JP5030707B2 - Connecting terminal - Google Patents
Connecting terminal Download PDFInfo
- Publication number
- JP5030707B2 JP5030707B2 JP2007222891A JP2007222891A JP5030707B2 JP 5030707 B2 JP5030707 B2 JP 5030707B2 JP 2007222891 A JP2007222891 A JP 2007222891A JP 2007222891 A JP2007222891 A JP 2007222891A JP 5030707 B2 JP5030707 B2 JP 5030707B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- substrate
- connection terminal
- legs
- upper substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Description
本発明は、接続端子に関するものであり、特に基板間の接続に用いる接続端子に関するものである。 The present invention relates to a connection terminal, and more particularly to a connection terminal used for connection between substrates.
特許文献１には、基板に挿嵌実装される接続端子が基板用端子の接続構造として開示されている。特許文献１の図２に示されているように保持部材１３と、４脚から成るバスバー１４と、基板用端子１５とを備える。基板用端子１５は、バスバー１４に設けられているスリット１６に係合されており、該スリット１６の周囲には、４脚が設けられている。 Patent Document 1 discloses a connection terminal that is inserted and mounted on a substrate as a connection structure for a substrate terminal. As shown in FIG. 2 of Patent Document 1, a holding member 13, a bus bar 14 including four legs, and a board terminal 15 are provided. The board terminal 15 is engaged with a slit 16 provided in the bus bar 14, and four legs are provided around the slit 16.
このスリット１６の周囲に設けた４脚によってバスバー１４は、自立することができる。ところで基板用端子１５の脚は、基板に設けた孔に挿嵌されて系止される。基板の孔に挿嵌される脚が安定して保持されるように、脚の周囲を取り巻くように保持部１３が装着されている。 The bus bar 14 can stand on its own by four legs provided around the slit 16. By the way, the leg of the board terminal 15 is inserted into a hole provided in the board and stopped. The holding part 13 is mounted so as to surround the periphery of the leg so that the leg inserted into the hole of the board is stably held.
前記したように基板に挿嵌実装された基板用端子１５には、差込部１５ａが設けられており、該差込部１５ａに例えばヒューズなどの電気部品が挟持される。 As described above, the board terminal 15 inserted and mounted on the board is provided with the insertion portion 15a, and an electrical component such as a fuse is sandwiched between the insertion portion 15a.
また、挿嵌構造に代えて面実装に用いる別の接続端子が図５に開示されている。
この接続端子は、上下に平行に離間する基板間を接続するために用いられており、具体的には上面に配線パターンが施された基板が上下に離間して配置されており、この基板間を接続すべく、接続端子の下端が下部基板に面実装され、上端が上部基板に設けた孔に挿嵌実装されて該各基板間が電気的に接続される。
Further, another connection terminal used for surface mounting instead of the insertion structure is disclosed in FIG.
This connection terminal is used to connect between boards that are spaced apart in parallel in the vertical direction. Specifically, a board having a wiring pattern on the upper surface is disposed so as to be spaced apart vertically. The lower ends of the connection terminals are surface-mounted on the lower substrate, and the upper ends are inserted and mounted in holes provided in the upper substrate to electrically connect the respective substrates.
ところで、この接続端子は図５に示すように、柱状の下端側に面実装のための狭い平面を有しているため、転倒し易く面実装する際には、転倒防止のための倒れ防止治具が必要となる。この倒れ防止治具は、所定の厚さ寸法を有する平板に脚が設けられた構造であり、その脚の高さ寸法は、平板に設けた孔から接続端子の上端が突出するように設定されている。これにより、平板上に上部基板を配置する際に、当該上部基板に設けた孔に接続端子の上端を容易に挿嵌することができ、もって接続端子の上端を容易に挿嵌実装することができる。 By the way, as shown in FIG. 5, this connection terminal has a narrow flat surface for surface mounting on the columnar lower end side. Therefore, when the surface mounting is easy to fall, the fall prevention treatment for preventing the fall is provided. Tools are required. This fall prevention jig has a structure in which a leg is provided on a flat plate having a predetermined thickness, and the height of the leg is set so that the upper end of the connection terminal protrudes from a hole provided in the flat plate. ing. Thus, when the upper substrate is disposed on the flat plate, the upper end of the connection terminal can be easily inserted into the hole provided in the upper substrate, and thus the upper end of the connection terminal can be easily inserted and mounted. it can.
