JPH07193169A - Resin-sealed semiconductor device and mounting method thereof - Google Patents

Abstract

PURPOSE:To provide a resin-sealed semiconductor device and the mounting method thereof, which is suitable for accomplishing highdensity mounting especially from the view point of the achievement of a thin, compact configuration of a system by improving the package main body of the resin-sealed type semiconductor device and the mounting method thereof. CONSTITUTION:Outer leads 2 are guided out from one edge of a package main body l. In this resin-sealed type semiconductor device, at least two protruding parts 3 outside both end pins of the outer leads 2 are provided at the side edge part at the opposite side of one side edge of the package main body 1 or the lower surface of the same positions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-encapsulated semiconductor device and a method of mounting the same, and more particularly to a resin having a structure of a resin-encapsulated semiconductor device suitable for thinning the device and increasing the mounting density. The present invention relates to a sealed semiconductor device and a mounting method thereof.

[0002]

2. Description of the Related Art A single-in-line-package (SIP) type LSI is used as this type of resin-sealed semiconductor device.
2. Description of the Related Art There is a package (hereinafter referred to as a package), and a conventional example thereof is disclosed in Japanese Patent Laid-Open No. 4-209559. FIG. 15 is a structural explanatory view by a perspective view (left side) and a side view (right side) of the package of the conventional resin-sealed semiconductor device shown in this publication. In the figure, 1 is a package body, 2 is a plurality of external leads that are usually led out from one end surface of the package body 1 at the same pitch, and are bent in the direction of the lower surface 1a of the package body 1, and the tips thereof are Further, it is bent in a direction parallel to the lower surface 1a and processed to be flat, and the flat surfaces are arranged so as to be flush with each other. Further, the convex portion 3 is provided on the lower surface 1a near the other side end surface facing the one end surface of the package body 1 from which the external lead 2 is led out.
The convex portion 3 is formed so that its tip has a height substantially equal to that of the flat portion at the tip of the external lead 2.

The conventional package body 1 constructed as described above is mounted so that the flat portions of the external leads 2 and the tips of the convex portions 3 are in contact with the surface of the printed circuit board 4, and the external lead 2 is mounted on the printed circuit board. No. 4 conductor pattern (not shown) is soldered and mounted at a predetermined position. Therefore, a space is formed between the lower surface 1a and the printed board 4. This structure is obtained because the main surface of the tip of the external lead is led out from one end surface of the package body and the convex portion is provided on the bottom surface near the other end surface of the package body. In addition to achieving the above, the space like a gap formed between the lower surface 1a and the printed circuit board 4 described above is used as the flow path of the cleaning liquid, so that the flux can be easily cleaned after soldering. It has become.

[0004]

In the conventional package as described above, the outermost two outer leads, which are led out from one end surface of the package body and arranged, and the bottom surface in the vicinity of the other side end surface. Since the provided convex portion is present at the same position in the length direction of the external lead, there is a problem in that it is insufficient in terms of increasing the mounting density in board mounting and downsizing the semiconductor device. As a method of mounting the semiconductor device, for example, a case of a recent memory card is shown in FIG.
Will be described with reference to the side view. The development of this card is remarkable, and there is an increasing demand for thinner and smaller system (card). Here, as shown in FIG. 16, a plurality of package main bodies 1 are arranged vertically and horizontally as close to each other as possible to be mounted on the printed circuit board 4 to increase the mounting density. However, as shown in the figure, up to the state in which the tips of the outer leads 2 and the buttocks of the protrusions 3 are in contact with each other is the limit at which they can be brought closest to each other.
In other words, this point has been the limit of miniaturization in the conventional package as shown in FIG.

Therefore, how to efficiently mount a semiconductor device such as a memory card in addition to thinning and downsizing has recently become a particularly important issue. From this point of view, the package body of FIG. 15 is excellent in terms of cleaning after mounting, but it has an insufficient structure from the viewpoint of increasing the mounting density, and the mounting method itself is satisfactory. There is a problem that it is not intended to be done.

The present invention has been made in order to solve the above-mentioned problems, and by improving the package body of the resin-sealed semiconductor device and the mounting method thereof, it is possible to reduce the thickness and size of the system. From a viewpoint, it is an object of the present invention to provide a resin-sealed semiconductor device suitable for achieving high-density mounting and a mounting method thereof.

