CN106170447A - Embossed carrier tape, the manufacture method manufacturing device and embossed carrier tape of embossed carrier tape - Google Patents
Embossed carrier tape, the manufacture method manufacturing device and embossed carrier tape of embossed carrier tape Download PDFInfo
- Publication number
- CN106170447A CN106170447A CN201380074678.8A CN201380074678A CN106170447A CN 106170447 A CN106170447 A CN 106170447A CN 201380074678 A CN201380074678 A CN 201380074678A CN 106170447 A CN106170447 A CN 106170447A
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- Prior art keywords
- carrier tape
- embossed carrier
- belt body
- location indentations
- several
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
- B31D5/00—Multiple-step processes for making three-dimensional articles ; Making three-dimensional articles
- B31D5/0039—Multiple-step processes for making three-dimensional articles ; Making three-dimensional articles for making dunnage or cushion pads
- B31D5/006—Multiple-step processes for making three-dimensional articles ; Making three-dimensional articles for making dunnage or cushion pads including controlled deformation of flat material, e.g. pleating, corrugating or embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/006—Using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/18—Thermoforming apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/007—Narrow strips, e.g. ribbons, tapes, bands
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- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
It is an object of the invention to provide a kind of embossed carrier tape, machining area can be positioned accurately by it relative to Working position.The embossed carrier tape (1) of the present invention is provided with several embossings recess (12) on the first type surface (11a) of belt body (11).Stored object is incorporated in several each embossing recess (12).The first type surface (11a) of belt body (11) is provided with several location indentations (13) that positioning fixture (120) is fitted together to.Location indentations (13) makes the first medial surface (13a) and the second medial surface (13b) be formed taper in the way of the area in the cross section parallel with the first type surface of belt body (11) (11a) gradually expands towards opening portion.
Description
Technical field
The present invention relates to the manufacture method manufacturing device and embossed carrier tape of embossed carrier tape, embossed carrier tape.
Background technology
Embossed carrier tape is for small size article such as conveying or automatically mounting core electronic level packagings (hereinafter referred to as " CSP ").
Embossed carrier tape is the thing arranging several embossing recesses on the first type surface of long size belt body along long side direction across predetermined distance
Product, after stored object is incorporated in several each embossing recesses, the opening portion of each embossing recess is closed by cover strip.
Having the embossed carrier tape being encapsulated into stored object to be wound on spool, this spool is installed on the equipment such as chip mounter.Then, embossing carries
Band unreels out from spool, is carried along long side direction, and the stored object in each embossing recess is taken out simultaneously by mechanism for picking
It is supplied to installation procedure etc..
It in addition, in the manufacturing process of embossed carrier tape, is processed and forms what the sprocket wheel of conveying embossed carrier tape was engaged
Conveying hole.Owing to this conveying hole is necessarily formed in the position of regulation relative to embossing recess, so forming conveying hole
When, need to be accurately positioned the machining area forming conveying hole on embossed carrier tape relative to Working position.Further, in shape
In processing beyond the processing in one-tenth conveying hole, sometimes also the machining area of embossed carrier tape must be carried out relative to Working position
It is accurately positioned.
Propose the method that following method is used as positioning the machining area of embossed carrier tape relative to Working position.
It is to say, arrange several location indentations on the long side direction of embossed carrier tape across interval, inserting positioning fixture should
Location indentations, thus embossed carrier tape is positioned Working position (for example, referring to patent document 1).
(patent document)
Patent document 1: Japanese Unexamined Patent Publication 2009-262963 publication
Content of the invention
But, there is problem as described below in existing embossed carrier tape.It is to say, be inserted into positioning at positioning fixture
In the state of recess, between the medial surface of location indentations and positioning fixture, there is small gap.Therefore, embossed carrier tape phase sometimes
If moving dry measure for positioning fixture, cause machining area, relative to Working position, position skew occurs.
