JP2007081238A - Surface mount type electronic component and its carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface mount type electronic component with lead terminals which can be easily surface-mounted on a circuit board and whose surface mount area can be reduced simultaneously, and its carrier tape. <P>SOLUTION: A pair of lead terminals 21 are projected from both end faces of an electronic component main body part 11. The respective lead terminals 21 are projected from the end faces of the electronic component main body part 11, then bent in the direction of the electronic component main body part 11 opposite to the projecting direction and put along the outer peripheral side face 111 of the electronic component main body part 11 with a prescribed interval L1 between both lead terminals 21. Respective parts along the outer peripheral side face 111 are turned to abutting parts 25 for surface mount. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component having a lead terminal and a surface-mountable electronic component that can be surface-mounted, and a carrier tape suitable for housing the surface-mounted electronic component.

  Conventionally, when an electronic component with a lead terminal having a structure in which the lead terminal protrudes from both end surfaces of the electronic component main body is mounted on a circuit board, the lead terminal of the electronic component is inserted into a hole provided in the circuit board. The method of inserting and soldering this was common. On the other hand, in recent years, it has been demanded that the electronic components with lead terminals can be directly surface mounted on the circuit board, instead of providing holes in the circuit board. As a method for surface mounting an electronic component with a lead terminal, a method of bending the lead terminal so that the electronic component main body can stand independently is considered.

  However, this type of conventional surface mount electronic component with a lead terminal has a structure in which the lead terminal protrudes from both ends of the electronic component main body. Therefore, when this is surface mounted on a circuit board, the lead terminal is placed. The land portion (a part of the circuit pattern) of the circuit board that protrudes from the both ends of the electronic component body is located on the outside of the electronic component body, so that the installation area of the surface mount type electronic component on the circuit board increases. There is a problem that electronic components to be surface-mounted cannot be integrated.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a surface-mounting type in which a surface-mounting electronic component with a lead terminal can be easily surface-mounted on a circuit board and the surface mounting area can be reduced at the same time. It is to provide an electronic component and its carrier tape.

  The invention according to claim 1 is a surface-mount type electronic component in which a pair of lead terminals protrudes from both end faces of the electronic component main body and a surface mounting contact portion is formed on the lead terminal. Is protruded from the end surface of the electronic component main body portion and then bent in the direction of the electronic component main body portion opposite to the protruding direction thereof, along the outer peripheral side surface of the electronic component main body portion. A surface mounting type electronic component is characterized by being a mounting contact portion.

  The invention according to claim 2 of the present application is characterized in that the surface mounting contact portion of each lead terminal is bent in the protruding direction along the outer peripheral side surface of the electronic component main body portion. The surface-mount type electronic component according to claim 1.

  Invention of Claim 3 of this application is a carrier tape which has a storage part which stores the surface mounting type electronic component of Claim 1 or 2, Comprising: It accommodated in this storage part in the bottom part of the said storage part. A positioning part for placing and positioning the electronic component main body of the electronic component is provided, and the lead is provided around the positioning part by installing the positioning part at a predetermined height from the bottom surface of the storage part. A carrier tape is provided with a lead terminal accommodating portion for accommodating a surface mounting contact portion of a terminal.

  According to the first and second aspects of the present invention, since both lead terminal portions along the outer peripheral side surface of the electronic component main body portion are the surface mounting contact portions, the lead terminals are formed by the surface mounting contact portions. The surface mount electronic component with a surface can be easily surface mounted on a circuit board. At the same time, the surface mounting contact portion is located at a position along the outer peripheral side surface of the electronic component main body portion. When this surface mounting type electronic component is placed on the circuit board, these surface mounting contact portions become the electronic component main body. It is located directly under the part (or near the outer peripheral side surface of the electronic component main body close to the bottom), and can occupy a small area on the circuit board of the surface mount type electronic component, and is a surface mount type electronic component having a lead terminal. Even if it exists, the surface mounting area can be reduced.

  According to the carrier tape of claim 3, even a surface mount electronic component having a bent lead terminal can be easily stored, and the surface mount electronic component can be easily positioned in the storage portion. be able to.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a view showing a surface-mount type electronic component 10-1 according to the first embodiment of the present invention. FIG. 1 (a) is a front view, FIG. 1 (b) is a bottom view, and FIG. FIG. 1D is a right side view, FIG. 1D is an explanatory diagram of the internal structure of the electronic component body 11, and FIG. As shown in the figure, the surface-mounted electronic component 10-1 is a surface-mounted fixed resistor, and a pair of terminals is formed from both end surfaces of the electronic component main body 11 (both end surfaces perpendicular to the longitudinal direction of the electronic component main body 11). The lead terminals 21 and 21 are configured to protrude. In this embodiment, as shown in FIG. 1 (d), the electronic component main body 11 is coated with a metal oxide film 15 around a cylindrical (rod-shaped) ceramic insulating rod 13 to adjust the resistance value. The metal oxide film 15 is cut in a spiral shape to form a cut groove 17, and bottomed cylindrical metal caps 19 and 19 are attached to both ends of the insulating rod 13, respectively. One end of a lead terminal 21, 21 made of a metal rod is fixed by spot welding or the like, and the entire insulating rod 13 including the metal caps 19, 19 is insulated and coated with an insulating paint 23. The pair of lead terminals 21 and 21 project from the both end surfaces of the electronic component main body 11 and then bend in the direction of the electronic component main body 11 opposite to the projecting direction. L1 is provided along the outer peripheral side surface 111 of the electronic component main body 11. Linear portions along the outer peripheral side surface 111 of the electronic component main body 11 are used as surface mounting contact portions 25, 25, and both the double-side mounting contact portions 25, 25 are both outer peripheral side surfaces of the electronic component main body portion 11. It is parallel to the longitudinal direction of 111. That is, both the lead terminals 21 and 21 are bent in a J shape.

  As shown in FIG. 2, the surface mount electronic component 10-1 is placed on a circuit board 40, and on that occasion, the surface mount type electronic component 10-1 is mounted on the pair of land portions 41, 41 provided on the circuit board 40. The contact portions 25, 25 are placed. For example, the surface mounting contact portions 25 and 25 are electrically and mechanically fixed to the land portions 41 and 41 by reflowing solder cream previously printed on the land portions 41 and 41. At this time, in this embodiment, since the electronic component main body 11 is installed with a predetermined distance from the upper surface of the circuit board 40, the surface-mounted electronic component 10-1 is a fixed resistor or the like that generates heat. However, there is no possibility that the circuit board 40 and other various electronic components attached thereto are destroyed. In the case of this surface-mounted electronic component 10-1, the surface-mounting contact parts 25, 25 are located at positions along the outer peripheral side surface 111 of the electronic component main body 11, so that the surface-mounted electronic component 10-1 is When mounted on the circuit board 40, these surface mounting contact portions 25, 25 are positioned directly below the electronic component main body 11 (or near the outer peripheral side surface 111 of the electronic component main body 11 close to the direct bottom). Accordingly, the land portions 41, 41 can also be positioned directly below the electronic component main body portion 11, and the area occupied on the circuit board 40 of the split surface mounting type electronic component 10-1 can be reduced. Even the surface-mount type electronic component 10-1 having 21 can reduce the installation area. In this embodiment, the lengths of the double-sided mounting contact portions 25 and 25 are the same, but the lengths may be varied depending on the case.

  FIG. 3 is an explanatory view of a bending method of the lead terminal 21. That is, the lead terminal 21 is bent by preparing a surface mount type electronic component 10-1 in which the lead terminals 21 and 21 are linearly projected from both end surfaces of the electronic component main body 11 as shown in FIG. 21 and 21 can be easily performed by folding back the portions (folded portions) protruding from both end faces of the electronic component main body 11 by 180 ° so that they are directed obliquely downward toward the electronic component main body 11 and parallel to each other. .

