JP2003072835A - Carrier tape for electronic component, and electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape for electronic components in which the position of a rail of a mounting machine need not be adjusted according to the thickness of an embossed tape, and the carrier tape wound around a reel does not meander when feeding the tape, and to provide a method for mounting the electronic components on a mount substrate. SOLUTION: In the carrier tape for accommodating and transporting or carrying the electronic components, projections 12 are provided on predetermined areas of the embossed tape 1 constituting the carrier tape. Since the height of the projections is added to the thickness of the embossed tape, the height (position) of the rail of the mounting machine need not be adjusted. Since the projections reinforce the embossed tape, the meandering of the carrier tape wound around the reel can be prevented. In addition, a manufacturing step can be simplified because the carrier tape can be worked simultaneously when forming pockets in the embossing step for forming the pockets.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, a liquid crystal display element for mobile or mobile phones, a surface acoustic wave element, a passive element such as a resistor, a coil or a capacitor,
The present invention relates to a structure of a carrier tape used in a process of accommodating a completed product of an electronic component such as a printed circuit board, transportation, transportation, or mounting on a mounting board.

[0002]

2. Description of the Related Art Conventional electronic parts such as BGA (Ball)
Products such as grid array) type semiconductor devices that have been completed are transported and transported by a carrier tape, and these products are mounted on a mounting board by a mounting machine or the like.
The carrier tape is composed of an embossed tape having the formed pocket as a product storage portion and a cover tape covering the embossed tape. Embossed tape
It is formed by vacuum forming, press forming, pressure forming, etc. using a sheet of a plastic material such as polystyrene. On the sheet, pockets for accommodating electronic parts and feed holes for feeding the tape are formed at a predetermined pitch. This shape is based on the JIS standard (JIS C 0
806).

FIG. 12 is a plan view of an embossed tape which constitutes a conventional carrier tape for electronic parts, and FIG. 13 is a cross-sectional view of a conventional carrier tape containing electronic parts. The carrier tape for electronic parts is an embossed tape 101 made of polystyrene sheet or the like having pockets 110 for accommodating electronic parts 105, and a cover tape laminated on the embossed tape 101 so as to seal the pockets accommodating electronic parts. 102 and is wound on a reel or the like made of a material such as polystyrene. The end portions of the cover tape 102 and the embossed tape 101 that have been wound are fixed with an adhesive tape. In an electronic component 105, for example, a BGA type semiconductor device, a silicon chip on which a semiconductor element such as an integrated circuit is formed is a mold resin (resin sealing body) 107 such as an epoxy resin.
And the ball terminal 106 is exposed on one surface. The other surface constitutes a mark portion on the surface of which symbols such as numbers and letters are written. The embossed tape 101 has a plurality of pockets 110 formed at the center thereof.
The bottom surface of 0 has a hole (air hole) 111 formed substantially in the center. Further, feed holes 109 for feeding the tape are provided on both sides of the embossed tape 101. The pocket 110 is slightly larger than the size of the electronic component 105 so that it can be easily taken in and out.

The cover tape 102 is an embossed tape 1.
No. 01 is formed inside the sprocket hole 109 and is formed using a laminated material sheet such as polyethylene terephthalate (PET). The adhesive tape is made of polypropylene (PP) or the like with an adhesive. An embossed tape containing a small-sized electronic component may have a feed hole only on one side. To store and wrap the electronic component 105 in the carrier tape, the carrier tape is unwound from the reel by a taping machine, and the pocket 1
10, the ball terminal 106 of the electronic component 105 is the pocket 1
It is housed so as to be in contact with the bottom surface of 10, and then the cover tape 102 is heat-sealed on the surface of the carrier tape. Further, this is wound on a reel, and the final end is attached with an adhesive tape for packaging (see FIG. 13).

