7) provides the effect of reducing electrostatic damage caused by friction of the package.

Above, the invention made by the present inventors has been specifically explained based on examples, but the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Needless to say. For example, the external connection terminal may be shaped to protrude from the lower surface of the lower package and extend toward the outside of the package.

Furthermore, a low surface portion is formed on the upper side of the upper package to
It is also possible to print characters, figures, etc. for identifying 11t. In this case, even if the upper and lower surfaces of the package rub against each other during stacking, the letters and the like will not be erased, reducing appearance defects.

In the above explanation, the invention made by the present inventors and others was mainly applied to surface-mounted ICs, which is the background field of application, but the invention is not limited thereto. It can be widely used.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, an external connection terminal is formed on the lower surface of the sealing body, and a cut portion is formed on the upper surface of the sealing body at a position opposite to a position where the external connection terminal is formed.

When multiple ICs are stacked, the IC placed on top
The external connection terminals are inserted into the cutouts of the IC arranged at the bottom, and the external connection terminals are stacked without coming into contact with the sealing body. As a result, even if multiple ICs are stacked and stored in a magazine case etc., the external connection terminals will not be deformed. It is also possible to reduce appearance defects of the IC.

[Brief explanation of the drawing]

FIGS. 1 and 2 show a first example of an electronic device to which the present invention is applied.
An embodiment is shown, and FIG. 1 is a perspective view showing the shape of the electronic device. FIG. 2 is a sectional view of the main parts showing the electronic device stacked and stored in a magazine case, and FIG. 3 is the second embodiment of the present invention.
FIG. 1 is a perspective view of an electronic device showing an embodiment of the present invention. FIG. 1 is a sectional view of a main part of an electronic device showing a third embodiment of the present invention. 1.21...Surface mount IC12, 22...Upper package, 3.23...Lower package, 5,25...
・Cut portion, 4, 24...External connection terminal, 11...
・Magazine case. Agent: Patent Attorney Katsoo Ogawa Figure 2

Claims (1)

[Claims] 1. A semiconductor chip, an external connection terminal having one end electrically connected to the semiconductor chip, the other end protruding outside the sealing body, and bent along one side of the sealing body, and the external connection terminal. A second main surface opposite to the first main surface of the sealing body whose tips face each other corresponds to at least a bending portion of the external connection terminal that corresponds in a direction perpendicular to a part of the surface formed by the first main surface. An electronic device comprising: a sealing body having a notch formed therein;