The present invention makes in view of above-mentioned problem, its object is to provide a kind of embossed carrier tape, can be by processing district
Territory carries out high-precision positioning relative to Working position.
The 1st aspect of the present invention is embossed carrier tape, and the first type surface of the long size belt body of described embossed carrier tape is provided with some
Individual embossing recess, stored object be incorporated in several embossing recesses described each in, described first type surface is provided with positioning
Several location indentations that fixture is fitted together to, described location indentations with the area in the cross section with described major surfaces in parallel towards opening
Mode that portion gradually expands and at least a portion that makes medial surface is formed taper.
Further, the 2nd aspect of the present invention is the manufacture device of the embossed carrier tape of first method, possesses: conveying device, its
Described belt body or the former cloth of the banding comprising described belt body are intermittently carried along long side direction, and will be along described band
The long side direction of body or described former cloth and one of several machining areas of configuring are supplied to Working position according to priority；
Positioner, it makes positioning fixture be entrenched at least one in several location indentations described, and processes one
Zone location is in described Working position；And perforating device, it forms several conveying holes at one machining area.
Further, the 3rd aspect of the present invention is the manufacture method of the embossed carrier tape of first method, possesses: conveying operation, its
Described belt body or the former cloth of the banding comprising described belt body are intermittently carried along long side direction, and will be along described band
The long side direction of body or described former cloth and one of several machining areas of configuring are supplied to Working position according to priority；
Positioning process, it makes positioning fixture be entrenched at least one in several location indentations described, and processes one
Zone location is in described Working position；And drilling process, it forms several conveying holes at one machining area.
(invention effect)
Machining area can be carried out high-precision positioning relative to Working position by the embossed carrier tape of the present invention.
Brief description
Fig. 1 is to represent the state diagram that the embossed carrier tape of embodiment of the present invention is wound in spool.
Fig. 2 is the part A zoomed-in view of Fig. 1.
Fig. 3 is the part amplification plan view of the embossed carrier tape shown in Fig. 1.
Fig. 4 is the IV-IV line profile of Fig. 3.
Fig. 5 is the V-V line profile of Fig. 3.
Fig. 6 is the schematic configuration diagram of the manufacture device of the embossed carrier tape shown in Fig. 1.
Fig. 7 is the schematic configuration diagram in the punching portion of the manufacture device shown in Fig. 6.
Fig. 8 is the profile of the state representing that the positioning fixture shown in Fig. 7 is embedded in location indentations.
Fig. 9 be represent the positioning fixture shown in Fig. 7 be embedded in location indentations the profile of state.
Figure 10 is the flow chart of the manufacture method representing embossed carrier tape 1.
Figure 11 is the particular flow sheet representing the hole forming method of the conveying in the manufacture method shown in Figure 10.
Detailed description of the invention
Hereinafter, referring to the drawings embodiments of the present invention are illustrated.Fig. 1 is the embossing representing embodiment of the present invention
Carrier band 1 is wound in the state diagram of spool 91, and Fig. 2 is the part A zoomed-in view of Fig. 1.
For example, the embossed carrier tape 1 shown in Fig. 1 is installed in the chip mounter automatically installing CSP, for by several CSP
It is supplied to installation procedure etc. successively.Embossed carrier tape 1 is in the state of several stored object are encapsulated into, along long side direction winding
In spool 91.As in figure 2 it is shown, the embossed carrier tape 1 being wound in spool 91 is the radially superimposed state along spool 91.
Fig. 3 is the part amplification plan view of embossed carrier tape 1, and Fig. 4 is the IV-IV line profile of Fig. 3, and Fig. 5 is the V-V of Fig. 3
Line profile.Embossed carrier tape 1 possesses the belt body 11 of long size.The material of belt body 11 is not particularly limited, as an example
For Zi, formed by synthetic resin such as PS, PET, PC.Further, the size of belt body 11 is not also particularly limited, as one
For example, width 8.0mm～56.0mm, thickness 0.15mm～about 0.4mm.