  FIG. 4 is an enlarged exploded perspective view of a main part showing the surface-mount type electronic component 10-1 and the carrier tape 60 and the covering tape 80 for housing the same. Here, the carrier tape refers to a tape in which concave storage portions are formed continuously at equal intervals on a flexible strip-shaped tape, and electronic components such as fixed resistors are stored in the respective storage portions. That is, as shown in FIG. 4, the carrier tape 60 is continuous with a flexible strip-shaped synthetic resin film 61 (only one is shown in FIG. 4) to form a concave storage portion 63. Feed holes 71 made up of a large number of circular through holes are formed at both ends in the width direction in the longitudinal direction. In this embodiment, the storage portion 63 is formed by press molding using a mold, but may be formed by using various other methods such as pressure forming or vacuum forming. In this embodiment, a polystyrene film is used as the material of the carrier tape 60, but other various synthetic resin films such as a polyethylene terephthalate film and a polypropylene film may be used.

  The storage part 63 has a substantially rectangular shape, and its longitudinal direction faces the width direction of the carrier tape 60, whereby adjacent storage parts 63 are arranged in parallel (parallel) toward the longitudinal direction of the majority carrier tape 60. I am doing so. A base 69 is provided at the center of the bottom 65 of the storage part 63, and a positioning part 67 is formed at the center of the upper surface of the base 69. The pedestal 69 is formed to protrude in a substantially rectangular shape upward from the bottom 65 so as to face the longitudinal direction of the storage portion 63. The longitudinal direction of the base portion 69 and the longitudinal direction of the storage portion 63 coincide with each other. The positioning portion 67 is formed by a linear V-shaped groove (concave portion) extending in the longitudinal direction of the storage portion 63 at the center of the upper surface of the base portion 69. The shape of the positioning portion 67 is not limited to the V-shaped groove, and may be an arc shape, a rectangular shape, or other shape groove. In short, the electronic component main body 11 of the surface mount electronic component 10-1 is mounted. Any shape / structure may be used as long as it can be positioned and positioned. The height of the pedestal 69, that is, the height from the bottom 65 of the positioning portion 67 is within the range that does not exceed the storage surface X that is the upper surface of the carrier tape 60. When the electronic component main body 11 is placed on the positioning portion 67, the surface mounting contact portion 25 of the lead terminal 21 of the surface mounting type electronic component 10-1 is formed at a height slightly away from the bottom portion 65. As described above, the positioning portion 67 is installed at a predetermined height from the bottom portion 65 of the storage portion 63, so that the surface mount type electronic device is provided around the positioning portion 67 (on both sides in the short direction of the storage portion 63). A concave lead terminal accommodating portion 72 for accommodating the lead terminal 21 of the component 10-1 is provided.

  Next, the covering tape 80 is constituted by a belt-like flat plate-shaped synthetic resin film 81 having flexibility with a width smaller than that of the carrier tape 60. As the material of the covering tape 80, a polystyrene film is used as in the case of the carrier tape 60, but various other synthetic resin films having flexibility such as a polyethylene terephthalate film and a polypropylene film may be used.

  FIG. 5 is a view showing a state in which the surface mount type electronic component 10-1 is housed in the housing portion 63 of the carrier tape 60. FIG. 5A is a plan view (however, the cover tape 80 is omitted), FIG. 5 (b) is a schematic sectional side view. As shown in FIG. 5, the electronic component main body 11 housed in the housing part 63 is placed on the positioning part 67. At the same time, the surface mounting contact parts 25, 25 of both the lead terminals 21, 21 are stored in the lead terminal. Housed in the sections 72, 72. At this time, as described above, the surface mounting contact portion 25 of the lead terminal 21 is separated from the bottom portion 65 of the lead terminal storage portion 72 (that is, the storage portion 63) by a predetermined dimension. Further, the surface mounting contact parts 25 of both lead terminals 21 and 21 come into contact with or approach both side surfaces 691 and 691 facing the longitudinal direction of the pedestal 69 so that the surface mount type electronic components housed in the housing part 63 are obtained. The rotation of 10-1 (rotation with the central axis of the surface mount electronic component 10-1 as the rotation central axis) is prevented.

