JP6447401B2 - Connector mounting board - Google Patents

Description

  The present invention relates to a connector mounting board in which a surface mounting type connector is mounted on a printed board.

  Conventionally, a connector mounting board in which a surface mount type connector is mounted on a printed circuit board is used as an internal circuit of an electric junction box for automobiles. Such a surface mount type connector mounted on a printed circuit board has, for example, a connector mounting hole that opens to the side of the printed circuit board as disclosed in JP-A-7-85932 (Patent Document 1). A connector housing having a plurality of connection terminals accommodated and held in the connector housing, and lead portions of the connection terminals protruding through the inner wall of the connector mounting hole are pad portions on the printed circuit board. Are connected to each other by reflow soldering.

  By the way, when a surface mount type connector is mounted on a printed circuit board by reflow soldering, the lead part is likely to rise from the pad part due to the buoyancy of the solder when the solder is melted, which may cause a soldering failure. . Therefore, as described in Patent Document 1, a structure is provided in which a protrusion protruding from the bottom surface of the connector housing to the printed circuit board side is provided on the opening side of the connector mounting hole that is separated from the inner wall of the connector mounting hole from which the lead portion protrudes. Proposed. According to this, when the connector housing is placed on the printed circuit board with a slight inclination by the protrusion, the force that presses the lead portion onto the pad portion works, and the lead portion rises from the pad portion. It can be reduced or prevented.

  However, in the structure described in Patent Document 1, since it is necessary to provide a special protrusion on the connector housing, the versatility is poor, and there is a concern about high costs due to a design change of the connector housing. Furthermore, since the support load of the connector is concentrated at the portion where the protrusion comes into contact with the printed circuit board, the resist or the like at that portion is easily peeled off. Therefore, it is difficult to route the printed wiring in such a portion, and there is a possibility that the density of the printed circuit board may be hindered.

JP 7-85932 A

  The present invention has been made in the background of the above-mentioned circumstances, and the solution is to achieve both prevention of lifting from the pad portion of the lead portion of the surface mount connector and high density of the printed wiring. An object of the present invention is to provide a connector mounting board having a novel structure that can be achieved.

A first aspect of the present invention includes a printed circuit board and a connector surface-mounted on the printed circuit board, wherein the connector has a connector mounting hole that opens to the side, and is held and held in the connector housing. The lead portion of each connection terminal protruding through the inner wall of the connector mounting hole is soldered to the pad portion of the printed circuit board. In the connector mounting board that is conductively connected, the lead portion protruding from the back wall of the connector housing is formed by partially thickening an insulating layer in the mounting area of the connector housing of the printed board. and ridges which is placed in an inclined state the connector housing to be pressed is provided in the pad portion, the raised portion, prior to And it extends in a large length dimension than the length between the two ends of the alignment direction of the plurality of lead portions, wherein the lower region of the raised portion is the wiring area of the printed circuit.

  According to this aspect, in the mounting region of the connector housing on the printed circuit board, the lead portion is pressed against the pad portion by the raised portion where the insulating layer is partially thickened. It can be mounted in an inclined state. As a result, when soldering by reflow or the like, the lead portion can be pressed against the pad portion due to the inclination of the connector housing, and the lead portion can be prevented from lifting from the pad portion during soldering. A reliable solder connection of the pad portion can be realized.

  Furthermore, since the raised portion that supports the connector housing in an inclined state is formed by partially thickening the insulating layer in the mounting area, the thickness of the insulating layer laminated on the surface of the printed circuit board can be reduced. The raised portion can be provided with a simple configuration to adjust. Therefore, it is not necessary to provide a special protrusion on the connector housing as in the conventional structure, and it can be applied to an existing connector, so that versatility can be improved.

  In addition, since the raised portion is composed of a thick insulating layer, even when the support load of the connector housing is concentrated on the raised portion, the thick insulating layer reduces the influence on the inside of the printed circuit board. Can be avoided. Therefore, in the conventional structure, it is difficult to route the printed wiring below the protrusion where the support load of the connector housing is concentrated. According to the present invention, the printed wiring is routed in the lower area of the raised portion. It is also possible to make the area, and it is possible to achieve high density of printed wiring.

  In addition, the formation part of the protruding part in the mounting area may be formed in any part as long as the connector housing can be inclined so that the lead part is pressed against the pad part. Can also be set arbitrarily. For example, a plurality of small raised portions may be provided in a dotted manner, or the raised portions may be provided in a long shape.