また、接続端子は、上端が倒れ防止治具の平板に設けた孔に挿嵌されて保持される。これにより、接続端子は、孔に挿嵌されることで挟持され転倒が防止される。
しかし、前記したように従来の接続端子は、下部基板に接続端子を面実装する際、および上部基板に接続端子を挿嵌実装するために倒れ防止治具が必要であり、この倒れ防止字具が不要となる構造が望まれていた。 However, as described above, the conventional connection terminal requires a fall prevention jig for surface mounting the connection terminal on the lower substrate and for mounting and mounting the connection terminal on the upper substrate. A structure that eliminates the need has been desired.
従って、本発明の目的は、上記した事情に鑑みて創案されたものであり、倒れ防止治具が不要となる接続端子を提供することにある。 Accordingly, an object of the present invention is to provide a connection terminal that has been developed in view of the above-described circumstances and does not require a collapse prevention jig.
上面に配線パターンが施された基板が上下に離間して配置されており、金属下部基板に表面実装されガラスエポキシ上部基板に設けた孔に挿嵌実装されて該各基板間を電気的に接続するための接続端子において、下端が前記金属下部基板上の配線パターン表面に接続され、上端が前記ガラスエポキシ上部基板に設けた孔に挿嵌されて該ガラスエポキシ上部基板上の配線パターン上で接続される端子部と、３脚から成り、前記端子部の下端側において、前記３脚の各脚が集合する部位の中央に設けた孔に前記端子部が貫通されて、該端子部の下部側と係合される端子保持部と、前記端子部の上端側において当該端子部から突出して前記ガラスエポキシ上部基板を支持する支持部と、を備えることを特徴とする。 Substrates with wiring patterns on the top surface are spaced apart from each other, and are mounted on the surface of the metal lower substrate and inserted into holes in the glass epoxy upper substrate to electrically connect the substrates. in connection terminals for the lower end is connected to the wiring pattern surface on the metal lower substrate, connected are inserted into the holes which the upper end is provided on the glass epoxy upper substrate on the wiring pattern on the glass epoxy upper substrate A terminal portion that is formed on the lower end side of the terminal portion, the lower end side of the terminal portion being inserted into a hole provided in the center of a portion where the legs of the three legs are assembled, And a terminal holding part that protrudes from the terminal part at the upper end side of the terminal part and supports the glass epoxy upper substrate .
上面に配線パターンが施された基板が上下に離間してケース内に収容されるべく配置されており、金属下部基板に表面実装されガラスエポキシ上部基板に設けた孔に挿嵌実装されて該各基板間を電気的に接続するための接続端子において、下端が前記金属下部基板上の配線パターン表面に接続され、上端が前記ケースの内壁に設けた段差に係合して所定の位置に配置される前記ガラスエポキシ上部基板に設けた孔に挿嵌されて該ガラスエポキシ上部基板上の配線パターン上で接合される端子部と、３脚から成り、前記端子部の下端側において、前記３脚の各脚が集合する部位の中央に設けた孔に前記端子部が挿通されて、該端子部の下部側と係合される端子保持部と、を備えることを特徴とする。 A substrate having a wiring pattern on the upper surface is arranged so as to be separated from the upper and lower sides and accommodated in the case, and is mounted on the surface of the metal lower substrate and inserted into holes provided in the glass epoxy upper substrate. In the connection terminal for electrically connecting the substrates , the lower end is connected to the surface of the wiring pattern on the metal lower substrate , and the upper end is disposed at a predetermined position by engaging with a step provided on the inner wall of the case. that the terminal portion which is inserted into the hole provided in the glass epoxy upper substrate is bonded on the wiring pattern on the glass epoxy upper substrate, it consists of three legs, at the lower end side of the terminal portion, of the three legs The terminal portion is inserted through a hole provided in the center of a portion where the legs are gathered, and a terminal holding portion engaged with the lower side of the terminal portion is provided.
端子保持部は、端子部との係合位置において被吸引面を有するようにしてもよい。
脚の径は脚端において低減してもよい。
脚端は、尖塔形状であってもよい。
脚端は、半球形状であってもよい。
The terminal holding part may have a suction surface at the position of engagement with the terminal part.