[0005]

The height of a rail provided in a mounter machine (M / C) for storing components in a carrier tape or a mounting machine for picking up electronic components from a carrier tape and mounting them on a mounting board has been proposed. Adjust the height to regulate the gap between the rail and the tape feed roller located under the rail to a constant value.) Is the thickness of the carrier tape in order to eliminate rattling between the rail and the carrier tape. It is necessary to change according to. That is, conventionally, when the carrier tape is thin, the rail height of the mounting machine is reduced, and when the carrier tape is thick, the rail height is increased to eliminate the rattling of the rail. In this way, before using the mounter or mounting machine, the height of the rail was adjusted according to the initially determined tape thickness. However, adjusting the position of the mounting machine is a difficult task, and thus it is difficult to change the tape thickness. Note that the carrier tape tends to have a smaller thickness with the aim of reducing the amount of waste, reducing the environmental load, and reducing the product price by making the material thinner.

The embossed tape used as the carrier tape for electronic parts is formed by vacuum forming, press forming, pressure forming, etc. using a sheet of plastic material or the like. On the sheet, pockets for housing electronic components and tape feed holes are formed and arranged at a fixed pitch. A plurality of pockets are provided in a concave shape having a size slightly larger than the width, length and height of the electronic component. As shown in FIG. 9, when the reel is spirally wound (long roll),
Depending on the material of the tape, meandering may occur, and the carrier tape may come off from the mounter M / C or the rail part of the mounting machine, causing a problem such as the mounter M / C stopping during tape feeding. As measures against this, there are problems such as changing to a high strength tape material and increasing the tape thickness to increase the tape thickness to prevent meandering. The present invention has been made under such circumstances, and it is not necessary to adjust the position of the rail of the mounting machine depending on the thickness of the embossing tape, and the carrier tape wound around the reel does not meander during tape feeding. Provided is a carrier tape for electronic parts that can be configured, and a method for mounting electronic parts on a mounting board using the carrier tape.

[0007]

The present invention relates to a semiconductor device such as a ball terminal integrated circuit, a liquid crystal display element for mobile or mobile phones, a surface acoustic wave element, a passive element such as a resistor or a coil, and a printed circuit board. In a carrier tape for an electronic component that holds a completed electronic component product and transports or conveys the product, a protrusion (rib) having a predetermined height in a predetermined region where a pocket of an embossed tape forming the carrier tape is not formed. ) Is provided. Since the height of the protrusion is added to the thickness of the embossing tape, it is not necessary to adjust the rail height of the mounting machine (position adjustment), and the protrusion reinforces the embossing tape. , It is possible to prevent the carrier tape wound on the reel from meandering when the tape is fed. Further, the carrier tape for electronic parts can be processed simultaneously with the formation of the pocket during the embossing step of forming the pocket, so that the manufacturing process can be simplified.

That is, the carrier tape for electronic parts of the present invention comprises an embossed tape having a plurality of pockets for accommodating electronic parts formed therein, and at least one protrusion is provided in a region other than the region where the pockets are formed. Is formed. A plurality of feed holes may be formed along at least one of both sides of the embossed tape. The protrusion may be formed between the feed holes. The protrusion may be formed between the pocket and the plurality of feed holes. The protrusion may be formed in a long shape. The protrusion may be formed along both sides. A cover tape may be laminated on the embossed tape so as to seal the pocket. The embossed tape may be wound on a reel. A mounting method of an electronic component of the present invention includes a step of disposing a mounting substrate at a predetermined position, and a step of mounting a predetermined electronic component taken out from the electronic component carrier tape described above at a predetermined position of the mounting substrate. It is characterized by having and.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. First, referring to FIG. 1 to FIG.
An example will be described. FIG. 1 is a perspective view of a carrier tape for electronic components wound on a reel of the present invention, FIG.
2 is a perspective view of an electronic component housed in this carrier tape, and FIG. 3 is FIG. 2 housed in the carrier tape of the present invention.
4 is a perspective view of an electronic component other than the electronic component shown in FIG. 4, FIG. 4 is a plan view of the embossed tape and a cross-sectional view of a portion along the line AA ′ of this plan view, and FIG. FIG. 6 is a partial side view of a mounter that carries out electronic components from a carrier tape, FIG. 6 is a sectional view of a part taken along the line AA ′ of FIG. 5, and FIG. FIG.