  That is, in this embodiment, a positioning portion 67 is provided on the bottom portion 65 of the storage portion 63 to place and position the electronic component main body 11 of the surface mount electronic component 10-1 stored in the storage portion 63, and By installing the positioning portion 67 at a predetermined height from the bottom 65 of the storage portion 63, a lead terminal storage portion 72 for storing the surface mounting contact portion 25 of the lead terminal 21 is provided around the positioning portion 67. ing.

  If the storage portion 63 of the carrier tape 60 is configured as described above, as shown in FIG. 5, the surface-mount type electronic component 10-1 is positioned by the positioning portion 67 so that the electronic component main body portion 11 is positioned in the storage portion 63. Located in the center. That is, at least when the carrier tape 60 is installed horizontally, even if the electronic component main body 11 is moved to a position other than the center of the storage unit 63, the surface mount type electronic component 10-1 is always moved to the positioning unit 67 by its own weight. It automatically enters and is located at the center of the storage unit 63. That is, positioning of the surface mount electronic component 10-1 in the storage unit 63 is automatically performed with high accuracy. At this time, in this embodiment, since the surface mounting contact portion 25 of the lead terminal 21 is separated from the bottom portion 75 of the lead terminal storage portion 72 by a predetermined dimension as described above, the entire surface mounting contact portion 25 is the bottom portion. The electronic component main body 11 is not prevented from automatically entering the positioning portion 67 by coming into contact with 65. Therefore, if the suction surface of the suction head is lowered to the central position B of the storage portion 63 in a state where the covering tape 80 is peeled off and the carrier tape 60 is leveled, the central portion of the electronic component main body 11 can always be suctioned accurately. Adsorption mistakes can be prevented, and the surface mount electronic component 10-1 can be easily taken out without using a special device. In this embodiment, as described above, the surface mounting contact portions 25 and 25 of the lead terminals 21 and 21 contact or approach both side surfaces 691 and 691 of the pedestal 69 so that the surface mount type electronic The rotation of the component 10-1 can be reliably prevented. That is, the surface mounting type electronic component 10-1 is automatically positioned with high accuracy in the storage portion 63 also by the surface mounting contact portion 25 and the both side surfaces 691.

[Second Embodiment]
6A and 6B are diagrams showing a surface-mounted electronic component 10-2 according to the second embodiment of the present invention. FIG. 6A is a front view, FIG. 6B is a bottom view, and FIG. The right side view and FIG. 6D are explanatory diagrams of the internal structure of the electronic component main body 11. FIG. 7 is a perspective view of a state in which the surface mount electronic component 10-2 is placed on the circuit board 40. FIG. In the surface-mounted electronic component 10-2 shown in both drawings, the same or corresponding parts as those of the surface-mounted electronic component 10-1 shown in FIGS. Note that matters other than those described below are the same as those in the embodiment shown in FIGS. The surface mount electronic component 10-2 shown in FIGS. 1 and 2 is different from the surface mount electronic component 10-1 only in the bent shape of the lead terminals 21 and 21. That is, also in this surface-mount type electronic component 10-2, a pair of lead terminals 21 and 21 protrude from both end surfaces of the electronic component main body 11, and the electronic component main body 11 has a cylindrical (bar-shaped) ceramic insulation. A metal oxide film 15 is coated around the rod 13, the metal oxide film 15 is cut in a spiral shape to form a cut groove 17, and metal caps 19, 19 are attached to both ends of the insulating rod 13. One end of each lead terminal 21, 21 made of a metal rod is fixed to the center of the outer surface 19 by spot welding or the like, and the entire insulating rod 13 including the metal caps 19, 19 is insulated and coated with an insulating paint 23. Yes.