The leg diameter may be reduced at the leg ends.
The leg ends may be spire shaped.
The leg ends may be hemispherical.
本発明の接続端子によれば、下端が下部基板上の配線パターン表面に接続され、上端が上部基板に設けた孔に挿嵌されて該上部基板上の配線パターン上で接続される端子部の下端側に、複数の脚を有する端子保持部が系合され、端子部の上端側において当該端子部から突出する支持部を備える。これにより、本発明の接続端子は、倒れ防止治具がなくても、自立することができ、かつ上部基板を保持することができる。 According to the connection terminal of the present invention, the lower end is connected to the surface of the wiring pattern on the lower substrate, and the upper end is inserted into the hole provided in the upper substrate and connected to the wiring pattern on the upper substrate. A terminal holding portion having a plurality of legs is coupled to the lower end side, and a support portion protruding from the terminal portion is provided on the upper end side of the terminal portion. As a result, the connection terminal of the present invention can be self-supporting and can hold the upper substrate without a collapse prevention jig.
更に本発明の接続端子によれば、下端が前記下部基板上の配線パターン表面に接続され、上端が前記ケースの内壁に設けた段差に係合して所定の位置に配置される前記上部基板に設けた孔に挿嵌されて該上部基板上の配線パターン上で接合される端子部の下端側に、複数の脚を有する端子保持部が係合される。これにより、本発明の接続端子は、倒れ防止治具がなくても、自立することができ、かつ上部基板が保持される。 Further, according to the connection terminal of the present invention, the lower end is connected to the surface of the wiring pattern on the lower substrate, and the upper end is engaged with the step provided on the inner wall of the case to the upper substrate arranged at a predetermined position. A terminal holding portion having a plurality of legs is engaged with the lower end side of the terminal portion that is inserted into the provided hole and joined on the wiring pattern on the upper substrate. As a result, the connection terminal of the present invention can stand on its own even without a collapse prevention jig, and the upper substrate is held.
以下、図面を用いて、本発明の実施形態を詳細に説明するが、以下の説明では、実施の形態に用いる図面について同一の構成要素は同一の符号を付し、かつ重複する説明は可能な限り省略する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same components are denoted by the same reference numerals in the drawings used in the embodiments, and overlapping descriptions are possible. Omitted as much as possible.
先ず、本発明の接続端子１０の適用例を簡単に説明する。
本発明の接続端子１０は、上面に配線パターンが施された基板間の接続に用いられており、当該接続端子１０は下部基板に対しては表面実装され、上部基板に対しては当該基板に形成された孔に挿嵌実装される。これにより、上部基板と下部基板とが電気的に接続される。
First, an application example of the connection terminal 10 of the present invention will be briefly described.
The connection terminal 10 of the present invention is used for connection between substrates having a wiring pattern on the upper surface. The connection terminal 10 is surface-mounted on the lower substrate and is connected to the substrate on the upper substrate. It is inserted and mounted in the formed hole. Thereby, the upper substrate and the lower substrate are electrically connected.
尚、本発明の接続端子１０により電気的に接続された上部基板２０および下部基板３０は、図２に示すように、ケース４０内に収容される。 In addition, the upper board | substrate 20 and the lower board | substrate 30 which were electrically connected by the connection terminal 10 of this invention are accommodated in the case 40, as shown in FIG.
上部基板２０および下部基板３０は、例えばガラスエポキシ系や、表面に絶縁層を有するアルミニウムなどの金属系の基板であり、その上面に所定の配線パターンが配設されており、上部基板２０においては接続端子１０が挿嵌されるための貫通孔が設けられている。ところで、上部基板２０と下部基板３０とは所定の間隔を有して平行に配置されており、この状態で上下の基板が電気的に接続されるように、配線パターンの配置が設計されている。 The upper substrate 20 and the lower substrate 30 are, for example, glass epoxy-based or metal-based substrates such as aluminum having an insulating layer on the surface, and a predetermined wiring pattern is disposed on the upper surface thereof. A through hole for inserting the connection terminal 10 is provided. Incidentally, the upper substrate 20 and the lower substrate 30 are arranged in parallel with a predetermined interval, and the arrangement of the wiring patterns is designed so that the upper and lower substrates are electrically connected in this state. .
