WO2013080588A1 - Structure pour fixation de diode - Google Patents

Structure pour fixation de diode Download PDF

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Publication number
WO2013080588A1
WO2013080588A1 PCT/JP2012/064472 JP2012064472W WO2013080588A1 WO 2013080588 A1 WO2013080588 A1 WO 2013080588A1 JP 2012064472 W JP2012064472 W JP 2012064472W WO 2013080588 A1 WO2013080588 A1 WO 2013080588A1
Authority
WO
WIPO (PCT)
Prior art keywords
diode
positioning
main body
mounting structure
structure according
Prior art date
Application number
PCT/JP2012/064472
Other languages
English (en)
Japanese (ja)
Inventor
吉川　裕之
典之 坂上
Original Assignee
住友電装株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電装株式会社 filed Critical 住友電装株式会社
Publication of WO2013080588A1 publication Critical patent/WO2013080588A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a diode mounting structure.
  • Patent Document 1 discloses a terminal box attached to a solar cell module.
  • a plurality of terminal plates are accommodated in the box body of the terminal box, and each terminal plate is connected to each other via a diode for preventing backflow.
  • the diode has a block-shaped main body portion having a heat generating portion and a pair of pin-shaped lead portions extending from the main body portion.
  • the main body is fixed by screwing to one of the adjacent terminal boards.
  • One of the lead portions is connected to one terminal board by soldering, and the other is connected to the other terminal board by soldering.
  • the conventional diode mounting structure has a problem that the screw tightening process and the soldering process must be performed separately, and the work load is large. In view of this, if the fixing operation of the main body is also performed with solder, the mounting of the entire diode is integrated into the soldering process, and the work burden is reduced. In this case, according to the reflow soldering, the mounting process is automated, and it becomes possible to further improve the workability. However, for example, when performing reflow soldering, there is a possibility that the main body of the diode may be displaced without staying at a predetermined position on the surface of one terminal board.
  • the present invention has been completed based on the above situation, and an object thereof is to prevent the displacement of the diode.
  • the diode mounting structure of the present invention is characterized in that it includes a heat radiating plate having a positioning portion for positioning the diode by surrounding the diode and supplying solder therein.
  • the diode When a diode is placed on the positioning part of the heat sink, the diode is surrounded by the positioning part and the diode is positioned, so that the diode is prevented from being displaced in the soldering process or the like.
  • FIG. 1 It is a top view of the terminal box for solar cell modules containing the attachment structure of the diode which concerns on Example 1 of this invention. It is sectional drawing of the attachment structure of a diode. It is a top view of the attachment structure of a diode. It is sectional drawing showing the state before mounting a diode on a heat sink. It is a top view of the 1st and 2nd positioning part. It is a top view of the 1st positioning part in the attachment structure of the diode which concerns on Example 2 of this invention. It is sectional drawing of the attachment structure of the diode which concerns on a reference example.
  • the positioning part has an enclosure wall facing the outer periphery of the bottom part of the diode, and the solder adheres to the outer periphery of the bottom part and the enclosure wall. Thereby, a good solder fillet is formed, and the solder connection strength is improved.
  • the slope of the solder fillet formed between the outer periphery of the bottom and the surrounding wall is positioned higher than the height of the bottom surface of the diode. Thereby, a sufficient solder height is ensured, and the solder connection strength is further increased.
  • the surrounding wall is a vertical surface substantially along the vertical direction. As a result, the solder easily rises along the enclosure wall, and a good solder fillet is formed.
  • the positioning portion is recessed along the bottom of the diode on the surface of the heat sink. Thereby, a positioning part can be shape
  • the diode includes a main body portion having a heat generating portion and a lead portion extending from the main body portion, and the heat sink is constituted by at least two terminal plates connected to each other via the diode, and the two terminal plates Of these, one terminal board is provided with the positioning part for positioning the main body part, and the other terminal board is provided with another positioning part for positioning the tip of the lead part. Since the positioning portion positions the main body portion on one terminal plate and the other positioning portion positions the lead portion on the other terminal plate, the displacement of the diode is reliably prevented.
  • the positioning part surrounds the outer periphery of the bottom part of the main body part over the entire circumference. This reliably prevents the diode from being displaced along the surface of the main body.
  • the other positioning portion surrounds the outer periphery of the tip portion of the lead portion except for the side facing the main body portion. As a result, the positional deviation of the leads can be reliably prevented.
  • the bottom wall of the positioning portion of the heat radiating plate is formed with a gas vent hole through which the gas generated inside the solder in a molten state passes. Since the gas generated inside the solder escapes to the outside through the vent hole, voids are hardly generated and the reliability of soldering is improved.
  • the diode mounting structure according to the first embodiment is formed in the solar cell module terminal box 60.
  • the solar cell module terminal box 60 is housed in a box body 61, a plurality of terminal plates 10 (heat radiating plates) housed in the box body 61, the box body 61, and And a plurality of diodes 30 supported by the terminal board 10.