A completed product such as a semiconductor device, a liquid crystal display element for a mobile phone or a mobile phone, a surface acoustic wave element, a passive element such as a resistor, a capacitor or a coil, and an electronic component such as a printed circuit board is housed, transported and transported. The carrier tape to be used is an embossed tape 1 made of a polystyrene sheet or the like having a pocket 11 for accommodating the electronic component 5 and an embossed tape 1 so as to seal the pocket 11 in which the electronic component 5 is accommodated. The embossed tape 1 including the cover tape 2 formed on the cover tape 2 is wound around a reel 3 made of a material such as polystyrene. The ends of the wound cover tape 2 and embossed tape 1 are fixed by an adhesive tape 4 (FIG. 1). The thickness of the embossed tape 1 is 0.
It is about 25 mm.

As shown in FIG. 1, the cover tape 2 has a size width that comes inside the feed hole of the embossed tape 1 and is formed by using a laminated material sheet such as polyethylene terephthalate (PET). The adhesive tape 4 is made of a material such as polypropylene (PP) with an adhesive. The electronic component 5, for example, a BGA type semiconductor device is formed by sealing a silicon chip on which a semiconductor element such as an integrated circuit is formed with a mold resin sealing body 7 such as an epoxy resin. Ball terminal 6 on one side of 7
Is exposed. The electronic component 5 is protected by the resin encapsulation body 7, and the other surface of the resin encapsulation body 7 is provided with a mark portion 8 on which symbols such as numbers and letters are written (FIG. 2).

In the present invention, in addition to a BGA type semiconductor device as an electronic component housed in an electronic component carrier tape, as shown in FIG. 3, a QFP (Quad Flat Pac) is used.
There is a kage) type semiconductor device (FIG. 3A). This is called a surface mount type package, and is characterized in that the leads are led out from four side surfaces of the resin encapsulation body and have a gull-wing shape. In addition, LOC (Lead On Chip)
There is a type of semiconductor device (FIG. 3B). This is to reduce the package size by placing leads on the chip and wire bonding. The leads are led out from two side surfaces of the resin sealing body. In addition, SOJ (Small O
There is a utline J-lead package) type semiconductor device (FIG. 3C). Leads are led out from two side surfaces of the resin encapsulant so that they can be surface-mounted on a mounting board such as a wiring board, and the leads are bent downward at a right angle on the way. The ends of the bent leads are bent in a J shape toward the bottom surface of the resin sealing body.

A feature of the present invention is that a protrusion having a predetermined thickness is formed in a region of the embossed tape where the pocket is not formed. In this embodiment, as shown in FIG. 4, the projections 12 are formed on both sides of the embossed tape 1.
The protrusions 12 are provided on the side where the feed holes 13 are arranged.
On the side where the feed holes 13 are not arranged, they are arranged between the tape side end and the pocket 11. As shown in FIG. 4, the embossed tape 1 has a plurality of pockets 11 formed in the central portion thereof, and a punched hole (air hole) 14 is formed substantially in the center of the bottom surface of the pocket 11. The pocket 11 is provided slightly larger than the size of the electronic component 5 to facilitate the taking in and out.

Next, a method of mounting electronic components on a mounting board using a carrier tape for electronic components will be described with reference to FIGS. The carrier tape for electronic parts is used for a product transportation or a board mounting process in which the electronic parts are stored in a pocket of the carrier tape by using a mounter machine (M / C) and then wound on a reel. A mounting machine for mounting an electronic component on a mounting board includes a reel mounting portion for mounting a reel on which a carrier tape for an electronic component is wound, a tape supply unit for removing the carrier tape for an electronic component from the reel, and an electronic component for the electronic component. It is equipped with a component operating unit having a suction head that is taken out from the carrier tape and mounted on the mounting substrate. FIG. 5 shows the tape supply unit and the component operation unit of the mounting machine. Mounter M / C for storing electronic parts and winding carrier tape on reels
Includes a reel mounting section for mounting a reel, a tape winding section for winding a carrier tape for electronic components on the reel, and a component operating section having a suction head for storing electronic components in the carrier tape for electronic components. The carrier tape for electronic parts is driven by being guided by rails and tape feed rollers having the same structure in both the mounter M / C and the mounter. Although the operation of the mounting machine will be described in this embodiment, the same applies to the case of the mounter M / C.