[0007]

A first resin-encapsulated semiconductor device according to the present invention is a resin-encapsulated semiconductor device in which external leads are led out from one end face of a package body. At least two convex portions are provided on the side end surface portion located on the outer side of the pin and opposite to the one end surface of the package body or the lower surface at the same position. In this case, instead of providing at least two convex portions on both ends, a plurality of convex portions located outside the external leads and between the leads may be provided.

According to a first method of mounting a resin-sealed semiconductor device of the present invention, a plurality of resin-sealed semiconductor devices in which external leads are led out from one end face of a package body are closely attached to a substrate. A method of mounting a resin-encapsulated semiconductor device to be mounted in parallel, wherein the package body is formed on a side end surface portion opposite to one end surface or on a lower surface at the same position as a position not overlapping the external lead installation position. Place the package with the convex part on the predetermined position of the board, and with the tip of the external lead of the adjacent one package protruding beyond the position where the convex part of the other package is formed and protruding into the lower surface of the package body, This is to solder the leads.

A second resin-encapsulated semiconductor device according to the present invention is a resin-encapsulated semiconductor device in which external leads are led out from one end surface of a package body, and the tips of the external leads are mounted obliquely. It is bent according to the inclination of the package body. In this case, the external leads are bent in accordance with the inclination of the package body that is obliquely mounted, and one end face from which the external leads are led out is also cut obliquely to form the same flat surface with each other. It may be Further, the side end surface on the opposite side to the one end surface from which the external lead is led may be cut obliquely according to the inclination of the package body to be mounted.

A third resin-encapsulated semiconductor device according to the present invention is the same as the second resin-encapsulated semiconductor device according to the preceding paragraph, in the vicinity of the central portion of the lower surface of the package body, a linear protrusion parallel to one end face. Part or at least two point-like convex parts.

According to a second method of mounting a resin-sealed semiconductor device of the present invention, a plurality of resin-sealed semiconductor devices having external leads led out from one end surface of a package body are closely contacted to a substrate. A method of mounting a resin-encapsulated semiconductor device, which is mounted at an angle, comprising: an external lead of a package body; a side face of the package body from which the external lead is led out; To form a flat part by diagonally mounting it so that the flat part on the external lead side of the flat part is diagonally overlapped with the lower surface and the upper surface of the package body adjacent to the surface of the substrate. It is installed and the packages are fixed and mounted. In this case, the portions where the lower surface and the upper surface of the adjacent package main bodies are diagonally overlapped may be bonded with an adhesive to fix the packages to each other for mounting.

A printed circuit board according to the present invention is a printed circuit board for mounting a resin-sealed semiconductor device in which external leads are led out from one end surface of a package body, wherein the package mounted on the printed circuit board is In the case of a third resin-encapsulated semiconductor device that has a convex portion provided in the substantially central portion of the lower surface of the package body, it is formed at a position where it abuts the printed circuit board during mounting, and It has a hole formed in a small size, and the tip of the convex portion is inserted into this hole and processed so that the package is obliquely mounted on the printed circuit board.

[0013]

In the resin-encapsulated semiconductor device and the method of mounting the same according to the present invention, first, the convex portion is formed on the end face opposite to the side face where the external lead is led out or on the end thereof so as not to overlap with the external lead. Since the tips of the adjacent external leads are soldered in the state where the tips of the adjacent external leads enter the gap formed between the lower surface of the package and the board, the mounting area becomes smaller and Since there is also a gap between the convex portion and the convex portion, the efficiency of flux cleaning after soldering can be improved. Secondly, the external leads are bent, the side end surface of the lead-out portion and the opposite end surface thereof are cut to be flat, and the convex portion is provided at the center of the lower surface, so that a plurality of parts can be formed on the substrate. Since the packages can be set diagonally, it is possible to stack them diagonally and mount them.
As the mounting density increases, it can be mounted firmly even if it is mounted diagonally.

[0014]

【Example】

Example 1 In this example, several structures of the package of the resin-sealed semiconductor device according to the present invention will be described. First, FIG. 1 is a structural explanatory view showing a first embodiment of the present invention and FIG. 2 is a second embodiment of the present invention. In both figures, the right side is a perspective view and the left side is a plan view of the bottom surface. A plurality of external leads 2 are led out from one end surface of the package body 1 at the same pitch, and both ends of the opposite end surface (Fig. 1) and corners or both side surfaces of a side bottom surface (Fig. 2) perpendicular to the side end surface. Is provided with a pair of convex portions. Convex portion 3 of FIG.
2 is a dot-shaped (hump-shaped), and the convex portion 3a in FIG. 2 is a linear (frame-shaped) convex portion. Like the conventional example in FIG. It is formed so as to be at the same level as the flat part of the tip of the lead 2. Then, as seen in the plan views of both figures, they are provided outside so as not to hit the pins at both ends of the external lead 2.