次に本発明の接続端子１０を説明する。
本発明の接続端子１０は、図１に示すように、柱状の端子部１１と、該端子部１１の下端側に係合される３脚から成る端子保持部１２と、端子部１１の上端側に設けられた支持部１３とを備える。
Next, the connection terminal 10 of the present invention will be described.
As shown in FIG. 1, the connection terminal 10 of the present invention includes a columnar terminal portion 11, a terminal holding portion 12 composed of three legs engaged with the lower end side of the terminal portion 11, and the upper end side of the terminal portion 11. And a support portion 13 provided in the.
柱状の端子部１１は、その径より大きな円状の平板１１１を下端に有している。この平板１１１下に配置される接合材としての半田の溶融によって、接続端子１１は、下部基板の配線パターン上に表面実装される。 The columnar terminal portion 11 has a circular flat plate 111 having a larger diameter than the diameter thereof at the lower end. The connection terminals 11 are surface-mounted on the wiring pattern of the lower substrate by melting of solder as a bonding material disposed under the flat plate 111.
端子部１１の上端は上部基板に設けた孔に挿入されて上部基板に挿嵌実装される。尚、端子部１１の上端の角を面取りしてもよく、これにより端子部１１の上端を上部基板の孔に挿入し易くすることができる。 The upper end of the terminal portion 11 is inserted into a hole provided in the upper substrate and is mounted on the upper substrate. The upper end corner of the terminal portion 11 may be chamfered, which makes it easier to insert the upper end of the terminal portion 11 into the hole of the upper substrate.
端子保持部１２は３脚形状であり、各脚が集合する部位の中央には孔が設けられており、この孔に端子部１１が貫通されて端子部１１の下部側で係合される。 The terminal holding portion 12 has a three-leg shape, and a hole is provided in the center of a portion where the legs are gathered. The terminal portion 11 is penetrated through the hole and engaged on the lower side of the terminal portion 11.
各脚が集合する部位、すなわち端子部１１と係合する部位は、図示省略の吸引器で吸引可能の被吸着面（平面）１２１を有している（図１（ｂ）参照）。これにより、吸引器を備えた自動配設機により、下部基板３０上の所望の位置に接続端子１０を容易に配置することができる。 The part where the legs are gathered, that is, the part that engages with the terminal portion 11 has an attracted surface (plane) 121 that can be sucked by an aspirator (not shown) (see FIG. 1B). Thereby, the connection terminal 10 can be easily arrange | positioned in the desired position on the lower board | substrate 30 with the automatic arrangement | positioning machine provided with the suction device.
ところで、各脚の先端（脚端）１２２は、図１（ｃ）又は図１（ｄ）に示すように、脚端の径が端に向かうに従って次第に低減するように形成されている。これにより、下部基板２０との摩擦抵抗を低減することができ、平板１１１下に配置される半田の溶融による表面張力を利用したセルフアライメントを得やすくすることができる。 By the way, as shown in FIG. 1C or FIG. 1D, the tip (leg end) 122 of each leg is formed so that the diameter of the leg end gradually decreases toward the end. Thereby, the frictional resistance with the lower substrate 20 can be reduced, and self-alignment using the surface tension due to the melting of the solder disposed under the flat plate 111 can be easily obtained.
尚、先端１２２の形状は、図１（ｃ）に示すように尖塔状であっても、図１（ｄ）に示すように半球状であって、何れの形状であってもよい。 The tip 122 may have a spire shape as shown in FIG. 1 (c) or a hemispherical shape as shown in FIG. 1 (d).
支持部１３は、柱状の端子部１１の上端側において側方に突出するように設けられており、突出する表面は平に形成されている。この平面でもって、上部基板２０の下面を支持する。このとき、端子部１１の上端は、上部基板２０に設けた孔に挿嵌される。
ところで、支持部１３および端子部１１は、一体的に形成しても、別途形成してもよい。
The support portion 13 is provided so as to protrude laterally on the upper end side of the columnar terminal portion 11, and the protruding surface is formed flat. With this plane, the lower surface of the upper substrate 20 is supported. At this time, the upper end of the terminal portion 11 is inserted into a hole provided in the upper substrate 20.