As shown in FIG. 5, the embossed tape 1 constituting the carrier tape for electronic parts is pulled out from the reel (not shown) mounted on the mounting machine by the tape supply section. The tape supply unit includes a rail 10 (also referred to as a tape pressing cover) and a tape feed roller 16. In the carrier tape for electronic components wound on the reel, the tape feed claws 15 of the tape feed roller 16 rotating in the feed hole 13 of the embossed tape 1 are inserted one after another and fed out from the reel forward (in the direction of the right arrow). . A suction head 9 constituting a component operation unit attached to a mounting machine is arranged at the tip of the embossed tape 1 fed out, and electronic components 5 housed in a pocket 11 of the embossed tape 1 are sequentially mounted on a mounting board (not shown). ) Will be installed.

As shown in FIG. 7, the rail 10 controls the movement of the moving tape.
Embossing tape 1 driven by 5 is tape feed roller 1
The tape is pushed from above and below to ensure stable running of the tape. At this time, the gap between the rail 10 and the tape feed roller 16 is made substantially the same as the thickness of the embossed tape 1 so that the rattling of the rail 10 and the embossed tape 1 during traveling is eliminated. As described above, the distance between the rail and the tape feeding roller for stably feeding the tape, which is conventionally provided in the mounter M / C or the mounting machine, is changed according to the thickness of the carrier tape running between them.
That is, when the carrier tape is thin, the rail height of the mounting machine is lowered to narrow the gap between the rail and the tape feed roller. However, in recent years, there has been an increasing demand for reducing the environmental load, and the movement to make the carrier tape thinner has become remarkable from the economical point of view. In response to such a demand, carrier tapes having different thicknesses are often used. There is. However, it is a difficult task to move the rail height of the mounting machine to adjust the distance between the rail and the tape feed roller, and it is a task that should be made unnecessary as much as possible.

In this embodiment, in order to avoid such unnecessary work, the embossing tape 1 constituting the carrier tape is provided with the protrusion 12, and the height of the protrusion 12 and the thickness of the embossing tape 1 are set. The feature is that the sum is made equal to the distance (d) between the rail 10 and the tape feed roller 16 to eliminate rattling between the carrier tape and the rail 10. If a protrusion having a predetermined shape is formed in accordance with a predetermined distance between the rail and the tape feed roller, a carrier machine of any thickness is adjusted to have a constant distance (the same applies to the mounter M / C). It is possible to carry out mounting work without mounting the above-mentioned difficult work.

Next, a second embodiment will be described with reference to FIGS. FIG. 8 is a plan view of the embossed tape and a cross-sectional view of a portion along the line AA ′ of this plan view, and FIG. 9 is a perspective view of a reel on which the embossed tape is wound as a carrier tape for electronic parts. In this embodiment, the embossed tape 25 is spirally wound around a reel 26 as shown in FIG. In such a winding method, meandering occurs due to the material and thickness of the tape, and the carrier tape may come off from the mounter M / C or the rail of the mounting machine, and the machine may stop during feeding. As a countermeasure against this, the material was changed to a high strength material and the plate thickness was increased to strengthen it to prevent meandering. In this embodiment, the carrier tape that contains, transports and conveys the completed electronic component product is
The cover tape is composed of an embossed tape 25 made of a polystyrene sheet or the like having a pocket 21 for accommodating an electronic component, and a cover tape overlaid on the emboss tape 25 so as to seal the pocket 21 in which an electronic component is accommodated. The stacked embossed tapes 25 are wound on a reel formed of a material such as polystyrene. The cover tape has a size width that comes inside the feed hole 23 of the embossed tape 25 and is made of polyethylene terephthalate (PET).
It is molded using a laminated material sheet such as. The adhesive tape is made of polypropylene (PP) or the like with an adhesive.

