WO2013080588A1 - Structure for attaching diode - Google Patents

Structure for attaching diode Download PDF

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Publication number
WO2013080588A1
WO2013080588A1 PCT/JP2012/064472 JP2012064472W WO2013080588A1 WO 2013080588 A1 WO2013080588 A1 WO 2013080588A1 JP 2012064472 W JP2012064472 W JP 2012064472W WO 2013080588 A1 WO2013080588 A1 WO 2013080588A1
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WO
WIPO (PCT)
Prior art keywords
diode
positioning
main body
mounting structure
structure according
Prior art date
Application number
PCT/JP2012/064472
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French (fr)
Japanese (ja)
Inventor
吉川　裕之
典之 坂上
Original Assignee
住友電装株式会社
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Publication date
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Publication of WO2013080588A1 publication Critical patent/WO2013080588A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a diode mounting structure.
  • Patent Document 1 discloses a terminal box attached to a solar cell module.
  • a plurality of terminal plates are accommodated in the box body of the terminal box, and each terminal plate is connected to each other via a diode for preventing backflow.
  • the diode has a block-shaped main body portion having a heat generating portion and a pair of pin-shaped lead portions extending from the main body portion.
  • the main body is fixed by screwing to one of the adjacent terminal boards.
  • One of the lead portions is connected to one terminal board by soldering, and the other is connected to the other terminal board by soldering.
  • the conventional diode mounting structure has a problem that the screw tightening process and the soldering process must be performed separately, and the work load is large. In view of this, if the fixing operation of the main body is also performed with solder, the mounting of the entire diode is integrated into the soldering process, and the work burden is reduced. In this case, according to the reflow soldering, the mounting process is automated, and it becomes possible to further improve the workability. However, for example, when performing reflow soldering, there is a possibility that the main body of the diode may be displaced without staying at a predetermined position on the surface of one terminal board.
  • the present invention has been completed based on the above situation, and an object thereof is to prevent the displacement of the diode.
  • the diode mounting structure of the present invention is characterized in that it includes a heat radiating plate having a positioning portion for positioning the diode by surrounding the diode and supplying solder therein.
  • the diode When a diode is placed on the positioning part of the heat sink, the diode is surrounded by the positioning part and the diode is positioned, so that the diode is prevented from being displaced in the soldering process or the like.
  • FIG. 1 It is a top view of the terminal box for solar cell modules containing the attachment structure of the diode which concerns on Example 1 of this invention. It is sectional drawing of the attachment structure of a diode. It is a top view of the attachment structure of a diode. It is sectional drawing showing the state before mounting a diode on a heat sink. It is a top view of the 1st and 2nd positioning part. It is a top view of the 1st positioning part in the attachment structure of the diode which concerns on Example 2 of this invention. It is sectional drawing of the attachment structure of the diode which concerns on a reference example.
  • the positioning part has an enclosure wall facing the outer periphery of the bottom part of the diode, and the solder adheres to the outer periphery of the bottom part and the enclosure wall. Thereby, a good solder fillet is formed, and the solder connection strength is improved.
  • the slope of the solder fillet formed between the outer periphery of the bottom and the surrounding wall is positioned higher than the height of the bottom surface of the diode. Thereby, a sufficient solder height is ensured, and the solder connection strength is further increased.
  • the surrounding wall is a vertical surface substantially along the vertical direction. As a result, the solder easily rises along the enclosure wall, and a good solder fillet is formed.
  • the positioning portion is recessed along the bottom of the diode on the surface of the heat sink. Thereby, a positioning part can be shape
  • the diode includes a main body portion having a heat generating portion and a lead portion extending from the main body portion, and the heat sink is constituted by at least two terminal plates connected to each other via the diode, and the two terminal plates Of these, one terminal board is provided with the positioning part for positioning the main body part, and the other terminal board is provided with another positioning part for positioning the tip of the lead part. Since the positioning portion positions the main body portion on one terminal plate and the other positioning portion positions the lead portion on the other terminal plate, the displacement of the diode is reliably prevented.
  • the positioning part surrounds the outer periphery of the bottom part of the main body part over the entire circumference. This reliably prevents the diode from being displaced along the surface of the main body.
  • the other positioning portion surrounds the outer periphery of the tip portion of the lead portion except for the side facing the main body portion. As a result, the positional deviation of the leads can be reliably prevented.
  • the bottom wall of the positioning portion of the heat radiating plate is formed with a gas vent hole through which the gas generated inside the solder in a molten state passes. Since the gas generated inside the solder escapes to the outside through the vent hole, voids are hardly generated and the reliability of soldering is improved.
  • the diode mounting structure according to the first embodiment is formed in the solar cell module terminal box 60.
  • the solar cell module terminal box 60 is housed in a box body 61, a plurality of terminal plates 10 (heat radiating plates) housed in the box body 61, the box body 61, and And a plurality of diodes 30 supported by the terminal board 10.
  • the box body 61 is made of a synthetic resin, and includes a rectangular plate-like base wall 62 attached to a back surface (non-light-receiving surface) of a solar cell module (not shown) and a frame plate-like peripheral wall 63 rising from the outer periphery of the base wall 62. Have. An opening 64 is defined between the front end of the base wall 62 and the peripheral wall 63. An interconnector (not shown) is inserted into the box main body 61 from the solar cell module side through the opening 64, and the tip of the interconnector is connected to each terminal board 10 by soldering. In the case of Example 1, the opening area of the opening 64 is larger than the surface area of the base wall 62.
  • a pair of cylindrical portions 65 are formed on both left and right sides of the peripheral wall 63 so as to protrude from both sides. Both tube portions 65 are formed with insertion holes 66 through which the cables 80 can be inserted. The cable 80 is inserted from the outside into the insertion hole 66 of both the cylinder portions 65, and the distal end portion of the inserted cable 80 faces the opening 64 in the box body 61. The core wire portion 82 is exposed and disposed at the distal end portion of the cable 80 by removing the covering portion 81.
  • the four terminal boards 10 are placed side by side on the base wall 62.
  • Each terminal plate 10 is fixed to the base wall 62 through a known fixing means, and a substantially front half portion of each terminal plate 10 is disposed so as to protrude into the opening 64.
  • the one located at both left and right ends is the cable connection terminal 10 ⁇ / b> A to which the cable 80 is connected, and the one located between the two cable connection terminals 10 ⁇ / b> A is the relay terminal 10 ⁇ / b> B to which the cable 80 is not connected. It is said that.
  • a barrel portion 11 is formed to protrude sideways.
  • the barrel portion 11 has an open barrel shape and is disposed to face the cylindrical portion 65. Further, the barrel portion 11 is connected by being crimped to the core wire portion 82 of the cable 80 penetrating the cylindrical portion 65.
  • An extended portion 12 that is extended in the width direction is formed in substantially the latter half of each terminal board 10 except for the cable connection terminal 10A at the right end in the drawing.