  The pair of lead terminals 21, 21 according to this embodiment protrudes from both end surfaces of the electronic component main body 11, and then bends in the direction of the electronic component main body 11 opposite to the protruding direction. Along the outer peripheral side surface of the electronic component main body 11 with a predetermined interval L1 (straight line portion 21a), the tip side portion is bent in the protruding direction along the outer peripheral side surface of the electronic component main body portion 11. (Curved part 21b and straight part 21c on the tip side thereof). The curved portion 21b is U-shaped in this embodiment, but may be other various bent shapes such as a V-shape. Both linear portions 21c also have a distance L1. The double-sided mounting contact portions 25, 25 formed by the straight portion 21a, the curved portion 21b, and the straight portion 21c of the lead terminal 21 are bent so that all of them are located on the same plane. The bending direction of the curved portions 21b of the lead terminals 21 and 21 is opposite. Both the straight portions 21a and the straight portions 21c are parallel to each other. The lead terminal 21 according to this embodiment is bent by once bending the lead terminal 21 that protrudes linearly from the end face of the electronic component main body 11 as in the first embodiment, and then bending the tip side portion again. It ’s easy.

  Then, the surface-mount type electronic component 10-2 is placed on the circuit board 40 as shown in FIG. 7, and on that occasion, the surface mount type electronic component 10-2 is placed on the pair of land portions 41, 41 provided on the circuit board 40, respectively. The contact portions 25, 25 are placed on the land portions 41, 41 by reflowing solder cream previously printed on the land portions 41, 41. Fixed and surface mounted. In that case, the same operations and effects as those of the first embodiment described with reference to FIG. 2 occur. Also in this embodiment, the length of the double-sided mounting contact portions 25, 25 may be varied depending on the case.

  FIG. 8 is an enlarged exploded perspective view of a main part showing the surface-mount type electronic component 10-2, the carrier tape 60-2 for housing it, and the cover tape 80-2. Also in this carrier tape 60-2, the same parts as those of the carrier tape 60 are denoted by the same reference numerals, and the matters other than those described below are the same as those of the carrier tape 60. As shown in FIG. 8, also in the carrier tape 60-2, concave storage portions 63 are formed at regular intervals continuously to the flexible synthetic resin film 61 having flexibility, and the width direction of the carrier tape 60-2. The feed holes 71 made up of a number of circular through-holes are formed at both end portions of the plate in the longitudinal direction. The storage part 63 is also substantially rectangular like the first embodiment, and its longitudinal direction faces the width direction of the carrier tape 60-2, and a base part 69 is provided at the center of the bottom 65 of the storage part 63. Yes. A positioning portion 67 is also formed at the center of the upper surface of the pedestal 69 in this embodiment. However, in the case of this pedestal 69, it is formed so as to protrude upward in a substantially rectangular shape from the bottom 65 so as to connect between a pair of opposed inner side surfaces 62, 64 facing the longitudinal direction of the storage portion 63. The positioning portion 67 is formed by a linear V-shaped groove (concave portion) extending in the longitudinal direction of the storage portion 63 at the center of the upper surface of the base portion 69. As in the first embodiment, the shape of the positioning portion 67 is not limited to the V-shaped groove. Moreover, the height of the base part 69, ie, the height from the bottom part 65 of the positioning part 67, is also installed on the same conditions as 1st Embodiment. Then, as described above, the positioning portion 67 is installed at a predetermined height from the bottom surface 65 of the storage portion 63, so that the surface mounting type is provided around the positioning portion 67 (front and rear in the longitudinal direction of the storage portion 63). Recessed lead terminal accommodating portions 72, 72 for accommodating the lead terminals 21, 21 of the electronic component 10-2 are provided. Furthermore, in the case of this embodiment, the semi-cylindrical protrusions that extend in the vertical direction and protrude toward the inside of the storage portion 63 at the opposing portions on the front and rear sides of the positioning portion 67 of the pair of opposing inner side surfaces 62 and 64. Two pairs of horizontal blur preventing protrusions 75 (total of four) are provided. The covering tape 80-2 is the same as the covering tape 80 of the first embodiment.

