JP2007076713A - Carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrier tape capable of performing a precise and automatic position setting of electronic parts within a storing part and easily taking out the electronic parts. <P>SOLUTION: A carrier tape 10 has a storing part 13 storing electronic parts 50 with lead terminals 61 protruded from both end surfaces of a main body part 51 of the electronic parts. A position setting part 17 is provided for use in setting position with the main body 51 of the electronic parts stored in a storing part 15 mounted at a bottom part 15 of the storing part 13. Lead terminals 61 are bent to cause the electronic parts 50 to be surface mounted and the predetermined portion is applied as a surface mounted abutment part 65. In turn, the position setting part 17 is mounted at a predetermined height position from a bottom surface 15 of the storing part 13 to cause lead terminal storing part 21 storing the lead terminals 61 to be arranged on both sides of the position setting part 17. Two pairs of lateral shift preventing protrusions 25 are arranged on inner side surfaces 22, 23 of the storing part 13. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a carrier tape having a large number of storage units for storing electronic components such as fixed resistors.

  Conventionally, there is a carrier tape in which concave storage portions are formed continuously at equal intervals on a strip-shaped tape having flexibility, and electronic components such as fixed resistors are stored in the respective storage portions (for example, Patent Document 1). FIG. 3). The carrier tape has a covering tape for covering each storage portion attached thereto. This type of carrier tape is wound and stored and transported, for example, in a hoop shape, and when used, the covering tape is peeled off while pulling out the wound carrier tape, and the electronic components stored in each storage section are collected by a suction head. Take out one by one. The extracted electronic component is placed on a desired circuit board and surface-mounted on the circuit board by reflow or the like.

  FIG. 6 is a partially enlarged schematic sectional view of the carrier tape 500 in which the electronic component 530 is accommodated. As shown in the figure, the carrier tape 500 is formed by forming concave (substantially rectangular) storage portions 511 continuously at equal intervals on a strip-shaped tape 510 having flexibility, and in each storage portion 511. Each of the electronic components 530 such as a fixed resistor is accommodated, and a covering tape 550 is attached thereon. When the electronic component 530 is taken out as described above, the covering tape 550 is peeled off, and a suction head (not shown) is attached to the central portion of the upper surface of the columnar electronic component main body 531 of the electronic component 530 in the storage portion 511. The electronic component 530 is sucked by sucking the surface and pulled out from the storage portion 511.

However, since the electronic component 530 is stored in the storage portion 511 with a predetermined play, the electronic component 530 is positioned at an optimum position for suction in the storage portion 511 when the cover tape 550 is peeled off. In some cases, the electronic component 530 may rotate and the lead terminal 533 of the electronic component 500 may be sideways or upward, so that the electronic component 530 is sucked to the suction head. There were cases where it could not be done well. In particular, when the electronic component main body 531 has a cylindrical shape, the outer peripheral surface is curved, so that the suction cannot be performed well unless it is sucked at an accurate position. In order to solve this problem, for example, as shown in Patent Document 1, the position of the electronic component 530 in the storage unit 511 when the cover tape 550 is peeled is detected, and the suction head is controlled according to the position. A method is also conceivable. However, when configured in this manner, the apparatus becomes large, for example, a device for detecting the position of the electronic component 530 is required, and the cost of the electronic component mounting apparatus increases.
JP 2002-353893 A

  The present invention has been made in view of the above-described points, and an object of the present invention is to provide a carrier tape in which positioning of an electronic component in a storage unit is automatically performed with high accuracy and the electronic component can be easily taken out. .

  According to the first aspect of the present invention, there is provided a carrier tape having a storage portion for storing an electronic component having a structure in which lead terminals protrude from both end surfaces of the electronic component main body portion. The carrier tape is provided with a positioning portion for mounting and positioning the electronic component main body portion of the electronic component housed in the electronic tape.

  According to a second aspect of the present invention, the lead terminal of the electronic component is bent so as to surface mount the electronic component, and a predetermined portion thereof is used as a surface mounting contact portion, while the positioning portion is a bottom surface of the storage portion. 2. A carrier tape according to claim 1, wherein a lead terminal accommodating portion for accommodating a lead terminal of the bent electronic component is provided on both sides of the positioning portion by being installed at a predetermined height from the position. It is in.

