MY179461A - Base plate, and semiconductor device provided with base plate - Google Patents

Base plate, and semiconductor device provided with base plate

Info

Publication number
MY179461A
MY179461A MYPI2016701892A MYPI2016701892A MY179461A MY 179461 A MY179461 A MY 179461A MY PI2016701892 A MYPI2016701892 A MY PI2016701892A MY PI2016701892 A MYPI2016701892 A MY PI2016701892A MY 179461 A MY179461 A MY 179461A
Authority
MY
Malaysia
Prior art keywords
base plate
joined
semiconductor device
concave
device provided
Prior art date
Application number
MYPI2016701892A
Inventor
Tao Hiroaki
Ichihara Chikara
Jiko Norihiro
Tauchi Yuki
Mitsui Toshiyuki
Original Assignee
Kobe Steel Ltd
Shinko Leadmikk Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd, Shinko Leadmikk Co Ltd filed Critical Kobe Steel Ltd
Publication of MY179461A publication Critical patent/MY179461A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A base plate (1, 1A to 1E, 11, 11A to 11E, 41, 51) in which a member to be joined (W) is joined to one mounting surface via a joining material (S), wherein the joining position of the mounting surface, to which the member to be joined (W) is joined, is provided with a concave for joining the member to be joined (W) via the joining material (S). The concave is configured so that the area of the opening thereof is greater than the member to be joined (W), and the depression at the outer circumferential part of the concave, which faces the outer circumferential edge of the member to be joined (W), is deeper than the depression at the central part of the concave.
MYPI2016701892A 2013-11-29 2014-11-26 Base plate, and semiconductor device provided with base plate MY179461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013248233 2013-11-29

Publications (1)

Publication Number Publication Date
MY179461A true MY179461A (en) 2020-11-06

Family

ID=53199100

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016701892A MY179461A (en) 2013-11-29 2014-11-26 Base plate, and semiconductor device provided with base plate

Country Status (7)

Country Link
JP (1) JP6371204B2 (en)
KR (1) KR101922783B1 (en)
CN (1) CN105814681B (en)
DE (1) DE112014006336T5 (en)
MY (1) MY179461A (en)
TW (1) TWI668808B (en)
WO (1) WO2015080161A1 (en)

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JP6572732B2 (en) * 2015-10-27 2019-09-11 三菱マテリアル株式会社 Power module
CN107431050B (en) * 2016-01-06 2019-12-13 新电元工业株式会社 mounting table for semiconductor device and in-vehicle apparatus
JP6761592B2 (en) * 2016-03-31 2020-09-30 大日本印刷株式会社 Electronic devices and their manufacturing methods
JP6610590B2 (en) * 2017-03-21 2019-11-27 トヨタ自動車株式会社 Semiconductor device and manufacturing method thereof
JP6930189B2 (en) * 2017-04-11 2021-09-01 富士電機株式会社 Module manufacturing method, solder, and module
JP6890496B2 (en) * 2017-07-27 2021-06-18 京セラ株式会社 Manufacturing method of electronic component mounting board, electronic device and electronic component mounting board
CN113922205B (en) * 2018-01-05 2023-02-14 深圳市绎立锐光科技开发有限公司 Substrate, method for forming packaging structure by using substrate and packaging structure
JP7005373B2 (en) 2018-02-09 2022-01-21 三菱電機株式会社 Power module and power converter
JP6933592B2 (en) * 2018-02-23 2021-09-08 日立Astemo株式会社 Igniter
JP7074621B2 (en) * 2018-09-05 2022-05-24 株式会社東芝 Semiconductor devices and their manufacturing methods
JP7237647B2 (en) * 2019-02-26 2023-03-13 京セラ株式会社 Circuit boards and electronic devices
WO2023223881A1 (en) * 2022-05-18 2023-11-23 ローム株式会社 Electronic device

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JPH0637122A (en) * 1992-07-15 1994-02-10 Hitachi Ltd Semiconductor device
JPH0758273A (en) * 1993-08-16 1995-03-03 Sony Corp Lead frame and semiconductor device using same
JPH10189845A (en) * 1996-12-25 1998-07-21 Denso Corp Heat sink for semiconductor device
KR20040093384A (en) * 2002-02-28 2004-11-05 로무 가부시키가이샤 Light emitting diode lamp
JP3913090B2 (en) * 2002-02-28 2007-05-09 ローム株式会社 Light emitting diode lamp
JP2006140402A (en) * 2004-11-15 2006-06-01 Toshiba Corp Semiconductor integrated circuit device
JP4904767B2 (en) * 2005-10-17 2012-03-28 富士電機株式会社 Semiconductor device
KR100752011B1 (en) * 2006-04-12 2007-08-28 삼성전기주식회사 A package strip format and its array
JP2009070907A (en) * 2007-09-11 2009-04-02 Toyota Motor Corp Semiconductor device
JP2009094157A (en) * 2007-10-04 2009-04-30 Sharp Corp Heat spreader, semiconductor apparatus, electronic equipment, manufacturing method of heat spreader, and manufacturing method of semiconductor device
JP4989552B2 (en) * 2008-05-08 2012-08-01 トヨタ自動車株式会社 Electronic components
JP5124396B2 (en) * 2008-09-01 2013-01-23 新電元工業株式会社 Heat dissipation board unit
JP5282075B2 (en) 2010-08-25 2013-09-04 株式会社豊田自動織機 Heat dissipation device
JP5577221B2 (en) * 2010-11-11 2014-08-20 新電元工業株式会社 Lead frame and semiconductor device
JP5691475B2 (en) * 2010-12-15 2015-04-01 富士電機株式会社 Semiconductor device and manufacturing method thereof
JP5884291B2 (en) 2011-04-20 2016-03-15 三菱マテリアル株式会社 Power module board unit with heat sink
JP5869890B2 (en) 2011-07-29 2016-02-24 株式会社神戸製鋼所 Heat sink and manufacturing method of heat sink
JP2013115338A (en) 2011-11-30 2013-06-10 Sumitomo Wiring Syst Ltd Fitting structure for diode
JP2013123016A (en) * 2011-12-12 2013-06-20 Denso Corp Semiconductor device
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Also Published As

Publication number Publication date
KR20160075713A (en) 2016-06-29
CN105814681B (en) 2020-01-10
WO2015080161A1 (en) 2015-06-04
CN105814681A (en) 2016-07-27
KR101922783B1 (en) 2018-11-27
JP6371204B2 (en) 2018-08-08
JP2015128154A (en) 2015-07-09
TWI668808B (en) 2019-08-11
TW201528442A (en) 2015-07-16
DE112014006336T5 (en) 2016-10-20

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