  • a main body 31 (to be described later) of the diode 30 is installed in the extended portion 12.
  • the diode 30 is a bypass diode that bypasses a reverse-bias current, and as shown in FIGS. 2 and 3, a rectangular block-shaped main body portion 31 and a pin-like shape protruding sideways from the side surface of the main body portion 31. It consists of a pair of lead portions 32.
  • the main body 31 is formed by covering a rectifying element serving as a heat generating portion with a mold resin.
  • the flat plate portion 33 is exposed on the bottom surface of the main body portion 31, and the end portion of the flat plate portion 33 protrudes on the opposite side of the main body portion 31 from the side where both lead portions 32 protrude.
  • the leading end portions 35 of both lead portions 32 are arranged at a position spaced from the side surface of the main body portion 31 and at substantially the same height as the bottom surface of the main body portion 31.
  • the flat plate portion 33 and both lead portions 32 constitute an electrode of the diode 30.
  • the first terminal board 13 includes the body of the diode 30.
  • a first positioning portion 15 for positioning the portion 31 is provided, and a second positioning portion 16 for positioning both lead portions 32 of the diode 30 is provided on the second terminal plate 14.
  • the first positioning portion 15 is formed on the extended portion 12 of the first terminal plate 13, and the second positioning portion 16 is an end portion 17 that faces the extended portion 12 of the adjacent first terminal plate 13 in the second terminal plate 14. Is formed.
  • the first positioning portion 15 is formed in a concave shape by hitting the surface of the extended portion 12 of the first terminal plate 13, and is formed within the plate thickness range of the first terminal plate 13. ing.
  • the bottom part 34 of the main-body part 31 is inserted by the positioning state.
  • the first positioning portion 15 has a square concave shape along the outer shape of the bottom portion 34 of the main body portion 31, and includes a bottom wall 18 having a square shape in plan view and a surrounding wall 19 rising from four sides of the bottom wall 18. It is partitioned.
  • the bottom wall 18 is substantially a horizontal plane
  • the surrounding wall 19 is a vertical plane substantially along the vertical direction.
  • the bottom wall 18 is disposed in contact with the bottom surface of the main body 31, and the surface area of the bottom wall 18 is slightly larger than the surface area of the bottom surface of the main body 31. Further, the outer wall 4 of the bottom 34 of the main body 31 is arranged so as to face the enclosure wall 19, and a clearance is set between the enclosure wall 19 and the outer circumference 4 of the main body 31.
  • the second positioning portion 16 is formed in a concave shape by hitting the surface of the end portion 17 of the second terminal plate 14, and is formed within the thickness range of the second terminal plate 14.
  • the leading end portions 35 of both lead portions 32 are fitted in a positioned state.
  • the second positioning portion 16 has an elongated shape in the width direction along the outer shape of the distal end portion 35 of both the lead portions 32 and is formed by a pair of front and rear concave grooves 21. Both concave grooves 21 are configured to extend in the width direction and open to the end face of the second terminal plate 14, and are disposed to face the second positioning portion 16 in the width direction.
  • the concave groove 21 includes an inner bottom surface 22 that is disposed in contact with the bottom surface of the tip portion 35 of the lead portion 32, and an outer periphery 3 excluding the first positioning portion 15 side of the outer periphery of the tip portions 35 of both lead portions 32. It is divided by the inner side surface 23 arrange
  • the relay terminal 10B is provided with both the first and second positioning portions 15 and 16, and the cable connection terminal 10A at the left end in the drawing has the first Only one positioning portion 15 is provided, and only the second positioning portion 16 is provided at the cable connection terminal 10A at the right end in the drawing. And each 1st, 2nd positioning part 15 and 16 is arrange
  • solder 40 is supplied into the first and second positioning portions 15 and 16, and the main body portion 31 is connected and fixed in the first positioning portion 15 via the solder 40. Both lead portions 32 are connected and fixed in the second positioning portion 16.
  • Each terminal board 10 supports a diode 30, the first positioning portion 15 accommodates the bottom 34 of the body portion 31 of the diode 30 in a positioned state, and the second positioning portion 16 includes the diode 30. Both lead portions 32 are accommodated in a positioned state.
  • the outer periphery of the bottom 34 of the main body 31 is surrounded by the surrounding wall 19 of the first positioning portion 15 over the entire periphery, and the outer periphery of the distal end portion 35 of both lead portions 32 faces the first positioning portion 15 side. Except for this, it is surrounded by the inner surface 23 of the second positioning portion 16.
  • paste solder 40 is applied in advance to the bottom wall 18 of the first positioning portion 15 and the inner bottom surface 22 of the second positioning portion 16.
  • each terminal plate 10 is passed through a reflow furnace (not shown), and the paste solder 40 is melted.
  • the first and second positioning portions 15 and 16 prevent the position of each diode 30 from being displaced.
  • the paste solder 40 is melted, as shown in FIG. 2, in the first positioning portion 15, the solder 40 rises along the outer periphery of the enclosure wall 19 and the bottom 34 of the main body 31, and the enclosure wall 19 and the main body Sufficient solder 40 is ensured between the outer periphery of the bottom 34 of the part 31.
  • a good solder fillet is formed between the enclosure wall 19 and the outer periphery of the bottom 34 of the main body 31.
  • the slope (hem portion) of the solder fillet is positioned higher than the height of the bottom surface of the diode 30.
  • the solder 40 rises along the outer periphery of the inner side surface 23 and the distal end portion 35 of both lead portions 32, and between the inner side surface 23 and the outer periphery of the distal end portion 35 of both lead portions 32. Sufficient solder 40 is ensured and a good solder fillet is formed.
  • the soldering strength of the diode 30 to each terminal board 10 may not be ensured.
  • the periphery of the diode 30 is surrounded by the first and second positioning portions 15 and 16 as in the first embodiment, the solder rise is improved and the soldering strength of the diode 30 is increased.
  • each terminal plate 10 is placed and fixed on the base wall 62 of the box body 61, and the core portions 82 of both cables 80 are crimped and connected to the barrel portions 11 of both cable connection terminals 10A.
  • the box body 61 is placed on the back surface of the solar cell module, and the interconnector is drawn through the opening 64 along with the box body 61, and the front end of each terminal board 10 is soldered to the front end of the interconnector.
  • the box body 61 is fixed to the back surface of the solar cell module through a known fixing means such as an adhesive.
  • the periphery of the body portion 31 is surrounded by the first positioning portion 15. Since 30 is positioned, it is possible to prevent the diode 30 from being displaced in the soldering process.
  • the first positioning portion 15 has the surrounding wall 19 facing the outer periphery of the bottom portion 34 of the main body portion 31, and the solder 40 adheres to the outer periphery of the bottom portion 34 of the main body portion 31 and the surrounding wall 19. A solder fillet is formed, and the solder connection strength is improved.