  In the invention according to claim 3 of the present application, a lateral blur preventing projection that protrudes toward the outer peripheral surface of the electronic component main body placed on the positioning portion is provided on the inner surface of the storage portion. The carrier tape according to claim 1, wherein the carrier tape is provided.

  According to a fourth aspect of the present invention, in the carrier tape according to the third aspect, at least a pair of the lateral blur preventing protrusions are provided at positions facing the inner side surface of the storage portion. is there.

  According to the first aspect of the present invention, the positioning of the electronic component in the storage unit is automatically performed with high accuracy by the positioning unit. Thus, the electronic component can be easily taken out from the storage unit.

  According to the second aspect of the present invention, even if the lead terminal of the electronic component is bent so that the electronic component is surface-mounted, positioning can be performed without any problem by accommodating the lead terminal in the lead terminal accommodating portion. The electronic component can be positioned automatically and accurately by the unit.

  According to the third and fourth aspects of the present invention, since the lateral blur preventing protrusion is provided, the lateral blur of the electronic component main body can be prevented, and therefore, it is ensured that the electronic component rotates together with the lead terminal by the lateral blur. Can be prevented. This also makes it possible to position the electronic component in the storage portion automatically and accurately, and to easily take out the electronic component from the storage portion.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an enlarged exploded perspective view showing a main part of a carrier tape 10 according to an embodiment of the present invention, an electronic component 50 accommodated in the carrier tape 10 and a covering tape 100 covering the carrier tape 10. 2A is an enlarged plan view of a main part of the carrier tape 10, and FIG. 2B is a cross-sectional view taken along line AA in FIG. 2A. As shown in these drawings, the carrier tape 10 is formed with concave storage portions 13 formed at equal intervals in succession to the flexible strip-shaped synthetic resin film 11, and the width direction of the carrier tape 10 (FIG. 2 ( A feed hole 41 composed of a large number of circular through holes is formed at both ends in the vertical direction (a) in the longitudinal direction (left-right direction in FIG. 2A). In this embodiment, the storage portion 13 is formed by press molding using a mold, but may be formed by using various other methods such as pressure forming and vacuum forming. Further, in this embodiment, a polystyrene film is used as the material of the carrier tape 10, but other various synthetic resin films such as a polyethylene terephthalate film and a polypropylene film may be used.

  The storage portion 13 has a substantially rectangular shape, and its longitudinal direction faces the width direction of the carrier tape 10, whereby adjacent storage portions 13 are arranged in parallel (in parallel) toward the longitudinal direction of the carrier tape 10. I am doing so. A base 19 is provided at the center of the bottom 15 of the storage part 13, and a positioning part 17 is formed at the center of the upper surface of the base 19. The pedestal 19 is formed so as to protrude upward in a substantially rectangular shape from the bottom 15 so as to connect between a pair of opposed inner side surfaces 22, 23 facing the longitudinal direction of the storage portion 13. And the positioning part 17 is formed in the center of the upper surface of the base part 19 by the linear V-shaped groove | channel (recessed part) which goes to the longitudinal direction of the accommodating part 13. As shown in FIG. The shape of the positioning portion 17 is not limited to the V-shaped groove, and may be an arc shape, a rectangular shape, or other shape groove. In short, the electronic component main body 51 of the electronic component 50 described below is mounted at that position. Any shape / structure may be used as long as it can be positioned and positioned. The height of the base 19, that is, the height from the bottom 15 of the positioning portion 17 does not exceed the storage surface X (see FIG. 1) that is the upper surface of the carrier tape 10. Further, when the electronic component main body 51 of the electronic component 50 described below is placed on the positioning portion 17, the surface mounting contact portion 65 of the lead terminal 61 described below of the electronic component 50 is slightly separated from the bottom portion 15. It is formed at a height. As described above, the positioning portion 17 is installed at a predetermined height from the bottom surface 15 of the storage portion 13, so that the concave leads for storing the lead terminals 61 of the electronic components 50 described below on both sides of the positioning portion 17. A terminal storage portion 21 is provided. On the other hand, on the opposing portions on both sides of the positioning portion 17 of the pair of opposing inner side surfaces 22, 23, two pairs of sideways formed by semi-cylindrical protrusions extending in the vertical direction and projecting into the storage portion 13. Anti-shake projections 25 (four in total) are provided.