  • the box body 61 is made of a synthetic resin, and includes a rectangular plate-like base wall 62 attached to a back surface (non-light-receiving surface) of a solar cell module (not shown) and a frame plate-like peripheral wall 63 rising from the outer periphery of the base wall 62. Have. An opening 64 is defined between the front end of the base wall 62 and the peripheral wall 63. An interconnector (not shown) is inserted into the box main body 61 from the solar cell module side through the opening 64, and the tip of the interconnector is connected to each terminal board 10 by soldering. In the case of Example 1, the opening area of the opening 64 is larger than the surface area of the base wall 62.
  • a pair of cylindrical portions 65 are formed on both left and right sides of the peripheral wall 63 so as to protrude from both sides. Both tube portions 65 are formed with insertion holes 66 through which the cables 80 can be inserted. The cable 80 is inserted from the outside into the insertion hole 66 of both the cylinder portions 65, and the distal end portion of the inserted cable 80 faces the opening 64 in the box body 61. The core wire portion 82 is exposed and disposed at the distal end portion of the cable 80 by removing the covering portion 81.
  • the four terminal boards 10 are placed side by side on the base wall 62.
  • Each terminal plate 10 is fixed to the base wall 62 through a known fixing means, and a substantially front half portion of each terminal plate 10 is disposed so as to protrude into the opening 64.
  • the one located at both left and right ends is the cable connection terminal 10 ⁇ / b> A to which the cable 80 is connected, and the one located between the two cable connection terminals 10 ⁇ / b> A is the relay terminal 10 ⁇ / b> B to which the cable 80 is not connected. It is said that.
  • a barrel portion 11 is formed to protrude sideways.
  • the barrel portion 11 has an open barrel shape and is disposed to face the cylindrical portion 65. Further, the barrel portion 11 is connected by being crimped to the core wire portion 82 of the cable 80 penetrating the cylindrical portion 65.
  • An extended portion 12 that is extended in the width direction is formed in substantially the latter half of each terminal board 10 except for the cable connection terminal 10A at the right end in the drawing.
  • a main body 31 (to be described later) of the diode 30 is installed in the extended portion 12.
  • the diode 30 is a bypass diode that bypasses a reverse-bias current, and as shown in FIGS. 2 and 3, a rectangular block-shaped main body portion 31 and a pin-like shape protruding sideways from the side surface of the main body portion 31. It consists of a pair of lead portions 32.
  • the main body 31 is formed by covering a rectifying element serving as a heat generating portion with a mold resin.
  • the flat plate portion 33 is exposed on the bottom surface of the main body portion 31, and the end portion of the flat plate portion 33 protrudes on the opposite side of the main body portion 31 from the side where both lead portions 32 protrude.
  • the leading end portions 35 of both lead portions 32 are arranged at a position spaced from the side surface of the main body portion 31 and at substantially the same height as the bottom surface of the main body portion 31.
  • the flat plate portion 33 and both lead portions 32 constitute an electrode of the diode 30.
  • the first terminal board 13 includes the body of the diode 30.
  • a first positioning portion 15 for positioning the portion 31 is provided, and a second positioning portion 16 for positioning both lead portions 32 of the diode 30 is provided on the second terminal plate 14.
  • the first positioning portion 15 is formed on the extended portion 12 of the first terminal plate 13, and the second positioning portion 16 is an end portion 17 that faces the extended portion 12 of the adjacent first terminal plate 13 in the second terminal plate 14. Is formed.
  • the first positioning portion 15 is formed in a concave shape by hitting the surface of the extended portion 12 of the first terminal plate 13, and is formed within the plate thickness range of the first terminal plate 13. ing.
  • the bottom part 34 of the main-body part 31 is inserted by the positioning state.
  • the first positioning portion 15 has a square concave shape along the outer shape of the bottom portion 34 of the main body portion 31, and includes a bottom wall 18 having a square shape in plan view and a surrounding wall 19 rising from four sides of the bottom wall 18. It is partitioned.
  • the bottom wall 18 is substantially a horizontal plane
  • the surrounding wall 19 is a vertical plane substantially along the vertical direction.
  • the bottom wall 18 is disposed in contact with the bottom surface of the main body 31, and the surface area of the bottom wall 18 is slightly larger than the surface area of the bottom surface of the main body 31. Further, the outer wall 4 of the bottom 34 of the main body 31 is arranged so as to face the enclosure wall 19, and a clearance is set between the enclosure wall 19 and the outer circumference 4 of the main body 31.
  • the second positioning portion 16 is formed in a concave shape by hitting the surface of the end portion 17 of the second terminal plate 14, and is formed within the thickness range of the second terminal plate 14.
  • the leading end portions 35 of both lead portions 32 are fitted in a positioned state.
  • the second positioning portion 16 has an elongated shape in the width direction along the outer shape of the distal end portion 35 of both the lead portions 32 and is formed by a pair of front and rear concave grooves 21. Both concave grooves 21 are configured to extend in the width direction and open to the end face of the second terminal plate 14, and are disposed to face the second positioning portion 16 in the width direction.
  • the concave groove 21 includes an inner bottom surface 22 that is disposed in contact with the bottom surface of the tip portion 35 of the lead portion 32, and an outer periphery 3 excluding the first positioning portion 15 side of the outer periphery of the tip portions 35 of both lead portions 32. It is divided by the inner side surface 23 arrange
  • the relay terminal 10B is provided with both the first and second positioning portions 15 and 16, and the cable connection terminal 10A at the left end in the drawing has the first Only one positioning portion 15 is provided, and only the second positioning portion 16 is provided at the cable connection terminal 10A at the right end in the drawing. And each 1st, 2nd positioning part 15 and 16 is arrange
