JPS60130673U - Device to prevent soldering defects caused by gas protrusion from printed wiring boards - Google Patents
Device to prevent soldering defects caused by gas protrusion from printed wiring boardsInfo
- Publication number
- JPS60130673U JPS60130673U JP1854784U JP1854784U JPS60130673U JP S60130673 U JPS60130673 U JP S60130673U JP 1854784 U JP1854784 U JP 1854784U JP 1854784 U JP1854784 U JP 1854784U JP S60130673 U JPS60130673 U JP S60130673U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- hole
- electronic component
- wiring boards
- defects caused
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第３図は、半田デイツプ時におけるホール内
か゛らのガスの突出によりランドの溶融半田が飛散する
過程を示す従来のプＩＪ ７ ト配線基板の要部断面図
、第４図及び第５図は、従来のホー−ル内カーらガス抜
きを行うべく電子部品のリード線を折り曲げ加工して、
該電子部品をプリント配線基板にマウントする状態の要
部断面図、第６図は、本考案に係るプリント配線基板の
ガス突出による半田付は不良防止装置の一実施例を示す
要部平面図、第７図は、電子部品がマウントされる状態
を示す第６図のＩ−Ｉ線断面図、第８図は、電子部品が
マウントされる状態を示す第６図の■−■線断面図、第
９図は、第８図における半田デイツプ時のホール内のガ
ス抜は状態を示す断面図、第１０図は、第８図において
、ホール内のガスが抜けてランドの半田が固化した状態
を示す断面図である。
１１・・・プリント配線基板、１２・・・電子部品、１
３ ａ、 １３ ｂ・・・リード線、１４．１６−・
・ホーール、１５・・・突起層、１７・・・溶融半田、
１７ａ・・・固化し 、た半田、１８・・・空隙、１
９・・・ランド。1 to 3 are cross-sectional views of main parts of a conventional printed circuit board, showing the process in which molten solder on lands is scattered due to the protrusion of gas from inside holes during solder dipping, and FIG. 4 and FIG. Figure 5 shows how the lead wires of electronic components are bent to vent gas from the conventional car in the hall.
FIG. 6 is a cross-sectional view of the main part of the electronic component mounted on the printed wiring board, and FIG. FIG. 7 is a cross-sectional view taken along the line I--I in FIG. 6 showing a state in which electronic components are mounted, and FIG. 8 is a cross-sectional view taken along the line ■-■ in FIG. 6 showing a state in which electronic components are mounted. Figure 9 is a cross-sectional view showing the state in which the gas in the hole is vented during solder dip in Figure 8, and Figure 10 is a cross-sectional view showing the state in which the gas in the hole has escaped and the solder on the land has solidified in Figure 8. FIG. 11...Printed wiring board, 12...Electronic component, 1
3 a, 13 b...Lead wire, 14.16-...
・Hole, 15... Projection layer, 17... Molten solder,
17a... solidified solder, 18... void, 1
9... Land.
Claims (1)
品をマウントすべくホールが穿設されたプリント配線基
板において、前記プリント配線基板への電子部品のマウ
ントによっても、ホール内を外部と連通可能に、ホール
周縁と電子部品との間に空隙を持たせるべく、ホールの
縁部付近に電子部品と当接する所定の層厚の突起層を形
成してなることを特徴とするプリント配線基板のガス突
出による半田付は不良防止装置。In a printed wiring board on which a predetermined wiring pattern is formed with copper foil and a hole is bored for mounting an electronic component, the inside of the hole can be communicated with the outside even when the electronic component is mounted on the printed wiring board. , a gas protrusion of a printed wiring board characterized in that a protrusion layer of a predetermined thickness is formed near the edge of the hole and comes into contact with the electronic component in order to create a gap between the edge of the hole and the electronic component. Soldering is a defect prevention device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1854784U JPS60130673U (en) | 1984-02-10 | 1984-02-10 | Device to prevent soldering defects caused by gas protrusion from printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1854784U JPS60130673U (en) | 1984-02-10 | 1984-02-10 | Device to prevent soldering defects caused by gas protrusion from printed wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60130673U true JPS60130673U (en) | 1985-09-02 |
Family
ID=30507291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1854784U Pending JPS60130673U (en) | 1984-02-10 | 1984-02-10 | Device to prevent soldering defects caused by gas protrusion from printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130673U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017028215A (en) * | 2015-07-28 | 2017-02-02 | 住友電装株式会社 | Connector mounting substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5246261B2 (en) * | 1975-04-14 | 1977-11-22 |
-
1984
- 1984-02-10 JP JP1854784U patent/JPS60130673U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5246261B2 (en) * | 1975-04-14 | 1977-11-22 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017028215A (en) * | 2015-07-28 | 2017-02-02 | 住友電装株式会社 | Connector mounting substrate |
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