  Next, the covering tape 100 shown in FIG. 1 is composed of a strip-shaped flat plate-shaped synthetic resin film 101 having flexibility smaller in width than the carrier tape 10. As the material of the covering tape 100, a polystyrene film is used similarly to the carrier tape 10, but other various synthetic resin films having flexibility such as a polyethylene terephthalate film and a polypropylene film may be used.

  3A and 3B are diagrams showing the electronic component 50. FIG. 3A is a plan view, FIG. 3B is a front view, FIG. 3C is a right side view, and FIG. 3D is an electronic component main body. It is internal structure explanatory drawing of 51. FIG. As shown in FIGS. 1 and 3, the electronic component 50 is configured by projecting lead terminals 61 and 61 from both end surfaces of the electronic component main body 51 (both end surfaces perpendicular to the longitudinal direction of the electronic component main body 51). . In this embodiment, as shown in FIG. 3 (d), the electronic component main body 51 is coated with a metal oxide film 55 around a cylindrical ceramic insulating rod 53 to adjust the resistance value. The metal oxide film 55 is cut in a spiral shape to provide a cut groove 57, metal caps 59, 59 are attached to both ends of the insulating rod 53, and lead terminals made of a metal rod at the center of the outer surface of the metal caps 59, 59, respectively. One end of 61, 61 is fixed by spot welding or the like, and the entire insulating rod 53 including the metal caps 59, 59 is further covered with an insulating coating 63. The two lead terminals 61, 61 are bent at substantially right angles in the same direction in the radial direction of the columnar electronic component main body 51 by projecting both protruding portions 61a, 61a from both end faces of the electronic component main body 51. Are the first bent portions 61b, 61b, and further, the distal end portions of the first bent portions 61b, 61b are folded back to the lower sides of the first bent portions 61b, 61b, and the distal end portions thereof are second bent portions 61c, 61c, and the straight second bent portions 61c and 61c are surface mounting contact portions 65 and 65, respectively. The bending angle of the first bent portion 61b and the second bent portion 61c is approximately 30 °, and both the second bent portions 61c and 61c are parallel.

  FIG. 5 is a perspective view showing an example of mounting the electronic component 50 on the circuit board 80. As shown in the figure, surface mounting contact portions 65, 65 of the electronic component 50 are placed on a pair of circuit patterns 81, 81 provided on the circuit board 80, and the electronic component 50 is mounted by solder reflow or the like. Surface mounted on the circuit board 80. At this time, the electronic component main body 51 can be installed with a predetermined distance from the upper surface of the circuit board 80. Therefore, even if the electronic component 50 is a fixed resistor or the like that generates heat, it is attached to the circuit board 80 and the circuit board 80. There is no risk of destroying other various electronic components.

  In FIG. 1, the electronic component 50 is stored in the storage portion 13 of the carrier tape 10. 4 is a view showing a state in which the electronic component 50 is housed in the housing portion 13 of the carrier tape 10. FIG. 4 (a) is a plan view (however, the description of the covering tape 100 is omitted), and FIG. It is a schematic sectional side view. As shown in FIG. 4, the central part of the electronic component main body 51 is placed on the positioning part 17, and at the same time, both lead terminals 61 and 61 are housed in the lead terminal housing parts 21 and 21. At this time, as described above, the surface mounting contact portion 65 of the lead terminal 61 is separated from the bottom portion 15 of the lead terminal storage portion 21 by a predetermined dimension. At this time, the cylindrical electronic component main body 51 is located at a position facing the outer peripheral surface (outer peripheral side surface) of the portion where the metal cap 59 is located near both ends of the electronic component main body 51 through a predetermined narrow space. Is opposed to the lateral blur preventing projection 25 that prevents the carrier tape 10 from shifting in the longitudinal direction of the carrier tape 10.