FIG. 3 is a structural explanatory view showing a third embodiment of the present invention, and FIG. 4 is a structural explanatory view showing a fourth embodiment of the present invention. In both figures, the right side is a perspective view and the left side is a plan view of the bottom surface. The embodiments of FIGS. 3 and 4 correspond to the embodiments of FIGS. 1 and 2, respectively, and both have the same convex portion 3 and convex portion 3a between the outer convex portion 3 and the convex portion 3a, respectively. It is arranged. Therefore, in particular, the convex portion 3a in FIG. 4 is formed in a striped shape. The shape and formation position of the convex portion are the same as those in FIGS. 1 and 2, and both are formed so as not to overlap or abut the position of the external lead 2. Others are the same as in the case of FIG. 1 and FIG. 2, and thus description thereof will be omitted.

FIG. 5 is a side view showing an embodiment in which the above-mentioned embodiment package is mounted horizontally on a board. This figure corresponds to the conventional example of FIG. 16, and the upper side shows a side view of two packages as an example, and the lower side shows an enlarged view of the A portion. As can be seen in the figure, when the embodiment packages of FIGS. 1 to 4 are used, the tips of the external leads 2 of the adjacent package body 1 can enter under the lower surface 1a, so that the bending of the external leads 2 can be prevented. It is possible to mount the two package bodies 1 close to each other in a docked state until the point and the side end surface of the package body 1 on the right side of the drawing are in contact with each other. Therefore, as much as this entered,
The mounting area can be reduced, and the effect is particularly exerted against the increase in mounting density. In addition, since a gap-like space is formed between the lower surface 1a and the printed circuit board 4 as in the conventional case, cleaning after soldering can be carried out without any trouble.

[Embodiment 2] In the present embodiment, various mounting modes in which the form of the resin-encapsulated semiconductor device according to the present invention is applied or modified will be described by taking a case of a memory card as an example. First, FIG. 6 is a sectional explanatory view showing an embodiment of a mounting method according to the present invention for mounting a large number of packages on a memory card at a high density. In this case,
In order to achieve higher density than the mounting method described above, the package bodies 1 to be arranged in at least the same direction are mounted on the printed circuit board 4 at an angle so as to overlap each other, and mounting is performed as a whole. Shows a state in which the semiconductor device mounted thinly is covered with the cover 5 of the card. As shown in the figure, the package used in this case is not the one to which some of the ones described in the first embodiment are applied as it is, but the package applicable to this mounting method is modified as follows. (Modificati
on) form, and the mounting method thereof will be described.

The package shown in FIGS. 7 and 8 corresponds to the leftmost package shown in FIG. 6, and has a dotted convex portion near the center of the lower surface 1a of the package body 1 in parallel with the side end surface. 7 is provided with a side surface portion (FIG. 7) or a linear convex portion 7a (FIG. 8). In this structure, the external lead 2 is deformed and soldered as shown in FIG. 6 by utilizing the inclination of the package due to the height of the convex portion 7 or 7a, so that the mounting inclination of a predetermined angle with respect to the printed circuit board 4 is obtained. It is easy to maintain and therefore easy to implement. Therefore, it becomes easy to arrange this type of package at the end of the array and stack and mount a simple package without the convex portions 7 and 7a on the basis of this. The package body 1
It is necessary to form a side surface cut 6 on the side end surface of the upper part of the so as to be parallel to the printed board 4. In FIG. 6, a package as shown in the sectional view of FIG. 9 is used as a simple package without the convex portions 7 and 7a just described. In the package of FIG. 9, the tips of the external leads 2 are bent according to the mounting inclination. That is, when the mounting is performed with a predetermined inclination, the bending angle is bent as shown in FIG. 9 according to the inclination. The side point surface on the opposite side is also cut at the same angle to form a side surface cut 6 parallel to the surface of the printed board 4.

The package shown in FIG. 10 shows a modification of the package shown in FIG. 9, and is suitable for use in the mounting method shown in FIG. 6 like the package shown in FIG. As shown in FIG. 10, the outer lead 2 is bent from the root of the lead-out portion,
After all, the angle is set according to the inclination of the mounting.
Therefore, side surface cuts 6 are formed on the upper and lower sides of the package body 1, and these are mounted in parallel with the surface of the printed board 4. The feature of this package is that it is more suitable for thinning than the package shown in FIG.

The package shown in FIG. 11 is obtained by modifying the external lead 2 shown in FIG. 7, for example, and corresponds to the package used for the leftmost package shown in FIG. It is characterized in that the tip portion of the external lead 2 is inclined according to the inclination angle of the package, the upper side cut 6 is further provided, and the convex portion 7 is used as a stick to stabilize the angle setting. .

FIG. 12 shows an example in which the mounting method of the package shown in FIG. 11 is modified. A hole 8 having a predetermined size is provided at a predetermined position of the printed board 4, and the hole 8 is formed, for example, as shown in FIG. The tip of the convex portion 7 of the package is partially fitted and fixed so that the mounting inclination of the package can be adjusted to be smaller. Therefore, this mounting method is also characterized in that it contributes to achievement of thinning. Needless to say, the hole 8 is formed smaller than the convex portion 7.

FIG. 13 is a cross-sectional explanatory view showing a method for surely arranging the packages shown in FIG. 10 when they are overlapped with each other. As shown in the figure, the overlapping portion of the front surface and the back surface of the package body 1 having no convex portion is bonded with the adhesive 9 in a tilted state to firmly fix the package tilt and the entire assembly. It is a thing. It is intended to provide a mounting method useful for forming a strong card.

FIG. 14 also shows another embodiment of the robust mounting method. For example, the package body 1 has external leads 2
A protrusion 10 is formed in the vicinity of the root of the outer lead 2, and a side cut 6 at the same level as the flat portion of the external lead 2 is formed on the extension of the protrusion.
And a hole 8 adapted to the protrusion 10 is provided on the printed circuit board 4 side. The protrusion 10 is inserted into the hole 8 so that the package can maintain a predetermined inclination. Also in this case, the side cut 6 and the printed circuit board 4 may be fixed to each other with an adhesive at the overlapping portion.

As described above, in the second embodiment, various mounting methods by modifying the package body and the external leads have been described. Extremely high density like a memory card
For semiconductor devices that are required to be thin, it is necessary to incline the packages and stack them as much as possible as shown in the example of the embodiment. By adopting some of the methods shown in the present embodiment or a combination thereof, high-density mounting as shown in FIG. 6 can be achieved with thinness and certainty.

[0025]

As described above, according to the present invention, first, at least two protrusions are formed on the end face opposite to the end face on which the outer lead of the package is led out or at its end so as not to overlap with the outer lead. Since the part is provided, the tip of the adjacent external lead will sound so that it can be soldered in the gap formed between the lower surface of the package and the board, and the effect that the mounting area will be reduced by that amount can get. In this case, since there is a gap between the convex portions as well, the efficiency of flux cleaning after soldering is further increased. Next, the external leads are bent, the side end surface of the lead-out portion and the opposite end surface are cut and made flat, and a convex portion is provided in the central portion of the lower surface. Since they can be set diagonally, the mounting inclination can be easily maintained, and the packages can be mounted by stacking them obliquely, which has an effect of increasing the mounting density and also being capable of firmly mounting even when mounted obliquely. Then, by utilizing these effects, a packaging method of a resin-sealed semiconductor device having a high packaging density, which is thin and easy to be miniaturized, has been achieved. In addition, in the case of diagonal mounting, a convex part that functions like a stick is provided in the center of the bottom surface of the package so that the package can be mounted with a certain inclination, and this convex part can be inserted into the hole of the board or the upper surface of the overlapping package. Since the lower surface is attached with an adhesive etc. to firmly fix the inclination,
High-precision high-density mounting has become possible.

[Brief description of drawings]

FIG. 1 is a structural explanatory view showing a first embodiment of a package according to the present invention.

FIG. 2 is a structural explanatory view showing a second embodiment of the package according to the present invention.

FIG. 3 is a structural explanatory view showing a third embodiment of the package according to the present invention.

FIG. 4 is a structural explanatory view showing a fourth embodiment of the package according to the present invention.

FIG. 5 is a side view illustrating an embodiment of the first mounting method according to the present invention.

FIG. 6 is an explanatory sectional view showing an embodiment of a second mounting method according to the present invention.

FIG. 7 is a structural explanatory view showing another embodiment of the package according to the present invention.

FIG. 8 is a structural explanatory view showing another embodiment of the package according to the present invention.

FIG. 9 is a structural explanatory view showing an example of diagonal mounting of a package according to the present invention.

FIG. 10 is a structural explanatory view showing another embodiment of oblique mounting of the package according to the present invention.

FIG. 11 is a structural explanatory view showing another embodiment of oblique mounting of the package according to the present invention.

FIG. 12 is a structural explanatory view showing another embodiment of oblique mounting of the package according to the present invention.

FIG. 13 is a structural explanatory view showing another embodiment of oblique mounting of the package according to the present invention.

FIG. 14 is a structural explanatory view showing another embodiment of oblique mounting of the package according to the present invention.

FIG. 15 is a structural explanatory view of a conventional resin-encapsulated semiconductor device in perspective view and side view.

FIG. 16 is an explanatory diagram showing a conventional high-density mounting method for a resin-sealed semiconductor device.

[Explanation of symbols]

 1 Package body 1a Lower surface 2 External lead 3,3a Convex part 4 Printed circuit board 5 Cover 6 Side cut 7,7a Convex part 8 Hole 9 Adhesive 10 Protrusion

Claims (11)

[Claims] 1. A resin-encapsulated semiconductor device in which external leads are led out from one end surface of a package body, which is located outside both end pins of the external leads and which is opposite to one end surface of the package body. A resin-sealed semiconductor device, characterized in that at least two convex portions are provided on a side end face portion or a lower face at the same position as the side end face portion. 2. A plurality of convex portions located outside the outer lead and between the leads are provided instead of providing the at least two convex portions at both ends.
The resin-encapsulated semiconductor device described. 3. A resin-encapsulated semiconductor device in which external leads are led out from one end surface of a package body, wherein tips of the external leads are bent in accordance with an inclination of the package body which is obliquely mounted. A resin-encapsulated semiconductor device characterized by the above. 4. A resin-sealed semiconductor device in which external leads are led out from one end face of a package body, wherein the external leads are bent in accordance with the inclination of the package body that is obliquely mounted, and The resin-encapsulated semiconductor device is also characterized in that the one end face from which the external lead is led is also cut obliquely to form the same flat surface with each other. 5. A resin-sealed semiconductor device in which external leads are led out from one end surface of a package body, wherein a side end surface opposite to the one end surface in which the external leads are led out is mounted. A resin-encapsulated semiconductor device, which is cut obliquely according to the inclination of the package body. 6. A linear convex portion or at least two dot-shaped convex portions parallel to the one end face is provided in the vicinity of a central portion of a lower surface of the package body.
The resin-encapsulated semiconductor device according to claim 4 or 5. 7. A printed circuit board for mounting a resin-sealed semiconductor device in which external leads are led out from one end surface of the package body, wherein a lower surface of the package body of the package mounted on the printed circuit board is substantially formed. The convex portion provided in the central portion is formed at a position where it abuts on the printed circuit board during mounting, and has a hole formed with a size smaller than the size of the convex portion, and the tip of the convex portion is inserted into this hole. The printed circuit board is processed so that the package is obliquely mounted on the printed circuit board. 8. The package body is provided with a convex bar-like projection on the lower surface of the package body such that the package body forms a predetermined inclination when the package is mounted on a printed circuit board. The resin-encapsulated semiconductor device described. 9. A mounting method for a resin-sealed semiconductor device, comprising mounting a plurality of resin-sealed semiconductor devices, each of which external leads are led out from one end surface of a package body, in close contact with each other and in parallel with a substrate. A package having a convex portion formed on a side end surface portion opposite to one end surface of the package body or on a lower surface at the same position as the package body at a position not overlapping the installation position of the external lead is placed at a predetermined position on the substrate The external leads of one package adjacent to each other are soldered to each other while the tips of the external leads project beyond the formation positions of the convex portions of the other package and project into the lower surface of the package body. Mounting method of sealed semiconductor device. 10. A method of mounting a resin-sealed semiconductor device, comprising mounting a plurality of resin-sealed semiconductor devices, each of which external leads are led out from one end surface of a package body, in close contact with each other and inclined to a substrate. And the external lead of the package body, and one end surface of the package body from which the external lead is led,
A side end surface on the opposite side is cut so as to be obliquely mounted on the substrate to form a flat portion, and the flat portion on the external lead side of the flat portion is adjacent to the surface of the substrate. A method for mounting a resin-encapsulated semiconductor device, characterized in that the package main body is installed such that the lower surface and the upper surface of the package obliquely overlap each other, and the packages are fixed and mounted. 11. The resin encapsulation according to claim 10, wherein the portions where the lower surface and the upper surface of the adjacent package main bodies are diagonally overlapped are adhered to each other with an adhesive to fix the packages to each other. Type semiconductor device mounting method.