  • the first positioning portion 15 surrounds the outer periphery of the bottom portion 34 of the main body portion 31 over the entire circumference, the diode 30 is reliably prevented from being displaced along the surface of the main body portion 31.
  • the first positioning portion 15 has a concave shape in which the bottom portion 34 of the main body 31 can be fitted on the surface of the terminal board 10, the first positioning portion 15 can be easily formed by press working.
  • the first positioning portion 15 positions the main body portion 31 in the first terminal plate 13 and the second positioning portion 16 positions both lead portions 32 in the second terminal plate 14, the displacement of the diode 30 is more reliable. To be prevented.
  • FIG. 6 shows a second embodiment of the present invention.
  • the internal shape of the bottom wall 18A of the first positioning portion 15A is different from the first embodiment. Others are the same as those of the first embodiment, and a duplicate description is omitted.
  • a gas vent hole 27 is formed in the bottom wall 18A of the first positioning portion 15A.
  • the gas vent hole 27 is elongated in a slit shape in the front-rear direction on the bottom wall 18 and penetrates the first terminal board 13 in the plate thickness direction.
  • the gas generated in the molten solder 40 during the reflow process escapes to the outside through the gas vent hole 27, voids are hardly generated and the reliability of soldering is improved.
  • the present invention is not limited to the embodiments described with reference to the above description and drawings, and may be, for example, as follows.
  • the surrounding wall may be erected on the surface of the first terminal plate, and the periphery of the main body of the diode may be surrounded by the surrounding wall.
  • the second positioning portion that positions both the lead portions of the diode may be omitted.
  • the diode may be supported by a heat radiating plate having no terminal function and having only a heat radiating function.
  • the diode may be of a bare chip type in which the periphery of the rectifying element is not sealed with resin.
  • a plurality of gas vent holes in the second embodiment may be provided on the bottom wall of the first positioning portion.
  • this invention is not limited to the terminal box for solar cell modules, It can apply widely to the thing of the structure which solders a diode to a heat sink.
  • Terminal board 13 First terminal board (one terminal board) 14 ... 2nd terminal board (the other terminal board) 15 ... 1st positioning part (positioning part) 16 ... 2nd positioning part (another positioning part) DESCRIPTION OF SYMBOLS 19 ... Enclosure 30 ... Diode 31 ... Main-body part 32 ... Lead part 34 ... Bottom part 35 ... Tip part (tip part of lead part) 40 ... solder 60 ... terminal box for solar cell module

Abstract

A positional shift of a diode (30) is eliminated. The diode (30) is connected to a first terminal plate (13) and a second terminal plate (14), which are adjacent to each other. A main body section (31) of the diode (30) is fitted in a first aligning section (15) by being aligned with the first aligning section that is formed in the first terminal plate (13), and the main body section is fixed to the first aligning section (15) by means of a solder (40) supplied to the inside of the first aligning section (15). A lead section (32) of the diode (30) is fitted in a second aligning section (16) by being aligned with the second aligning section that is formed in the second terminal plate (14), and the lead section is fixed to the second aligning section (16) by means of the solder (40) supplied to the inside of the second aligning section (16).

Description

ダイオードの取付構造Diode mounting structure
　本発明は、ダイオードの取付構造に関する。 The present invention relates to a diode mounting structure.
　特許文献１には、太陽電池モジュールに取り付けられる端子ボックスが開示されている。端子ボックスのボックス本体内には複数の端子板が収容され、各端子板が逆流防止用のダイオードを介して相互に接続されている。ダイオードは、発熱部を有するブロック状の本体部と、本体部から延びるピン状の一対のリード部とを有している。本体部は、隣接する端子板のうちの一方の端子板にねじ締めして固定されている。また、両リード部のうちの片方は一方の端子板に半田付けにより接続され、もう片方は他方の端子板に半田付けにより接続されている。 Patent Document 1 discloses a terminal box attached to a solar cell module. A plurality of terminal plates are accommodated in the box body of the terminal box, and each terminal plate is connected to each other via a diode for preventing backflow. The diode has a block-shaped main body portion having a heat generating portion and a pair of pin-shaped lead portions extending from the main body portion. The main body is fixed by screwing to one of the adjacent terminal boards. One of the lead portions is connected to one terminal board by soldering, and the other is connected to the other terminal board by soldering.
特開２００５－２５１９６２号公報JP 2005-251962 A
　上記従来のダイオードの取付構造では、ねじ締め工程と半田付け工程とを別々に行わねばならず、作業負担が大きいという問題がある。これに鑑み、本体部の固定作業も半田で行えば、ダイオード全体の取り付けが半田付け工程に統合されて、作業負担が軽減される。またこの場合に、リフロー半田によれば、実装工程が自動化され、さらなる作業性の改善を図ることが可能となる。しかし、例えば、リフロー半田を行う際に、ダイオードの本体部が一方の端子板の表面における所定位置に留まらずに位置ずれするおそれがある。 The conventional diode mounting structure has a problem that the screw tightening process and the soldering process must be performed separately, and the work load is large. In view of this, if the fixing operation of the main body is also performed with solder, the mounting of the entire diode is integrated into the soldering process, and the work burden is reduced. In this case, according to the reflow soldering, the mounting process is automated, and it becomes possible to further improve the workability. However, for example, when performing reflow soldering, there is a possibility that the main body of the diode may be displaced without staying at a predetermined position on the surface of one terminal board.
　本発明は上記のような事情に基づいて完成されたものであって、ダイオードの位置ずれを防止することを目的とする。 The present invention has been completed based on the above situation, and an object thereof is to prevent the displacement of the diode.
　本発明のダイオードの取付構造は、ダイオードの周りを取り囲むことにより、前記ダイオードを位置決めし、かつ内部に半田が供給される位置決め部を有する放熱板を備えたところに特徴を有する。 The diode mounting structure of the present invention is characterized in that it includes a heat radiating plate having a positioning portion for positioning the diode by surrounding the diode and supplying solder therein.
　放熱板の位置決め部にダイオードを載せると、ダイオードの周りが位置決め部によって取り囲まれて、ダイオードが位置決めされるため、半田付け工程等でダイオードが位置ずれするのが防止される。 When a diode is placed on the positioning part of the heat sink, the diode is surrounded by the positioning part and the diode is positioned, so that the diode is prevented from being displaced in the soldering process or the like.
本発明の実施例１に係るダイオードの取付構造を含む太陽電池モジュール用端子ボックスの平面図である。It is a top view of the terminal box for solar cell modules containing the attachment structure of the diode which concerns on Example 1 of this invention. ダイオードの取付構造の断面図である。It is sectional drawing of the attachment structure of a diode. ダイオードの取付構造の平面図である。It is a top view of the attachment structure of a diode. 放熱板にダイオードを載せる前の状態をあらわす断面図である。It is sectional drawing showing the state before mounting a diode on a heat sink. 第１、第２位置決め部の平面図である。It is a top view of the 1st and 2nd positioning part. 本発明の実施例２に係るダイオードの取付構造における第１位置決め部の平面図である。It is a top view of the 1st positioning part in the attachment structure of the diode which concerns on Example 2 of this invention. 参考例に係るダイオードの取付構造の断面図である。It is sectional drawing of the attachment structure of the diode which concerns on a reference example.