By the way, the support part 13 and the terminal part 11 may be formed integrally or separately.
ここで再び図２を参照して、本発明の接続端子１０の使用方法を説明する。
下部基板３０上には、スクリーン半田印刷を行なうべく、各種電子部品が所定の位置に配置されており、本発明の接続端子１０も各種電子部品と同様に所定の位置に配置されている。このとき、本発明の接続端子１０は、端子保持部１２の被吸着面１２１が図示省略の自動配設機の吸引器により吸引され、当該接続端子１０が所定の位置まで自動的に搬送されて下部基板３０上に配置される。
Here, referring to FIG. 2 again, a method of using the connection terminal 10 of the present invention will be described.
Various electronic components are arranged at predetermined positions on the lower substrate 30 for screen solder printing, and the connection terminals 10 of the present invention are also arranged at predetermined positions like the various electronic components. At this time, in the connection terminal 10 of the present invention, the attracted surface 121 of the terminal holding portion 12 is sucked by a suction device of an automatic placement machine (not shown), and the connection terminal 10 is automatically conveyed to a predetermined position. It is disposed on the lower substrate 30.
尚、下部基板３０上に配置される接続端子１０は、その上端側で上部基板２０を支持可能にバランス良く配置されており、複数の接続端子１０とバランス良い配置でもって上部基板２０を安定的に保持することができる。 The connection terminals 10 arranged on the lower substrate 30 are arranged in a well-balanced manner so that the upper substrate 20 can be supported on the upper end side thereof, and the upper substrate 20 is stably arranged in a balanced arrangement with the plurality of connection terminals 10. Can be held in.
更に、複数の接続端子を近接して配置する際には、各接続端子の脚が当接することの無いように脚と脚との間に、隣に配置される接続端子の脚が配置されることが好ましく、このように配置することで、接続端子における実装面積の低減を図ることができる。 Further, when the plurality of connection terminals are arranged close to each other, the legs of the adjacent connection terminals are arranged between the legs so that the legs of each connection terminal do not contact each other. It is preferable that the mounting area of the connection terminal can be reduced by arranging in this manner.
下部基板３０上に配置された各種電子部品および接続端子１０が表面実装された後、上部基板２０を所定の位置に配置する。このとき、上部基板２０に設けた孔に端子部１１の上端が挿嵌され、上部基板２０から突出する上端が半田によって上部基板２０上に接続される。 After the various electronic components and the connection terminals 10 arranged on the lower substrate 30 are surface-mounted, the upper substrate 20 is arranged at a predetermined position. At this time, the upper end of the terminal portion 11 is inserted into a hole provided in the upper substrate 20, and the upper end protruding from the upper substrate 20 is connected to the upper substrate 20 by solder.
尚、上部基板２０が配置されるとき、該基板２０は接続端子１０の端子部１１から突出する支持部１３によって支持されており、接続端子１０の倒れ防止治具等が不用であるとともに、上部基板２０を所定の位置で支持するための冶具も不用となる。 When the upper substrate 20 is disposed, the substrate 20 is supported by the support portion 13 protruding from the terminal portion 11 of the connection terminal 10, so that a jig for preventing the connection terminal 10 from falling down is unnecessary, and A jig for supporting the substrate 20 at a predetermined position is also unnecessary.
前記したようにして上部基板２０および下部基板３０が接続端子１０によって電気的に接続された後、これらがケース４０内に収容される（図３参照）。 After the upper substrate 20 and the lower substrate 30 are electrically connected by the connection terminals 10 as described above, these are accommodated in the case 40 (see FIG. 3).
以上述べたように、実施例１の接続端子１０によれば、下端が下部基板３０上の配線パターン表面に接続され、上端が上部基板２０に設けた孔に挿嵌されて該上部基板２０上の配線パターン上で接続される端子部１１の下端側に複数の脚から成る端子保持部１２が系合されており、端子部１１の上端側において当該端子部１１から突出する支持部１３を備える。これにより、本発明の接続端子１０は、倒れ防止治具がなくても、自立することができ、かつ上部基板２０を所定の位置に保持することができる。 As described above, according to the connection terminal 10 of the first embodiment, the lower end is connected to the surface of the wiring pattern on the lower substrate 30, and the upper end is inserted into the hole provided in the upper substrate 20. A terminal holding portion 12 composed of a plurality of legs is coupled to the lower end side of the terminal portion 11 connected on the wiring pattern, and a support portion 13 protruding from the terminal portion 11 is provided on the upper end side of the terminal portion 11. . As a result, the connection terminal 10 of the present invention can stand on its own without a collapse prevention jig, and can hold the upper substrate 20 in a predetermined position.