  A second aspect of the present invention is the one described in the first aspect, wherein the raised portion is provided at a mounting portion on the opening side of the connector mounting hole in the connector housing.

  According to this aspect, since the raised portion is provided on the mounting portion on which the opening side of the connector mounting hole that is farthest away from the back wall of the connector mounting hole from which the lead portion protrudes, the lead portion is The pad portion can be pressed with a larger pressing force.

  According to a third aspect of the present invention, in the second aspect, the plurality of lead portions protrude from the back wall of the connector mounting hole, and the plurality of lead portions are connected to the connector. While the protruding portions are arranged in a row apart from each other in the width direction of the hole, the raised portion has a long shape extending in the width direction of the connector mounting hole, Both end portions of the raised portion in the width direction protrude outward in the width direction from the lead portions positioned at both ends of the plurality of the lead portions arranged in alignment.

  According to this aspect, the raised portion extends in the width direction of the connector mounting hole at the mounting portion where the opening side of the connector mounting hole that is farthest from the inner wall of the connector mounting hole from which the lead portion protrudes is mounted. It is formed in a long shape. In addition, both ends of the raised portion are provided with a length that protrudes outward in the width direction, rather than both ends of the plurality of lead portions that are aligned and spaced apart from each other in the width direction of the connector mounting hole. . Accordingly, the connector housing can be stably supported by the raised portion on the opening side of the connector mounting hole, and all the lead portions can be more reliably pressed against the pad portion more reliably.

  According to the present invention, in the mounting region of the connector housing on the printed circuit board, the lead portion is pressed against the pad portion by the raised portion where the insulating layer is partially thickened. It can be placed in an inclined state. Thereby, when soldering by reflow or the like, it is possible to prevent the lead portion from being lifted from the pad portion during soldering and to realize a reliable solder connection between the lead portion and the pad portion. Furthermore, since the raised portion is formed by partially thickening the insulating layer in the mounting region, the raised portion can be formed with a simple configuration that adjusts the thickness of the insulating layer laminated on the surface of the printed circuit board. Therefore, it is possible to provide a highly versatile structure applicable to existing connectors. In addition, since the raised portion is constituted by a thick insulating layer, even when the support load of the connector housing is concentrated on the raised portion, the influence on the inside of the printed circuit board can be reduced or avoided. . Therefore, it is possible to achieve high density of the printed wiring by using the area below the raised portion as the wiring area of the printed wiring.

The top view of the connector mounting board | substrate as one Embodiment of this invention. The side view of the connector mounting board | substrate shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, the connector mounting board | substrate 10 as one Embodiment of this invention is shown to FIGS. The connector mounting board 10 includes a printed board 12 and a connector 16 mounted on a surface 14 that is one surface of the printed board 12. The connector 16 has a structure in which a plurality of connection terminals 20 are inserted and held in a connector housing 18. More specifically, the lead portion 22 which is one end portion of the connection terminal 20 is conductively connected to the pad portion 24 of the printed circuit board 12 by soldering, while the other end of the connection terminal 20 is connected. By connecting the part to a mating connector (not shown), the mating connector is electrically connected to the printed circuit board 12. For easy understanding, illustration of solder is omitted in FIGS. Further, in the following description, “upper” means the upper side in FIG. 2, and “lower” means the lower side in FIG.

  As shown in FIGS. 1 and 2, the connector housing 18 is an integrally molded product formed of synthetic resin, and is a substantially rectangular box that opens to the side (right side in FIGS. 1 and 2). A connector mounting hole 28 having a body shape is provided. A mating connector (not shown) is fitted into the connector mounting hole 28. Further, a flat block-like peg holding portion 30 that protrudes outward is provided at the lower ends of both sides of the connector housing 18 in the width direction (vertical direction in FIG. 1). Further, the upper surface 32 of the peg holding part 30 is provided with a substantially groove-like peg insertion hole 34 at three locations spaced apart in the longitudinal direction (left and right direction in FIGS. 1 and 2) of the connector housing 18. The pegs 36 are accommodated and held in the three peg insertion holes 34 provided in the peg holding portion 30 of the connector housing 18. The peg 36 has a substantially vertically long flat plate shape, and is formed, for example, by stamping a metal plate having a surface such as a copper plate plated with tin. A lead portion 38 is provided at the lower end of the peg 36 in the length direction (vertical direction in FIG. 2) and is soldered by being inserted into a through hole 44 of the printed circuit board 12 described later.