　本発明の好ましい形態は次の通りである。
　前記位置決め部が前記ダイオードの底部の外周と対向する囲い壁を有し、前記半田が前記底部の外周及び前記囲い壁に付着している。これにより、良好な半田フィレットが形成され、半田接続強度が向上する。
　前記底部の外周と前記囲い壁との間に形成される半田フィレットの斜面が、前記ダイオードの底面の高さよりも高位に位置している。これにより、充分な半田高さが確保され、半田接続強度がより高められる。
　前記囲い壁が鉛直方向にほぼ沿った垂直面とされている。これにより、囲い壁に沿って半田が上がり易くなり、良好な半田フィレットが形成される。
　前記位置決め部が前記放熱板の表面において前記ダイオードの底部に沿って凹む形態とされている。これにより、位置決め部を容易に成形できる。
　前記ダイオードが、発熱部を有する本体部と、前記本体部から延びるリード部とからなり、前記放熱板が前記ダイオードを介して互いに接続される少なくとも２つの端子板によって構成され、前記２つの端子板のうち、一方の端子板に、前記本体部を位置決めする前記位置決め部が設けられ、他方の端子板に、前記リード部の先端部を位置決めする別の位置決め部が設けられている。位置決め部が一方の端子板において本体部を位置決めし、別の位置決め部が他方の端子板においてリード部を位置決めするため、ダイオードの位置ずれが確実に防止される。
　前記位置決め部が、前記本体部の底部の外周を全周に亘って取り囲む形態とされている。これにより、ダイオードが本体部の表面に沿って位置ずれするのが確実に防止される。
　前記別の位置決め部が、前記リード部の先端部の外周を、前記本体部と対向する側を除いて取り囲む形態とされている。これにより、リードの位置ずれも確実に防止される。
　前記放熱板における前記位置決め部の底壁には、溶融状態にある前記半田の内部で発生したガスを抜くためのガス抜き孔が貫通して形成されている。半田の内部で発生したガスがガス抜き孔を通して外部に抜けることにより、ボイドが発生し難くなり、半田付けの信頼性が向上する。 Preferred embodiments of the present invention are as follows.
The positioning part has an enclosure wall facing the outer periphery of the bottom part of the diode, and the solder adheres to the outer periphery of the bottom part and the enclosure wall. Thereby, a good solder fillet is formed, and the solder connection strength is improved.
The slope of the solder fillet formed between the outer periphery of the bottom and the surrounding wall is positioned higher than the height of the bottom surface of the diode. Thereby, a sufficient solder height is ensured, and the solder connection strength is further increased.
The surrounding wall is a vertical surface substantially along the vertical direction. As a result, the solder easily rises along the enclosure wall, and a good solder fillet is formed.
The positioning portion is recessed along the bottom of the diode on the surface of the heat sink. Thereby, a positioning part can be shape | molded easily.
The diode includes a main body portion having a heat generating portion and a lead portion extending from the main body portion, and the heat sink is constituted by at least two terminal plates connected to each other via the diode, and the two terminal plates Of these, one terminal board is provided with the positioning part for positioning the main body part, and the other terminal board is provided with another positioning part for positioning the tip of the lead part. Since the positioning portion positions the main body portion on one terminal plate and the other positioning portion positions the lead portion on the other terminal plate, the displacement of the diode is reliably prevented.
The positioning part surrounds the outer periphery of the bottom part of the main body part over the entire circumference. This reliably prevents the diode from being displaced along the surface of the main body.
The other positioning portion surrounds the outer periphery of the tip portion of the lead portion except for the side facing the main body portion. As a result, the positional deviation of the leads can be reliably prevented.
The bottom wall of the positioning portion of the heat radiating plate is formed with a gas vent hole through which the gas generated inside the solder in a molten state passes. Since the gas generated inside the solder escapes to the outside through the vent hole, voids are hardly generated and the reliability of soldering is improved.
　＜実施例１＞
　実施例１を図１ないし図５によって説明する。実施例１に係るダイオードの取付構造は、太陽電池モジュール用端子ボックス６０に形成されている。太陽電池モジュール用端子ボックス６０は、図１に示すように、ボックス本体６１と、ボックス本体６１内に収容される複数の端子板１０（放熱板）と、ボックス本体６１内に収容され、かつ各端子板１０に支持される複数のダイオード３０とを備えている。 <Example 1>
A first embodiment will be described with reference to FIGS. The diode mounting structure according to the first embodiment is formed in the solar cell module terminal box 60. As shown in FIG. 1, the solar cell module terminal box 60 is housed in a box body 61, a plurality of terminal plates 10 (heat radiating plates) housed in the box body 61, the box body 61, and And a plurality of diodes 30 supported by the terminal board 10.
　ボックス本体６１は合成樹脂製であって、図示しない太陽電池モジュールの裏面（非受光面）に取り付けられる矩形板状の基壁６２と、基壁６２の外周から立ち上がる枠板状の周壁６３とを有している。基壁６２の前端と周壁６３との間には開口部６４が区画して形成されている。ボックス本体６１内には、開口部６４を通して太陽電池モジュール側から図示しないインターコネクタが挿入され、インターコネクタの先端部が各端子板１０に半田付けにより接続されるようになっている。実施例１の場合、開口部６４の開口面積は基壁６２の表面積よりも大きくされている。 The box body 61 is made of a synthetic resin, and includes a rectangular plate-like base wall 62 attached to a back surface (non-light-receiving surface) of a solar cell module (not shown) and a frame plate-like peripheral wall 63 rising from the outer periphery of the base wall 62. Have. An opening 64 is defined between the front end of the base wall 62 and the peripheral wall 63. An interconnector (not shown) is inserted into the box main body 61 from the solar cell module side through the opening 64, and the tip of the interconnector is connected to each terminal board 10 by soldering. In the case of Example 1, the opening area of the opening 64 is larger than the surface area of the base wall 62.
　周壁６３の左右両側には、一対の筒部６５が両側方に突出して形成されている。両筒部６５には、ケーブル８０を挿入可能な挿入孔６６が貫通して形成されている。ケーブル８０は両筒部６５の挿入孔６６内に外側から挿入され、挿入されたケーブル８０の先端部はボックス本体６１内の開口部６４に臨むようになっている。ケーブル８０の先端部には、被覆部８１の除去によって芯線部８２が露出して配置されている。 A pair of cylindrical portions 65 are formed on both left and right sides of the peripheral wall 63 so as to protrude from both sides. Both tube portions 65 are formed with insertion holes 66 through which the cables 80 can be inserted. The cable 80 is inserted from the outside into the insertion hole 66 of both the cylinder portions 65, and the distal end portion of the inserted cable 80 faces the opening 64 in the box body 61. The core wire portion 82 is exposed and disposed at the distal end portion of the cable 80 by removing the covering portion 81.