次に、支持部１３が設けられていない接続端子を説明する。
実施例２の接続端子１００は、図４に示すように前記した実施例１と同様の柱状の端子部１１と、該端子部１１の下端側に係合される３脚状の端子保持部１２とを備えている。
Next, the connection terminal in which the support part 13 is not provided is demonstrated.
As shown in FIG. 4, the connection terminal 100 according to the second embodiment includes a columnar terminal portion 11 similar to the first embodiment described above, and a tripod-shaped terminal holding portion 12 that is engaged with the lower end side of the terminal portion 11. And.
本実施例の特徴は、端子部１１に挿嵌される上部基板２０が収容されるケース４０の内壁に段差４１が設けられており、この段差に上部基板２０が係合される。 A feature of the present embodiment is that a step 41 is provided on the inner wall of the case 40 in which the upper substrate 20 inserted into the terminal portion 11 is accommodated, and the upper substrate 20 is engaged with this step.
例えば上部基板２０が平面から見て方形状であるとき、少なくとも対向する各辺、すなわち対向する互いの辺の縁部がケース４０内壁の段差４１に係合されており、これを実現すべく、ケース４０内壁の段差間の距離と基板の寸法との調整が図られている。 For example, when the upper substrate 20 has a square shape when viewed from the plane, at least the opposing sides, that is, the edges of the opposing sides are engaged with the step 41 on the inner wall of the case 40, and in order to realize this, The distance between the steps on the inner wall of the case 40 and the dimensions of the substrate are adjusted.
ところで、ケース４０の底には、下部基板３０が配置されており、該下部基板３０上に接続端子１００が表面実装される。尚、接続端子１００の端子部１１の上端が上部基板２０に挿嵌実装されるように接続端子１００の高さ寸法と、ケース内の段差の形成位置との調整が図られている。 Incidentally, the lower substrate 30 is disposed on the bottom of the case 40, and the connection terminals 100 are surface-mounted on the lower substrate 30. In addition, adjustment of the height dimension of the connection terminal 100 and the formation position of the level | step difference in a case is achieved so that the upper end of the terminal part 11 of the connection terminal 100 may be inserted and mounted in the upper board | substrate 20. FIG.
ここで、本発明の接続端子１００の使用方法を説明する。
下部基板３０上には、各種電子部品および本発明の接続端子１００が所定の位置に配置されており、これらがスクリーン半田印刷によって表面実装される。
Here, the usage method of the connection terminal 100 of this invention is demonstrated.
On the lower substrate 30, various electronic components and the connection terminals 100 of the present invention are arranged at predetermined positions, and these are surface-mounted by screen solder printing.
下部基板３０上に各種電子部品および接続端子１０が表面実装された後、これをケース４０内に収容する。その後、上部基板２０を所定の位置に配置する。このとき、上部基板２０は、ケース内に設けた段差４１に係合され、下部基板に表面実装された接続端子１００の端子部１１の上端が設けた孔に挿嵌され上部基板２０から突出する上端が半田によって上部基板２０上に接続される。 After various electronic components and connection terminals 10 are surface-mounted on the lower substrate 30, they are accommodated in the case 40. Thereafter, the upper substrate 20 is disposed at a predetermined position. At this time, the upper substrate 20 is engaged with the step 41 provided in the case, and is inserted into a hole provided with the upper end of the terminal portion 11 of the connection terminal 100 surface-mounted on the lower substrate and protrudes from the upper substrate 20. The upper end is connected to the upper substrate 20 by solder.