  In other words, in this embodiment, the positioning part 17 is provided to place and position the electronic component main body 51 of the electronic component 50 accommodated in the accommodating part 13 on the bottom 15 of the accommodating part 13 of the carrier tape 10. The terminal 61 is bent so as to surface-mount the electronic component 50, and a predetermined portion thereof is used as a surface mounting contact portion 65, while the positioning portion 17 is installed at a predetermined height from the bottom surface 15 of the storage portion 13. Thus, the lead terminal accommodating portion 21 for accommodating the lead terminal 61 of the bent electronic component 50 is provided on both sides of the positioning portion 17, and two pairs are positioned at opposing positions of the inner side surfaces 22 and 23 of the accommodating portion 13. Protrusions 25 for preventing lateral blur that project toward the outer peripheral surface of the electronic component main body 51 placed on the portion 17 are provided.

  If the storage part 13 of the carrier tape 10 is configured as described above, as shown in FIG. 4, the electronic component main body 51 of the electronic component 50 is positioned by the positioning part 17 and is positioned at the center of the storage part 13. That is, at least when the carrier tape 10 is installed horizontally, even if the electronic component main body 51 is moved to a position other than the center of the storage unit 13, it always enters the positioning unit 17 by its own weight. Located in the center of the storage portion 13. That is, positioning of the electronic component 50 in the storage unit 13 is automatically performed with high accuracy. At this time, in this embodiment, since the surface mounting contact portion 65 of the lead terminal 61 is separated from the bottom portion 15 of the lead terminal storage portion 21 by a predetermined dimension as described above, the entire surface mounting contact portion 65 is the bottom portion. Therefore, the electronic component main body 51 is not prevented from automatically entering the positioning portion 17. Therefore, if the suction surface of the suction head is lowered to the central position B of the storage portion 13 with the covering tape 100 peeled off and the carrier tape 10 being leveled, the central portion of the electronic component main body 51 can always be suctioned accurately. An adsorption mistake can be prevented, and the electronic component 50 can be easily taken out without using a special device.

  Further, in this embodiment, as described above, the lateral blur preventing protrusion 25 protrudes toward the outer peripheral surface of the electronic component main body 51 and the gap between the two is made a predetermined narrow width. 51 does not greatly sway in the horizontal direction (C direction shown in FIG. 4A) perpendicular to the central axis direction of the electronic component main body 51. Therefore, the electronic component 50 does not rotate together with the lead terminals 61 due to lateral blurring (rotation about the straight line connecting both the lead terminals 61 of the electronic component 50 as the rotation center axis), and the lead terminals 61 face left and right or face up and down. Can be surely prevented. In other words, the positioning of the electronic component 50 in the storage unit 13 is automatically performed with high accuracy by the lateral blur preventing projection 25. Further, the lateral blur preventing projection 25 is constituted by a projection, and the position thereof is opposed to the outer peripheral surface of the portion where the metal cap 59 in the vicinity of both ends of the electronic component main body 51 is located. For this reason, the suction head (not shown) does not hinder the lowering of the suction head to the center of the upper surface of the electronic component main body 51 (the position of the point B in FIG. It does not interfere with the storage and removal of the lead terminal 61 from the storage unit 13.