　基壁６２には、４つの端子板１０が横並びで載置されている。各端子板１０は周知の固定手段を介して基壁６２に固定され、かつ各端子板１０の略前半部は開口部６４内に突出して配置されている。各端子板１０のうち、左右両端部に位置するものは、ケーブル８０が接続されるケーブル接続端子１０Ａとされ、両ケーブル接続端子１０Ａの間に位置するものは、ケーブル８０が接続されない中継端子１０Ｂとされている。両ケーブル接続端子１０Ａの側縁には、バレル部１１が側方に突出して形成されている。バレル部１１は、オープンバレル状をなし、筒部６５と対向して配置される。また、バレル部１１は、筒部６５を貫通したケーブル８０の芯線部８２に圧着して接続される。 The four terminal boards 10 are placed side by side on the base wall 62. Each terminal plate 10 is fixed to the base wall 62 through a known fixing means, and a substantially front half portion of each terminal plate 10 is disposed so as to protrude into the opening 64. Of each terminal plate 10, the one located at both left and right ends is the cable connection terminal 10 </ b> A to which the cable 80 is connected, and the one located between the two cable connection terminals 10 </ b> A is the relay terminal 10 </ b> B to which the cable 80 is not connected. It is said that. At the side edges of both cable connection terminals 10A, a barrel portion 11 is formed to protrude sideways. The barrel portion 11 has an open barrel shape and is disposed to face the cylindrical portion 65. Further, the barrel portion 11 is connected by being crimped to the core wire portion 82 of the cable 80 penetrating the cylindrical portion 65.
　各端子板１０の略後半部には、図示向かって右端のケーブル接続端子１０Ａを除いて、幅方向に拡張された拡張部１２が形成されている。拡張部１２には、ダイオード３０の本体部３１（後述する）が設置されるようになっている。 An extended portion 12 that is extended in the width direction is formed in substantially the latter half of each terminal board 10 except for the cable connection terminal 10A at the right end in the drawing. A main body 31 (to be described later) of the diode 30 is installed in the extended portion 12.
　ダイオード３０は、逆バイアスの電流をバイパスするバイパスダイオードであって、図２及び図３に示すように、矩形ブロック状の本体部３１と、本体部３１の側面から側方に突出するピン状の一対のリード部３２とからなる。本体部３１は、発熱部分となる整流素子の周りをモールド樹脂で被覆してなるものである。本体部３１の底面には平板部３３が露出しており、本体部３１を挟んで両リード部３２が突出する側とは反対側に、平板部３３の端部が突出して配置されている。そして、両リード部３２の先端部３５は、本体部３１の側面から離間した位置で、かつ本体部３１の底面とほぼ同じ高さ位置に配置されている。なお、平板部３３及び両リード部３２は、ダイオード３０の電極を構成している。 The diode 30 is a bypass diode that bypasses a reverse-bias current, and as shown in FIGS. 2 and 3, a rectangular block-shaped main body portion 31 and a pin-like shape protruding sideways from the side surface of the main body portion 31. It consists of a pair of lead portions 32. The main body 31 is formed by covering a rectifying element serving as a heat generating portion with a mold resin. The flat plate portion 33 is exposed on the bottom surface of the main body portion 31, and the end portion of the flat plate portion 33 protrudes on the opposite side of the main body portion 31 from the side where both lead portions 32 protrude. The leading end portions 35 of both lead portions 32 are arranged at a position spaced from the side surface of the main body portion 31 and at substantially the same height as the bottom surface of the main body portion 31. The flat plate portion 33 and both lead portions 32 constitute an electrode of the diode 30.
　さて、互いに隣接する端子板１０のうち、一方の端子板を第１端子板１３とし、他方の端子板を第２端子板１４とした場合に、第１端子板１３には、ダイオード３０の本体部３１を位置決めする第１位置決め部１５が設けられ、第２端子板１４には、ダイオード３０の両リード部３２を位置決めする第２位置決め部１６が設けられている。第１位置決め部１５は、第１端子板１３の拡張部１２に形成され、第２位置決め部１６は、第２端子板１４において隣接する第１端子板１３の拡張部１２と対向する端部１７に形成されている。 Of the terminal boards 10 adjacent to each other, when one terminal board is the first terminal board 13 and the other terminal board is the second terminal board 14, the first terminal board 13 includes the body of the diode 30. A first positioning portion 15 for positioning the portion 31 is provided, and a second positioning portion 16 for positioning both lead portions 32 of the diode 30 is provided on the second terminal plate 14. The first positioning portion 15 is formed on the extended portion 12 of the first terminal plate 13, and the second positioning portion 16 is an end portion 17 that faces the extended portion 12 of the adjacent first terminal plate 13 in the second terminal plate 14. Is formed.
　そして、第１位置決め部１５は、図４及び図５に示すように、第１端子板１３の拡張部１２の表面を叩いて凹状に形成され、第１端子板１３の板厚範囲で形成されている。第１位置決め部１５内には、本体部３１の底部３４が位置決め状態で嵌め込まれるようになっている。具体的には、第１位置決め部１５は、本体部３１の底部３４の外形状に沿った角凹状をなし、平面視四角形の底壁１８と底壁１８の４辺から立ち上がる囲い壁１９とで区画されている。底壁１８はほぼ水平面とされ、囲い壁１９は鉛直方向にほぼ沿った垂直面とされている。底壁１８には本体部３１の底面が当接して配置され、底壁１８の表面積は本体部３１の底面の表面積より若干大きくされている。また、囲い壁１９には本体部３１の底部３４の外周４面が対面して配置され、囲い壁１９と本体部３１の外周４面との間に若干隙間があくように設定されている。 As shown in FIGS. 4 and 5, the first positioning portion 15 is formed in a concave shape by hitting the surface of the extended portion 12 of the first terminal plate 13, and is formed within the plate thickness range of the first terminal plate 13. ing. In the 1st positioning part 15, the bottom part 34 of the main-body part 31 is inserted by the positioning state. Specifically, the first positioning portion 15 has a square concave shape along the outer shape of the bottom portion 34 of the main body portion 31, and includes a bottom wall 18 having a square shape in plan view and a surrounding wall 19 rising from four sides of the bottom wall 18. It is partitioned. The bottom wall 18 is substantially a horizontal plane, and the surrounding wall 19 is a vertical plane substantially along the vertical direction. The bottom wall 18 is disposed in contact with the bottom surface of the main body 31, and the surface area of the bottom wall 18 is slightly larger than the surface area of the bottom surface of the main body 31. Further, the outer wall 4 of the bottom 34 of the main body 31 is arranged so as to face the enclosure wall 19, and a clearance is set between the enclosure wall 19 and the outer circumference 4 of the main body 31.