  In addition, the connector housing 18 accommodates and holds a plurality of connection terminals 20. More specifically, as shown in FIG. 1, the lead portion 22, which is one end portion of the plurality of connection terminals 20, penetrates the back wall 40 of the connector mounting hole 28 and outward (in FIG. 1, (Left side) protrudes in a substantially crank shape, and the leading end portion of the lead portion 22 is placed on the pad portion 24 provided on the surface 14 of the printed circuit board 12, and the connector mounting hole 28 are arranged so as to be separated from each other in the width direction (vertical direction in FIG. 1). On the other hand, the other end of each of the plurality of connection terminals 20 protrudes inside the connector mounting hole 28.

  The printed circuit board 12 is a substantially rectangular flat plate-shaped insulating substrate made of a known insulating material such as glass epoxy resin, and is provided with printed wiring such as pad portions 24 on the front surface 14 and the back surface 42 thereof. The printed circuit board 12 has three through-holes 44 each having a substantially circular cross section in parallel, each of which has lead portions 38 of the pegs 36 attached to the peg holding portions 30 on both sides of the connector housing 18. Are arranged in an aligned manner.

  In addition, as shown in FIGS. 1 and 2, in the mounting region 46 of the connector housing 18 on the surface 14 of the printed circuit board 12, the mounting portion 48 on the opening side of the connector mounting hole 28 in the connector housing 18. Is provided with a raised portion 50 having a long shape extending in the width direction of the connector mounting hole 28 (vertical direction in FIG. 1). In addition, the width dimension W1 of the raised portion 50 is larger than the aligned width direction W2 of the plurality of lead portions 22, and both end portions in the width direction (vertical direction in FIG. 1) of the raised portion 50 are aligned. The plurality of lead portions 22 are formed so as to protrude outward in the width direction from the lead portions 22 located at both ends of the plurality of lead portions 22. Further, as shown in FIG. 2, the raised portion 50 includes a copper foil layer 52 made of a copper foil constituting the printed wiring, a resist layer 54 that protects the surface 14 of the printed board 12, and the printed board 12. A silk print layer 56 for printing on the surface 14 is laminated. Here, the resist layer 54 is an insulating protective film that protects the printed wiring from dust, heat, and moisture, and any known resist can be used. The film thickness of the resist layer 54 is generally about 50 to 100 μm. The silk print layer 56 is formed by silk printing using a known waterproof / insulating ink, and the film thickness of the silk print layer 56 is generally set to an arbitrary value of 50 μm or more. It can be set. Therefore, in the raised portion 50, the height dimension: H of the resist layer 54 and the silk printed layer 56 is higher than the pad portion 24 of the printed circuit board 12 on which the tip portion of the lead portion 22 is placed. Is formed. That is, in the region where the raised portion 50 is formed, the insulating layer is thicker than the region where the pad portion 24 is formed by the height dimension H corresponding to the resist layer 54 and the silk print layer 56. As a result, as shown in FIG. 2, the lead 38 of the peg 36 attached to the connector 16 is inserted into the through hole 44 of the printed circuit board 12, that is, positioned and held at the normal position. The connector housing 18 is inclined. Therefore, the plurality of lead portions 22 can be placed while being pressed against the pad portion 24.

  Then, in the state where the connector 16 is positioned and placed at the normal position with respect to the printed circuit board 12 as described above, the step of soldering the plurality of lead parts 22 to the pad part 24 and the lead parts 38 of the pegs 36 are printed circuit boards The process of soldering to the 12 through holes 44 is simultaneously performed using, for example, a reflow method. As a result, the lead portion 22 is soldered to the pad portion 24 so that the mating connector and the printed circuit board 12 are electrically connected, and the lead portion 38 of the peg 36 that is inserted into the through hole 44 of the printed circuit board 12. The connector housing 18 is fixed to the printed circuit board 12 by soldering.