A feature of the present invention is that a protrusion is formed in a region of the embossed tape where the pocket is not formed, and the protrusion has a long shape. In this embodiment, FIG.
As shown in, the protrusions 12 are formed on both sides of the embossed tape 1. The protrusions 12 are formed along both sides of the tape, and are formed between the feed hole 23 and the pocket 21 on the side where the feed holes are arranged, and between the tape side end and the pocket 21 on the side where the feed holes are not arranged. Are arranged in. The embossed tape 25 has a plurality of pockets 21 formed in the central portion thereof, and a punched hole (air hole) 24 is formed substantially in the center of the bottom surface of the pocket 21. The pocket 21 is provided to be slightly larger than the size of the electronic component to facilitate the taking in and out. In this embodiment, since the protrusions having a predetermined shape are formed in accordance with the predetermined distance between the rail and the tape feed roller, the mounting machine having any thickness of the carrier tape adjusted at a constant distance ( The same can be applied to the mounter M / C), and the mounting work can be performed without the difficult work of adjusting the distance between the rail and the tape feed roller. Further, since the long protrusions are formed on the carrier tape, the tape is reinforced and the meandering of the carrier tape can be prevented.

Next, a third embodiment will be described with reference to FIG. The embossed tape of the carrier tape for electronic parts described in the above-mentioned embodiment has the feed holes formed on only one side, but the present invention can use those arranged on both sides of the tape. In this embodiment, feed holes are formed on both sides of the tape. The size of the tape pocket determines whether the feed holes are formed on both sides or one side of the tape. Larger pockets, ie, larger chip sizes, usually have perforations formed on both sides of the tape. The size of the protrusions may be different on each side.
However, the height of each protrusion is the same. Also, the pitch of the feed holes need not match the pitch of the pockets. As shown in FIG. 10, the embossed tape 35 has a plurality of pockets 31 formed in the central portion thereof, and a punched hole (air hole) 34 is formed substantially in the center of the bottom surface of the pocket 31. The pocket 31 is provided to be slightly larger than the size of the electronic component to facilitate the taking in and out.

In this embodiment, the protrusion 32 is provided on the embossed tape 35 constituting the carrier tape in order to avoid the difficult work of adjusting the distance between the rail for conveying the carrier tape and the tape feed roller. ,
The sum of the height of the protrusion 32 and the thickness of the embossed tape 35 is made equal to the distance between the rail and the tape feed roller to eliminate rattling between the carrier tape and the rail. If a protrusion having a predetermined shape is formed in accordance with a predetermined distance between the rail and the tape feed roller, a carrier machine of any thickness is adjusted to have a constant distance (the same applies to the mounter M / C). It is possible to carry out mounting work without mounting the above-mentioned difficult work. The protrusions 32 are formed between the pitches of the feed holes 33.

Next, with reference to FIG. 11, a method of manufacturing the embossed tape which constitutes the carrier tape for electronic parts described in the above embodiment will be described. FIG. 11 is a schematic sectional view of a mold for producing an embossed tape and an enlarged sectional view of the mold. The embossed tape used as a carrier tape for electronic parts is formed by vacuum forming, press forming, pressure forming, etc. using a sheet of plastic material such as polystyrene. The vacuum forming method will be described with reference to the drawings. A sheet of polystyrene or the like is fed from a reel and supplied to a heated rotating die (sheet insertion). The sheet is heated in the mold and is evacuated on the mold to be molded along the shape of the mold. By this molding, the pockets are formed with a predetermined pitch, and at the same time, the protrusions described in each embodiment are formed. The sheet formed on the embossed tape is wound on the winding reel. The embossed tape wound on the reel has electronic parts stored in a pocket, is laminated with a cover tape, is wound on another reel, and is closed with an adhesive tape to end the packaging.

[0023]

According to the present invention, by providing a protrusion on the embossed tape, the work of adjusting the rail height of the mounter or the mounting machine becomes unnecessary even if the tape thickness becomes thin, and the protrusion has an embossed tape. Because it will reinforce
It is possible to prevent the carrier tape wound on the reel from meandering when the tape is fed. Further, the carrier tape for electronic parts can be processed simultaneously with the pocket during the embossing process for forming the pocket, so that the manufacturing process can be simplified.