　第２位置決め部１６は、第２端子板１４の端部１７の表面を叩いて凹状に形成され、第２端子板１４の板厚範囲で形成されている。第２位置決め部１６内には、両リード部３２の先端部３５が位置決め状態で嵌め込まれるようになっている。具体的には、第２位置決め部１６は、両リード部３２の先端部３５の外形状に沿った幅方向に細長い形状をなし、前後一対の凹溝２１によって形成されている。両凹溝２１は、幅方向に延びて第２端子板１４の端面に開口する形態とされ、第２位置決め部１６と幅方向で対向して配置されている。そして、凹溝２１は、リード部３２の先端部３５の底面が当接して配置される内底面２２と、両リード部３２の先端部３５の外周のうち第１位置決め部１５側を除く外周３面が対面して配置される内側面２３とで区画されている。 The second positioning portion 16 is formed in a concave shape by hitting the surface of the end portion 17 of the second terminal plate 14, and is formed within the thickness range of the second terminal plate 14. In the second positioning portion 16, the leading end portions 35 of both lead portions 32 are fitted in a positioned state. Specifically, the second positioning portion 16 has an elongated shape in the width direction along the outer shape of the distal end portion 35 of both the lead portions 32 and is formed by a pair of front and rear concave grooves 21. Both concave grooves 21 are configured to extend in the width direction and open to the end face of the second terminal plate 14, and are disposed to face the second positioning portion 16 in the width direction. The concave groove 21 includes an inner bottom surface 22 that is disposed in contact with the bottom surface of the tip portion 35 of the lead portion 32, and an outer periphery 3 excluding the first positioning portion 15 side of the outer periphery of the tip portions 35 of both lead portions 32. It is divided by the inner side surface 23 arrange | positioned so that a surface may face.
　なお、実施例１の場合、図１に示すように、中継端子１０Ｂには、第１、第２位置決め部１５、１６がいずれも設けられ、図示向かって左端のケーブル接続端子１０Ａには、第１位置決め部１５のみが設けられ、図示向かって右端のケーブル接続端子１０Ａには、第２位置決め部１６のみが設けられている。そして、各第１、第２位置決め部１５、１６は、幅方向に同軸上に並んで配置されている。また、図４に示すように、第１、第２位置決め部１５、１６内には半田４０が供給され、半田４０を介して、本体部３１が第１位置決め部１５内に接続固定されるとともに、両リード部３２が第２位置決め部１６内に接続固定されるようになっている。 In the case of the first embodiment, as shown in FIG. 1, the relay terminal 10B is provided with both the first and second positioning portions 15 and 16, and the cable connection terminal 10A at the left end in the drawing has the first Only one positioning portion 15 is provided, and only the second positioning portion 16 is provided at the cable connection terminal 10A at the right end in the drawing. And each 1st, 2nd positioning part 15 and 16 is arrange | positioned along with the coaxial in the width direction. As shown in FIG. 4, solder 40 is supplied into the first and second positioning portions 15 and 16, and the main body portion 31 is connected and fixed in the first positioning portion 15 via the solder 40. Both lead portions 32 are connected and fixed in the second positioning portion 16.
　次に、実施例１に係るダイオード３０の取付構造の作用を説明する。
　各端子板１０には、ダイオード３０が支持され、第１位置決め部１５内には、ダイオード３０の本体部３１の底部３４が位置決め状態で収容され、かつ、第２位置決め部１６内にはダイオード３０の両リード部３２が位置決め状態で収容される。これにより、本体部３１の底部３４の外周が第１位置決め部１５の囲い壁１９に全周に亘って取り囲まれ、かつ、両リード部３２の先端部３５の外周が第１位置決め部１５側を除いて第２位置決め部１６の内側面２３に取り囲まれる。また、各端子板１０にダイオード３０が支持されるに先立ち、第１位置決め部１５の底壁１８及び第２位置決め部１６の内底面２２には、予めペースト半田４０が塗布される。 Next, the operation of the diode 30 mounting structure according to the first embodiment will be described.
Each terminal board 10 supports a diode 30, the first positioning portion 15 accommodates the bottom 34 of the body portion 31 of the diode 30 in a positioned state, and the second positioning portion 16 includes the diode 30. Both lead portions 32 are accommodated in a positioned state. As a result, the outer periphery of the bottom 34 of the main body 31 is surrounded by the surrounding wall 19 of the first positioning portion 15 over the entire periphery, and the outer periphery of the distal end portion 35 of both lead portions 32 faces the first positioning portion 15 side. Except for this, it is surrounded by the inner surface 23 of the second positioning portion 16. Prior to the support of the diode 30 on each terminal board 10, paste solder 40 is applied in advance to the bottom wall 18 of the first positioning portion 15 and the inner bottom surface 22 of the second positioning portion 16.
　次いで、図示しないリフロー炉に上記の各端子板１０を通し、ペースト半田４０を融解させる。リフロー炉に各端子板１０を通す際には、第１、第２位置決め部１５、１６によって各ダイオード３０の位置ずれが阻止される。また、ペースト半田４０が融解されると、図２に示すように、第１位置決め部１５では、囲い壁１９及び本体部３１の底部３４の外周に沿って半田４０が上がり、囲い壁１９と本体部３１の底部３４の外周との間に充分な半田４０が確保される。その結果、囲い壁１９と本体部３１の底部３４の外周との間に良好な半田フィレットが形成される。この場合、半田フィレットの斜面（裾部分）は、ダイオード３０の底面の高さよりの高位に位置している。同様に、第２位置決め部１６内でも、内側面２３及び両リード部３２の先端部３５の外周に沿って半田４０が上がり、内側面２３と両リード部３２の先端部３５の外周との間に充分な半田４０が確保され、良好な半田フィレットが形成される。 Next, each terminal plate 10 is passed through a reflow furnace (not shown), and the paste solder 40 is melted. When each terminal plate 10 is passed through the reflow furnace, the first and second positioning portions 15 and 16 prevent the position of each diode 30 from being displaced. When the paste solder 40 is melted, as shown in FIG. 2, in the first positioning portion 15, the solder 40 rises along the outer periphery of the enclosure wall 19 and the bottom 34 of the main body 31, and the enclosure wall 19 and the main body Sufficient solder 40 is ensured between the outer periphery of the bottom 34 of the part 31. As a result, a good solder fillet is formed between the enclosure wall 19 and the outer periphery of the bottom 34 of the main body 31. In this case, the slope (hem portion) of the solder fillet is positioned higher than the height of the bottom surface of the diode 30. Similarly, in the second positioning portion 16, the solder 40 rises along the outer periphery of the inner side surface 23 and the distal end portion 35 of both lead portions 32, and between the inner side surface 23 and the outer periphery of the distal end portion 35 of both lead portions 32. Sufficient solder 40 is ensured and a good solder fillet is formed.
　一方、仮に、各端子板１０に第１、第２位置決め部１５、１６が形成されていないと、図７の参考例で示すように、ダイオード３０の周りを取り囲むものがないため、半田上がりが悪く、各端子板１０に対するダイオード３０の半田付け強度を確保できないおそれがある。その点、実施例１のように、ダイオード３０の周りが第１、第２位置決め部１５、１６によって取り囲まれていれば、半田上がりが改善され、ダイオード３０の半田付け強度が高められる。 On the other hand, if the first and second positioning portions 15 and 16 are not formed on each terminal board 10, there is nothing surrounding the diode 30 as shown in the reference example of FIG. Unfortunately, the soldering strength of the diode 30 to each terminal board 10 may not be ensured. In this respect, if the periphery of the diode 30 is surrounded by the first and second positioning portions 15 and 16 as in the first embodiment, the solder rise is improved and the soldering strength of the diode 30 is increased.
　なお、実施例１の場合、各端子板１０はボックス本体６１の基壁６２に載置固定され、両ケーブル接続端子１０Ａのバレル部１１には両ケーブル８０の芯線部８２が圧着接続される。そして、ボックス本体６１は、太陽電池モジュールの裏面に載せられ、それに伴い開口部６４を通してインターコネクタが引き込まれ、各端子板１０の前端部にインターコネクタの先端部が半田接続される。また、ボックス本体６１は太陽電池モジュールの裏面に接着材等の周知の固定手段を介して固定される。 In the case of the first embodiment, each terminal plate 10 is placed and fixed on the base wall 62 of the box body 61, and the core portions 82 of both cables 80 are crimped and connected to the barrel portions 11 of both cable connection terminals 10A. The box body 61 is placed on the back surface of the solar cell module, and the interconnector is drawn through the opening 64 along with the box body 61, and the front end of each terminal board 10 is soldered to the front end of the interconnector. The box body 61 is fixed to the back surface of the solar cell module through a known fixing means such as an adhesive.
　以上説明したように、実施例１によれば、端子板１０の第１位置決め部１５にダイオード３０の本体部３１を載せると、本体部３１の周りが第１位置決め部１５によって取り囲まれて、ダイオード３０が位置決めされるため、半田付け工程でダイオード３０が位置ずれするのが防止される。この場合に、第１位置決め部１５が本体部３１の底部３４の外周と対向する囲い壁１９を有し、半田４０が本体部３１の底部３４の外周及び囲い壁１９に付着するため、良好な半田フィレットが形成され、半田接続強度が向上する。しかも、第１位置決め部１５が本体部３１の底部３４の外周を全周に亘って取り囲む形態とされているため、ダイオード３０が本体部３１の表面に沿って位置ずれするのが確実に防止される。 As described above, according to the first embodiment, when the body portion 31 of the diode 30 is placed on the first positioning portion 15 of the terminal board 10, the periphery of the body portion 31 is surrounded by the first positioning portion 15. Since 30 is positioned, it is possible to prevent the diode 30 from being displaced in the soldering process. In this case, the first positioning portion 15 has the surrounding wall 19 facing the outer periphery of the bottom portion 34 of the main body portion 31, and the solder 40 adheres to the outer periphery of the bottom portion 34 of the main body portion 31 and the surrounding wall 19. A solder fillet is formed, and the solder connection strength is improved. In addition, since the first positioning portion 15 surrounds the outer periphery of the bottom portion 34 of the main body portion 31 over the entire circumference, the diode 30 is reliably prevented from being displaced along the surface of the main body portion 31. The
　また、第１位置決め部１５が端子板１０の表面において本体部３１の底部３４を嵌め込み可能な凹状の形態をなしているため、プレス加工で第１位置決め部１５を容易に成形することができる。 In addition, since the first positioning portion 15 has a concave shape in which the bottom portion 34 of the main body 31 can be fitted on the surface of the terminal board 10, the first positioning portion 15 can be easily formed by press working.
　また、第１位置決め部１５が第１端子板１３において本体部３１を位置決めし、第２位置決め部１６が第２端子板１４において両リード部３２を位置決めするため、ダイオード３０の位置ずれがより確実に防止される。 Further, since the first positioning portion 15 positions the main body portion 31 in the first terminal plate 13 and the second positioning portion 16 positions both lead portions 32 in the second terminal plate 14, the displacement of the diode 30 is more reliable. To be prevented.
　＜実施例２＞
　図６は、本発明の実施例２をあらわす。実施例２では、第１位置決め部１５Ａの底壁１８Ａの内部形状が実施例１とは異なる。その他は、実施例１と同様であり、重複する説明は省略する。 <Example 2>
FIG. 6 shows a second embodiment of the present invention. In the second embodiment, the internal shape of the bottom wall 18A of the first positioning portion 15A is different from the first embodiment. Others are the same as those of the first embodiment, and a duplicate description is omitted.
　第１位置決め部１５Ａの底壁１８Ａには、ガス抜き孔２７が形成されている。ガス抜き孔２７は、底壁１８において前後方向にスリット状に細長く延びて、第１端子板１３を板厚方向に貫通する形態とされている。 A gas vent hole 27 is formed in the bottom wall 18A of the first positioning portion 15A. The gas vent hole 27 is elongated in a slit shape in the front-rear direction on the bottom wall 18 and penetrates the first terminal board 13 in the plate thickness direction.
　実施例２によれば、リフロー過程で溶融状態の半田４０内に発生したガスがガス抜き孔２７を通して外部に抜けるため、ボイドが発生し難く、半田付けの信頼性が向上する。 According to the second embodiment, since the gas generated in the molten solder 40 during the reflow process escapes to the outside through the gas vent hole 27, voids are hardly generated and the reliability of soldering is improved.
　本発明は上記記述及び図面によって説明した実施例に限定されるものではなく、例えば次のような態様であってもよい。
　第１端子板の表面に囲繞壁が立設され、ダイオードの本体部の周りが囲繞壁によって取り囲まれる形態であってもよい。
　また、ダイオードの両リード部を位置決めする第２位置決め部は省略されてもよい。
　また、ダイオードは、端子機能を有さず、放熱機能のみを有する放熱板に支持されるものであってもよい。
　また、ダイオードは、整流素子の周りを樹脂封止しないベアチップタイプのものであってもよい。
　また、実施例２のガス抜き孔は、第１位置決め部の底壁に複数設けられていてもよい。
　そして、本発明は、太陽電池モジュール用端子ボックスに限定されず、放熱板にダイオードを半田付けする構造のものに広く適用可能である。 The present invention is not limited to the embodiments described with reference to the above description and drawings, and may be, for example, as follows.
The surrounding wall may be erected on the surface of the first terminal plate, and the periphery of the main body of the diode may be surrounded by the surrounding wall.
Further, the second positioning portion that positions both the lead portions of the diode may be omitted.
Further, the diode may be supported by a heat radiating plate having no terminal function and having only a heat radiating function.
Further, the diode may be of a bare chip type in which the periphery of the rectifying element is not sealed with resin.
Further, a plurality of gas vent holes in the second embodiment may be provided on the bottom wall of the first positioning portion.
And this invention is not limited to the terminal box for solar cell modules, It can apply widely to the thing of the structure which solders a diode to a heat sink.
　１０…端子板
　１３…第１端子板（一方の端子板）
　１４…第２端子板（他方の端子板）
　１５…第１位置決め部（位置決め部）
　１６…第２位置決め部（別の位置決め部）
　１９…囲い壁
　３０…ダイオード
　３１…本体部
　３２…リード部
　３４…底部
　３５…先端部（リード部の先端部）
　４０…半田
　６０…太陽電池モジュール用端子ボックス 10 ... Terminal board 13 ... First terminal board (one terminal board)
14 ... 2nd terminal board (the other terminal board)
15 ... 1st positioning part (positioning part)
16 ... 2nd positioning part (another positioning part)
DESCRIPTION OF SYMBOLS 19 ... Enclosure 30 ... Diode 31 ... Main-body part 32 ... Lead part 34 ... Bottom part 35 ... Tip part (tip part of lead part)
40 ... solder 60 ... terminal box for solar cell module

Claims (10)

  1. 　ダイオードの周りを取り囲むことにより、前記ダイオードを位置決めし、かつ内部に半田が供給される位置決め部を有する放熱板を備えたダイオードの取付構造。 A diode mounting structure provided with a heat sink having a positioning portion for positioning the diode by surrounding the diode and supplying solder therein.
  2. 　前記位置決め部が前記ダイオードの底部の外周と対向する囲い壁を有し、前記半田が前記底部の外周及び前記囲い壁に付着していることを特徴とする請求項１記載のダイオードの取付構造。 2. The diode mounting structure according to claim 1, wherein the positioning portion has a surrounding wall facing an outer periphery of the bottom portion of the diode, and the solder is attached to the outer periphery of the bottom portion and the surrounding wall.
  3. 　前記底部の外周と前記囲い壁との間に形成される半田フィレットの斜面が、前記ダイオードの底面の高さよりも高位に位置していることを特徴とする請求項２記載のダイオードの取付構造。 3. The diode mounting structure according to claim 2, wherein a slope of a solder fillet formed between an outer periphery of the bottom portion and the surrounding wall is positioned higher than a height of a bottom surface of the diode.
  4. 　前記囲い壁が鉛直方向にほぼ沿った垂直面とされていることを特徴とする請求項２又は３記載のダイオードの取付構造。 4. The diode mounting structure according to claim 2, wherein the surrounding wall is a vertical surface substantially along the vertical direction.
  5. 　前記位置決め部が前記放熱板の表面において前記ダイオードの底部に沿って凹む形態とされていることを特徴とする請求項２ないし４のいずれか１項記載のダイオードの取付構造。 The diode mounting structure according to any one of claims 2 to 4, wherein the positioning portion is recessed along the bottom of the diode on the surface of the heat sink.
  6. 　前記位置決め部が前記放熱板の板厚範囲内で形成されていることを特徴とする請求項５記載のダイオードの取付構造。 6. The diode mounting structure according to claim 5, wherein the positioning portion is formed within a thickness range of the heat radiating plate.
  7. 　前記ダイオードが、発熱部を有する本体部と、前記本体部から延びるリード部とからなり、前記放熱板が前記ダイオードを介して互いに接続される少なくとも２つの端子板によって構成され、前記２つの端子板のうち、一方の端子板に、前記本体部を位置決めする前記位置決め部が設けられ、他方の端子板に、前記リード部の先端部を位置決めする別の位置決め部が設けられていることを特徴とする請求項１ないし６のいずれか１項記載のダイオードの取付構造。 The diode includes a main body portion having a heat generating portion and a lead portion extending from the main body portion, and the heat sink is constituted by at least two terminal plates connected to each other via the diode, and the two terminal plates One of the terminal plates is provided with the positioning portion for positioning the main body, and the other terminal plate is provided with another positioning portion for positioning the leading end of the lead portion. The diode mounting structure according to any one of claims 1 to 6.
  8. 　前記位置決め部が、前記本体部の底部の外周を全周に亘って取り囲む形態とされていることを特徴とする請求項７記載のダイオードの取付構造。 8. The diode mounting structure according to claim 7, wherein the positioning portion surrounds the entire outer periphery of the bottom portion of the main body portion.
  9. 　前記別の位置決め部が、前記リード部の先端部の外周を、前記本体部と対向する側を除いて取り囲む形態とされていることを特徴とする請求項７又は８記載のダイオードの取付構造。 9. The diode mounting structure according to claim 7, wherein the another positioning portion surrounds the outer periphery of the tip portion of the lead portion except for the side facing the main body portion.
  10. 　前記放熱板における前記位置決め部の底壁には、溶融状態にある前記半田の内部で発生したガスを抜くためのガス抜き孔が貫通して形成されていることを特徴とする請求項１ないし９のいずれか１項記載のダイオードの取付構造。 10. A vent hole for venting a gas generated inside the solder in a molten state is formed through the bottom wall of the positioning portion of the heat radiating plate. The diode mounting structure according to any one of the above.
PCT/JP2012/064472 2011-11-30 2012-06-05 Structure for attaching diode WO2013080588A1 (en)

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JP2011262148A JP2013115338A (en) 2011-11-30 2011-11-30 Fitting structure for diode

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JP2016025228A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure
JP2016122679A (en) * 2014-12-24 2016-07-07 株式会社オートネットワーク技術研究所 Circuit constitution body and manufacturing method for the same

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CN105814681B (en) 2013-11-29 2020-01-10 株式会社神户制钢所 Base plate and semiconductor device provided with base plate

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JP2007116173A (en) * 2005-10-20 2007-05-10 Tyco Electronics Amp Gmbh Connecting apparatus, manufacturing method of the same and solar module

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JPS6225491A (en) * 1985-07-25 1987-02-03 松下電工株式会社 Printed wiring board and making thereof
JP2003258415A (en) * 2002-02-28 2003-09-12 Hitachi Unisia Automotive Ltd Circuit board device
JP2005101353A (en) * 2003-09-25 2005-04-14 Toshiba Corp Ceramics circuit substrate
JP2007116173A (en) * 2005-10-20 2007-05-10 Tyco Electronics Amp Gmbh Connecting apparatus, manufacturing method of the same and solar module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025228A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure
JP2016122679A (en) * 2014-12-24 2016-07-07 株式会社オートネットワーク技術研究所 Circuit constitution body and manufacturing method for the same

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