JP2753190B2 - Surface mount type connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type connector.

[0002] A surface mount type connector is passed through a reflow furnace while being mounted on a circuit board, and a terminal portion is soldered to a pad on the circuit board and mounted on the circuit board.

[0003] In order to ensure that all the terminals are soldered to the pads, the terminals must be as close to the pads as possible while the surface mount connector is mounted on the circuit board. is necessary.

If the surface mount type connector is inclined in a direction of falling forward, the surface mount type connector is placed on the circuit board, so that the circuit board obstructs the surface of the plug connector. Insertion connection to the mounting type connector becomes difficult. For this reason, it is necessary to avoid that the surface mount type connector is inclined forward.

[0005]

2. Description of the Related Art FIG. 12 shows a conventional surface mount type connector 10 as an example.

The connector 10 comprises a resin-made block-shaped connector body 11 and a plurality of terminal members 12 incorporated in the connector body 10.

The terminal member 12 includes a contact portion 12a protruding forward from a front surface 11a of the connector main body 11, and a terminal portion 1 protruding rearward from a rear surface 11b of the connector main body 11.
2b.

The connector body 11 has a substantially rectangular parallelepiped shape, and the bottom surface 11c is flat.

The terminal 12b and the bottom surface 11c are connected to the terminal 1
2b is set to be slightly higher by about a (about 0.3 mm) than the bottom face 11c.

Before the connector 10 is passed through the reflow furnace, as shown in FIG.
c is placed and supported on a horizontal circuit board 13.

At this time, the terminal portion 12b is connected to the circuit board 13
A small dimension b (about 0.2 mm) floats from the surface of the solder layer 15 previously coated on the pad 14 of FIG.

Thus, the contact portion 12a is horizontal,
That is, it is parallel to the circuit board 13.

In this state, it is passed through a reflow furnace.

As a result, the solder layer 15 is melted, the terminal portions 12b are soldered to the pads 14, and the connector 10
The contact portion 12a is mounted on the circuit board 13 in parallel with the circuit board 13.

[0015]

SUMMARY OF THE INVENTION Terminal portions 12b _-1 to 12b _{-1 to} 12
The height of b- ₆ varies somewhat as shown in FIG. 13A, and this variation cannot be avoided. The amount of variation is c.

Conventionally, the thickness d of the solder layer 15 is 0.2 mm
It was relatively thick. Therefore, the solder layer 15
Was raised when the solder was melted, and the solder e was relatively large, and e> (d + b + c).

[0017] Therefore, even if there are variations in the terminal portion 12b _-1 ~12b _-6, is passed through a reflow furnace, the solder, as shown by reference numeral 16 in FIG. 13 (B), the terminal portions 12b _{- 1}
To 12b _-5 , and all terminal parts 12b _{-1 to} 12b
_-6 was soldered.

However, in recent years, the amount of solder used has been reduced, and the thickness of the solder layer on the pad tends to be thin.

FIG. 14A shows this example. The thickness f of the solder layer 20 is about half of the conventional thickness. For this reason, the amount g of swelling when the solder layer 20 is melted is also reduced.

As the thickness of the solder layer 20 is reduced, the dimension a is reduced and the terminal portions 12b _{-1 to} 12b are reduced.
_-6 from the surface of the solder layer 20 is the above-mentioned dimension b.
More.

However, g <(f + h + c), and the variation c of the height of the terminal portions 12b _{-1 to} 12b _-6 cannot be covered depending on the amount of swelling when the solder layer 17 is melted, and FIG. As shown in (1), depending on the terminal portion, there is a possibility that a solder-unattached portion may occur as shown by reference numerals 21 and 22. If the unsoldered portion occurs, the mounting of the surface mount connector becomes defective. Therefore, the present invention
An object of the present invention is to provide a surface mount type connector that solves the above-mentioned problems.

[0022]

According to a first aspect of the present invention, there is provided a connector body made of an electrical insulator, having a contact portion at one end and a terminal portion at the other end, and is incorporated in the connector body. A plurality of terminal members, wherein the terminal portion extends from a back surface of the connector main body, the connector main body is supported on a circuit board, and the terminal portion is connected to a pad on the circuit board. In the surface mount type connector having the configuration, in a state where the surface mount type connector is mounted on the circuit board, an inclination means for inclining the surface mount type connector in a direction in which the terminal portion approaches the circuit board is provided. The configuration is as follows.

According to a second aspect of the present invention, the tilting means of the first aspect is provided at a portion of the bottom surface of the connector main body which is deviated from the center of gravity of the surface mount type connector toward the contact portion, and the terminal is provided. This is a configuration in which it is a projection projecting below the portion.