  • solder 40 is supplied into the first and second positioning portions 15 and 16, and the main body portion 31 is connected and fixed in the first positioning portion 15 via the solder 40. Both lead portions 32 are connected and fixed in the second positioning portion 16.
  • Each terminal board 10 supports a diode 30, the first positioning portion 15 accommodates the bottom 34 of the body portion 31 of the diode 30 in a positioned state, and the second positioning portion 16 includes the diode 30. Both lead portions 32 are accommodated in a positioned state.
  • the outer periphery of the bottom 34 of the main body 31 is surrounded by the surrounding wall 19 of the first positioning portion 15 over the entire periphery, and the outer periphery of the distal end portion 35 of both lead portions 32 faces the first positioning portion 15 side. Except for this, it is surrounded by the inner surface 23 of the second positioning portion 16.
  • paste solder 40 is applied in advance to the bottom wall 18 of the first positioning portion 15 and the inner bottom surface 22 of the second positioning portion 16.
  • each terminal plate 10 is passed through a reflow furnace (not shown), and the paste solder 40 is melted.
  • the first and second positioning portions 15 and 16 prevent the position of each diode 30 from being displaced.
  • the paste solder 40 is melted, as shown in FIG. 2, in the first positioning portion 15, the solder 40 rises along the outer periphery of the enclosure wall 19 and the bottom 34 of the main body 31, and the enclosure wall 19 and the main body Sufficient solder 40 is ensured between the outer periphery of the bottom 34 of the part 31.
  • a good solder fillet is formed between the enclosure wall 19 and the outer periphery of the bottom 34 of the main body 31.
  • the slope (hem portion) of the solder fillet is positioned higher than the height of the bottom surface of the diode 30.
  • the solder 40 rises along the outer periphery of the inner side surface 23 and the distal end portion 35 of both lead portions 32, and between the inner side surface 23 and the outer periphery of the distal end portion 35 of both lead portions 32. Sufficient solder 40 is ensured and a good solder fillet is formed.
  • the soldering strength of the diode 30 to each terminal board 10 may not be ensured.
  • the periphery of the diode 30 is surrounded by the first and second positioning portions 15 and 16 as in the first embodiment, the solder rise is improved and the soldering strength of the diode 30 is increased.
  • each terminal plate 10 is placed and fixed on the base wall 62 of the box body 61, and the core portions 82 of both cables 80 are crimped and connected to the barrel portions 11 of both cable connection terminals 10A.
  • the box body 61 is placed on the back surface of the solar cell module, and the interconnector is drawn through the opening 64 along with the box body 61, and the front end of each terminal board 10 is soldered to the front end of the interconnector.
  • the box body 61 is fixed to the back surface of the solar cell module through a known fixing means such as an adhesive.
  • the periphery of the body portion 31 is surrounded by the first positioning portion 15. Since 30 is positioned, it is possible to prevent the diode 30 from being displaced in the soldering process.
  • the first positioning portion 15 has the surrounding wall 19 facing the outer periphery of the bottom portion 34 of the main body portion 31, and the solder 40 adheres to the outer periphery of the bottom portion 34 of the main body portion 31 and the surrounding wall 19. A solder fillet is formed, and the solder connection strength is improved.
  • the first positioning portion 15 surrounds the outer periphery of the bottom portion 34 of the main body portion 31 over the entire circumference, the diode 30 is reliably prevented from being displaced along the surface of the main body portion 31.
  • the first positioning portion 15 has a concave shape in which the bottom portion 34 of the main body 31 can be fitted on the surface of the terminal board 10, the first positioning portion 15 can be easily formed by press working.
  • the first positioning portion 15 positions the main body portion 31 in the first terminal plate 13 and the second positioning portion 16 positions both lead portions 32 in the second terminal plate 14, the displacement of the diode 30 is more reliable. To be prevented.
  • FIG. 6 shows a second embodiment of the present invention.
  • the internal shape of the bottom wall 18A of the first positioning portion 15A is different from the first embodiment. Others are the same as those of the first embodiment, and a duplicate description is omitted.
  • a gas vent hole 27 is formed in the bottom wall 18A of the first positioning portion 15A.
  • the gas vent hole 27 is elongated in a slit shape in the front-rear direction on the bottom wall 18 and penetrates the first terminal board 13 in the plate thickness direction.
  • the gas generated in the molten solder 40 during the reflow process escapes to the outside through the gas vent hole 27, voids are hardly generated and the reliability of soldering is improved.
  • the present invention is not limited to the embodiments described with reference to the above description and drawings, and may be, for example, as follows.
  • the surrounding wall may be erected on the surface of the first terminal plate, and the periphery of the main body of the diode may be surrounded by the surrounding wall.
  • the second positioning portion that positions both the lead portions of the diode may be omitted.
  • the diode may be supported by a heat radiating plate having no terminal function and having only a heat radiating function.
  • the diode may be of a bare chip type in which the periphery of the rectifying element is not sealed with resin.
  • a plurality of gas vent holes in the second embodiment may be provided on the bottom wall of the first positioning portion.
  • this invention is not limited to the terminal box for solar cell modules, It can apply widely to the thing of the structure which solders a diode to a heat sink.
  • Terminal board 13 First terminal board (one terminal board) 14 ... 2nd terminal board (the other terminal board) 15 ... 1st positioning part (positioning part) 16 ... 2nd positioning part (another positioning part) DESCRIPTION OF SYMBOLS 19 ... Enclosure 30 ... Diode 31 ... Main-body part 32 ... Lead part 34 ... Bottom part 35 ... Tip part (tip part of lead part) 40 ... solder 60 ... terminal box for solar cell module