  In the above-described embodiment, two pairs of protrusions 25 for preventing horizontal blur are provided at positions facing the inner side surfaces 22 and 23 of the storage unit 13, and these arrangement positions are optimum arrangement positions having the above-described effects. The present invention is not limited to this arrangement position. For example, as shown in FIG. 7A, a pair may be provided at the center of the inner side surfaces 22 and 23 of the storage portion 13. If the outer diameter of the suction head for sucking the electronic component 50 is small, this configuration may be used. Three or more pairs may be provided. Further, depending on circumstances, as shown in FIG. 7B, only one location may be provided at the center of one inner surface 23 of the storage portion 13. Further, as shown in FIGS. 7 (c) and 7 (d), a plurality of the inner side surfaces 22 and 23 of the storage portion 13 are alternately arranged at positions that do not face each other (one in each of the inner side surfaces 22 and 23 in FIG. 7 (c)). In FIG. 7 (d), various modifications are possible, such as providing two inner surfaces 22 and 23, but any number thereof. In short, at least one of the inner side surfaces 22 and 23 of the storage unit 13 protrudes toward the outer peripheral surface of the electronic component main body 51 stored in the storage unit 13 and prevents one or more horizontal blurs. What is necessary is just to provide the protrusion 25 for prevention. Even if these lateral blur preventing protrusions 25 are provided alone in the storage part 13 where the positioning part 17 is not provided, the lateral movement is prevented so that the electronic component 50 can be accurately positioned in the storage part 13. It has the effect of being done automatically.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, the electronic component main body 51 may have a rod shape other than a cylindrical shape, for example, a polygonal shape such as an octagonal shape. In the above embodiment, a fixed resistor in which a ceramic insulating rod is coated with a metal oxide film is shown as a fixed resistor. However, other fixed resistors may be used, and capacitors other than fixed resistors may be used. Or other electronic components such as a diode. In short, any electronic component having a structure in which lead terminals protrude from both end faces of the electronic component main body may be used. Further, the bent shape of the lead terminal 61 is not limited to the above embodiment, and various different bent shapes may be used. The predetermined part is used as a surface mounting contact portion, and any electronic component can be surface mounted by placing the pair of surface mounting contact portions on the circuit board. In that case, it is preferable that the electronic component main body is separated from the circuit board by a predetermined distance. In some cases, the lead terminal 61 may not be bent, and the lead terminal 61 protruding from both end faces of the electronic component main body 51 may be projected straight in the protruding direction. Moreover, although the shape of the accommodating part 13 was made into the substantially rectangular shape in the said embodiment, other various shapes may be sufficient. In the above embodiment, the feed holes 41 are provided at both ends of the carrier tape 10. However, the feed holes 41 may be provided only on one end side of the carrier tape 10.

FIG. 2 is an enlarged exploded perspective view of a main part showing a carrier tape 10, an electronic component 50, and a covering tape 100. 2A is an enlarged plan view of a main part of the carrier tape 10, and FIG. 2B is a cross-sectional view taken along line AA in FIG. 2A. 3A is a plan view, FIG. 3B is a front view, FIG. 3C is a right side view, and FIG. 3D is an internal view of the electronic component main body 51. It is structure explanatory drawing. FIGS. 4A and 4B are views showing a state in which the electronic component 50 is housed in the housing portion 13 of the carrier tape 10. FIG. 4A is a plan view (however, the cover tape 100 is omitted), and FIG. FIG. 4 is a perspective view showing an example of surface mounting the electronic component 50 on a circuit board 80. FIG. 2 is a partially enlarged schematic cross-sectional view of a carrier tape 500. FIG. It is a figure which shows other various embodiment of the protrusion 25 for horizontal blur prevention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Carrier tape 13 Storage part 15 Bottom part 17 Positioning part 19 Base part 21 Lead terminal storage part 22,23 Inner side surface 25 Side | surface blur prevention protrusion 50 Electronic component 51 Electronic component main body part 61 Lead terminal 65 Surface mounting contact part 100 Covering tape

Claims (4)

In a carrier tape having a storage portion for storing an electronic component having a structure in which a lead terminal protrudes from both end surfaces of the electronic component main body,
A carrier tape, wherein a positioning portion for placing and positioning an electronic component main body portion of the electronic component housed in the housing portion is provided at a bottom portion of the housing portion. The lead terminal of the electronic component is bent so as to surface mount the electronic component, and a predetermined portion thereof is used as a surface mounting contact portion,
On the other hand, the positioning portion is installed at a predetermined height from the bottom surface of the storage portion, so that a lead terminal storage portion for storing the lead terminal of the bent electronic component is provided on both sides of the positioning portion. The carrier tape according to claim 1.   3. A lateral blur preventing protrusion that protrudes toward an outer peripheral surface of an electronic component main body placed on the positioning part is provided on an inner surface of the storage part. The carrier tape described in 1.   The carrier tape according to claim 3, wherein at least one pair of the lateral blur prevention protrusions is provided at a position facing the inner side surface of the storage portion.

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