[Brief description of drawings]

FIG. 1 is a perspective view of a carrier tape for electronic parts wound around a reel according to a first embodiment of the present invention.

FIG. 2 is a perspective view of an electronic component housed in the electronic component carrier tape of FIG.

FIG. 3 is a perspective view of an electronic component other than the electronic component shown in FIG. 2 housed in the carrier tape of the present invention.

FIG. 4 is a plan view of an embossed tape that constitutes the carrier tape for electronic parts of FIG. 1 and a cross-sectional view of a portion along the line AA ′ of this plan view.

FIG. 5 is a partial side view of a mounting machine that carries a carrier tape for electronic parts, which explains a first embodiment of the present invention, to a mounting board, and carries out electronic parts from the carrier tape.

6 is a sectional view of a portion taken along the line AA ′ in FIG.

FIG. 7 is a plan view of the mounting machine shown in FIGS. 5 and 6 as seen from above.

FIG. 8 is a plan view of an embossing tape which constitutes a carrier tape for electronic parts according to a second embodiment of the present invention and a cross-sectional view of a portion along the line AA ′ of this plan view.

9 is a perspective view of a reel in which the embossed tape of FIG. 8 is wound as a carrier tape for electronic parts.

FIG. 10 is a plan view of an embossing tape which constitutes a carrier tape for electronic parts according to a third embodiment of the present invention and a cross-sectional view of a portion along the line AA ′ of this plan view.

FIG. 11 is a schematic cross-sectional view of a mold for explaining the method for manufacturing the embossed tape used in the first to third embodiments of the present invention.

FIG. 12 is a plan view of an embossed tape that constitutes a conventional carrier tape.

FIG. 13 is a cross-sectional view of a conventional carrier tape containing electronic components.

[Explanation of symbols]

1, 25, 35, 101 ... Embossed tape, 2, 1
02 ... cover tape, 3, 26 ... reel,
4 ... Adhesive tape, 5, 105 ... Electronic components,
6, 106 ... Ball terminal, 7, 107 ... Resin sealing body, 8 ... Mark part, 9 ... Suction head, 10 ... Rail (tape pressing cover), 11, 2
1, 31, 110 ... Pockets, 12, 22, 32 ...
..Protrusions (ribs), 13, 23, 33, 109 ... Feed holes, 14, 24, 34, 111 ... Holes, 15.
..Tape feed claws, 16 ... Tape feed rollers.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Koji Koga             1st Komukai Toshiba-cho, Sachi-ku, Kawasaki-shi, Kanagawa             Ceremony Company Toshiba Microelectronics Sen             Inside F term (reference) 3E067 AA11 AB41 AC04 BA34A                       BB14A CA24 EE38 EE46                       FA01 FC01 GD10                 3E096 AA06 BA08 CA15 CC02 DA08                       DA23 EA02 FA15 FA20 GA01                 5E313 AA01 AA11 AA18 DD31 EE22

Claims (9)

[Claims] 1. An embossed tape having a plurality of pockets for accommodating electronic components formed therein, wherein at least one protrusion is formed in a region other than the region where the pockets are formed. Carrier tape for electronic parts. 2. The carrier tape for electronic parts according to claim 1, wherein a plurality of feed holes are formed along at least one of both sides of the embossed tape. 3. The carrier tape for electronic parts according to claim 2, wherein the protrusion is formed between the plurality of feed holes. 4. The carrier tape for electronic parts according to claim 2, wherein the protrusion is formed between the pocket and the plurality of feed holes. 5. The carrier tape for electronic parts according to claim 4, wherein the protrusion is formed in an elongated shape. 6. The carrier tape for electronic parts according to claim 1, wherein the protrusions are formed along both sides of the embossed tape. 7. The carrier tape for electronic parts according to claim 1, wherein a cover tape is laminated on the embossed tape so as to seal the pocket. 8. The carrier tape for electronic parts according to claim 7, wherein the embossed tape is wound on a reel. 9. A step of disposing a mounting board at a predetermined position, and a step of mounting a predetermined electronic component taken out from the carrier tape for electronic parts according to claim 8 at a predetermined position of the mounting board. A method for mounting an electronic component, comprising: