JPS6023995Y2 - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS6023995Y2 JPS6023995Y2 JP9098179U JP9098179U JPS6023995Y2 JP S6023995 Y2 JPS6023995 Y2 JP S6023995Y2 JP 9098179 U JP9098179 U JP 9098179U JP 9098179 U JP9098179 U JP 9098179U JP S6023995 Y2 JPS6023995 Y2 JP S6023995Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- components
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
本考案は、リードレス部品とリード付部品とがプリント
基板に取付けられるプリント配線基板に関するものであ
り、プリント基板が反ってもり−ドレス部品の半田付部
分にひびが入ることがなく、しかも部品を比較的高密度
に取付けることができるプリント配線基板を提供しよう
とするものである。[Detailed description of the invention] The invention relates to a printed wiring board in which leadless components and leaded components are attached to a printed circuit board, and the printed circuit board warps and cracks occur in the soldered parts of the dressed components. The object of the present invention is to provide a printed wiring board on which components can be mounted at a relatively high density without causing problems.
１０ｃｒｎＸ１０ｃｍ以上の面積を持つプリント基板で
は、半田デイツプ槽で半田付けをすると、その時の熱に
よってプリント基板が少し反ることがある。When a printed circuit board with an area of 10 crn x 10 cm or more is soldered in a solder dip bath, the printed circuit board may warp slightly due to the heat generated.
このため、プリント基板の裏面の銅箔に剛性の大きい抵
抗等のリードレス部品が半田付けされている場合には、
上述の反りによってその半田付部分にひびが入ることが
ある。For this reason, if leadless components such as highly rigid resistors are soldered to the copper foil on the back of the printed circuit board,
The above-mentioned warping may cause cracks in the soldered portion.
そこで、本考案は、半田デイツプ槽による半田付けの際
にプリント基板が反った場合にでもり−ドレス部品の半
田付部分にひびが入らず、しかも、リード付部品を含め
て部品を高密度に取付けることができるようにしたプリ
ント配線基板を提供しようとするものであり、以下、本
考案の一実施例について図面を参照して説明する。Therefore, the present invention is designed to prevent cracks from occurring in the soldered parts of dress parts even if the printed circuit board is warped during soldering using a solder dip tank, and also to allow parts, including parts with leads, to be packed in high density. The present invention is intended to provide a printed wiring board that can be mounted, and one embodiment of the present invention will be described below with reference to the drawings.
図に示すように、このプリント配線基板では、プリント
基板１に半田デイツプ槽で半田付けをすることによって
生じる上記プリント基板１の裏面の銅箔に剛性の大きい
抵抗等のリードレス部品２が半田付けされる。As shown in the figure, in this printed wiring board, a leadless component 2 such as a resistor with high rigidity is soldered to the copper foil on the back side of the printed circuit board 1, which is produced by soldering to the printed circuit board 1 in a solder dip tank. be done.
３は半田である。一方、図に示すように、上記リードレ
ス部品２を直交する方向に配列して、プリント基板１の
表面に抵抗等のリード付部品４が配置され、このリード
付部品４のリード線４ａ、４ｂがプリント基板１の透孔
に挿入されて裏面で銅箔と半田付けされている。3 is solder. On the other hand, as shown in the figure, the leadless components 2 are arranged in the orthogonal direction, and a leaded component 4 such as a resistor is arranged on the surface of the printed circuit board 1, and lead wires 4a, 4b of the leaded component 4 are arranged. is inserted into the through hole of the printed circuit board 1 and soldered to the copper foil on the back side.
５ａ、５ｂは半田である。5a and 5b are solder.
以上のような構成により、リードレス部品２の配列方向
がプリント基板１の反り曲線と直交しているので、リー
ドレス部品２の半田付は部分にプリント基板１の反りに
よる力が加わることがなくなり、この半田付部分にひび
が入ることがない。With the above configuration, the arrangement direction of the leadless components 2 is perpendicular to the warpage curve of the printed circuit board 1, so that no force is applied to the soldering portion of the leadless components 2 due to the warpage of the printed circuit board 1. , this soldered part will not crack.
また、リード付部品４をリードレス部品２と直交する方
向に配列したのできリードレス部品２との間で相互に邪
魔になることがなく、部品を高密度に取付けることがで
きる。Furthermore, since the leaded components 4 are arranged in a direction perpendicular to the leadless components 2, they do not get in the way of each other and the components can be mounted at high density.
以上のように本考案によれば、リードレス部品をプリン
ト基板に確実に取付けることができるとともにリード付
部品を含んだ部品を含んだ部品を高密度に取付けること
ができるのである。As described above, according to the present invention, leadless components can be reliably mounted on a printed circuit board, and components including components with leads can be mounted with high density.
図は本考案の一実施例におけるプリント配線基板の側面
図である。
１・・・・・・プリント基板、２・・・・・・リードレ
ス部品、３ｔ ５ａｔ ５ｂ・・・・・・半田、４・・
・・・・リード付部品、４ａ、４ｂ・・・・・・リード
線。The figure is a side view of a printed wiring board in one embodiment of the present invention. 1... Printed circuit board, 2... Leadless parts, 3t 5at 5b... Solder, 4...
...Leaded parts, 4a, 4b...Lead wire.
Claims (1)
リント基板の反り曲線に直交する方向に配列されて上記
プリント基板の裏面に半田付けされたリードレス部品と
、上記リードレス部品と直交する方向に配列されて上記
プリント基板の表面に取り付けられたリード付部品とを
有するプリント配線基板。leadless components arranged in a direction perpendicular to the warp curve of the printed circuit board caused by soldering in a solder dip bath and soldered to the back surface of the printed circuit board; and a leaded component attached to the surface of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9098179U JPS6023995Y2 (en) | 1979-07-02 | 1979-07-02 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9098179U JPS6023995Y2 (en) | 1979-07-02 | 1979-07-02 | printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS569776U JPS569776U (en) | 1981-01-27 |
| JPS6023995Y2 true JPS6023995Y2 (en) | 1985-07-17 |
Family
ID=29324070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9098179U Expired JPS6023995Y2 (en) | 1979-07-02 | 1979-07-02 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6023995Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6214022U (en) * | 1985-07-08 | 1987-01-28 | ||
| JPS62120627U (en) * | 1986-01-25 | 1987-07-31 |
-
1979
- 1979-07-02 JP JP9098179U patent/JPS6023995Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS569776U (en) | 1981-01-27 |
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