以上述べたように、実施例２の接続端子１００によれば、端子部１１の下端が下部基板３０上の配線パターン表面に接続され、上端が上部基板２０に設けた孔に挿嵌されて該上部基板２０上の配線パターン上で接続され、当該端子部１１の下端側に、脚を有する端子保持部１２が系合されており、上部基板２０はケース４０に設けた段差４１に系合される。これにより、実施例２の接続端子１００は、倒れ防止治具がなくても、自立することができ、かつ上部基板２０を所定の位置に保持することができる。 As described above, according to the connection terminal 100 of the second embodiment, the lower end of the terminal portion 11 is connected to the surface of the wiring pattern on the lower substrate 30, and the upper end is inserted into a hole provided in the upper substrate 20. Connected on the wiring pattern on the upper substrate 20, the terminal holding portion 12 having legs is coupled to the lower end side of the terminal portion 11, and the upper substrate 20 is coupled to the step 41 provided in the case 40. The As a result, the connection terminal 100 according to the second embodiment can stand on its own even without a collapse prevention jig, and can hold the upper substrate 20 in a predetermined position.
前記した実施例では、下部基板３０上に配置される端子部１１の平板１１１下に半田を設けて、接続端子を表面実装する例で説明したが、端子保持部１２の各脚の先端１２２が半田との濡れ性の良い部材を適用するならば、脚の先端１２２下に半田を設け、この端子保持部１２の脚も下部基板３０上に表面実装するようにしてもよい。 In the above-described embodiment, the example in which the solder is provided under the flat plate 111 of the terminal portion 11 arranged on the lower substrate 30 and the connection terminals are surface-mounted has been described, but the tip 122 of each leg of the terminal holding portion 12 is If a member having good wettability with solder is applied, solder may be provided under the leg tip 122 and the legs of the terminal holding part 12 may be surface-mounted on the lower substrate 30.
前記した実施例２では、図４に示すようにケース４０の内壁に階段状の段差４１が設けられた例で説明したがこれに限定される必要はなく、例えばケースの内壁に別途部材を取付け、この取付けた部材でもってケース内壁に段差を設けるようにしてもよい。 In the second embodiment described above, the example in which the stepped step 41 is provided on the inner wall of the case 40 as shown in FIG. 4 is not limited to this. For example, a separate member is attached to the inner wall of the case. A step may be provided on the inner wall of the case with the attached member.
１０、１００ 接続端子
１１ 端子部
１２ 端子保持部
１３ 支持部
１１１ 平板
１２１ 被吸着面
１２２ 先端（脚端）
２０ 上部基板
３０ 下部基板
４０ ケース
４１ 段差
DESCRIPTION OF SYMBOLS 10, 100 Connection terminal 11 Terminal part 12 Terminal holding part 13 Support part 111 Flat plate 121 Adsorbed surface 122 Tip (leg end)
20 Upper substrate 30 Lower substrate 40 Case 41 Step
Claims (6)
下端が前記金属下部基板上の配線パターン表面に接続され、上端が前記ガラスエポキシ上部基板に設けた孔に挿嵌されて該ガラスエポキシ上部基板上の配線パターン上で接続される端子部と、
３脚から成り、前記端子部の下端側において、前記３脚の各脚が集合する部位の中央に設けた孔に前記端子部が貫通されて、該端子部の下部側と係合される端子保持部と、
前記端子部の上端側において当該端子部から突出して前記ガラスエポキシ上部基板を支持する支持部と、
を備えることを特徴とする接続端子。 Substrates with wiring patterns on the top surface are spaced apart from each other, and are mounted on the surface of the metal lower substrate and inserted into holes in the glass epoxy upper substrate to electrically connect the substrates. In the connection terminal to
Lower end is connected to the wiring pattern surface on the metal lower substrate, and is inserted into the hole in which the upper end is provided on the glass epoxy upper substrate terminal unit connected on the wiring pattern on the glass epoxy upper substrate,
A terminal that is composed of three legs, and is engaged with the lower side of the terminal part through the hole provided in the center of the portion where the legs of the three legs gather on the lower end side of the terminal part. A holding part;
A support portion that protrudes from the terminal portion at the upper end side of the terminal portion and supports the glass epoxy upper substrate ;
A connection terminal comprising:
下端が前記金属下部基板上の配線パターン表面に接続され、上端が前記ケースの内壁に設けた段差に係合して所定の位置に配置される前記ガラスエポキシ上部基板に設けた孔に挿嵌されて該ガラスエポキシ上部基板上の配線パターン上で接合される端子部と、
３脚から成り、前記端子部の下端側において、前記３脚の各脚が集合する部位の中央に設けた孔に前記端子部が挿通されて、該端子部の下部側と係合される端子保持部と、を備えることを特徴とする接続端子。 A substrate having a wiring pattern on the upper surface is arranged so as to be separated from the upper and lower sides and accommodated in the case, and is mounted on the surface of the metal lower substrate and inserted into holes provided in the glass epoxy upper substrate. In the connection terminal for electrical connection between the boards,