  According to the connector mounting substrate 10 of the present embodiment having such a structure, the raised portion 50 has the resist layer 54 as compared with the pad portion 24 of the printed circuit board 12 on which the leading end portion of the lead portion 22 is placed. Since the height of the silk print layer 56 minutes is higher by H, the printed board is in a state where the connector housing 18 is inclined so that the plurality of lead portions 22 are pressed against the pad portion 24. 12 can be placed on the surface 14. Then, by soldering by reflow or the like in this state, the lead portion 22 is prevented from being lifted from the pad portion 24 at the time of soldering, and a reliable solder connection to the pad portion 24 of the lead portion 22 is realized. It can be done.

  Further, since the raised portion 50 that supports the connector housing 18 in an inclined state is formed by laminating a resist layer 54 and a silk print layer 56 as an insulating layer, the selection of the insulating layer to be laminated and the selected insulation are performed. The raised portion 50 can be easily configured by adjusting the thickness of the layer. Therefore, since there is no need to provide a special protrusion on the connector housing 18 as in the conventional structure, versatility can be improved. In addition, since the raised portion 50 is composed of a thick insulating layer such as a laminate of the resist layer 54 and the silk print layer 56, even if the support load of the connector housing 18 is concentrated on the raised portion 50, the thick portion 50 is thick. The influence on the printed circuit board 12 can be reduced or avoided by the insulating layer. Therefore, according to the present invention, the arrangement of the raised portion 50 is provided as compared with the case where it is difficult to route the printed wiring below the protruding portion where the support load of the connector housing 18 is concentrated. It is also possible to make the area a wiring area for printed wiring, and it is possible to achieve high density of printed wiring.

  In addition, since the raised portion 50 is provided in the placement portion 48 on the opening side of the connector mounting hole 28 that is farthest from the lead portion 22 in the placement region 46 of the connector housing 18, the lead portion 22 can be pressed against the pad portion 24 with a larger pressing force. In addition, the raised portion 50 has a long shape extending in the width direction of the connector mounting hole 28, and both end portions in the width direction of the raised portion 50 are positioned at both ends of the plurality of lead portions 22. It protrudes outward in the width direction. As a result, the connector housing 18 can be stably supported by the raised portion 50 on the opening side of the connector mounting hole 28, and all the lead portions 22 are more reliably pressed against the pad portion 24 more securely. be able to.

  As mentioned above, although several embodiment of this invention was explained in full detail, this invention is not limited by these specific description. For example, in the above-described embodiment, the raised portion 50 is provided in the mounting portion 48 on the opening side of the connector mounting hole 28 in the connector housing 18, but the connector so that the lead portion 22 is pressed against the pad portion 24. As long as the housing 18 can be inclined, it may be formed in any part. Moreover, the shape, the number, and the like of the raised portions 50 can be arbitrarily set. For example, a plurality of small raised portions may be provided in a dotted manner.

10: Connector mounting board, 12: Printed board, 14: Surface, 16: Connector, 18: Connector housing, 20: Connection terminal, 22: Lead part, 24: Pad part, 28: Connector mounting hole, 40: Back wall, 46: placement region, 48: placement site, 50: raised portion, 54: resist layer (insulating layer), 56: silk printing layer (insulating layer)

Claims (3)

A printed circuit board,
A connector surface-mounted on the printed circuit board;
While the connector includes a connector housing having a connector mounting hole that opens to the side, and a plurality of connection terminals accommodated and held in the connector housing,
In the connector mounting board, the lead portion of each connection terminal protruding through the inner wall of the connector mounting hole is conductively connected to the pad portion of the printed board by soldering.
In the mounting area of the connector housing of the printed circuit board, the connector is configured such that the lead portion protruding from the back wall of the connector housing is pressed against the pad portion by partially thickening an insulating layer. A raised portion is provided for placing the housing in an inclined state .
The raised portion extends with a length dimension larger than the length dimension between both end portions in the alignment direction of the plurality of lead portions,
A connector mounting board, wherein a region below the raised portion is a wiring region for printed wiring .   The connector mounting board according to claim 1, wherein the raised portion is provided at a mounting portion on the opening side of the connector mounting hole in the connector housing. While the plurality of lead portions protrude from the back wall of the connector mounting hole, the plurality of lead portions are arranged in a row apart from each other in the width direction of the connector mounting hole,
The raised portion has a long shape extending in the width direction of the connector mounting hole in the placement portion,
3. The connector according to claim 2, wherein both end portions of the raised portion in the width direction protrude outward in the width direction from the lead portions located at both ends of the plurality of the lead portions arranged in alignment. Mounting board.

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