As it is shown on figure 3, the side of the first type surface 11a at belt body 11, alternately set along long side direction across predetermined distance
Have several embossing recesses 12 and several location indentations 13.Further, the opposite side of first type surface 11a at belt body 11, along length
Edge direction is provided with several conveying holes 14 across predetermined distance.The sprocket wheel that embossed carrier tape 1 carries along long side direction (is not schemed
Show) be fastened on several conveying holes 14 each in.
Not being particularly limited the shape or size of embossing recess 12, in present embodiment, embossing recess 12 is formed as
Rectangular-shaped.The size of each several part of embossing recess 12 is not particularly limited, for an example, (the reference of degree of depth D
It Fig. 4) is about 0.1mm～0.3mm, along size L of long side direction of belt body 11 in the opening portion of embossing recess 121For
About 0.2mm～5.0mm, along size L of width of belt body 11 in the opening portion of embossing recess 122For 0.4mm～
5.0mm left and right.In present embodiment, the diapire of embossing recess 12 is provided with SS 12a.It is accommodated in embossing recess 12
Stored object, is maintained at embossing recessed owing to embossing the vacuum suction pressure paid outside recess 12 by SS 12a
In portion 12.
Location indentations 13 have on the long side direction of belt body 11 relative to a pair first medial surface 13a and at belt body 11
On width relative to a pair second medial surface 13b.Location indentations 13 with the area in the cross section parallel with first type surface 11a towards
Mode that opening portion gradually expands and formed.It is to say, as shown in Figure 4, a pair first medial surface 13a are with towards location indentations
The mode that the opening portion of 13 is gradually distance from is formed taper.Further, as it is shown in figure 5, a pair second medial surface 13b also with towards
The mode that the opening portion of location indentations 13 is gradually distance from is formed taper.
Not being particularly limited the size of each several part of location indentations 13, for an example, degree of depth d is
About 0.1mm～0.3mm, along size L of long side direction of belt body 11 in the opening portion of location indentations 133(with reference to Fig. 3) is
About 0.6mm～1.5mm, along size L of width of belt body 11 in the opening portion of location indentations 134(with reference to Fig. 4) is
About 0.2mm～6.0mm.
The angle [alpha] (with reference to Fig. 4) being formed the face of the first medial surface 13a and the long side direction being orthogonal to belt body 11 is not done
Particularly limit, for an example, be 3.0 °～about 6.0 °.Further, to the second medial surface 13b be orthogonal to belt body
The angle beta (with reference to Fig. 5) that the face of the width of 11 is formed is not particularly limited, and for an example, is 3.0 °
About～6.0 °.
In addition, each several part size of location indentations 13 also can be set as can not to be accommodated in being received in embossing recess 12
The size that thing of receiving inserts.It is to say, in the case that stored object is inserted incorrectly into location indentations 13, it is necessary to stopping will
Stored object inserts the device of embossing recess 12, and removes the stored object being erroneously inserted into location indentations 13.This situation
Under, if stored object is small, then remove the trivial operations of stored object in location indentations 13, recovery is by time-consuming, therefore significantly
Infringement productivity ratio.It by location indentations 13 is formed as the size can not inserted stored object, is prevented from this problem
Occur.
It follows that illustrate with reference to the manufacture device 10 to embossed carrier tape 1 for the Fig. 6.Fig. 6 is the manufacture dress of embossed carrier tape 1
Put the schematic configuration diagram of 10.
As shown in Figure 6, manufacture device 10 to possess: supply unit the 20th, heating part the 30th, forming part the 40th, the first delivery section 50A, cold
But portion's the 60th, slitting unit the 70th, punching portion the 80th, inspection portion the 85th, the second delivery section 50B and winder 90.First delivery section 50A and second
Delivery section 50B plays a role as the conveying device of the present invention.
Supply unit 20 possesses spool 21, and spool 21 is for winding as the former cloth M of the raw-material banding of embossed carrier tape 1.