  FIG. 9 is a view showing a state in which the surface mounting type electronic component 10-2 is housed in the housing portion 63 of the carrier tape 60-2. FIG. 9A is a plan view (however, the cover tape 80-2 is shown). (Omitted) and FIG.9 (b) are schematic sectional side views. As shown in the figure, the electronic component main body 11 has its central portion placed on the positioning portion 67, and at the same time, both lead terminals 21 and 21 are accommodated in the lead terminal accommodating portions 72 and 72. At this time, the surface mounting contact portion 25 of the lead terminal 21 is separated from the bottom portion 65 of the lead terminal storage portion 72 by a predetermined dimension. Further, at this time, the lateral blur preventing protrusion 75 is opposed to the outer peripheral surface (outer peripheral side surface) of the portion where the metal cap 19 is located near both ends of the electronic component main body 11 through a predetermined narrow space. Thus, the columnar electronic component main body 11 is prevented from shifting in the longitudinal direction of the carrier tape 60-2 in the storage portion 63.

  That is, in this embodiment, a positioning portion 67 is provided on the bottom portion 65 of the storage portion 63 to place and position the electronic component main body portion 11 of the surface mount type electronic component 10-2 stored in the storage portion 63. By installing the positioning portion 67 at a predetermined height from the bottom 65 of the storage portion 63, a lead terminal storage portion 72 for storing the surface mounting contact portion 25 of the lead terminal 21 is provided around the positioning portion 67. In addition, two pairs of lateral blur preventing projections 75 projecting toward the outer peripheral surface of the electronic component main body 11 placed on the positioning unit 67 are provided at positions facing the inner side surfaces 62 and 64 of the storage unit 63. Yes.

  If the storage part 63 of the carrier tape 60-2 is configured as described above, the electronic component main body 11 of the surface mount electronic component 10-2 is positioned by the positioning part 67 as shown in FIG. Located in the center of. In other words, at least when the carrier tape 60-2 is installed horizontally, even if the electronic component main body 11 is moved to a position other than the center of the storage portion 63, the positioning portion is surely set by the weight of the surface mount electronic component 10-2. 67 automatically enters the center of the storage unit 63. That is, positioning of the surface mount electronic component 10-2 in the storage unit 63 is automatically performed with high accuracy. At this time, also in this embodiment, since the surface mounting contact portion 25 of the lead terminal 21 is separated from the bottom portion 65 of the lead terminal storage portion 72 by a predetermined dimension as described above, the entire surface mounting contact portion 25 is the bottom portion. The electronic component main body 11 is not prevented from automatically entering the positioning portion 67 by coming into contact with 65. Therefore, if the suction surface of the suction head is lowered to the central position B of the storage portion 63 in a state where the covering tape 80-2 is peeled off and the carrier tape 60-2 is leveled, the central portion of the electronic component main body portion 11 is always accurately positioned. Suction can be prevented and mistakes in the suction can be prevented, and the surface-mounted electronic component 10-2 can be easily taken out without using a special device or the like.