The lower end is connected to the surface of the wiring pattern on the metal lower substrate , and the upper end is inserted into a hole provided in the glass epoxy upper substrate arranged at a predetermined position by engaging with a step provided on the inner wall of the case. Terminal portions bonded on the wiring pattern on the glass epoxy upper substrate ,
A terminal composed of three legs, the lower end side of the terminal part, the terminal part being inserted into a hole provided in the center of the portion where the legs of the three legs are assembled, and being engaged with the lower side of the terminal part And a holding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007222891A JP5030707B2 (en) | 2007-08-29 | 2007-08-29 | Connecting terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007222891A JP5030707B2 (en) | 2007-08-29 | 2007-08-29 | Connecting terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009054551A JP2009054551A (en) | 2009-03-12 |
| JP5030707B2 true JP5030707B2 (en) | 2012-09-19 |
Family
ID=40505440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007222891A Active JP5030707B2 (en) | 2007-08-29 | 2007-08-29 | Connecting terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5030707B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2405671A4 (en) | 2009-03-04 | 2014-04-02 | Panasonic Corp | Ultrasonic transducer, ultrasonic probe, and ultrasonic diagnostic device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02181492A (en) * | 1989-01-06 | 1990-07-16 | Mitsubishi Electric Corp | Semiconductor device |
| JPH06275328A (en) * | 1993-03-19 | 1994-09-30 | Fuji Elelctrochem Co Ltd | Printed board lead terminal and its mounting method |
| JPH07221419A (en) * | 1994-01-31 | 1995-08-18 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| JP4506456B2 (en) * | 2004-12-24 | 2010-07-21 | 住友電装株式会社 | Board terminal mounting structure on circuit board |
-
2007
- 2007-08-29 JP JP2007222891A patent/JP5030707B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009054551A (en) | 2009-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5078683B2 (en) | Printed circuit board and surface mount device mounting structure | |
| JP5030707B2 (en) | Connecting terminal | |
| JP5628057B2 (en) | Pin header, electronic device and method of manufacturing electronic device | |
| TWI569697B (en) | The electronic components of the ring structure | |
| US7316571B1 (en) | Support structure of circuit module | |
| JP6007413B2 (en) | Wiring board | |
| JP2012019101A (en) | Surface-mounted electronic circuit module | |
| JP2008288359A (en) | Printed circuit board | |
| JP6447401B2 (en) | Connector mounting board | |
| JPH05327161A (en) | Electronic circuit module | |
| JP2008166525A (en) | Electronic circuit module | |
| KR100970699B1 (en) | Lead structure for smd/smc | |
| JP5087049B2 (en) | PCB terminal | |
| JP2006179523A (en) | High-frequency module | |
| JP2011044519A (en) | Electronic component mounting structure | |
| KR100396868B1 (en) | a fixed method of flexible printed circuit board and structure | |
| KR20150109713A (en) | Printed Circuit Board Assembly | |
| JP2007059481A (en) | Terminal pin and power supply device using the same | |
| JP2005310901A (en) | Electronic circuit unit | |
| US9761968B1 (en) | Electronic device package box | |
| TWM513493U (en) | Ring-like structure of electronic component base | |
| JPS635248Y2 (en) | ||
| JP5933425B2 (en) | Surface mount type electric device, surface mount type electric device mounted motherboard, method for manufacturing surface mount type electric device mounted motherboard | |
| JP2015084368A (en) | Substrate structure and printed circuit board | |
| JP2003174242A (en) | Electronic circuit device and method for manufacturing it |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100209 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110929 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120124 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120313 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120626 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120626 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5030707 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150706 Year of fee payment: 3 |