The former cloth M unreeling out from spool 21 is heated to set point of temperature by heating part 30 so that it is soften.To heating part 30
Structure is not particularly limited, and for an example, is constituted in the way of heating former cloth M to former cloth M blowing hot-air.
A part of the forming part 40 mould former cloth M to thermoplastic presses, and makes embossing recess 12 (with reference to figure
4) it is molded with location indentations 13 (with reference to Fig. 4).
First delivery section 50A will be formed with the former cloth M of embossing recess 12 and location indentations 13 along long side direction (X-direction)
Intermittently carry every the spacing specifying.
For example, former cloth M is cooled to room temperature by cooling end 60.The structure of cooling end 60 is not particularly limited, as one
For individual example, constituted in the way of former cloth M being blown a cold wind over and cools down former cloth M.
Former cloth M is cut by slitting unit 70 along long side direction, and cuts off the dual-side of the former cloth M shrinking due to cooling
Edge.Its result, forms the belt body 11 (with reference to Fig. 3) of Rack.
Punching portion 80 is in each of several machining areas R (with reference to Fig. 3) of the long side direction configuration along belt body 11
Middle formation conveying hole 14, thus make embossed carrier tape 1.With regard to the particular content in punching portion 80, will be described later.
Second delivery section 50B by made embossed carrier tape 1 along long side direction (X-direction) every regulation spacing between
Carry to having a rest property.By the second delivery section 50B, embossed carrier tape 1 is intermittently carried, in several machining areas R
One be supplied to Working position according to priority.
The first type surface 11a (with reference to Fig. 3) to embossed carrier tape 1 for inspection portion 85 camera installation shoots, to gained image
It is analyzed, detect the presence of embossing recess the 12nd, location indentations 13 and conveying hole 14 or shape etc., thus to embossed carrier tape 1 be
No judge for non-defective unit.
The embossed carrier tape 1 of non-defective unit is wound in spool 91 along long side direction by winder 90.
It follows that illustrate with reference to the particular content to punching portion 80 for the Fig. 7.Fig. 7 is the punching portion 80 manufacturing device 10
Schematic configuration diagram.Punching portion 80 possesses punching mechanism 110 and positioning fixture 120.
Punching mechanism 110 has several the elongated punching pins 111 highlighting downwards.Several punching pins 111 along
The long side direction (X-direction) of belt body 11 configures across predetermined distance.Several punching pins 111 utilize not shown driving machine
Structure moves reciprocatingly along Z-direction simultaneously.Punching mechanism 110 plays a role as the perforating device of the present invention.
Positioning fixture 120 has the fitting projection 121 highlighting downwards.Fitting projection 121 is formed as and embossed carrier tape 1
The corresponding shape of location indentations 13, chimeric with location indentations 13.Positioning fixture 120 utilizes not shown drive mechanism in upper end
Move reciprocatingly along Z-direction between position (position of Fig. 7) and lower end position (position of Fig. 8 and Fig. 9).Positioning fixture
120 and drive mechanism play a role as the positioner of the present invention.
Fig. 8 and Fig. 9 is the profile of the state representing that positioning fixture 120 is fitted to location indentations 13.Such as Fig. 8 and Fig. 9 institute
Showing, when positioning fixture 120 reaches lower end position, fitting projection 121 is just chimeric with location indentations 13.Fitting projection 121 and positioning
A pair first medial surface 13a of recess 13 and a pair second medial surface 13b are seamlessly in close contact.
It follows that illustrate with reference to the manufacture method to embossed carrier tape 1 for Fig. 6 and Figure 10.Figure 10 is to represent embossed carrier tape 1
The flow chart of manufacture method.
As shown in Figure 10, first, in step S10, operator prepares to be wound with the spool 21 of banding former cloth M, and is pacified
It is loaded on manufacture device 10.
It follows that former cloth M is unreeled out from spool 21 by the first delivery section 50A, former cloth M is carried along long side direction,
In step S20, heating part 30 is heated former cloth M and makes it soften.