  Further, in this embodiment, as described above, the lateral blur preventing protrusion 75 protrudes toward the outer peripheral surface of the electronic component main body 11, and the gap between the two is made a predetermined narrow width. 11 does not greatly sway in the horizontal direction (C direction shown in FIG. 9A) perpendicular to the central axis direction of the electronic component main body 11. Therefore, the surface mounting type electronic component 10-2 does not rotate together with the lead terminal 21 due to lateral blur (rotation with the central axis of the surface mounting type electronic component 10-2 as the rotation center axis), and the lead terminal 21 faces left and right. It can be reliably prevented from going up and down. In other words, the surface-mount type electronic component 10-2 is automatically and accurately positioned in the storage portion 63 by the lateral blur prevention protrusion 75. Further, the lateral blur preventing projection 75 is formed of a projection, and the position thereof is a position facing the outer peripheral surface of the portion where the metal caps 19 near both ends of the electronic component main body 11 are located. -2 is not obstructed when a suction head (not shown) is lowered to the center of the upper surface of the electronic component main body 11 (position B in FIG. 9A). In the above-described embodiment, two pairs of lateral blur preventing projections 75 are provided at positions facing the inner side surfaces 72 and 74 of the storage portion 63, and these arrangement positions are the optimum arrangement positions having the above-described effects. The present invention is not limited to this arrangement position, and for example, a pair may be provided at the center of the inner side surfaces 72 and 74 of the storage portion 63. If the outer diameter of the suction head that sucks the surface-mounted electronic component 10-2 is small, it may be configured in this way. Three or more pairs may be provided. Furthermore, depending on circumstances, only one location may be provided at the center of one inner side surface 74 of the storage unit 63, or may be provided alternately at positions where the inner side surfaces 72 and 74 of the storage unit 63 do not face each other. It can be changed. In short, at least one of the inner surfaces 72 and 74 of the storage unit 63 protrudes toward the outer peripheral surface of the electronic component main body 11 stored in the storage unit 63 and prevents one or more horizontal blurs. What is necessary is just to provide the protrusion 75 for prevention. Even if these lateral blur prevention protrusions 75 are provided alone in the storage portion 63 where the positioning portion 67 is not provided, the surface mounting type electronic component 10-2 in the storage portion 63 is prevented by preventing the lateral blur. The positioning can be performed automatically with high accuracy.

[Third Embodiment]
FIG. 10 is a view showing a surface-mount type electronic component 10-3 according to the third embodiment of the present invention. FIG. 10 (a) is a front view, FIG. 10 (b) is a bottom view, and FIG. It is a right view. In the surface-mounted electronic component 10-3 shown in the figure, the same or corresponding parts as those of the surface-mounted electronic component 10-2 shown in FIG. Items other than those described below are the same as those in the embodiment shown in FIGS. The surface mount electronic component 10-3 shown in FIG. 10 is different from the surface mount electronic component 10-2 only in the bent shape (bending direction) of the lead terminals 21 and 21. That is, the pair of lead terminals 21 and 21 applied to the surface-mount type electronic component 10-3 protrude from both end surfaces of the electronic component main body 11, and then bend in the direction of the electronic component main body 11 opposite to the protruding direction. Along the outer peripheral side surface of the electronic component main body 11 (straight line portion 21 a), the two straight line portions 21 a are positioned on the same straight line, and the front end side portion extends along the outer peripheral side surface of the electronic component main body portion 11. Then, it is bent in the protruding direction (curved portion 21b and the straight portion 21c at the tip thereof), and at this time, both the straight portions 21c are positioned on the same straight line. The double-sided mounting contact portions 25, 25 formed by the straight portion 21a, the curved portion 21b, and the straight portion 21c of the lead terminal 21 are bent so that all of them are located on the same plane. Further, the bending directions of the curved portions 21b of the lead terminals 21 and 21 are the same. Both the straight portions 21a and the straight portions 21c are parallel to each other. That is, the difference between the surface-mounted electronic component 10-3 and the surface-mounted electronic component 10-2 is that the lead terminals 21 and 21 are point symmetric when viewed from the back side (second embodiment). It is only a point whether it is left-right symmetric (3rd Embodiment). The curved portion 21b is U-shaped in this embodiment, but may be other various bent shapes such as a V-shape. Even if comprised in this way, there exists an effect similar to the said 2nd Embodiment. Note that the same carrier tape 60-2 as that used in the second embodiment can be used as the carrier tape for housing the surface-mounted electronic component 10-3.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, the electronic component main body 11 may have a rod shape other than a cylindrical shape, for example, a polygonal shape such as an octagonal shape. In the above embodiment, a fixed resistor in which a ceramic insulating rod is coated with a metal oxide film is shown as a fixed resistor. However, other fixed resistors may be used, and capacitors other than fixed resistors may be used. Or other electronic components such as a diode. In short, any function can be used as long as it is a surface mount type electronic component having a structure in which a pair of lead terminals protrudes from both end surfaces of the electronic component main body and a surface mounting contact portion is formed on the lead terminals. There may be. The surface-mount type electronic component may be any surface-mountable electronic component as long as it can be surface-mounted by placing the pair of surface-mounting contact portions on the circuit board. In this case, the electronic component main body is separated from the circuit board by a predetermined distance. It is preferable. Moreover, although the shape of the storage part 63 is substantially rectangular in the above embodiment, other various shapes may be used. In the above embodiment, the feed holes 71 are provided at both ends of the carrier tape 60, but the feed holes 71 may be provided only at one end side of the carrier tape 60.

FIGS. 1A and 1B are diagrams illustrating a surface-mount type electronic component 10-1, in which FIG. 1A is a front view, FIG. 1B is a bottom view, FIG. 1C is a right side view, and FIG. The internal structure explanatory drawing of the main-body part 11 and FIG.1 (e) are perspective views. 1 is a perspective view showing a surface mount electronic component 10-1 placed on a circuit board 40. FIG. FIG. 10 is an explanatory diagram of a bending method of the lead terminal 21. FIG. 2 is an enlarged exploded perspective view of a main part showing a surface-mount type electronic component 10-1 and a carrier tape 60 and a cover tape 80 for housing the same. FIGS. 5A and 5B are views showing a state in which the surface mount type electronic component 10-1 is housed in the carrier tape 60, FIG. 5A is a plan view (however, description of the cover tape 80 is omitted), and FIG. FIG. FIGS. 6A and 6B are diagrams illustrating a surface-mount type electronic component 10-2, in which FIG. 6A is a front view, FIG. 6B is a bottom view, FIG. 6C is a right side view, and FIG. 3 is an explanatory diagram of an internal structure of a main body portion 11. FIG. 3 is a perspective view of a state where the surface mount electronic component 10-2 is placed on the circuit board 40. It is a principal part expansion disassembled perspective view which shows the surface mount type electronic component 10-2, the carrier tape 60-2 which accommodates this, and the cover tape 80-2. It is a figure which shows the state which accommodated the surface mount type electronic component 10-2 in the carrier tape 60-2, Fig.9 (a) is a top view (however, description of the covering tape 80 is abbreviate | omitted), FIG.9 (b) is schematic. It is a sectional side view. FIGS. 10A and 10B are diagrams showing a surface-mounted electronic component 10-3, in which FIG. 10A is a front view, FIG. 10B is a bottom view, and FIG. 10C is a right side view.

Explanation of symbols

10-1 Surface Mount Type Electronic Component 11 Electronic Component Main Body 111 Outer Side 19 Metal Cap 21 Lead Terminal L1 Predetermined Spacing 23 Insulating Paint 25 Surface Mount Contact 40 Circuit Board 60 Carrier Tape 61 Synthetic Resin Film 63 Storage 65 Bottom portion 67 Positioning portion 69 Base portion 72 Lead terminal housing portion 80 Cover tape 10-2 Surface mount type electronic component 60-2 Carrier tape 75 Protrusion 80-2 for preventing lateral blur Cover tape 10-3 Surface mount type electronic component

Claims (3)

In a surface mount type electronic component that protrudes a pair of lead terminals from both end faces of the electronic component main body, and in which a contact portion for surface mounting is formed on this lead terminal,
Each lead terminal protrudes from the end surface of the electronic component main body portion and then bends in the direction of the electronic component main body portion opposite to the protruding direction, along the outer peripheral side surface of the electronic component main body portion. A surface-mount type electronic component, wherein the portion is the surface-mount contact portion.   2. The surface mounting according to claim 1, wherein the surface mounting contact portion of each lead terminal is bent in the protruding direction along the outer peripheral side surface of the electronic component main body portion. Type electronic components. A carrier tape having a storage portion for storing the surface-mount type electronic component according to claim 1,
A positioning part for placing and positioning the electronic component main body part of the electronic component stored in the storage part is provided at the bottom of the storage part,
Further, the positioning portion is installed at a predetermined height from the bottom surface of the storage portion, and a lead terminal storage portion is provided around the positioning portion to store the surface mounting contact portion of the lead terminal. And carrier tape.

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