Abstract

L'invention concerne l'élimination d'un décalage de position d'une diode (30). La diode (30) est connectée à une première plaque à bornes (13) et à une deuxième plaque à bornes (14), qui sont adjacentes l'une à l'autre. Une section du corps principal (31) de la diode (30) est placée dans une première section d'alignement (15) en étant alignée avec la première section d'alignement qui est formée dans la première plaque à bornes (13), et la section du corps principal est fixée à la première section d'alignement (15) au moyen d'une soudure (40) fournie à l'intérieur de la première section d'alignement (15). Une section de raccordement (32) de la diode (30) est placée dans une deuxième section d'alignement (16) en étant alignée avec la deuxième section d'alignement qui est formée dans la deuxième plaque à bornes (14), et la section de raccordement est fixée à la deuxième section d'alignement (16) au moyen de la soudure (40) fournie à l'intérieur de la deuxième section d'alignement (16).
PCT/JP2012/064472 2011-11-30 2012-06-05 Structure pour fixation de diode WO2013080588A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-262148 2011-11-30
JP2011262148A JP2013115338A (ja) 2011-11-30 2011-11-30 ダイオードの取付構造

Publications (1)

Publication Number Publication Date
WO2013080588A1 true WO2013080588A1 (fr) 2013-06-06

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PCT/JP2012/064472 WO2013080588A1 (fr) 2011-11-30 2012-06-05 Structure pour fixation de diode

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WO (1) WO2013080588A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025228A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体
JP2016122679A (ja) * 2014-12-24 2016-07-07 株式会社オートネットワーク技術研究所 回路構成体およびその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY179461A (en) 2013-11-29 2020-11-06 Kobe Steel Ltd Base plate, and semiconductor device provided with base plate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6225491A (ja) * 1985-07-25 1987-02-03 松下電工株式会社 印刷配線板の製法
JP2003258415A (ja) * 2002-02-28 2003-09-12 Hitachi Unisia Automotive Ltd 回路基板装置
JP2005101353A (ja) * 2003-09-25 2005-04-14 Toshiba Corp セラミックス回路基板
JP2007116173A (ja) * 2005-10-20 2007-05-10 Tyco Electronics Amp Gmbh 接続装置、その製造方法及びソーラーモジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6225491A (ja) * 1985-07-25 1987-02-03 松下電工株式会社 印刷配線板の製法
JP2003258415A (ja) * 2002-02-28 2003-09-12 Hitachi Unisia Automotive Ltd 回路基板装置
JP2005101353A (ja) * 2003-09-25 2005-04-14 Toshiba Corp セラミックス回路基板
JP2007116173A (ja) * 2005-10-20 2007-05-10 Tyco Electronics Amp Gmbh 接続装置、その製造方法及びソーラーモジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025228A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体
JP2016122679A (ja) * 2014-12-24 2016-07-07 株式会社オートネットワーク技術研究所 回路構成体およびその製造方法

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