It follows that in step S30, processing department 40 carries out embossing processing to former cloth M, make several embossing recesses 12 and positioning
Recess 13 is molded.
It follows that in step S40, the former cloth M after embossing recess 12 and location indentations 13 shaping is carried out cold by cooling end 60
But.
It follows that in step S50, chilled former cloth M is cut by slitting unit 70 along long side direction, and excise due to
The dual-side edge of the former cloth M cooling down and shrinking, thus make belt body 11 (with reference to Fig. 3).
It follows that in step S60, punching portion 80 forms conveying hole 14 on belt body 11, thus makes embossed carrier tape 1.
With regard to the particular content of step S60, will be described later.
It follows that in step S70, inspection portion 85 checks the quality of embossed carrier tape 1.The situation being non-defective unit at embossed carrier tape 1
Under, embossed carrier tape 1 is transported to winder 90.In the case that embossed carrier tape 1 is defective products, by display part or siren etc.
Notify operator.
Then, in step S80, the embossed carrier tape 1 of non-defective unit is wound in spool 91.
It follows that with reference to Figure 11, the forming method in conveying hole 14 is described in detail.Figure 11 is to represent shown in Figure 10
Manufacture method in the conveying particular flow sheet of hole forming method.Step S610 shown in Figure 11, step S620 and step
The operation of S630 is included in step S60 shown in Figure 10.
First, in step S610, the first delivery section 50A and the second delivery section 50B by belt body 11 (with reference to Fig. 3) along long limit side
To intermittently carrying, one of several machining areas R of long side direction configuration along belt body 11 is supplied to add
Station puts P.Step S610 plays a role as the conveying operation of the present invention.
It follows that in step S620, insert the fitting projection 121 of positioning fixture 120 in several location indentations 13
One, the machining area R that supply comes is navigated to Working position P.Step S620 plays a role as the positioning process of the present invention.
It follows that in step S630, punching mechanism 110 forms conveying on the machining area R be positioned Working position P and uses
Hole 14.Step S630 plays a role as the drilling process of the present invention.
It according to this manufacture method, before positioning fixture 120 is fitted to location indentations 13, is being supplied to Working position P's
Machining area R is fitted together to convex relative to Working position P in the case that long side direction and/or width there occurs that position offsets
Portion 121 is inserted into location indentations 13 and makes belt body 11 move, thus a pair first medial surface 13a of location indentations 13 and a pair
Two medial surface 13b and fitting projection 121 are in close contact.Its result, this machining area R is accurately positioned in Working position P, can
Three conveying holes 14 that suppression is formed in this machining area R offset relative to the position of location indentations 13.
Further, in present embodiment, degree of depth d (with reference to Fig. 4) of location indentations 13 is more than degree of depth D of embossing recess 12.This
In the case of Zhong, when embossed carrier tape 1 is wound in the state of spool 91 (with reference to Fig. 1), the bottom of location indentations 13 and corresponding thereto
Belt body 11 first type surface 11a between produce space C (with reference to Fig. 2).Therefore, from location indentations 13 bottom side stress not
The stored object received in acting on embossing recess 12.
Further, owing to the bottom of location indentations 13 is not connected to the first type surface 11a of belt body 11, thus suppression is on spool 91
Winding moment of torsion during winding embossed carrier tape 1 causes location indentations 13 to bend to arc-shaped along the first type surface 11a of belt body 11.And
And, location indentations 13 plays the effect of reinforcement relative to embossing recess 12, thus suppresses to emboss the deformation of recess 12.Its knot
Really, the stress acting on the stored object in embossing recess 12 can be made to reduce, and suppress deformation or the damage of stored object.
Above, with reference to Fig. 1～Figure 10, embodiment of the present invention is illustrated, but the invention is not restricted to this embodiment party
Formula, can carry out various change to present embodiment without departing from the scope of the gist of the present invention.