[0024]

According to the structure of the present invention, the terminal portion comes into contact with the pad on the circuit board in a state where the surface mount connector is mounted on the circuit board, and the contact portion is provided. It acts so as to face diagonally upward.

According to a second aspect of the present invention, the inclination means is a projection.
It works as feasible with modification of the current product.

[0026]

【Example】

First Embodiment FIGS. 1 to 3 show a surface mount type connector 30 according to a first embodiment of the present invention. The connector 30
The connector is of a type that is surface-mounted on a portion of the circuit board remote from the edge, and includes a connector main body 31 and a connector main body 31.
The six terminal members 32-
37.

The connector main body 31 is made of an electrically insulating synthetic resin and has a substantially rectangular parallelepiped shape.

The terminal members 32-37 are connected to the connector body 31.
Contact portions 32a to 37a projecting from the front surface 31a of the connector body 31 and arranged in two rows, and terminal portions 32b to 37b projecting from the rear surface 31b of the connector main body 31.

As shown in FIG. 2, each terminal portion 32b-37
b is a dimension 1 slightly smaller than the bottom surface 31c of the connector body 31.
Only located below.

The dimension m of each of the terminal portions 32b to 37b from the back surface 31b of the connector main body 31 is equal.

Thus, the terminal portions 32b to 37b are arranged in a line.

The height of the terminal portions 32b to 37b is as shown in FIG.
As shown in (A), the dimension c varies.

Next, the main part of the present invention will be described.

Reference numerals 40 and 41 denote substantially hemispherical projections, which are formed on the bottom surface 31c of the connector main body 31 at portions facing the front surface 31a and on the left and right end sides.

The protrusions 40 and 41 are connected to the center of gravity G of the connector 31.
It is located at a site offset dimension n to the front 31a side of the _1.

The protrusions 40 and 41 have a protrusion dimension of 0, and the protrusions 40 and 41 protrude below the terminal 32b by a dimension p.

The dimension p is set larger than a dimension q described later.

The connector body 31 is a resin molded product, and the projections 40 and 41 can be formed by partially modifying a molding die currently in use.

Next, mounting of the connector 30 having the above configuration will be described.

The pads 14 are arranged on the circuit board 13A, and the thin solder layer 2 having a thickness f is formed on the upper surface of each pad 14.
0 is formed. Solder layer 2 from the surface of circuit board 13A
The protrusion dimension to the surface of 0 is q.

When the connector 30 is mounted on the circuit board 13A, it becomes as shown in FIG.

That is, the projections 40 and 41 come into contact with the circuit board 50, and a clockwise moment acts on the connector 30 around the projections 40 and 41 as indicated by the arrow M, as shown in FIG. ), Some of the terminal portions 32b, 3
4b and 36b are in contact with the solder layer 20, and FIG.
The dimension h in 4 (A) is zero.

For this reason, the terminal portions 33b, 35b, 37b
The floating dimension s from the solder layer 20 is as small as the above-mentioned dimension c.

(Thickness f of solder layer 20 + floating dimension s)
Comparing the swell amount g when the solder layer 20 is melted, g> (f + s).

For this reason, when it is passed through a reflow furnace, it becomes as shown in FIGS. 5 and 6 (B).

Reference numeral 51 denotes solder.

The solder 51 is connected to the terminal portions 32b, 34b, 36
b, as well as the terminal portions 33b, 35b, 37b without fail, and all the terminal portions 32b to 37b are soldered to the pads 14.

As shown in FIG. 4, the connector 30 is inclined in a direction in which the terminal portions 32b are lowered from the horizontal position, and the contact portions 32a and the like face obliquely upward. The inclination angle α is about 1 degree.

For this reason, a plug connector (not shown)
Are mounted on the connector 30 without any trouble.

[Second Embodiment] FIGS. 7 and 8 show a surface mount type connector 70 according to a second embodiment of the present invention. The connector 70 is of a type that is surface-mounted at the cutout portion 81 of the circuit board 13B.
And a plurality of terminal members 72 incorporated in the connector main body 71.

The connector main body 71 has a main body 71a and an L-shaped arm 71 extending left and right from the main body 71a.
b, 71c. On the lower surfaces of the arms 71b and 71c, projections 71d and 71e are provided in a hemispherical shape.

The terminal member 72 has a contact portion 72 at one end.
a, and has a terminal portion 72b at the other end. Contact part 72a
Is incorporated in the main body 71a. The terminal portion 72b
It protrudes backward from the back surface 71a- ₁ of the main body 71a,
They are arranged in a line.