For example, in present embodiment, the medial surface of location indentations 13 is entirely formed to taper, but also can be that positioning is recessed
A part for the medial surface in portion is formed as taper.
Further, in present embodiment, make positioning fixture 120 be embedded in one of several location indentations 13 and come to processing
Region R positions, but positioning fixture 120 also can be made to be embedded in several location indentations 13 and carry out machining area R
Positioning.
Further, in present embodiment, punching portion 80 forms three conveying holes 14 relative to a machining area R, but
Also can be the quantity in the conveying hole 14 that punching portion 80 is formed relative to a machining area R be less than two or four
Above.
Further, in present embodiment, the degree of depth of location indentations 13 is more than degree of depth D of embossing recess 12, but also can be
Degree of depth d of location indentations 13 is identical with degree of depth D of embossing recess 12, or degree of depth d of location indentations 13 is less than embossing recess 12
Degree of depth D.
Further, in present embodiment, before being punched in conveying hole 14, former cloth M is cut, but also may be used
To be after being punched in conveying hole 14, former cloth M to be cut.
Further, in present embodiment, when carrying out the processing forming conveying hole 14 on belt body 11, positioning fixture 120 is made
It is embedded in location indentations 13 and belt body 11 is positioned Working position P, but also can be that it is being carried out to belt body 11 or former cloth M
Make positioning fixture 120 be embedded in location indentations 13 during his processing (for example, cutting processing) to carry out to belt body 11 or former cloth M determining
Position.
Further, it, in present embodiment, has been separately provided location indentations 13 outside embossing recess 12, but also can be embossing
Recess 12 is also used as location indentations 13.
Further, it is accommodated in article (for example, the structural elements beyond the stored object embossing in recess 12 also can be CSP
Part).
Further, as long as the material flexible material of embossed carrier tape 1, it is also possible to be the material beyond synthetic resin
(for example, paper or metal).
In addition, without departing from the scope of the gist of the present invention various change can be carried out to present embodiment.
(description of reference numerals)
1 embossed carrier tape
2 spools
11 belt bodies
11a first type surface
12 embossing recesses
13 location indentations
13a the first medial surface
13b the second medial surface
14 conveying holes
50A the first delivery section (conveying device)
50B the first delivery section (conveying device)
110 punching mechanisms (perforating device)
120 positioning fixtures (positioner)
121 fitting projection
91 spools
The former cloth of M
R machining area
Claims (8)
1. an embossed carrier tape, is provided with several embossing recesses on the first type surface of its long size belt body, and stored object is contained
In each of several embossing recesses described,
Described first type surface is provided with several location indentations that positioning fixture is fitted together to,
In described location indentations makes in the way of the area in the cross section with described major surfaces in parallel gradually expands towards opening portion
At least a portion of side is formed taper.
2. embossed carrier tape according to claim 1, wherein,
Described location indentations have on the long side direction of described belt body relative to a pair first medial surfaces and at described belt body
Width on relative to a pair second medial surfaces,
The pair of first medial surface and the pair of second medial surface are gradually distance from the opening portion towards described location indentations
Mode be formed as taper.
3. the embossed carrier tape according to claim 1 or claim 2, wherein,
In the state being wound in spool, the reinforcement of the deformation as suppression described embossing recess for the described location indentations plays to be made
With.
4. the embossed carrier tape according to any one in claim 1 to claim 3, wherein,
Described location indentations is alternately arranged with described embossing recess along the long side direction of described belt body across predetermined distance,
The degree of depth of described location indentations is more than the degree of depth of described embossing recess.
5. the embossed carrier tape according to any one in claim 1 to claim 4, wherein,
Described location indentations is formed as the size can not inserted described stored object.
6. the embossed carrier tape according to any one in claim 1 to claim 5, wherein,
Possess several conveying holes being formed along long side direction across predetermined distance.
7. a manufacture device for embossed carrier tape, for the embossed carrier tape described in manufacturing claims 6, possesses:
Conveying device, described belt body or the former cloth of banding comprising described belt body are carried out intermittently defeated by it along long side direction
Send, and one of several machining areas configuring the long side direction along described belt body or described former cloth are in order
Be supplied to Working position；
Positioner, it makes positioning fixture be entrenched at least one in several location indentations described, and by one
Machining area is positioned described Working position；And
Perforating device, it forms described conveying hole at one machining area.
8. a manufacture method for embossed carrier tape, for the embossed carrier tape described in manufacturing claims 6, possesses:
Conveying operation, described belt body or the former cloth of banding comprising described belt body are carried out intermittently defeated by it along long side direction
Send, and one of several machining areas configuring the long side direction along described belt body or described former cloth are in order
Be supplied to Working position；
Positioning process, it makes positioning fixture be entrenched at least one in several location indentations described, and by one
Machining area is positioned described Working position；And
Drilling process, it forms described conveying hole at one machining area.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2013/073310 WO2015029212A1 (en) | 2013-08-30 | 2013-08-30 | Embossed carrier tape, device for manufacturing embossed carrier tape, and method for manufacturing embossed carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106170447A true CN106170447A (en) | 2016-11-30 |
Family
ID=52585828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380074678.8A Pending CN106170447A (en) | 2013-08-30 | 2013-08-30 | Embossed carrier tape, the manufacture method manufacturing device and embossed carrier tape of embossed carrier tape |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN106170447A (en) |
| TW (1) | TW201515964A (en) |
| WO (1) | WO2015029212A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110000623A (en) * | 2019-04-30 | 2019-07-12 | 广东凯文印刷有限公司 | A kind of product examine machine belt texture organisation of working |
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| JP2004345688A (en) * | 2003-05-22 | 2004-12-09 | Shin Etsu Polymer Co Ltd | Carrier tape for carrying electronic component |
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| JP2010149878A (en) * | 2008-12-24 | 2010-07-08 | Ishii Sangyo Kk | Carrier tape |
| JP4755410B2 (en) * | 2003-11-18 | 2011-08-24 | ルネサスエレクトロニクス株式会社 | Tape-shaped component packaging |
| JP4822845B2 (en) * | 2006-01-10 | 2011-11-24 | パナソニック株式会社 | Carrier tape, electronic component packaging body, and electronic component packaging method |
-
2013
- 2013-08-30 WO PCT/JP2013/073310 patent/WO2015029212A1/en active Application Filing
- 2013-08-30 CN CN201380074678.8A patent/CN106170447A/en active Pending
-
2014
- 2014-08-25 TW TW103129182A patent/TW201515964A/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000203630A (en) * | 1999-01-13 | 2000-07-25 | Miyagi Oki Denki Kk | Embossed carrier tape and embossed carrier taping method |
| JP2002308211A (en) * | 2001-04-19 | 2002-10-23 | Yayoi Kk | Parts transferring member and its manufacturing method |
| JP2004345688A (en) * | 2003-05-22 | 2004-12-09 | Shin Etsu Polymer Co Ltd | Carrier tape for carrying electronic component |
| JP4755410B2 (en) * | 2003-11-18 | 2011-08-24 | ルネサスエレクトロニクス株式会社 | Tape-shaped component packaging |
| JP4822845B2 (en) * | 2006-01-10 | 2011-11-24 | パナソニック株式会社 | Carrier tape, electronic component packaging body, and electronic component packaging method |
| JP2009262963A (en) * | 2008-04-25 | 2009-11-12 | Ishii Sangyo Kk | Carrier tape |
| JP2010149878A (en) * | 2008-12-24 | 2010-07-08 | Ishii Sangyo Kk | Carrier tape |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110000623A (en) * | 2019-04-30 | 2019-07-12 | 广东凯文印刷有限公司 | A kind of product examine machine belt texture organisation of working |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015029212A1 (en) | 2015-03-05 |
| TW201515964A (en) | 2015-05-01 |
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