[0053] projections 71d, 71e is the anterior surface of a contact part 72a (main body portion 71a from the center of gravity G ₂ of the connector 70 7
1a _-2 ) It is located at a position deviated by the dimension u toward the side, and protrudes below the terminal portion 72b to the height of the dimension v.

As shown in FIGS. 9, 10 and 11, the connector 70 is formed by fitting a part of the main body 71a into the notch 81 and locking the arms 71b and 71c to the circuit board 13B. , Placed on the circuit board 13B and passed through a reflow furnace. The terminal portion 72b is soldered to the pad 14.

In view of the arrangement of the protrusions 72d and 72e, the connector 70 is mounted on the circuit board 81,
In Figure 8 the connector 70, the terminal portion 72b indicated by the arrow M ₁
Occurs direction of moment down is slightly inclined in the arrow M ₁ direction, a state in which the terminal portion 72b is in contact with the pad 14.

As a result, all the terminal portions 72b are securely soldered to the pad 14, similarly to the above embodiment.

The present invention can also be realized by providing a projection at a predetermined position on a portion of the circuit board where the surface mount connector is to be mounted. However, providing the projection on the circuit board is more troublesome than providing the projection on the connector body.

[0058]

As described above, according to the first aspect of the present invention, the terminal portion always comes into contact with the pad when the surface mount type connector is mounted on the circuit board. Is not in a state of floating from the pad, the terminal part is in a state of contacting the pad and is passed through the reflow furnace, even if the thickness of the solder layer on the pad is thin, all Can be securely soldered to the pad, and can be mounted with high reliability.

Further, since the contact portion is directed obliquely upward, the surface mount connector can be mounted in such a posture that the plug connector can be connected without hindrance by the circuit board.

According to the second aspect of the present invention, it can be easily realized by partially modifying the molding die of the connector body of the current surface mount type connector.

[Brief description of the drawings]

FIG. 1 is a perspective view of a surface mount type connector according to a first embodiment of the present invention.

FIG. 2 is a side view of the surface mount connector of FIG. 1;

FIG. 3 is a front view of the surface mount connector of FIG. 1;

FIG. 4 is a diagram showing a state when the surface mount connector of FIG. 1 is mounted on a circuit board.

FIG. 5 is a diagram showing a state in which the surface mount connector of FIG. 1 is mounted on a circuit board.

FIG. 6 is a diagram showing a relationship between a terminal portion and a pad during mounting and after mounting.

FIG. 7 is a perspective view of a surface mount type connector according to a second embodiment of the present invention.

FIG. 8 is an enlarged side view of the surface mount connector of FIG. 7;

FIG. 9 is a side view of the surface mounted connector of FIG. 7 in a mounted state.

FIG. 10 is a front view of the surface mounted connector of FIG. 7 in a mounted state.

FIG. 11 is a plan view showing a mounted state of the surface mount connector of FIG. 7;

FIG. 12 is a side view of a conventional example of a surface mount type connector.

FIG. 13 is a diagram showing a relationship between a terminal portion and a pad at the time of mounting and after mounting when the solder layer is thick.

FIG. 14 is a diagram showing a relationship between a terminal portion and a pad at the time of mounting and after mounting when the solder layer is thin.

[Explanation of symbols]

 13A, 13B Circuit board 14 Pad 20 Thin solder layer 30, 70 Surface mount type connector 31, 71 Connector body 32, -37, 72 Terminal member 32a-37a, 72a Contact part 32b-37b, 72b Terminal part 40, 41 Projection 51 Solder 71a Body 71b, 71c Arm 71d, 71e Projection

Claims (2)

(57) [Claims] A connector body (31, 7) made of an electrical insulator.
1), a plurality of terminal members (32 to 37, 72) having a contact portion (32a, 72a) at one end and a terminal portion (32b, 72b) at the other end, and being incorporated in the connector body. Wherein the terminal portion extends from the back surface (31b) of the connector main body, the connector main body is supported on a circuit board, and the terminal portion is connected to a pad on the circuit board. The tilting means (40, 41) for tilting the surface mount connector in a direction in which the terminal portion approaches the circuit board in a state where the surface mount connector is mounted on the circuit board. ,
71d, 71e) is provided. 2. The inclining means according to claim 1, wherein the inclining means is provided at a portion of the bottom surface of the connector main body which is deviated from the center of gravity of the surface mount type connector toward the contact portion, and protrudes below the terminal portion. Projections (40, 41,
71d, 71e). A surface mount type connector characterized in that: