WO2023223881A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2023223881A1
WO2023223881A1 PCT/JP2023/017376 JP2023017376W WO2023223881A1 WO 2023223881 A1 WO2023223881 A1 WO 2023223881A1 JP 2023017376 W JP2023017376 W JP 2023017376W WO 2023223881 A1 WO2023223881 A1 WO 2023223881A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
electronic device
thickness direction
electronic
mounting
Prior art date
Application number
PCT/JP2023/017376
Other languages
French (fr)
Japanese (ja)
Inventor
羊水 二村
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of WO2023223881A1 publication Critical patent/WO2023223881A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Definitions

  • the present disclosure relates to electronic devices.
  • Patent Document 1 discloses a semiconductor device (electronic device) including a semiconductor element as an electronic component.
  • the semiconductor device described in Patent Document 1 includes a semiconductor element, leads, a bonding material, and a sealing resin.
  • the semiconductor element is, for example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) chip.
  • the semiconductor element is bonded to the lead using a bonding material.
  • the lead mounts the semiconductor element and is electrically connected to the semiconductor element.
  • the bonding material is interposed between the semiconductor element and the lead to bond them together.
  • the sealing resin covers part of the lead, the semiconductor element, and the bonding material.
  • An object of the present disclosure is to provide an electronic device that is improved over conventional electronic devices.
  • An electronic device includes a first electronic component having a functional section, a mounting section on which the first electronic component is mounted, and a joint that joins the first electronic component and the mounting section. material and.
  • the mounting portion has a back surface facing one side in the thickness direction of the first electronic component, and a first surface and a second surface facing the other side in the thickness direction and to which the first electronic component is bonded. , has.
  • the second surface is located on the other side of the first surface in the thickness direction.
  • the first surface overlaps at least a portion of the outer periphery of the first electronic component when viewed in the thickness direction.
  • the second surface overlaps the functional section when viewed in the thickness direction.
  • FIG. 1 is a perspective view showing an electronic device according to a first embodiment.
  • FIG. 2 is a plan view showing the electronic device according to the first embodiment.
  • FIG. 3 is a plan view of essential parts of the electronic device according to the first embodiment.
  • FIG. 4 is an enlarged view of a part of FIG. 3 showing the electronic components and the bonding material.
  • FIG. 5 is a bottom view of the electronic device according to the first embodiment.
  • FIG. 6 is a front view showing the electronic device according to the first embodiment.
  • FIG. 7 is a sectional view taken along line VII-VII in FIG. 3.
  • FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 3.
  • FIG. 9 is a sectional view taken along line IX-IX in FIG. 4.
  • FIG. 7 is a sectional view taken along line VII-VII in FIG. 3.
  • FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 3.
  • FIG. 9 is a section
  • FIG. 10 is an enlarged cross-sectional view of essential parts of an electronic device according to a first modification of the first embodiment, and corresponds to the cross-section of FIG. 9 .
  • FIG. 11 is an enlarged plan view of essential parts of an electronic device according to a second modification of the first embodiment, and corresponds to FIG. 4.
  • FIG. 12 is an enlarged plan view of a main part of an electronic device according to a third modification of the first embodiment, and corresponds to FIG. 4 .
  • FIG. 13 is an enlarged sectional view of a main part of an electronic device according to a third modification of the first embodiment, and is a sectional view taken along line XIII-XIII in FIG. 12.
  • FIG. 14 is an enlarged plan view of essential parts of an electronic device according to a fourth modification of the first embodiment, and corresponds to FIG. 4.
  • FIG. 15 is an enlarged sectional view of a main part of an electronic device according to a fourth modification of the first embodiment, and is a sectional view taken along line XV-XV in FIG. 14.
  • FIG. 16 is an enlarged plan view of essential parts of an electronic device according to a fifth modification of the first embodiment, and corresponds to FIG. 4.
  • FIG. FIG. 17 is a perspective view showing an electronic device according to a second embodiment.
  • FIG. 18 is a plan view showing the electronic device according to the second embodiment, and is a view through a resin member.
  • FIG. 19 is a partially enlarged view of FIG.
  • FIG. 20 is a cross-sectional view taken along line XX-XX in FIG. 18.
  • FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 18.
  • FIG. 22 is a perspective view showing the electronic device according to the third embodiment, with the resin member omitted.
  • FIG. 23 is a plan view showing the electronic device according to the third embodiment, and is a view through a resin member.
  • FIG. 24 is a diagram in which one of the two input terminals is further transparent in the plan view of FIG. 23.
  • FIG. 25 is an enlarged view of a part of FIG. 24 showing a plurality of electronic components and a bonding material.
  • FIG. 26 is a cross-sectional view taken along line XXVI-XXVI in FIG. 23.
  • FIG. 27 is a cross-sectional view taken along line XXVII-XXVII in FIG. 23.
  • FIG. 28 is a sectional view taken along line XXVIII-XXVIII in FIG. 23.
  • FIG. 29 is an enlarged plan view of essential parts of an electronic device according to a modification of the third embodiment, and corresponds to FIG. 25.
  • a thing A is formed on a thing B" and "a thing A is formed on a thing B” mean “a thing A is formed on a thing B" unless otherwise specified.
  • A is formed directly on something B
  • a thing A is formed on something B, with another thing interposed between them.” including.
  • "a certain thing A is placed on a certain thing B” and "a certain thing A is placed on a certain thing B” are used as "a certain thing A is placed on a certain thing B” unless otherwise specified.
  • ⁇ It is placed directly on something B,'' and ⁇ A thing A is placed on something B, with another thing interposed between them.'' include.
  • an object A is located on an object B
  • an object A is in contact with an object B, and an object A is located on an object B.
  • an object A overlaps an object B when viewed in a certain direction means, unless otherwise specified, “an object A overlaps all of an object B" and "a certain object A overlaps an object B".
  • a certain thing A (constituent material) includes a certain material C means "a case where a certain thing A (constituent material) consists of a certain material C" and "a certain thing A (constituent material) includes a certain material C”. Including cases where the main component of is a certain material C.
  • First embodiment: 1 to 9 show an electronic device A1 according to the first embodiment.
  • the electronic device A1 is used in electronic equipment including a power conversion circuit, such as a DC-DC converter.
  • the electronic device A1 includes an electronic component 1A, a first lead 21, a second lead 22, a third lead 23, a bonding material 3, a plurality of conductive members 4, and a resin member 5.
  • the resin member 5 is shown as an imaginary line (two-dot chain line).
  • the electronic component 1A and the bonding material 3 are transparent, and each is shown by an imaginary line. Further, in FIG. 4, each conductive member 4 and resin member 5 are omitted.
  • the thickness direction of the electronic device A1 will be referred to as the "thickness direction z.”
  • one side of the thickness direction z may be referred to as the lower side, and the other side may be referred to as the upper side.
  • descriptions such as “upper”, “lower”, “upper”, “lower”, “upper surface”, and “lower surface” indicate the relative positional relationship of each component etc. in the thickness direction z, and do not necessarily mean It is not a term that defines the relationship with the direction of gravity.
  • plane view refers to when viewed in the thickness direction z.
  • first direction x is the vertical direction in the plan view of the electronic device A1 (see FIGS. 2 and 3).
  • second direction y A direction perpendicular to the thickness direction z and the first direction x is referred to as a "second direction y.”
  • the second direction y is the left-right direction in the plan view of the electronic device A1 (see FIGS. 2 and 3).
  • the electronic component 1A is the functional center of the electronic device A1.
  • the electronic component 1A is mounted on the first lead 21.
  • the electronic component 1A has a main surface 10a and a back surface 10b.
  • the main surface 10a and the back surface 10b are spaced apart from each other in the thickness direction z.
  • the main surface 10a faces upward in the thickness direction z
  • the back surface 10b faces downward in the thickness direction z.
  • the back surface 10b faces the first lead 21.
  • the dimension of the electronic component 1A in the thickness direction z (the distance between the main surface 10a and the back surface 10b along the thickness direction z) is not limited at all, but is, for example, 50 ⁇ m or more and 200 ⁇ m or less.
  • the electronic component 1A includes a functional section 11.
  • the functional unit 11 is, for example, a power transistor.
  • the power transistor is, for example, a vertical MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor).
  • the functional unit 11 is not limited to a MOSFET, and may be another transistor such as an IGBT (Insulated Gate Bipolar Transistor), an LSI, or a diode.
  • the functional unit 11 becomes a heat source when the electronic device A1 is energized. For convenience of understanding, a dot pattern is drawn on the functional section 11 in FIG.
  • the functional section 11 includes a semiconductor layer 110, a first electrode 111, a second electrode 112, and a third electrode 113.
  • Semiconductor layer 110 includes a semiconductor material.
  • the semiconductor material is silicon carbide (SiC), for example.
  • silicon (Si), GaN (gallium nitride), or the like may be used as the semiconductor material.
  • a current corresponding to the electric power converted by the functional unit 11 flows through the first electrode 111 .
  • a current corresponding to the power before being converted by the functional unit 11 flows through the second electrode 112 .
  • a drive signal for driving the functional unit 11 is input to the third electrode 113 .
  • the first electrode 111 is a drain
  • the second electrode 112 is a source
  • the third electrode 113 is a gate.
  • the first electrode 111 is arranged on the back surface 10b.
  • the second electrode 112 and the third electrode 113 are arranged on the main surface 10a.
  • the first lead 21 is mounted with the electronic component 1A and forms part of a conductive path between the electronic component 1A and a circuit board (not shown) on which the electronic device A1 is mounted.
  • the first lead 21 includes a mounting portion 211 and a terminal portion 212.
  • the mounting portion 211 and the terminal portion 212 are integrally formed.
  • the mounting portion 211 is covered with the resin member 5.
  • the electronic component 1A described above is mounted on the mounting section 211.
  • the mounting portion 211 is electrically connected to the first electrode 111 of the electronic component 1A via the bonding material 3.
  • the mounting portion 211 has a first surface 210a, a second surface 210b, and a back surface 210d.
  • Each of the first surface 210a and the second surface 210b is located below the electronic component 1A in the thickness direction z.
  • Each of the first surface 210a and the second surface 210b faces upward in the thickness direction z.
  • the electronic component 1A is bonded to the first surface 210a and the second surface 210b so as to straddle them.
  • the first surface 210a is arranged so as to surround the second surface 210b in plan view.
  • the first surface 210a is, for example, flat and extends along a plane (xy plane) orthogonal to the thickness direction z. In the illustrated example, the first surface 210a overlaps the entire outer periphery 19 of the electronic component 1A in plan view.
  • the second surface 210b is located above the first surface 210a in the thickness direction z. That is, the second surface 210b is located closer to the electronic component 1A than the first surface 210a in the thickness direction z.
  • the second surface 210b is, for example, flat and extends along the xy plane. In this embodiment, the second surface 210b is located inside the electronic component 1A in plan view. Further, the second surface 210b overlaps all of the functional section 11 in plan view.
  • the second surface 210b has a rectangular shape in plan view.
  • the back surface 210d faces downward in the thickness direction z. That is, the back surface 210d faces the opposite side to the first surface 210a and the second surface 210b in the thickness direction z.
  • the back surface 210d is, for example, flat and extends along the xy plane. In the illustrated example, the back surface 210d is exposed from the resin member 5. In plan view, the back surface 210d overlaps the first surface 210a and the second surface 210b.
  • the mounting portion 211 includes a base portion 2111 and a protruding portion 2112.
  • the base 2111 surrounds the protrusion 2112 in plan view.
  • the protrusion 2112 protrudes higher than the base 2111 in the thickness direction z.
  • the thickness of the protrusion 2112 (dimension in the thickness direction z) is larger than the thickness (dimension in the thickness direction z) of the base 2111.
  • the lower surface of the base 2111 and the lower surface of the protrusion 2112 are flush with each other.
  • the first surface 210a described above is the upper surface of the base 2111.
  • the second surface 210b described above is the upper surface of the protrusion 2112.
  • the back surface 210d described above is the lower surface of the base 2111 and the lower surface of the protrusion 2112.
  • the protrusion dimension of the protrusion 2112 with respect to the base 2111 is not limited at all, but is, for example, 20 ⁇ m or more and 50 ⁇ m or less.
  • the mounting portion 211 has a through hole 211A formed in the base portion 2111.
  • the through hole 211A penetrates the base portion 2111 (mounting portion 211) in the z direction.
  • the through hole 211A has a circular shape in plan view.
  • the terminal portion 212 extends along the first direction x from the edge of the mounting portion 211 on the other side in the first direction x.
  • the terminal portion 212 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5.
  • the portion of the terminal portion 212 covered with the resin member 5 is bent.
  • the surface of the terminal portion 212 exposed from the resin member 5 may be plated (for example, tin plating).
  • a portion of the terminal portion 212 exposed from the resin member 5 is electrically connected to a circuit board (not shown) on which the electronic device A1 is mounted.
  • the second lead 22 is separated from the first lead 21.
  • the second lead 22 is electrically connected to the second electrode 112 of the electronic component 1A via the conductive member 4.
  • the second lead 22 includes a pad portion 221 and a terminal portion 222.
  • the pad portion 221 is covered with the resin member 5.
  • the conductive member 4 is joined to the pad portion 221 .
  • the surface of the pad portion 221 to which the conductive member 4 is bonded may be plated with silver or tin, for example.
  • the terminal section 222 is connected to the pad section 221.
  • the terminal portion 222 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5.
  • the terminal portion 222 extends, for example, in parallel with the terminal portion 212 in the first direction x.
  • the surface of the terminal portion 222 exposed from the resin member 5 may be plated (for example, tin plated).
  • a portion of the terminal portion 222 exposed from the resin member 5 is electrically connected to a circuit board (not shown) on which the electronic device A1 is mounted.
  • the third lead 23 is separated from the first lead 21 and is located on the opposite side of the second lead 22 with the first lead 21 in between in the second direction y.
  • the third lead 23 is electrically connected to the third electrode 113 of the electronic component 1A via the conductive member 4.
  • the third lead 23 includes a pad portion 231 and a terminal portion 232.
  • the pad portion 231 is covered with the resin member 5.
  • the conductive member 4 is joined to the pad portion 231 .
  • the surface of the pad portion 231 to which the conductive member 4 is bonded may be plated with silver, tin, or the like.
  • the terminal section 232 is connected to the pad section 231.
  • the terminal portion 232 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5.
  • the terminal portion 232 extends, for example, in parallel with the terminal portion 212 in the first direction x.
  • the surface of the terminal portion 232 exposed from the resin member 5 may be plated (for example, tin plating).
  • a portion of the terminal portion 232 exposed from the resin member 5 is electrically connected to a circuit board (not shown) on which the electronic device A1 is mounted.
  • the bonding material 3 bonds the electronic component 1A and the mounting portion 211 (first lead 21).
  • the bonding material 3 includes a conductive material, such as solder, metal paste material, or sintered metal.
  • the bonding material 3 includes a first bonding portion 31, a second bonding portion 32, and a fillet portion 30.
  • the first joint portion 31 is interposed between the first surface 210a and the back surface 10b. That is, the first joint portion 31 is interposed between the base portion 2111 and the electronic component 1A.
  • the second joint portion 32 is interposed between the second surface 210b and the back surface 10b. That is, the second joint portion 32 is interposed between the protrusion portion 2112 and the electronic component 1A.
  • the fillet portion 30 protrudes from the electronic component 1A in plan view.
  • the fillet portion 30 partially covers each side surface of the electronic component 1A. Note that the bonding material 3 does not need to include the fillet portion 30.
  • the plurality of conductive members 4 are electrically connected to the electronic component 1A, the second lead 22, and the third lead 23. This establishes mutual conduction between the electronic component 1A, the second lead 22, and the third lead 23.
  • the plurality of conductive members 4 include a first member 41 and a second member 42.
  • the first member 41 is joined to the second electrode 112 of the electronic component 1A and the pad portion 221 of the second lead 22, making them conductive.
  • the composition of the first member 41 includes copper.
  • the first member 41 is a metal clip.
  • the first member 41 is conductively bonded to the second electrode 112 and the pad portion 221 via a conductive bonding material 49 .
  • the second member 42 is joined to the third electrode 113 of the electronic component 1A and the pad portion 231 of the third lead 23, making them conductive.
  • the second member 42 is a metal wire and is formed by wire bonding.
  • the composition of the second member 42 includes gold, aluminum, or copper.
  • the resin member 5 includes the electronic component 1A, a part of the first lead 21, a part of the second lead 22, a part of the third lead 23, and a bonding member. material 3 and a plurality of conductive members 4.
  • the resin member 5 has electrical insulation properties.
  • the constituent material of the resin member 5 includes, for example, black epoxy resin.
  • the resin member 5 has a resin main surface 51, a resin back surface 52, a pair of resin side surfaces 53, a pair of resin side surfaces 54, a pair of openings 55, and a mounting hole 56.
  • the resin main surface 51 and the resin back surface 52 are spaced apart from each other in the thickness direction z.
  • the main resin surface 51 faces upward in the thickness direction z. That is, the main resin surface 51 faces the same side as the first surface 210a and the second surface 210b in the thickness direction z.
  • the resin back surface 52 faces downward in the thickness direction z. That is, the resin back surface 52 faces the same side as the second surface 210b in the thickness direction z.
  • the back surface 210d is exposed from the resin back surface 52.
  • the resin back surface 52 and the back surface 210d are flush with each other.
  • the pair of resin side surfaces 53 are spaced apart from each other in the first direction x.
  • a pair of resin side surfaces 53 are connected to the resin main surface 51 and the resin back surface 52.
  • the terminal portion 212 of the first lead 21, the terminal portion 222 of the second lead 22, and the terminal portion 232 of the third lead 23 are connected. sticks out.
  • the pair of resin side surfaces 54 are spaced apart from each other in the second direction y.
  • a pair of resin side surfaces 54 are connected to the resin main surface 51 and the resin back surface 52.
  • the pair of openings 55 are spaced apart from each other in the second direction y.
  • Each of the pair of openings 55 is recessed inward from the resin member 5 from either the resin main surface 51 or the pair of resin side surfaces 54 .
  • a portion of the upper surface of the mounting portion 211 of the first lead 21 is exposed through the pair of openings 55 .
  • the attachment hole 56 penetrates the resin member 5 from the main resin surface 51 to the resin back surface 52 in the thickness direction z.
  • the attachment hole 56 is included in the through hole 211A of the mounting portion 211.
  • the inner peripheral surface of the mounting portion 211 that defines the through hole 211A is covered with the resin member 5.
  • the maximum dimension of the attachment hole 56 is smaller than the dimension of the through hole 211A.
  • the mounting portion 211 has a first surface 210a and a second surface 210b to which the electronic component 1A is bonded.
  • the first surface 210a and the second surface 210b each face upward (on the other side) in the thickness direction z.
  • the first surface 210a overlaps at least a portion of the outer periphery 19 of the electronic component 1A when viewed in the thickness direction z.
  • the second surface 210b is located above (on the other side) in the thickness direction z than the first surface 210a, and overlaps the functional section 11 when viewed in the thickness direction z.
  • the distance along the thickness direction z between the mounting section 211 and the electronic component 1A is small due to the second surface 210b below (on one side) in the thickness direction z of the functional section 11 which is a heat generation source. , it becomes possible to improve thermal conductivity from the electronic component 1A (functional section 11) to the mounting section 211. In other words, it is possible to improve the heat dissipation performance for the heat generated by the electronic component 1A. Furthermore, due to the first surface 210a, the distance between the mounting portion 211 and the electronic component 1A along the thickness direction z is large in a part of the outer periphery 19 of the electronic component 1A, so that the distance between the mounting portion 211 and the electronic component 1A is large.
  • the bonding material 3 first bonding portion 31.
  • the bonding strength of the electronic component 1A to the mounting portion 211 can be ensured appropriately, and the mounting reliability of the electronic component 1A can be improved. Therefore, the electronic device A1 can improve the heat dissipation of the heat generated by the electronic component 1A (functional section 11) while ensuring the mounting reliability of the electronic component 1A on the mounting section 211.
  • the first surface 210a overlaps the four corners of the electronic component 1A when viewed in the thickness direction z. According to this configuration, an appropriate thickness of the bonding material 3 can be ensured at the four corners of the electronic component 1A in plan view.
  • thermal stress is applied to the bonding material 3. If the electronic component 1A were to peel off from the mounting portion 211 due to this thermal stress, it would likely occur from the outer periphery 19 (particularly at the four corners) of the electronic component 1A.
  • the bonding material 3 is appropriately thick at the four corners of the electronic component 1A in plan view, peeling of the electronic component 1A from the mounting portion 211 is suppressed.
  • the reliability of mounting the electronic component 1A on the mounting portion 211 can be improved more than when the first surface 210a does not overlap the four corners of the electronic component 1A when viewed in the thickness direction z.
  • the first surface 210a overlaps the entire outer periphery 19 of the electronic component 1A when viewed in the thickness direction z.
  • an appropriate thickness of the bonding material 3 can be ensured along the outer periphery 19 of the electronic component 1A in plan view. Therefore, the electronic device A1 can further improve the mounting reliability of the electronic component 1A on the mounting section 211.
  • the second surface 210b overlaps all of the functional parts 11 when viewed in the thickness direction z. According to this configuration, the electronic device A1 has better heat dissipation performance for the heat generated by the electronic component 1A (functional unit 11) than when the second surface 210b overlaps only a part of the functional unit 11 when viewed in the thickness direction z. You can improve.
  • the thickness of the electronic component 1A is 50 ⁇ m or more and 200 ⁇ m or less. According to the research of the inventor of the present application, when the thickness of the electronic component 1A is within this range (50 ⁇ m or more and 200 ⁇ m or less), the heat from the functional part 11 is more It has been found that the particles are not dispersed inside (for example, the semiconductor layer 110). In other words, it has been found that when the thickness of the electronic component 1A is within the above-mentioned range, a thermal gradient can occur within the electronic component 1A.
  • the electronic device A1 reduces the heat generation of the electronic component 1A (functional section 11) by reducing the distance along the thickness direction z between the electronic component 1A and the mounting section 211 below the functional section 11, which is a heat generation source. Appropriate heat dissipation can be ensured.
  • FIG. 10 shows an electronic device A2 according to a first modification of the first embodiment.
  • the electronic device A2 differs from the electronic device A1 in the following points. That is, the bonding material 3 of the electronic device A2 does not include the second bonding portion 32.
  • the bonding material 3 does not include the second bonding portion 32, and the protruding portion 2112 is in contact with the main surface 10a. That is, the first electrode 111 is in contact with the protrusion 2112 and is directly electrically connected.
  • the electronic device A2 heat dissipation can be improved while ensuring mounting reliability. Further, in the electronic device A2, the electronic component 1A is in contact with the mounting section 211. Therefore, the thermal conductivity from the electronic component 1A to the mounting portion 211 is higher in the electronic device A2 than in the electronic device A1. In other words, the electronic device A2 can improve heat dissipation compared to the electronic device A1.
  • FIG. 11 shows an electronic device A3 according to a second modification of the first embodiment.
  • the electronic device A3 differs from the electronic device A1 in the following points. That is, the shape of the protrusion 2112 of the electronic device A3 in plan view is different from the shape of the protrusion 2112 of the electronic device A1 in plan view.
  • the protruding portion 2112 of the electronic device A3 has a shape in which a strip-shaped portion extending along the first direction x and a strip-shaped portion extending along the second direction y intersect in plan view.
  • the upper surface of the protrusion 2112 that is, the second surface 210b overlaps a part of the functional section 11 in a plan view.
  • the upper surface of the base 2111 that is, the first surface 210a, overlaps a part of the outer periphery 19 of the electronic component 1A in plan view, and overlaps at least the four corners of the electronic component 1A.
  • the electronic device A3 heat dissipation can be improved while ensuring mounting reliability. Furthermore, in the electronic device A3, the first surface 210a overlaps the four corners of the electronic component 1A in plan view. Therefore, like the electronic device A1, the electronic device A3 has higher mounting reliability of the electronic component 1A on the mounting portion 211 than when the first surface 210a does not overlap the four corners of the electronic component 1A when viewed in the thickness direction z. You can improve.
  • FIGS. 12 and 13 show an electronic device A4 according to a third modification of the first embodiment.
  • the electronic device A4 differs from the electronic device A1 in the following points.
  • the mounting portion 211 of the electronic device A4 includes a groove portion 2113 instead of the protrusion portion 2112.
  • the mounting portion 211 of the electronic device A4 further has a third surface 210c.
  • the groove portion 2113 is recessed from the base portion 2111 in the thickness direction z.
  • the thickness of the groove portion 2113 (dimension in the thickness direction z) is smaller than the thickness of the base portion 2111 (dimension in the thickness direction z).
  • the lower surface of the base portion 2111 and the lower surface of the groove portion 2113 are flush with each other.
  • the groove portion 2113 is formed in a rectangular ring shape when viewed from above.
  • the base 2111 has a region surrounding the groove 2113 and a region surrounded by the groove 2113 in plan view.
  • the mounting portion 211 has a first surface 210a, a second surface 210b, a third surface 210c, and a back surface 210d.
  • the third surface 210c is located above the first surface 210a in the thickness direction z.
  • the third surface 210c is at the same position as the second surface 210b in the thickness direction z.
  • the first surface 210a is the upper surface of the groove portion 2113.
  • the second surface 210b is the upper surface of the portion of the base 2111 surrounded by the groove 2113 in plan view.
  • the third surface 210c is the upper surface of the portion of the base 2111 that surrounds the groove 2113 in a plan view.
  • the back surface 210d is the lower surface of the base portion 2111 and the lower surface of the groove portion 2113.
  • the second surface 210b reduces the distance along the thickness direction z between the mounting portion 211 and the electronic component 1A below the functional portion 11, which is a heat generation source, in the thickness direction z. can be made smaller. Therefore, it is possible to improve the thermal conductivity from the electronic component 1A (functional section 11) to the mounting section 211.
  • the distance along the thickness direction z between the mounting portion 211 and the electronic component 1A can be increased in at least a portion of the outer periphery 19 of the electronic component 1A by the first surface 210a. That is, like the electronic device A1, the electronic device A4 can improve the heat dissipation of the heat generated by the electronic component 1A (functional section 11) while ensuring the mounting reliability of the electronic component 1A on the mounting section 211.
  • the first surface 210a is the upper surface of the groove portion 2113 that is recessed below the base portion 2111 in the thickness direction z. According to this configuration, the spread of the bonding material 3 to the outside of the groove 2113 is suppressed due to the difference in level between the groove 2113 and the base 2111 located outside the groove 2113. In other words, the electronic device A4 can prevent the thickness of the bonding material 3 from becoming unintentionally small in the outer periphery 19 portion of the electronic component 1A in plan view.
  • FIGS. 14 and 15 show an electronic device A5 according to a fourth modification of the first embodiment.
  • Electronic device A5 differs from electronic device A4 in the following points. That is, the second surface 210b of the electronic device A5 is arranged not in the base 2111 but in the groove 2113.
  • the groove portion 2113 includes a deep bottom portion and a shallow bottom portion.
  • the deep bottom portion is more depressed from the base 2111 than the shallow bottom portion.
  • the shallow bottom portion has a rectangular shape in plan view, and the deep bottom portion has a rectangular annular shape surrounding the shallow bottom portion.
  • the shallow bottom portion overlaps the functional section 11 in plan view.
  • the first surface 210a is the top surface of the deep bottom portion
  • the second surface 210b is the top surface of the shallow bottom portion.
  • the second surface 210b is located below the third surface 210c in the thickness direction z.
  • a part of the electronic component 1A is accommodated in the groove 2113.
  • heat dissipation can be improved while ensuring mounting reliability.
  • the spread of the bonding material 3 outward of the groove portion 2113 can be suppressed, similarly to the electronic device A4. Thereby, it is possible to prevent the thickness of the bonding material 3 of the electronic device A5 from becoming unintentionally small in the outer periphery 19 portion of the electronic component 1A in plan view.
  • FIG. 16 shows an electronic device A6 according to a fifth modification of the first embodiment.
  • Electronic device A6 differs from electronic device A4 in the following points. That is, the shape of the groove 2113 of the electronic device A6 in plan view is different from the shape of the groove 2113 of the electronic device A4 in plan view.
  • the second surface 210b has a portion extending from the outside of the electronic component 1A to the electronic component 1A in plan view. This extended portion overlaps the functional section 11 in plan view. Further, the first surface 210a overlaps the four corners of the electronic component 1A in a plan view.
  • the electronic device A6 like the electronic device A4, at least a portion of the second surface 210b overlaps the functional section 11 in a plan view. Therefore, electronic device A6 can improve heat dissipation similarly to electronic device A4. Furthermore, in the electronic device A6, the first surface 210a overlaps the four corners of the electronic component 1A in a plan view, so that the mounting reliability of the electronic component 1A on the mounting portion 211 can be improved. From the above, the electronic device A6, like the electronic device A4, can improve heat dissipation while ensuring mounting reliability.
  • Second embodiment show an electronic device B1 according to the second embodiment.
  • the electronic device B1 differs from the electronic device A1 mainly in the following points.
  • the electronic device B1 includes an electronic component 1B instead of the electronic component 1A.
  • the electronic device B1 has a different package structure from the electronic device A1.
  • the electronic device B1 has an SOP (Small Outline Package) type package structure.
  • the electronic device B1 includes an electronic component 1B, a first lead 21, a plurality of leads 24, a bonding material 3, a plurality of conductive members 43, 44, 45, and a resin member 5.
  • the electronic component 1B has a functional section 11 and a control section 12.
  • the functional section 11 of the electronic component 1B is a power transistor like the functional section 11 of the electronic component 1A.
  • the control unit 12 controls the functional unit 11 (power transistor).
  • the control unit 12 includes a gate drive circuit as its functional element.
  • other circuits such as a protection circuit or an active clamp circuit may be included.
  • the gate drive circuit generates a drive signal that controls the drive of the functional section 11 (switching operation of the power transistor) based on a control signal input from the outside.
  • the electronic component 1B has a plurality of electrodes 114, 115, and 121.
  • the plurality of electrodes 114 are arranged on the main surface 10a and are electrically connected to the functional section 11.
  • the electrode 115 is arranged on the back surface 10b and is electrically connected to the functional section 11.
  • the electrode 115 is electrically connected to the mounting portion 211 via the bonding material 3.
  • the plurality of electrodes 121 are arranged on the main surface 10a and are electrically connected to the control section 12.
  • the plurality of leads 24 are each separated from the first lead 21, as shown in FIG.
  • the plurality of leads 24 are electrically connected to the electronic component 1B via the plurality of conductive members 43, 44, and 45.
  • one of the plurality of leads 24 is not connected to any of the plurality of conductive members 43, 44, and 45, and is not electrically connected to the electronic component 1B.
  • the plurality of leads 24 are arranged around the first lead 21 (mounting part 211), and in the illustrated example, one is arranged on one side of the first lead 21 in the first direction x, and the other is arranged on one side of the first lead 21 in the first direction There is one placed on the other side of one direction x.
  • the plurality of leads 24 those arranged on one side in the first direction x with respect to the first lead 21 protrude from the resin side surface 53 on one side in the first direction x.
  • those arranged on the other side in the first direction x with respect to the first lead 21 protrude from the resin side surface 53 on the other side in the first direction x.
  • the plurality of leads 24 are spaced apart from each other in the second direction y on one side in the first direction x and on the other side in the second direction y.
  • Each of the plurality of leads 24 includes a pad portion 241 and a terminal portion 242.
  • the pad portion 241 is covered with the resin member 5.
  • the pad portion 241 is connected to any one of the plurality of conductive members 43, 44, and 45.
  • the terminal portion 242 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5.
  • the terminal portion 242 extends outward from the pad portion 241 in the first direction x.
  • the terminal portion 242 is bent in a gullwing shape when viewed along the second direction y.
  • the terminal section 242 is used as an external terminal of the electronic device B1.
  • Each of the plurality of conductive members 43, 44, and 45 is, for example, a metal wire, and is formed by wire bonding.
  • the composition of each of the plurality of conductive members 43, 44, and 45 includes gold, aluminum, or copper.
  • Each of the plurality of conductive members 43 is joined to one of the plurality of electrodes 114 and one of the plurality of pad sections 241.
  • Each of the plurality of conductive members 44 is joined to one of the plurality of electrodes 121 and one of the plurality of pad sections 241.
  • Each of the plurality of conductive members 45 is joined to the mounting section 211 and one of the plurality of pad sections 241.
  • the plurality of leads 24 include one conductive to the electrode 114, one conductive to the electrode 115, and one conductive to the electrode 121 through the plurality of conductive members 43, 44, and 45.
  • the electronic device B1 has the same functions and effects as the electronic device A1 as follows. That is, the mounting portion 211 of the electronic device B1 has a first surface 210a and a second surface 210b to which the electronic component 1B is bonded. The first surface 210a and the second surface 210b each face the other side (upward) in the thickness direction z. The first surface 210a overlaps at least a portion of the outer periphery 19 of the electronic component 1B when viewed in the thickness direction z. The second surface 210b is located above the first surface 210a in the thickness direction z, and overlaps the functional section 11 when viewed in the thickness direction z.
  • the electronic device B1 similarly to the electronic device A1, the electronic device B1 has a second surface 210b that extends along the thickness direction z between the mounting portion 211 and the electronic component 1B below the functional portion 11 that is a heat generation source in the thickness direction z. Since the distance is small, it is possible to improve thermal conductivity from the electronic component 1B (functional section 11) to the mounting section 211. In other words, it is possible to improve the heat dissipation performance for the heat generated by the electronic component 1B. Further, in the electronic device B1, like the electronic device A1, the distance along the thickness direction z between the mounting portion 211 and the electronic component 1B is large in a part of the outer periphery 19 of the electronic component 1B due to the first surface 210a.
  • the electronic device B1 can improve the heat dissipation of the heat generated by the electronic component 1B (functional section 11) while ensuring the mounting reliability of the electronic component 1B on the mounting section 211.
  • the electronic device B1 has the same configuration as each of the electronic devices A1 to A6, and thus achieves the same effects as each of the electronic devices A1 to A6.
  • the second surface 210b is formed to have a similar shape to the outer shape of the functional unit 11 when viewed from above, but unlike this configuration, the second surface 210b is , it may be formed to have a similar shape to the outer shape (outer periphery 19) of the electronic component 1B.
  • the second surface 210b that is, the protruding portions 2112 are evenly arranged with respect to the electronic component 1B, it is possible to suppress the posture of the electronic component 1B from tilting.
  • the mounting portion 211 includes the base portion 2111 and the protruding portion 2112, but unlike this configuration, the mounting portion 211 is similar to the electronic devices A4 to A6 described above.
  • the structure may include a base portion 2111 and a groove portion 2113.
  • the electronic device B1 is not limited to the SOP type package structure, and may adopt other package structures.
  • the electronic device B1 may have a terminal insertion type package structure similar to the electronic device A1, or may have a leadless type package structure.
  • leadless package structures include BGA (Ball Grid Array), LGA (Land Grid Array), DFN (Dual Flatpack No-leaded), and QFN (Quad Flat No-leaded). That is, the package structure of the electronic device of the present disclosure is not limited at all.
  • Third embodiment: 22 to 28 show an electronic device C1 according to the third embodiment.
  • the electronic device C1 differs from the electronic device A1 mainly in the following points.
  • the electronic device C1 includes a plurality of electronic components 1C and 1D instead of the electronic component 1A.
  • the electronic device C1 has a different package structure from the electronic device A1.
  • the electronic device C1 includes a plurality of electronic components 1C and 1D, a pair of support boards 611 and 612, a pair of mounting parts 621 and 622, a pair of wiring boards 631 and 632, two input terminals 71 and 72, an output terminal 73, and a pair of support boards 611 and 612.
  • Each of the plurality of electronic components 1C and 1D is configured similarly to the electronic component 1A described above. That is, the plurality of electronic components 1C and 1D include a functional section 11 in which a power transistor is formed. For convenience of understanding, in FIG. 25, a dot pattern is drawn on each functional section 11 of the plurality of electronic components 1C and 1D. Further, each of the plurality of electronic components 1C and 1D has a main surface 10a, a back surface 10b, a first electrode 111, a second electrode 112, and a third electrode 113, similarly to the electronic component 1A.
  • the plurality of electronic components 1C are electrically connected in parallel. That is, the first electrodes 111 of the plurality of electronic components 1C are electrically connected to each other, and the second electrodes 112 of the plurality of electronic components 1C are electrically connected to each other. Further, the plurality of electronic components 1D are electrically connected in parallel. That is, the first electrodes 111 of the plurality of electronic components 1D are electrically connected to each other, and the second electrodes 112 of the plurality of electronic components 1D are electrically connected to each other.
  • a pair of support substrates 611 and 612 support a plurality of electronic components 1C and 1D via a pair of mounting parts 621 and 622.
  • Each of the pair of support substrates 611 and 612 is, for example, a DBC (Direct Bonded Copper) substrate.
  • the pair of mounting parts 621 and 622 are joined to the pair of support substrates 611 and 612, respectively.
  • Each composition of the pair of mounting parts 621 and 622 includes copper.
  • a plurality of electronic components 1C are bonded to the mounting portion 621.
  • the first electrodes 111 of the plurality of electronic components 1C are electrically connected to each other via the mounting portion 621.
  • a plurality of electronic components 1D are bonded to the mounting portion 622.
  • the first electrodes 111 of the plurality of electronic components 1D are electrically connected to each other via the mounting portion 622.
  • the pair of mounting parts 621 and 622 each have a first surface 620a, a second surface 620b, and a back surface 620d.
  • a first surface 620a, a second surface 620b, and a back surface 620d described below are common to each mounting portion 621, 622 unless otherwise specified.
  • the first surface 620a is arranged so as to surround the second surface 620b in plan view.
  • the first surface 620a is, for example, flat and extends along the xy plane.
  • the first surface 620a of the mounting portion 621 overlaps the four corners of each electronic component 1C in plan view.
  • the first surface 620a of the mounting section 622 overlaps the four corners of each electronic component 1D.
  • the second surface 620b is located above the first surface 620a in the thickness direction z.
  • the second surface 620b is, for example, flat and extends along the xy plane.
  • the second surface 620b has a band shape extending in the second direction y when viewed from above.
  • the second surface 620b of the mounting section 621 is formed across the plurality of electronic components 1C, and overlaps with the functional section 11 of each electronic component 1C.
  • the second surface 620b of the mounting section 622 is formed across the plurality of electronic components 1D, and overlaps with the functional section 11 of each electronic component 1D.
  • the back surface 620d faces downward in the thickness direction z. That is, the back surface 620d faces the opposite side to the first surface 620a and the second surface 620b in the thickness direction z.
  • the back surface 620d is, for example, flat and extends along the xy plane.
  • a back surface 620d of the mounting portion 621 is joined to the support substrate 611, and a back surface 620d of the mounting portion 622 is joined to the support substrate 612.
  • the pair of mounting parts 621 and 622 each include a base part 6201 and a protrusion part 6202.
  • a base portion 6201 and a protrusion portion 6202, which will be described below, are common to each of the mounting portions 621 and 622, respectively.
  • the base 6201 surrounds the protrusion 6202 in plan view.
  • the thickness of the protrusion 6202 (dimension in the thickness direction z) is larger than the thickness of the base 6201 (dimension in the thickness direction z).
  • the protrusion 6202 protrudes higher than the base 6201 in the thickness direction z.
  • the first surface 620a described above is the upper surface of the base 6201.
  • the second surface 620b described above is the upper surface of the protrusion 6202.
  • the above-mentioned back surface 620d is the lower surface of the base 6201 and the lower surface of the protrusion 6202.
  • the pair of wiring boards 631 and 632 are joined to the pair of mounting parts 621 and 622, respectively.
  • the pair of wiring boards 631 and 632 are configured of DBC boards, for example, like the support boards 611 and 612.
  • the wiring board 631 transmits drive signals and detection signals for each electronic component 1C.
  • the wiring board 632 transmits drive signals and detection signals for each electronic component 1D.
  • the two input terminals 71 and 72, the output terminal 73, and the plurality of signal terminals 741, 742, 751, and 752 each include a portion covered with the resin member 5 and a portion exposed from the resin member 5.
  • the input terminal 71 is electrically connected to the first electrode 111 of the plurality of electronic components 1C.
  • the input terminal 72 is electrically connected to the second electrode 112 of the plurality of electronic components 1D.
  • the output terminal 73 is electrically connected to the second electrode 112 of the plurality of electronic components 1C and the first electrode 111 of the plurality of electronic components 1D.
  • the signal terminal 741 is electrically connected to the third electrode 113 of the plurality of electronic components 1C via the wiring board 631.
  • the signal terminal 742 is electrically connected to the third electrode 113 of the plurality of electronic components 1D via the wiring board 632.
  • the signal terminal 751 is electrically connected to the second electrode 112 of the plurality of electronic components 1C via the wiring board 631.
  • the signal terminal 752 is electrically connected to the second electrode 112 of the plurality of electronic components 1D via the wiring board 632.
  • Each of the plurality of conductive members 46 and 47 is, for example, a metal wire, and is formed by wire bonding.
  • the composition of each of the plurality of conductive members 46 and 47 includes gold, aluminum, or copper.
  • Each of the plurality of conductive members 46 is joined to one of the plurality of electronic components 1C, 1D and one of the pair of wiring boards 631, 632.
  • the plurality of conductive members 46 include one that connects the third electrode 113 of the electronic component 1C and the wiring board 631, one that connects the second electrode 112 of the electronic component 1C and the wiring board 631, and a third conductive member of the electronic component 1D.
  • the plurality of conductive members 47 are joined to either one of the pair of wiring boards 631, 632 and one of the plurality of signal terminals 741, 742, 751, 752.
  • the plurality of conductive members 47 include one that connects the wiring board 631 and the signal terminal 741, one that connects the wiring board 631 and the signal terminal 751, one that connects the wiring board 632 and the signal terminal 742, and one that connects the wiring board 631 and the signal terminal 742.
  • the circuit board 632 and the signal terminal 752 are electrically connected to each other.
  • Each of the plurality of conductive members 48 is, for example, a metal clip.
  • the composition of each of the plurality of conductive members 48 includes, for example, copper.
  • Each of the plurality of conductive members 48 is bonded to one of the second electrodes 112 of the plurality of electronic components 1C and the mounting portion 622 via a conductive bonding material. Therefore, the second electrodes 112 of the plurality of electronic components 1C and the mounting portions 622 are electrically connected via the plurality of conductive members 48.
  • the electronic device C1 has the same functions and effects as the electronic devices A1 and B1, as follows. That is, the mounting portion 621 of the electronic device C1 has a first surface 620a and a second surface 620b to which each electronic component 1C is bonded. Each of the first surface 620a and the second surface 620b faces the other side (upward) in the thickness direction z. The first surface 620a overlaps at least a portion of the outer periphery 19 of each electronic component 1C when viewed in the thickness direction z. The second surface 620b is located on the other side (upper side) in the thickness direction z than the first surface 620a, and overlaps with the functional section 11 when viewed in the thickness direction z.
  • the second surface 620b allows the electronic device C1 to connect the mounting portion 621 and the electronic component 1B in the thickness direction below the functional portion 11, which is a heat generation source, in the thickness direction z. Since the distance along z is small, it is possible to improve thermal conductivity from each electronic component 1C (functional section 11) to the mounting section 621. In other words, it is possible to improve the heat dissipation performance for the heat generated by each electronic component 1C. Further, like each of the electronic devices A1 and B1, the electronic device C1 has a first surface 620a that extends in the thickness direction z between the mounting portion 621 and each electronic component 1C at a part of the outer periphery 19 of each electronic component 1C.
  • the electronic device C1 can improve the heat dissipation of heat generated by each electronic component 1C (functional unit 11) while ensuring the mounting reliability of each electronic component 1C on the mounting section 621. This also applies to the relationship between each electronic component 1D and the mounting section 622. In other words, the electronic device C1 can improve the heat dissipation of heat generated by each electronic component 1D (functional unit 11) while ensuring the mounting reliability of each electronic component 1D on the mounting section 622.
  • the electronic device C1 has the same configuration as each of the electronic devices A1 to A6, B1, and thus achieves the same effects as each of the electronic devices A1 to A6, B1.
  • the protrusion 2112 is formed across a plurality of electronic components 1C, but unlike this example, one protrusion 2112 is provided for each electronic component 1C. It's okay.
  • each protrusion 2112 is configured similarly to the protrusion 2112 of the electronic devices A1 to A3. This also applies to the protrusions 2112 for the plurality of electronic components 1D.
  • FIG. 29 shows an electronic device C2 according to a first modification of the third embodiment.
  • the electronic device C2 differs from the electronic device C1 in the following points. That is, each mounting section 621, 622 of the electronic device C2 includes a groove section 6203 instead of the protrusion section 6202.
  • the groove portion 6203 is depressed from the base portion 6201 in the thickness direction z.
  • the thickness of the groove portion 6203 (dimension in the thickness direction z) is smaller than the thickness of the base portion 6201 (dimension in the thickness direction z).
  • the lower surface of the base 6201 and the lower surface of the groove 6203 are flush with each other.
  • the groove portion 6203 is formed in a band shape extending in the second direction y when viewed from above.
  • the groove portion 6203 has two portions spaced apart in the first direction x.
  • One of these two parts straddles the corner of the plurality of electronic components 1C (1D) in the first direction x one side, and the other of the two parts extends in the first direction x of the plurality of electronic components 1C (1D).
  • x straddles the corner on the other side.
  • the second surface 620b allows the mounting portion 621 and each electronic component 1C to be connected to each other in the thickness direction z below the functional portion 11 of each electronic component 1C, which is a heat generation source.
  • the distance along the thickness direction z can be reduced. Therefore, it is possible to improve the thermal conductivity from each electronic component 1C (functional section 11) to the mounting section 621.
  • the distance along the thickness direction z between the mounting portion 621 and each electronic component 1C can be increased in at least a portion of the outer periphery 19 of each electronic component 1C by the first surface 620a.
  • the electronic device C2 improves the heat dissipation of heat generated by each electronic component 1C (functional section 11) while ensuring the mounting reliability of each electronic component 1C on the mounting section 621. can do.
  • This also applies to the relationship between each electronic component 1D of the electronic device C2 and the mounting section 622.
  • the electronic device C2 can improve the heat dissipation of heat generated by each electronic component 1D (functional unit 11) while ensuring the mounting reliability of each electronic component 1D on the mounting section 622.
  • the electronic device C2 has the same configuration as the electronic device C1, and has the same effects as the electronic device C1.
  • the electronic device according to the present disclosure is not limited to the embodiments described above.
  • the specific configuration of each part of the electronic device of the present disclosure can be modified in various ways.
  • the present disclosure includes the embodiments described in the appendix below. Additional note 1.
  • a first electronic component having a functional section; a mounting section on which the first electronic component is mounted; a bonding material for bonding the first electronic component and the mounting section; Equipped with The mounting portion has a back surface facing one side in the thickness direction of the first electronic component, and a first surface and a second surface facing the other side in the thickness direction and to which the first electronic component is bonded.
  • the second surface is located on the other side in the thickness direction than the first surface, The first surface overlaps at least a portion of the outer periphery of the first electronic component when viewed in the thickness direction, The second surface overlaps the functional section when viewed in the thickness direction of the electronic device.
  • Appendix 2. The first electronic component has a rectangular shape when viewed in the thickness direction, The electronic device according to supplementary note 1, wherein the second surface does not overlap any of the four corners of the first electronic component.
  • Appendix 3. When viewed in the thickness direction, all of the second surface overlaps the first electronic component, The electronic device according to appendix 1 or 2, wherein the first surface overlaps the entire outer periphery of the first electronic component when viewed in the thickness direction.
  • the mounting portion includes a base and a protrusion protruding from the base to the other side in the thickness direction, The base has the first surface, The electronic device according to any one of Supplementary Notes 1 to 4, wherein the protruding portion has the second surface.
  • the mounting portion includes a base and a groove recessed from the base to one side in the thickness direction, The groove portion has the first surface,
  • Appendix 7. The electronic device according to appendix 6, wherein the groove portion has the second surface.
  • Appendix 8. The second surface is located on one side of the third surface in the thickness direction, The electronic device according to appendix 7, wherein a part of the first electronic component is accommodated in the groove.
  • Appendix 9. The electronic device according to any one of attachments 1 to 8, wherein the functional unit is a power transistor.
  • Appendix 11. further comprising a resin member covering the first electronic component, The electronic device according to any one of Supplementary notes 1 to 10, wherein the resin member covers a part of the mounting section. Appendix 12. The electronic device according to appendix 11, wherein the back surface is exposed from the resin member. Appendix 13. further comprising a lead electrically connected to the first electronic component, The electronic device according to attachment 11 or attachment 12, wherein the lead includes a portion covered with the resin member and a portion exposed from the resin member. Appendix 14. The electronic device according to any one of Supplementary Notes 1 to 13, wherein the first electronic component and the mounting portion are electrically connected via the bonding material.
  • A1 to A6, B1, C1, C2 Electronic devices 1A, 1B, 1C, 1D: Electronic component 3: Bonding material 4: Conductive member 5: Resin member 10a: Main surface 10b: Back surface 11: Functional section 12: Control section 19 : Outer circumference 21: First lead 22: Second lead 23: Third lead 24: Lead 30: Fillet part 31: First joint part 32: Second joint part 41: First member 42: Second member 43-48: Conductive member 49: Conductive bonding material 51: Resin main surface 52: Resin back surface 53, 54: Resin side surface 55: Opening 56: Mounting holes 71, 72: Input terminal 73: Output terminal 110: Semiconductor layer 111: First electrode 112 : Second electrode 113: Third electrode 114, 115, 121: Electrode 210a: First surface 210b: Second surface 210c: Third surface 210d: Back surface 211: Mounting section 211A: Through hole 212: Terminal section 221: Pad section 222: Terminal section 231: Pad section 232:

Abstract

This electronic device comprises an electronic component having a functioning part, a mount part on which the electronic component is mounted, and a joining material for joining the electronic component and the mount part. The mount part has a rear surface facing one side in the thickness direction of the electronic component, and a first surface and a second surface which face the other side in the thickness direction and to which the electronic component is joined. The second surface is positioned further on the other side in the thickness direction than the first surface. The first surface overlaps at least a portion of the outer periphery of the electronic component when viewed in the thickness direction. The second surface overlaps the functioning part when viewed in the thickness direction.

Description

電子装置electronic equipment
　本開示は、電子装置に関する。 The present disclosure relates to electronic devices.
　従来、ダイオード、トランジスタおよびＩＣなどの電子部品を樹脂パッケージで覆った電子装置が知られている。特許文献１には、電子部品としての半導体素子を備える半導体装置（電子装置）が開示されている。特許文献１に記載の半導体装置は、半導体素子、リード、接合材および封止樹脂を備えている。この半導体装置において、半導体素子は、たとえばＭＯＳＦＥＴ（Metal Oxide Semiconductor Field Effect Transistor）チップである。半導体素子は、接合材により、リードに接合される。リードは、半導体素子を搭載するとともに、半導体素子に導通する。接合材は、半導体素子とリードとの間に介在し、これらを接合する。封止樹脂は、リードの一部、半導体素子および接合材を覆っている。 Conventionally, electronic devices are known in which electronic components such as diodes, transistors, and ICs are covered with resin packages. Patent Document 1 discloses a semiconductor device (electronic device) including a semiconductor element as an electronic component. The semiconductor device described in Patent Document 1 includes a semiconductor element, leads, a bonding material, and a sealing resin. In this semiconductor device, the semiconductor element is, for example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) chip. The semiconductor element is bonded to the lead using a bonding material. The lead mounts the semiconductor element and is electrically connected to the semiconductor element. The bonding material is interposed between the semiconductor element and the lead to bond them together. The sealing resin covers part of the lead, the semiconductor element, and the bonding material.
特開２０２１－９３４７３号公報JP 2021-93473 Publication
　上記特許文献１に記載の半導体装置のように、接合材によって電子部品を被接合対象に実装する構成では、接合材が厚いほど、被接合対象に対する電子部品の接合強度が高く、実装信頼性が高い。一方で、電子部品から被接合対象への熱伝導性が低下し、電子部品の放熱性が低下する。反対に、接合材が薄いほど、電子部品から被接合対象への熱伝導性が向上し、電子部品の放熱性が高くなる。一方で、被接合対象に対する電子部品の接合強度が低下し、実装信頼性が低下する。 In a configuration in which an electronic component is mounted on an object to be bonded using a bonding material, such as the semiconductor device described in Patent Document 1, the thicker the bonding material, the higher the bonding strength of the electronic component to the object to be bonded, and the higher the mounting reliability. expensive. On the other hand, the thermal conductivity from the electronic component to the object to be bonded decreases, and the heat dissipation of the electronic component decreases. On the other hand, the thinner the bonding material is, the better the thermal conductivity from the electronic component to the object to be bonded is, and the higher the heat dissipation of the electronic component. On the other hand, the bonding strength of the electronic component to the object to be bonded decreases, and the mounting reliability decreases.
　本開示は、従来よりも改良が施された電子装置を提供することを一の課題とする。特に本開示は、上記事情に鑑み、電子部品の実装信頼性を確保しつつ、放熱性の向上を図った電子装置を提供することを一の課題とする。 An object of the present disclosure is to provide an electronic device that is improved over conventional electronic devices. In particular, in view of the above circumstances, it is an object of the present disclosure to provide an electronic device that improves heat dissipation while ensuring mounting reliability of electronic components.
　本開示の第１の側面に基づく電子装置は、機能部を有する第１電子部品と、前記第１電子部品が搭載された搭載部と、前記第１電子部品と前記搭載部とを接合する接合材と、を備える。前記搭載部は、前記第１電子部品の厚さ方向の一方側を向く裏面と、前記厚さ方向の他方側を向き、かつ前記第１電子部品が接合された第１面および第２面と、を有する。前記第２面は、前記第１面よりも前記厚さ方向の他方側に位置する。前記第１面は、前記厚さ方向に見て、前記第１電子部品の外周の少なくとも一部に重なる。前記第２面は、前記厚さ方向に見て、前記機能部に重なる。 An electronic device according to a first aspect of the present disclosure includes a first electronic component having a functional section, a mounting section on which the first electronic component is mounted, and a joint that joins the first electronic component and the mounting section. material and. The mounting portion has a back surface facing one side in the thickness direction of the first electronic component, and a first surface and a second surface facing the other side in the thickness direction and to which the first electronic component is bonded. , has. The second surface is located on the other side of the first surface in the thickness direction. The first surface overlaps at least a portion of the outer periphery of the first electronic component when viewed in the thickness direction. The second surface overlaps the functional section when viewed in the thickness direction.
　上記構成によれば、電子装置において、電子部品の実装信頼性を確保しつつ、放熱性を向上させることができる。 According to the above configuration, in the electronic device, it is possible to improve heat dissipation while ensuring mounting reliability of electronic components.
図１は、第１実施形態にかかる電子装置を示す斜視図である。FIG. 1 is a perspective view showing an electronic device according to a first embodiment. 図２は、第１実施形態にかかる電子装置を示す平面図である。FIG. 2 is a plan view showing the electronic device according to the first embodiment. 図３は、第１実施形態にかかる電子装置を示す要部平面図である。FIG. 3 is a plan view of essential parts of the electronic device according to the first embodiment. 図４は、図３の一部を拡大した要部拡大図であって、電子部品および接合材を透過した図である。FIG. 4 is an enlarged view of a part of FIG. 3 showing the electronic components and the bonding material. 図５は、第１実施形態にかかる電子装置を示す底面図である。FIG. 5 is a bottom view of the electronic device according to the first embodiment. 図６は、第１実施形態にかかる電子装置を示す正面図である。FIG. 6 is a front view showing the electronic device according to the first embodiment. 図７は、図３のＶＩＩ－ＶＩＩ線に沿う断面図である。FIG. 7 is a sectional view taken along line VII-VII in FIG. 3. 図８は、図３のＶＩＩＩ－ＶＩＩＩ線に沿う断面図である。FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 3. 図９は、図４のＩＸ－ＩＸ線に沿う断面図である。FIG. 9 is a sectional view taken along line IX-IX in FIG. 4. 図１０は、第１実施形態の第１変形例にかかる電子装置を示す要部拡大断面図であり、図９の断面に対応した図である。FIG. 10 is an enlarged cross-sectional view of essential parts of an electronic device according to a first modification of the first embodiment, and corresponds to the cross-section of FIG. 9 . 図１１は、第１実施形態の第２変形例にかかる電子装置を示す要部拡大平面図であり、図４に対応した図である。FIG. 11 is an enlarged plan view of essential parts of an electronic device according to a second modification of the first embodiment, and corresponds to FIG. 4. FIG. 図１２は、第１実施形態の第３変形例にかかる電子装置を示す要部拡大平面図であり、図４に対応した図である。FIG. 12 is an enlarged plan view of a main part of an electronic device according to a third modification of the first embodiment, and corresponds to FIG. 4 . 図１３は、第１実施形態の第３変形例にかかる電子装置を示す要部拡大断面図であり、図１２のＸＩＩＩ－ＸＩＩＩ線に沿う断面図である。FIG. 13 is an enlarged sectional view of a main part of an electronic device according to a third modification of the first embodiment, and is a sectional view taken along line XIII-XIII in FIG. 12. 図１４は、第１実施形態の第４変形例にかかる電子装置を示す要部拡大平面図であり、図４に対応した図である。FIG. 14 is an enlarged plan view of essential parts of an electronic device according to a fourth modification of the first embodiment, and corresponds to FIG. 4. 図１５は、第１実施形態の第４変形例にかかる電子装置を示す要部拡大断面図であり、図１４のＸＶ－ＸＶ線に沿う断面図である。FIG. 15 is an enlarged sectional view of a main part of an electronic device according to a fourth modification of the first embodiment, and is a sectional view taken along line XV-XV in FIG. 14. 図１６は、第１実施形態の第５変形例にかかる電子装置を示す要部拡大平面図であり、図４に対応した図である。FIG. 16 is an enlarged plan view of essential parts of an electronic device according to a fifth modification of the first embodiment, and corresponds to FIG. 4. FIG. 図１７は、第２実施形態にかかる電子装置を示す斜視図である。FIG. 17 is a perspective view showing an electronic device according to a second embodiment. 図１８は、第２実施形態にかかる電子装置を示す平面図であって、樹脂部材を透過した図である。FIG. 18 is a plan view showing the electronic device according to the second embodiment, and is a view through a resin member. 図１９は、図１８の一部を拡大した部分拡大図であって、電子部品および接合材を透過した図である。FIG. 19 is a partially enlarged view of FIG. 18, in which the electronic component and the bonding material are seen through. 図２０は、図１８のＸＸ－ＸＸ線に沿う断面図である。FIG. 20 is a cross-sectional view taken along line XX-XX in FIG. 18. 図２１は、図１８のＸＸＩ－ＸＸＩ線に沿う断面図である。FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 18. 図２２は、第３実施形態にかかる電子装置を示す斜視図であって、樹脂部材を省略した図である。FIG. 22 is a perspective view showing the electronic device according to the third embodiment, with the resin member omitted. 図２３は、第３実施形態にかかる電子装置を示す平面図であって、樹脂部材を透過した図である。FIG. 23 is a plan view showing the electronic device according to the third embodiment, and is a view through a resin member. 図２４は、図２３の平面図において、２つの入力端子の一方をさらに透過した図である。FIG. 24 is a diagram in which one of the two input terminals is further transparent in the plan view of FIG. 23. 図２５は、図２４の一部拡大した要部拡大図であって、複数の電子部品および接合材を透過した図である。FIG. 25 is an enlarged view of a part of FIG. 24 showing a plurality of electronic components and a bonding material. 図２６は、図２３のＸＸＶＩ－ＸＸＶＩ線に沿う断面図である。FIG. 26 is a cross-sectional view taken along line XXVI-XXVI in FIG. 23. 図２７は、図２３のＸＸＶＩＩ－ＸＸＶＩＩ線に沿う断面図である。FIG. 27 is a cross-sectional view taken along line XXVII-XXVII in FIG. 23. 図２８は、図２３のＸＸＶＩＩＩ－ＸＸＶＩＩＩ線に沿う断面図である。FIG. 28 is a sectional view taken along line XXVIII-XXVIII in FIG. 23. 図２９は、第３実施形態の変形例にかかる電子装置を示す要部拡大平面図であって、図２５に対応した図である。FIG. 29 is an enlarged plan view of essential parts of an electronic device according to a modification of the third embodiment, and corresponds to FIG. 25.
　本開示の電子装置の好ましい実施の形態について、図面を参照して、以下に説明する。以下では、同一あるいは類似の構成要素に、同じ符号を付して、重複する説明を省略する。本開示における「第１」、「第２」、「第３」等の用語は、単にラベルとして用いたものであり、必ずしもそれらの対象物に順列を付することを意図していない。 Preferred embodiments of the electronic device of the present disclosure will be described below with reference to the drawings. Hereinafter, the same or similar components will be denoted by the same reference numerals, and redundant explanation will be omitted. Terms such as "first", "second", "third", etc. in this disclosure are used merely as labels and are not necessarily intended to attach a permutation to those objects.
　本開示において、「ある物Ａがある物Ｂに形成されている」および「ある物Ａがある物Ｂ（の）上に形成されている」とは、特段の断りのない限り、「ある物Ａがある物Ｂに直接形成されていること」、および、「ある物Ａとある物Ｂとの間に他の物を介在させつつ、ある物Ａがある物Ｂに形成されていること」を含む。同様に、「ある物Ａがある物Ｂに配置されている」および「ある物Ａがある物Ｂ（の）上に配置されている」とは、特段の断りのない限り、「ある物Ａがある物Ｂに直接配置されていること」、および、「ある物Ａとある物Ｂとの間に他の物を介在させつつ、ある物Ａがある物Ｂに配置されていること」を含む。同様に、「ある物Ａがある物Ｂ（の）上に位置している」とは、特段の断りのない限り、「ある物Ａがある物Ｂに接して、ある物Ａがある物Ｂ（の）上に位置していること」、および、「ある物Ａとある物Ｂとの間に他の物が介在しつつ、ある物Ａがある物Ｂ（の）上に位置していること」を含む。また、「ある方向に見てある物Ａがある物Ｂに重なる」とは、特段の断りのない限り、「ある物Ａがある物Ｂのすべてに重なること」、および、「ある物Ａがある物Ｂの一部に重なること」を含む。また、「ある物Ａ（の構成材料）がある材料Ｃを含む」とは、「ある物Ａ（の構成材料）がある材料Ｃからなる場合」、および、「ある物Ａ（の構成材料）の主成分がある材料Ｃである場合」を含む。 In the present disclosure, "a thing A is formed on a thing B" and "a thing A is formed on a thing B" mean "a thing A is formed on a thing B" unless otherwise specified. "A is formed directly on something B," and "A thing A is formed on something B, with another thing interposed between them." including. Similarly, "a certain thing A is placed on a certain thing B" and "a certain thing A is placed on a certain thing B" are used as "a certain thing A is placed on a certain thing B" unless otherwise specified. ``It is placed directly on something B,'' and ``A thing A is placed on something B, with another thing interposed between them.'' include. Similarly, "an object A is located on an object B" means, unless otherwise specified, "an object A is in contact with an object B, and an object A is located on an object B". ``Being located on (above) something'' and ``A thing A being located on (above) a thing B while another thing is intervening between the thing A and the thing B.'' Including "thing". In addition, "an object A overlaps an object B when viewed in a certain direction" means, unless otherwise specified, "an object A overlaps all of an object B" and "a certain object A overlaps an object B". This includes "overlapping a part of something B." In addition, "a certain thing A (constituent material) includes a certain material C" means "a case where a certain thing A (constituent material) consists of a certain material C" and "a certain thing A (constituent material) includes a certain material C". Including cases where the main component of is a certain material C.
　第１実施形態：
　図１～図９は、第１実施形態にかかる電子装置Ａ１を示している。電子装置Ａ１は、たとえばＤＣ－ＤＣコンバータといった、電力変換回路を備える電子機器などに使用される。図１～図９に示すように、電子装置Ａ１は、電子部品１Ａ、第１リード２１、第２リード２２、第３リード２３、接合材３、複数の導通部材４および樹脂部材５を備える。理解の便宜上、図３では、樹脂部材５を透過し、想像線（二点鎖線）で示している。図４では、電子部品１Ａおよび接合材３を透過し、それぞれ想像線で示している。また、図４では、各導通部材４および樹脂部材５を省略している。 First embodiment:
1 to 9 show an electronic device A1 according to the first embodiment. The electronic device A1 is used in electronic equipment including a power conversion circuit, such as a DC-DC converter. As shown in FIGS. 1 to 9, the electronic device A1 includes an electronic component 1A, a first lead 21, a second lead 22, a third lead 23, a bonding material 3, a plurality of conductive members 4, and a resin member 5. For convenience of understanding, in FIG. 3, the resin member 5 is shown as an imaginary line (two-dot chain line). In FIG. 4, the electronic component 1A and the bonding material 3 are transparent, and each is shown by an imaginary line. Further, in FIG. 4, each conductive member 4 and resin member 5 are omitted.
　説明の便宜上、電子装置Ａ１の厚さ方向を「厚さ方向ｚ」という。以下の説明では、厚さ方向ｚの一方を下方といい、他方を上方ということがある。なお、「上」、「下」、「上方」、「下方」、「上面」および「下面」などの記載は、厚さ方向ｚにおける各部品等の相対的位置関係を示すものであり、必ずしも重力方向との関係を規定する用語ではない。また、「平面視」とは、厚さ方向ｚに見たときをいう。厚さ方向ｚに対して直交する１つの方向を「第１方向ｘ」という。一例として、第１方向ｘは、電子装置Ａ１の平面図（図２および図３参照）における上下方向である。厚さ方向ｚおよび第１方向ｘに直交する方向を「第２方向ｙ」という。第２方向ｙは、電子装置Ａ１の平面図（図２および図３参照）における左右方向である。 For convenience of explanation, the thickness direction of the electronic device A1 will be referred to as the "thickness direction z." In the following description, one side of the thickness direction z may be referred to as the lower side, and the other side may be referred to as the upper side. Note that descriptions such as "upper", "lower", "upper", "lower", "upper surface", and "lower surface" indicate the relative positional relationship of each component etc. in the thickness direction z, and do not necessarily mean It is not a term that defines the relationship with the direction of gravity. Moreover, "planar view" refers to when viewed in the thickness direction z. One direction perpendicular to the thickness direction z is referred to as a "first direction x." As an example, the first direction x is the vertical direction in the plan view of the electronic device A1 (see FIGS. 2 and 3). A direction perpendicular to the thickness direction z and the first direction x is referred to as a "second direction y." The second direction y is the left-right direction in the plan view of the electronic device A1 (see FIGS. 2 and 3).
　電子部品１Ａは、電子装置Ａ１の機能中枢となるものである。電子部品１Ａは、第１リード２１に搭載される。電子部品１Ａは、主面１０ａおよび裏面１０ｂを有する。主面１０ａおよび裏面１０ｂは、厚さ方向ｚにおいて、互いに離間する。主面１０ａは、厚さ方向ｚ上方を向き、裏面１０ｂは、厚さ方向ｚ下方を向く。裏面１０ｂは、第１リード２１に対向する。電子部品１Ａの厚さ方向ｚの寸法（主面１０ａと裏面１０ｂとの厚さ方向ｚに沿う距離）は、何ら限定されないが、たとえば５０μｍ以上２００μｍ以下である。 The electronic component 1A is the functional center of the electronic device A1. The electronic component 1A is mounted on the first lead 21. The electronic component 1A has a main surface 10a and a back surface 10b. The main surface 10a and the back surface 10b are spaced apart from each other in the thickness direction z. The main surface 10a faces upward in the thickness direction z, and the back surface 10b faces downward in the thickness direction z. The back surface 10b faces the first lead 21. The dimension of the electronic component 1A in the thickness direction z (the distance between the main surface 10a and the back surface 10b along the thickness direction z) is not limited at all, but is, for example, 50 μm or more and 200 μm or less.
　電子部品１Ａは、機能部１１を含む。機能部１１は、たとえばパワートランジスタである。当該パワートランジスタは、たとえば縦型構造のＭＯＳＦＥＴ（Metal-Oxide-Semiconductor Field-Effect Transistor）である。機能部１１は、ＭＯＳＦＥＴに限定されず、ＩＧＢＴ（Insulated Gate Bipolar Transistor）などの他のトランジスタでもよいし、ＬＳＩまたはダイオードでもよい。機能部１１は、電子装置Ａ１の通電時において、発熱源となる。理解の便宜上、図４において、機能部１１にドット柄を描画する。 The electronic component 1A includes a functional section 11. The functional unit 11 is, for example, a power transistor. The power transistor is, for example, a vertical MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). The functional unit 11 is not limited to a MOSFET, and may be another transistor such as an IGBT (Insulated Gate Bipolar Transistor), an LSI, or a diode. The functional unit 11 becomes a heat source when the electronic device A1 is energized. For convenience of understanding, a dot pattern is drawn on the functional section 11 in FIG.
　機能部１１は、半導体層１１０、第１電極１１１、第２電極１１２および第３電極１１３を含む。半導体層１１０は、半導体材料を含む。当該半導体材料は、たとえば炭化ケイ素（ＳｉＣ）である。この他、半導体材料として、ケイ素（Ｓｉ）またはＧａＮ（窒化ガリウム）などを用いてもよい。第１電極１１１には、機能部１１により変換された後の電力に対応する電流が流れる。第２電極１１２には、機能部１１により変換される前の電力に対応する電流が流れる。第３電極１１３には、機能部１１が駆動するための駆動信号が入力される。機能部１１がＭＯＳＦＥＴである例において、第１電極１１１はドレインであり、第２電極１１２はソースであり、第３電極１１３はゲートである。第１電極１１１は、裏面１０ｂに配置される。第２電極１１２および第３電極１１３は、主面１０ａに配置される。 The functional section 11 includes a semiconductor layer 110, a first electrode 111, a second electrode 112, and a third electrode 113. Semiconductor layer 110 includes a semiconductor material. The semiconductor material is silicon carbide (SiC), for example. In addition, silicon (Si), GaN (gallium nitride), or the like may be used as the semiconductor material. A current corresponding to the electric power converted by the functional unit 11 flows through the first electrode 111 . A current corresponding to the power before being converted by the functional unit 11 flows through the second electrode 112 . A drive signal for driving the functional unit 11 is input to the third electrode 113 . In an example where the functional unit 11 is a MOSFET, the first electrode 111 is a drain, the second electrode 112 is a source, and the third electrode 113 is a gate. The first electrode 111 is arranged on the back surface 10b. The second electrode 112 and the third electrode 113 are arranged on the main surface 10a.
　第１リード２１は、電子部品１Ａが搭載されるとともに、電子部品１Ａと電子装置Ａ１が実装される回路基板（図示略）等との導通経路の一部をなす。第１リード２１は、搭載部２１１および端子部２１２を含む。搭載部２１１および端子部２１２は、一体的に形成されている。 The first lead 21 is mounted with the electronic component 1A and forms part of a conductive path between the electronic component 1A and a circuit board (not shown) on which the electronic device A1 is mounted. The first lead 21 includes a mounting portion 211 and a terminal portion 212. The mounting portion 211 and the terminal portion 212 are integrally formed.
　搭載部２１１は、樹脂部材５に覆われている。上述した電子部品１Ａは、搭載部２１１に搭載されている。搭載部２１１は、接合材３を介して、電子部品１Ａの第１電極１１１に導通する。 The mounting portion 211 is covered with the resin member 5. The electronic component 1A described above is mounted on the mounting section 211. The mounting portion 211 is electrically connected to the first electrode 111 of the electronic component 1A via the bonding material 3.
　搭載部２１１は、第１面２１０ａ、第２面２１０ｂおよび裏面２１０ｄを有する。第１面２１０ａおよび第２面２１０ｂの各々は、電子部品１Ａよりも厚さ方向ｚ下方に位置する。第１面２１０ａおよび第２面２１０ｂの各々は、厚さ方向ｚ上方を向く。図４および図９に示すように、電子部品１Ａは、第１面２１０ａおよび第２面２１０ｂに、これらに跨って接合される。 The mounting portion 211 has a first surface 210a, a second surface 210b, and a back surface 210d. Each of the first surface 210a and the second surface 210b is located below the electronic component 1A in the thickness direction z. Each of the first surface 210a and the second surface 210b faces upward in the thickness direction z. As shown in FIGS. 4 and 9, the electronic component 1A is bonded to the first surface 210a and the second surface 210b so as to straddle them.
　第１面２１０ａは、平面視において、第２面２１０ｂを囲うように配置される。第１面２１０ａは、たとえば平坦であり、厚さ方向ｚに直交する平面（ｘ－ｙ平面）に沿って広がる。図示された例では、第１面２１０ａは、平面視において、電子部品１Ａの外周１９のすべてに重なる。 The first surface 210a is arranged so as to surround the second surface 210b in plan view. The first surface 210a is, for example, flat and extends along a plane (xy plane) orthogonal to the thickness direction z. In the illustrated example, the first surface 210a overlaps the entire outer periphery 19 of the electronic component 1A in plan view.
　第２面２１０ｂは、第１面２１０ａよりも厚さ方向ｚ上方に位置する。つまり、第２面２１０ｂは、厚さ方向ｚにおいて、第１面２１０ａよりも電子部品１Ａに近い側に位置する。第２面２１０ｂは、たとえば平坦であり、ｘ－ｙ平面に沿って広がる。本実施形態では、第２面２１０ｂは、平面視において、電子部品１Ａの内方に位置する。また、第２面２１０ｂは、平面視において、機能部１１のすべてに重なる。第２面２１０ｂは、平面視矩形状である。 The second surface 210b is located above the first surface 210a in the thickness direction z. That is, the second surface 210b is located closer to the electronic component 1A than the first surface 210a in the thickness direction z. The second surface 210b is, for example, flat and extends along the xy plane. In this embodiment, the second surface 210b is located inside the electronic component 1A in plan view. Further, the second surface 210b overlaps all of the functional section 11 in plan view. The second surface 210b has a rectangular shape in plan view.
　裏面２１０ｄは、厚さ方向ｚ下方を向く。つまり、裏面２１０ｄは、厚さ方向ｚにおいて、第１面２１０ａおよび第２面２１０ｂと反対側を向く。裏面２１０ｄは、たとえば平坦であり、ｘ－ｙ平面に沿って広がる。図示された例では、裏面２１０ｄは、樹脂部材５から露出する。平面視において、裏面２１０ｄは、第１面２１０ａおよび第２面２１０ｂに重なる。 The back surface 210d faces downward in the thickness direction z. That is, the back surface 210d faces the opposite side to the first surface 210a and the second surface 210b in the thickness direction z. The back surface 210d is, for example, flat and extends along the xy plane. In the illustrated example, the back surface 210d is exposed from the resin member 5. In plan view, the back surface 210d overlaps the first surface 210a and the second surface 210b.
　搭載部２１１は、基部２１１１および突出部２１１２を含む。基部２１１１は、平面視において、突出部２１１２を囲む。突出部２１１２は、基部２１１１よりも厚さ方向ｚ上方に突き出る。突出部２１１２の厚さ（厚さ方向ｚの寸法）は、基部２１１１の厚さ（厚さ方向ｚ寸法）よりも大きい。基部２１１１の下面と突出部２１１２の下面とは面一である。上述した第１面２１０ａは、基部２１１１の上面である。上述した第２面２１０ｂは、突出部２１１２の上面である。上述した裏面２１０ｄは、基部２１１１の下面および突出部２１１２の下面である。基部２１１１に対する突出部２１１２の突出寸法（第１面２１０ａと第２面２１０ｂとの厚さ方向ｚに沿う距離）は、何ら限定されないが、たとえば２０μｍ以上５０μｍ以下である。 The mounting portion 211 includes a base portion 2111 and a protruding portion 2112. The base 2111 surrounds the protrusion 2112 in plan view. The protrusion 2112 protrudes higher than the base 2111 in the thickness direction z. The thickness of the protrusion 2112 (dimension in the thickness direction z) is larger than the thickness (dimension in the thickness direction z) of the base 2111. The lower surface of the base 2111 and the lower surface of the protrusion 2112 are flush with each other. The first surface 210a described above is the upper surface of the base 2111. The second surface 210b described above is the upper surface of the protrusion 2112. The back surface 210d described above is the lower surface of the base 2111 and the lower surface of the protrusion 2112. The protrusion dimension of the protrusion 2112 with respect to the base 2111 (the distance along the thickness direction z between the first surface 210a and the second surface 210b) is not limited at all, but is, for example, 20 μm or more and 50 μm or less.
　搭載部２１１は、基部２１１１に貫通孔２１１Ａが形成されている。貫通孔２１１Ａは、ｚ方向において、基部２１１１（搭載部２１１）を貫通する。貫通孔２１１Ａは、平面視において、円形状である。 The mounting portion 211 has a through hole 211A formed in the base portion 2111. The through hole 211A penetrates the base portion 2111 (mounting portion 211) in the z direction. The through hole 211A has a circular shape in plan view.
　端子部２１２は、搭載部２１１の第１方向ｘ他方側の端縁から、第１方向ｘに沿って延びる。端子部２１２は、樹脂部材５に覆われた部分と樹脂部材５から露出する部分とを含む。樹脂部材５に覆われた端子部２１２の部分は、屈曲する。樹脂部材５から露出する端子部２１２の表面には、めっき（たとえば錫めっき）が施されていてもよい。端子部２１２のうちの樹脂部材５から露出する部分は、電子装置Ａ１が実装される回路基板（図示略）等に導通接合される。 The terminal portion 212 extends along the first direction x from the edge of the mounting portion 211 on the other side in the first direction x. The terminal portion 212 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5. The portion of the terminal portion 212 covered with the resin member 5 is bent. The surface of the terminal portion 212 exposed from the resin member 5 may be plated (for example, tin plating). A portion of the terminal portion 212 exposed from the resin member 5 is electrically connected to a circuit board (not shown) on which the electronic device A1 is mounted.
　第２リード２２は、第１リード２１から離れている。第２リード２２は、導通部材４を介して電子部品１Ａの第２電極１１２に導通する。第２リード２２は、パッド部２２１および端子部２２２を含む。 The second lead 22 is separated from the first lead 21. The second lead 22 is electrically connected to the second electrode 112 of the electronic component 1A via the conductive member 4. The second lead 22 includes a pad portion 221 and a terminal portion 222.
　パッド部２２１は、樹脂部材５に覆われている。パッド部２２１には、導通部材４が接合される。パッド部２２１の導通部材４が接合される面には、たとえば銀めっきまたは錫めっき等が施されていてもよい。端子部２２２は、パッド部２２１に繋がる。端子部２２２は、樹脂部材５に覆われた部分と樹脂部材５から露出する部分とを含む。端子部２２２は、たとえば端子部２１２と平行に第１方向ｘに延びる。樹脂部材５から露出する端子部２２２の表面には、めっき（たとえば錫めっき）が施されていてもよい。端子部２２２のうちの樹脂部材５から露出する部分は、電子装置Ａ１が実装される回路基板（図示略）等に導通接合される。 The pad portion 221 is covered with the resin member 5. The conductive member 4 is joined to the pad portion 221 . The surface of the pad portion 221 to which the conductive member 4 is bonded may be plated with silver or tin, for example. The terminal section 222 is connected to the pad section 221. The terminal portion 222 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5. The terminal portion 222 extends, for example, in parallel with the terminal portion 212 in the first direction x. The surface of the terminal portion 222 exposed from the resin member 5 may be plated (for example, tin plated). A portion of the terminal portion 222 exposed from the resin member 5 is electrically connected to a circuit board (not shown) on which the electronic device A1 is mounted.
　第３リード２３は、第１リード２１から離れており、第１リード２１を挟んで第２リード２２とは第２方向ｙにおいて反対側に位置する。第３リード２３は、導通部材４を介して電子部品１Ａの第３電極１１３に導通する。第３リード２３は、パッド部２３１および端子部２３２を含む。 The third lead 23 is separated from the first lead 21 and is located on the opposite side of the second lead 22 with the first lead 21 in between in the second direction y. The third lead 23 is electrically connected to the third electrode 113 of the electronic component 1A via the conductive member 4. The third lead 23 includes a pad portion 231 and a terminal portion 232.
　パッド部２３１は、樹脂部材５に覆われている。パッド部２３１には、導通部材４が接合される。パッド部２３１の導通部材４が接合される面には、銀めっきまたは錫めっき等が施されていてもよい。端子部２３２は、パッド部２３１に繋がる。端子部２３２は、樹脂部材５に覆われた部分と樹脂部材５から露出する部分とを含む。端子部２３２は、たとえば端子部２１２と平行に第１方向ｘに延びる。樹脂部材５から露出する端子部２３２の表面には、めっき（たとえば錫めっき）が施されていてもよい。端子部２３２のうちの樹脂部材５から露出する部分は、電子装置Ａ１が実装される回路基板（図示略）等に導通接合される。 The pad portion 231 is covered with the resin member 5. The conductive member 4 is joined to the pad portion 231 . The surface of the pad portion 231 to which the conductive member 4 is bonded may be plated with silver, tin, or the like. The terminal section 232 is connected to the pad section 231. The terminal portion 232 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5. The terminal portion 232 extends, for example, in parallel with the terminal portion 212 in the first direction x. The surface of the terminal portion 232 exposed from the resin member 5 may be plated (for example, tin plating). A portion of the terminal portion 232 exposed from the resin member 5 is electrically connected to a circuit board (not shown) on which the electronic device A1 is mounted.
　接合材３は、電子部品１Ａと搭載部２１１（第１リード２１）とを接合する。本実施形態において、接合材３は、導電性材料を含み、たとえば、はんだ、金属ペースト材、または、焼結金属等である。 The bonding material 3 bonds the electronic component 1A and the mounting portion 211 (first lead 21). In this embodiment, the bonding material 3 includes a conductive material, such as solder, metal paste material, or sintered metal.
　図９に示すように、接合材３は、第１接合部３１、第２接合部３２およびフィレット部３０を含む。第１接合部３１は、第１面２１０ａと裏面１０ｂとの間に介在する。つまり、第１接合部３１は、基部２１１１と電子部品１Ａとの間に介在する。第２接合部３２は、第２面２１０ｂと裏面１０ｂとの間に介在する。つまり、第２接合部３２は、突出部２１１２と電子部品１Ａとの間に介在する。フィレット部３０は、平面視において、電子部品１Ａからはみ出る。フィレット部３０は、電子部品１Ａの各側面の一部ずつを覆う。なお、接合材３は、フィレット部３０を含んでいなくてもよい。 As shown in FIG. 9, the bonding material 3 includes a first bonding portion 31, a second bonding portion 32, and a fillet portion 30. The first joint portion 31 is interposed between the first surface 210a and the back surface 10b. That is, the first joint portion 31 is interposed between the base portion 2111 and the electronic component 1A. The second joint portion 32 is interposed between the second surface 210b and the back surface 10b. That is, the second joint portion 32 is interposed between the protrusion portion 2112 and the electronic component 1A. The fillet portion 30 protrudes from the electronic component 1A in plan view. The fillet portion 30 partially covers each side surface of the electronic component 1A. Note that the bonding material 3 does not need to include the fillet portion 30.
　複数の導通部材４は、図３に示すように、電子部品１Ａと第２リード２２および第３リード２３とに導通接合されている。これにより、電子部品１Ａと第２リード２２および第３リード２３との相互導通がなされる。複数の導通部材４は、第１部材４１および第２部材４２を含む。 As shown in FIG. 3, the plurality of conductive members 4 are electrically connected to the electronic component 1A, the second lead 22, and the third lead 23. This establishes mutual conduction between the electronic component 1A, the second lead 22, and the third lead 23. The plurality of conductive members 4 include a first member 41 and a second member 42.
　第１部材４１は、図８に示すように、電子部品１Ａの第２電極１１２と、第２リード２２のパッド部２２１に接合され、これらを導通させる。第１部材４１の組成は、銅を含む。本実施形態では、第１部材４１は、金属クリップである。第１部材４１は、導電性接合材４９を介して、第２電極１１２およびパッド部２２１に導通接合される。 As shown in FIG. 8, the first member 41 is joined to the second electrode 112 of the electronic component 1A and the pad portion 221 of the second lead 22, making them conductive. The composition of the first member 41 includes copper. In this embodiment, the first member 41 is a metal clip. The first member 41 is conductively bonded to the second electrode 112 and the pad portion 221 via a conductive bonding material 49 .
　第２部材４２は、電子部品１Ａの第３電極１１３と、第３リード２３のパッド部２３１とに接合され、これらを導通させる。第２部材４２は、金属ワイヤであり、ワイヤボンディングにより形成される。第２部材４２の組成は、金、アルミニウムまたは銅のいずれかを含む。 The second member 42 is joined to the third electrode 113 of the electronic component 1A and the pad portion 231 of the third lead 23, making them conductive. The second member 42 is a metal wire and is formed by wire bonding. The composition of the second member 42 includes gold, aluminum, or copper.
　樹脂部材５は、図１～図３および図５～図９に示すように、電子部品１Ａ、第１リード２１の一部、第２リード２２の一部、第３リード２３の一部、接合材３および複数の導通部材４を覆う。樹脂部材５は、電気絶縁性を有する。樹脂部材５の構成材料は、たとえば黒色のエポキシ樹脂を含む。樹脂部材５は、樹脂主面５１、樹脂裏面５２、一対の樹脂側面５３、一対の樹脂側面５４、一対の開口５５および取付孔５６を有する。 As shown in FIGS. 1 to 3 and 5 to 9, the resin member 5 includes the electronic component 1A, a part of the first lead 21, a part of the second lead 22, a part of the third lead 23, and a bonding member. material 3 and a plurality of conductive members 4. The resin member 5 has electrical insulation properties. The constituent material of the resin member 5 includes, for example, black epoxy resin. The resin member 5 has a resin main surface 51, a resin back surface 52, a pair of resin side surfaces 53, a pair of resin side surfaces 54, a pair of openings 55, and a mounting hole 56.
　樹脂主面５１および樹脂裏面５２は、厚さ方向ｚにおいて互いに離間する。樹脂主面５１は、厚さ方向ｚ上方を向く。つまり、樹脂主面５１は、厚さ方向ｚにおいて、第１面２１０ａおよび第２面２１０ｂと同じ側を向く。樹脂裏面５２は、厚さ方向ｚ下方を向く。つまり、樹脂裏面５２は、厚さ方向ｚにおいて、第２面２１０ｂと同じ側を向く。樹脂裏面５２から、裏面２１０ｄが露出する。樹脂裏面５２と裏面２１０ｄとは、互いに面一である。 The resin main surface 51 and the resin back surface 52 are spaced apart from each other in the thickness direction z. The main resin surface 51 faces upward in the thickness direction z. That is, the main resin surface 51 faces the same side as the first surface 210a and the second surface 210b in the thickness direction z. The resin back surface 52 faces downward in the thickness direction z. That is, the resin back surface 52 faces the same side as the second surface 210b in the thickness direction z. The back surface 210d is exposed from the resin back surface 52. The resin back surface 52 and the back surface 210d are flush with each other.
　一対の樹脂側面５３は、第１方向ｘにおいて互いに離間する。一対の樹脂側面５３は、樹脂主面５１および樹脂裏面５２に繋がる。図３および図６に示すように、一対の樹脂側面５３のうちの一方から、第１リード２１の端子部２１２と、第２リード２２の端子部２２２と、第３リード２３の端子部２３２とが突き出る。 The pair of resin side surfaces 53 are spaced apart from each other in the first direction x. A pair of resin side surfaces 53 are connected to the resin main surface 51 and the resin back surface 52. As shown in FIGS. 3 and 6, from one of the pair of resin side surfaces 53, the terminal portion 212 of the first lead 21, the terminal portion 222 of the second lead 22, and the terminal portion 232 of the third lead 23 are connected. sticks out.
　一対の樹脂側面５４は、第２方向ｙにおいて互いに離間する。一対の樹脂側面５４は、樹脂主面５１および樹脂裏面５２に繋がる。 The pair of resin side surfaces 54 are spaced apart from each other in the second direction y. A pair of resin side surfaces 54 are connected to the resin main surface 51 and the resin back surface 52.
　図５に示すように、一対の開口５５は、第２方向ｙにおいて互いに離間する。一対の開口５５の各々は、樹脂主面５１と一対の樹脂側面５４のいずれかとから樹脂部材５の内方に向けて凹んでいる。一対の開口５５から、第１リード２１の搭載部２１１の上面の一部が露出する。 As shown in FIG. 5, the pair of openings 55 are spaced apart from each other in the second direction y. Each of the pair of openings 55 is recessed inward from the resin member 5 from either the resin main surface 51 or the pair of resin side surfaces 54 . A portion of the upper surface of the mounting portion 211 of the first lead 21 is exposed through the pair of openings 55 .
　図２、図３および図８に示すように、取付孔５６は、厚さ方向ｚにおいて樹脂主面５１から樹脂裏面５２に至って樹脂部材５を貫通する。平面視において、取付孔５６は、搭載部２１１の貫通孔２１１Ａに内包されている。貫通孔２１１Ａを規定する搭載部２１１の内周面は、樹脂部材５に覆われている。これにより、平面視において、取付孔５６の最大寸法は、貫通孔２１１Ａの寸法よりも小となっている。 As shown in FIGS. 2, 3, and 8, the attachment hole 56 penetrates the resin member 5 from the main resin surface 51 to the resin back surface 52 in the thickness direction z. In plan view, the attachment hole 56 is included in the through hole 211A of the mounting portion 211. The inner peripheral surface of the mounting portion 211 that defines the through hole 211A is covered with the resin member 5. Thereby, in plan view, the maximum dimension of the attachment hole 56 is smaller than the dimension of the through hole 211A.
　以上のように構成された電子装置Ａ１の作用および効果は、次の通りである。 The functions and effects of the electronic device A1 configured as above are as follows.
　電子装置Ａ１では、搭載部２１１は、電子部品１Ａが接合された第１面２１０ａおよび第２面２１０ｂを有する。第１面２１０ａおよび第２面２１０ｂはそれぞれ、厚さ方向ｚの上方（他方側）を向く。第１面２１０ａは、厚さ方向ｚに見て、電子部品１Ａの外周１９の少なくとも一部に重なる。第２面２１０ｂは、第１面２１０ａよりも厚さ方向ｚの上方（他方側）に位置し、かつ、厚さ方向ｚに見て、機能部１１に重なる。この構成によれば、第２面２１０ｂによって、発熱源となる機能部１１の厚さ方向ｚ下方（一方側）において、搭載部２１１と電子部品１Ａとの厚さ方向ｚに沿う距離が小さいので、電子部品１Ａ（機能部１１）から搭載部２１１への熱伝導性を向上させることが可能となる。つまり、電子部品１Ａの発熱に対する放熱性を向上できる。また、第１面２１０ａによって、電子部品１Ａの外周１９の一部において、搭載部２１１と電子部品１Ａとの厚さ方向ｚに沿う距離が大きいので、搭載部２１１と電子部品１Ａとの挟まれた接合材３（第１接合部３１）の厚さを適度に確保することが可能となる。つまり、搭載部２１１に対する電子部品１Ａの接合強度を適度に確保し、電子部品１Ａの実装信頼性を向上できる。したがって、電子装置Ａ１は、搭載部２１１に対する電子部品１Ａの実装信頼性を確保しつつ、電子部品１Ａ（機能部１１）の発熱に対する放熱性を向上することができる。 In the electronic device A1, the mounting portion 211 has a first surface 210a and a second surface 210b to which the electronic component 1A is bonded. The first surface 210a and the second surface 210b each face upward (on the other side) in the thickness direction z. The first surface 210a overlaps at least a portion of the outer periphery 19 of the electronic component 1A when viewed in the thickness direction z. The second surface 210b is located above (on the other side) in the thickness direction z than the first surface 210a, and overlaps the functional section 11 when viewed in the thickness direction z. According to this configuration, the distance along the thickness direction z between the mounting section 211 and the electronic component 1A is small due to the second surface 210b below (on one side) in the thickness direction z of the functional section 11 which is a heat generation source. , it becomes possible to improve thermal conductivity from the electronic component 1A (functional section 11) to the mounting section 211. In other words, it is possible to improve the heat dissipation performance for the heat generated by the electronic component 1A. Furthermore, due to the first surface 210a, the distance between the mounting portion 211 and the electronic component 1A along the thickness direction z is large in a part of the outer periphery 19 of the electronic component 1A, so that the distance between the mounting portion 211 and the electronic component 1A is large. It becomes possible to ensure an appropriate thickness of the bonding material 3 (first bonding portion 31). In other words, the bonding strength of the electronic component 1A to the mounting portion 211 can be ensured appropriately, and the mounting reliability of the electronic component 1A can be improved. Therefore, the electronic device A1 can improve the heat dissipation of the heat generated by the electronic component 1A (functional section 11) while ensuring the mounting reliability of the electronic component 1A on the mounting section 211.
　電子装置Ａ１では、第１面２１０ａは、厚さ方向ｚに見て、電子部品１Ａの四隅に重なる。この構成によれば、平面視における電子部品１Ａの四隅において、接合材３の厚さを適度に確保することができる。電子部品１Ａの発熱に伴い、接合材３に熱応力がかかる。仮に、この熱応力によって、電子部品１Ａが搭載部２１１から剥離する場合、電子部品１Ａの外周１９（特に四隅）から発生しやすい。しかしながら、電子装置Ａ１では、平面視における電子部品１Ａの四隅において、接合材３の厚さが適度に確保されるので、搭載部２１１からの電子部品１Ａの剥離が抑制される。したがって、電子装置Ａ１は、第１面２１０ａが厚さ方向ｚに見て電子部品１Ａの四隅に重ならない場合よりも、搭載部２１１に対する電子部品１Ａの実装信頼性を向上できる。特に、電子装置Ａ１は、第１面２１０ａは、厚さ方向ｚに見て、電子部品１Ａの外周１９のすべてに重なる。この構成によれば、平面視における電子部品１Ａの外周１９に沿って、接合材３の厚さを適度に確保することができる。したがって、電子装置Ａ１は、搭載部２１１に対する電子部品１Ａの実装信頼性をさらに向上できる。 In the electronic device A1, the first surface 210a overlaps the four corners of the electronic component 1A when viewed in the thickness direction z. According to this configuration, an appropriate thickness of the bonding material 3 can be ensured at the four corners of the electronic component 1A in plan view. As the electronic component 1A generates heat, thermal stress is applied to the bonding material 3. If the electronic component 1A were to peel off from the mounting portion 211 due to this thermal stress, it would likely occur from the outer periphery 19 (particularly at the four corners) of the electronic component 1A. However, in the electronic device A1, since the bonding material 3 is appropriately thick at the four corners of the electronic component 1A in plan view, peeling of the electronic component 1A from the mounting portion 211 is suppressed. Therefore, in the electronic device A1, the reliability of mounting the electronic component 1A on the mounting portion 211 can be improved more than when the first surface 210a does not overlap the four corners of the electronic component 1A when viewed in the thickness direction z. In particular, in the electronic device A1, the first surface 210a overlaps the entire outer periphery 19 of the electronic component 1A when viewed in the thickness direction z. According to this configuration, an appropriate thickness of the bonding material 3 can be ensured along the outer periphery 19 of the electronic component 1A in plan view. Therefore, the electronic device A1 can further improve the mounting reliability of the electronic component 1A on the mounting section 211.
　電子装置Ａ１では、第２面２１０ｂは、厚さ方向ｚに見て、機能部１１のすべてに重なる。この構成によれば、電子装置Ａ１は、第２面２１０ｂが厚さ方向ｚに見て機能部１１の一部だけに重なる場合よりも、電子部品１Ａ（機能部１１）の発熱に対する放熱性を向上できる。 In the electronic device A1, the second surface 210b overlaps all of the functional parts 11 when viewed in the thickness direction z. According to this configuration, the electronic device A1 has better heat dissipation performance for the heat generated by the electronic component 1A (functional unit 11) than when the second surface 210b overlaps only a part of the functional unit 11 when viewed in the thickness direction z. You can improve.
　電子装置Ａ１では、電子部品１Ａの厚さは、５０μｍ以上２００μｍ以下である。本願発明者の研究によれば、電子部品１Ａの厚さがこの範囲（５０μｍ以上２００μｍ以下）内である場合、この範囲よりも大きい場合と比較して、機能部１１からの熱が電子部品１Ａ内部（たとえば半導体層１１０）で分散されないとの知見を得た。つまり、電子部品１Ａの厚さが上述の範囲である場合、電子部品１Ａ内で熱勾配できるとの知見を得た。したがって、電子装置Ａ１は、発熱源となる機能部１１の下方において、電子部品１Ａと搭載部２１１との厚さ方向ｚに沿う距離を小さくすることで、電子部品１Ａ（機能部１１）の発熱に対する放熱性を適度に確保できる。 In the electronic device A1, the thickness of the electronic component 1A is 50 μm or more and 200 μm or less. According to the research of the inventor of the present application, when the thickness of the electronic component 1A is within this range (50 μm or more and 200 μm or less), the heat from the functional part 11 is more It has been found that the particles are not dispersed inside (for example, the semiconductor layer 110). In other words, it has been found that when the thickness of the electronic component 1A is within the above-mentioned range, a thermal gradient can occur within the electronic component 1A. Therefore, the electronic device A1 reduces the heat generation of the electronic component 1A (functional section 11) by reducing the distance along the thickness direction z between the electronic component 1A and the mounting section 211 below the functional section 11, which is a heat generation source. Appropriate heat dissipation can be ensured.
　図１０は、第１実施形態の第１変形例にかかる電子装置Ａ２を示している。電子装置Ａ２は、電子装置Ａ１と比較して、次の点で異なる。すなわち、電子装置Ａ２の接合材３は、第２接合部３２を含んでいない。 FIG. 10 shows an electronic device A2 according to a first modification of the first embodiment. The electronic device A2 differs from the electronic device A1 in the following points. That is, the bonding material 3 of the electronic device A2 does not include the second bonding portion 32.
　電子装置Ａ２では、接合材３が第２接合部３２を含んでおらず、突出部２１１２が主面１０ａに接している。つまり、第１電極１１１は、突出部２１１２に接し、直接導通する。 In the electronic device A2, the bonding material 3 does not include the second bonding portion 32, and the protruding portion 2112 is in contact with the main surface 10a. That is, the first electrode 111 is in contact with the protrusion 2112 and is directly electrically connected.
　電子装置Ａ２においても、電子装置Ａ１と同様に、実装信頼性を確保しつつ、放熱性を向上できる。さらに、電子装置Ａ２では、電子部品１Ａが搭載部２１１に接する。したがって、電子部品１Ａから搭載部２１１への熱導電性は、電子装置Ａ１よりも電子装置Ａ２が高い。つまり、電子装置Ａ２は、電子装置Ａ１よりも放熱性を向上できる。 Similarly to the electronic device A1, in the electronic device A2, heat dissipation can be improved while ensuring mounting reliability. Further, in the electronic device A2, the electronic component 1A is in contact with the mounting section 211. Therefore, the thermal conductivity from the electronic component 1A to the mounting portion 211 is higher in the electronic device A2 than in the electronic device A1. In other words, the electronic device A2 can improve heat dissipation compared to the electronic device A1.
　図１１は、第１実施形態の第２変形例にかかる電子装置Ａ３を示している。電子装置Ａ３は、電子装置Ａ１と比較して、次の点で異なる。すなわち、電子装置Ａ３の突出部２１１２の平面視形状が、電子装置Ａ１の突出部２１１２の平面視形状と異なる。 FIG. 11 shows an electronic device A3 according to a second modification of the first embodiment. The electronic device A3 differs from the electronic device A1 in the following points. That is, the shape of the protrusion 2112 of the electronic device A3 in plan view is different from the shape of the protrusion 2112 of the electronic device A1 in plan view.
　図１１に示すように、電子装置Ａ３の突出部２１１２は、平面視において第１方向ｘに沿って延びる帯状の部位と第２方向ｙに沿って延びる帯状の部位とが交差した形状をなす。このとき、突出部２１１２の上面、すなわち、第２面２１０ｂは、平面視において、機能部１１の一部に重なる。また、基部２１１１の上面、すなわち、第１面２１０ａは、平面視において、電子部品１Ａの外周１９の一部に重なっており、少なくとも電子部品１Ａの四隅に重なる。 As shown in FIG. 11, the protruding portion 2112 of the electronic device A3 has a shape in which a strip-shaped portion extending along the first direction x and a strip-shaped portion extending along the second direction y intersect in plan view. At this time, the upper surface of the protrusion 2112, that is, the second surface 210b overlaps a part of the functional section 11 in a plan view. Further, the upper surface of the base 2111, that is, the first surface 210a, overlaps a part of the outer periphery 19 of the electronic component 1A in plan view, and overlaps at least the four corners of the electronic component 1A.
　電子装置Ａ３においても、電子装置Ａ１と同様に、実装信頼性を確保しつつ、放熱性を向上できる。また、電子装置Ａ３では、平面視において、第１面２１０ａが電子部品１Ａの四隅に重なる。したがって、電子装置Ａ３は、電子装置Ａ１と同様に、第１面２１０ａが厚さ方向ｚに見て電子部品１Ａの四隅に重ならない場合よりも、搭載部２１１に対する電子部品１Ａの実装信頼性を向上できる。 Similarly to the electronic device A1, in the electronic device A3, heat dissipation can be improved while ensuring mounting reliability. Furthermore, in the electronic device A3, the first surface 210a overlaps the four corners of the electronic component 1A in plan view. Therefore, like the electronic device A1, the electronic device A3 has higher mounting reliability of the electronic component 1A on the mounting portion 211 than when the first surface 210a does not overlap the four corners of the electronic component 1A when viewed in the thickness direction z. You can improve.
　図１２および図１３は、第１実施形態の第３変形例にかかる電子装置Ａ４を示している。電子装置Ａ４は、電子装置Ａ１と比較して、次の点で異なる。第１に、電子装置Ａ４の搭載部２１１は、突出部２１１２の代わりに、溝部２１１３を含む。第２に、電子装置Ａ４の搭載部２１１は、さらに第３面２１０ｃを有する。 FIGS. 12 and 13 show an electronic device A4 according to a third modification of the first embodiment. The electronic device A4 differs from the electronic device A1 in the following points. First, the mounting portion 211 of the electronic device A4 includes a groove portion 2113 instead of the protrusion portion 2112. Second, the mounting portion 211 of the electronic device A4 further has a third surface 210c.
　溝部２１１３は、基部２１１１から厚さ方向ｚに窪む。溝部２１１３の厚さ（厚さ方向ｚの寸法）は、基部２１１１の厚さ（厚さ方向ｚの寸法）よりも小さい。基部２１１１の下面と溝部２１１３の下面とは面一である。図１２に示すように、溝部２１１３は、平面視において、矩形環状に形成されている。本変形例では、基部２１１１は、平面視において、溝部２１１３を囲む部位と、溝部２１１３に囲まれた部位とを有する。 The groove portion 2113 is recessed from the base portion 2111 in the thickness direction z. The thickness of the groove portion 2113 (dimension in the thickness direction z) is smaller than the thickness of the base portion 2111 (dimension in the thickness direction z). The lower surface of the base portion 2111 and the lower surface of the groove portion 2113 are flush with each other. As shown in FIG. 12, the groove portion 2113 is formed in a rectangular ring shape when viewed from above. In this modification, the base 2111 has a region surrounding the groove 2113 and a region surrounded by the groove 2113 in plan view.
　搭載部２１１は、第１面２１０ａ、第２面２１０ｂ、第３面２１０ｃおよび裏面２１０ｄを有する。図１３に示すように、第３面２１０ｃは、第１面２１０ａよりも厚さ方向ｚ上方に位置する。本変形例では、図１３に示すように、第３面２１０ｃは、厚さ方向ｚにおいて、第２面２１０ｂと同じ位置である。第１面２１０ａは、溝部２１１３の上面である。第２面２１０ｂは、基部２１１１のうちの平面視において溝部２１１３に囲まれた部分の上面である。第３面２１０ｃは、基部２１１１のうちの平面視において溝部２１１３を囲う部分の上面である。裏面２１０ｄは、基部２１１１の下面および溝部２１１３の下面である。 The mounting portion 211 has a first surface 210a, a second surface 210b, a third surface 210c, and a back surface 210d. As shown in FIG. 13, the third surface 210c is located above the first surface 210a in the thickness direction z. In this modification, as shown in FIG. 13, the third surface 210c is at the same position as the second surface 210b in the thickness direction z. The first surface 210a is the upper surface of the groove portion 2113. The second surface 210b is the upper surface of the portion of the base 2111 surrounded by the groove 2113 in plan view. The third surface 210c is the upper surface of the portion of the base 2111 that surrounds the groove 2113 in a plan view. The back surface 210d is the lower surface of the base portion 2111 and the lower surface of the groove portion 2113.
　電子装置Ａ４においても、電子装置Ａ１と同様に、第２面２１０ｂによって、発熱源となる機能部１１の厚さ方向ｚ下方において、搭載部２１１と電子部品１Ａとの厚さ方向ｚに沿う距離を小さくできる。したがって、電子部品１Ａ（機能部１１）から搭載部２１１への熱伝導性を向上させることが可能となる。また、第１面２１０ａによって、電子部品１Ａの外周１９の少なくとも一部において、搭載部２１１と電子部品１Ａとの厚さ方向ｚに沿う距離を大きくできる。つまり、電子装置Ａ４は、電子装置Ａ１と同様に、搭載部２１１に対する電子部品１Ａの実装信頼性を確保しつつ、電子部品１Ａ（機能部１１）の発熱に対する放熱性を向上することができる。 In the electronic device A4 as well, similarly to the electronic device A1, the second surface 210b reduces the distance along the thickness direction z between the mounting portion 211 and the electronic component 1A below the functional portion 11, which is a heat generation source, in the thickness direction z. can be made smaller. Therefore, it is possible to improve the thermal conductivity from the electronic component 1A (functional section 11) to the mounting section 211. Moreover, the distance along the thickness direction z between the mounting portion 211 and the electronic component 1A can be increased in at least a portion of the outer periphery 19 of the electronic component 1A by the first surface 210a. That is, like the electronic device A1, the electronic device A4 can improve the heat dissipation of the heat generated by the electronic component 1A (functional section 11) while ensuring the mounting reliability of the electronic component 1A on the mounting section 211.
　電子装置Ａ４では、第１面２１０ａは、基部２１１１よりも厚さ方向ｚ下方に窪む溝部２１１３の上面である。この構成によれば、溝部２１１３と、溝部２１１３の外方に位置する基部２１１１との段差によって、接合材３が溝部２１１３の外方に広がることが抑制される。つまり、電子装置Ａ４は、平面視における電子部品１Ａの外周１９部分において、接合材３の厚さが意図せず小さくなることを抑制できる。 In the electronic device A4, the first surface 210a is the upper surface of the groove portion 2113 that is recessed below the base portion 2111 in the thickness direction z. According to this configuration, the spread of the bonding material 3 to the outside of the groove 2113 is suppressed due to the difference in level between the groove 2113 and the base 2111 located outside the groove 2113. In other words, the electronic device A4 can prevent the thickness of the bonding material 3 from becoming unintentionally small in the outer periphery 19 portion of the electronic component 1A in plan view.
　図１４および図１５は、第１実施形態の第４変形例にかかる電子装置Ａ５を示している。電子装置Ａ５は、電子装置Ａ４と比較して、次の点で異なる。すなわち、電子装置Ａ５の第２面２１０ｂが、基部２１１１ではなく、溝部２１１３に配置されている。 FIGS. 14 and 15 show an electronic device A5 according to a fourth modification of the first embodiment. Electronic device A5 differs from electronic device A4 in the following points. That is, the second surface 210b of the electronic device A5 is arranged not in the base 2111 but in the groove 2113.
　本変形例では、溝部２１１３は、深底部と浅底部とを含む。深底部は、浅底部よりも、基部２１１１から窪んでいる。浅底部は、平面視矩形状であり、深底部は、浅底部を囲む矩形環状である。浅底部は、平面視において、機能部１１に重なる。本変形例では、第１面２１０ａは、深底部の上面であり、第２面２１０ｂは、浅底部の上面である。 In this modification, the groove portion 2113 includes a deep bottom portion and a shallow bottom portion. The deep bottom portion is more depressed from the base 2111 than the shallow bottom portion. The shallow bottom portion has a rectangular shape in plan view, and the deep bottom portion has a rectangular annular shape surrounding the shallow bottom portion. The shallow bottom portion overlaps the functional section 11 in plan view. In this modification, the first surface 210a is the top surface of the deep bottom portion, and the second surface 210b is the top surface of the shallow bottom portion.
　本変形例では、図１５に示すように、第２面２１０ｂは、第３面２１０ｃよりも厚さ方向ｚ下方に位置する。このような構成により、電子部品１Ａの一部は、溝部２１１３に収容される。 In this modification, as shown in FIG. 15, the second surface 210b is located below the third surface 210c in the thickness direction z. With such a configuration, a part of the electronic component 1A is accommodated in the groove 2113.
　電子装置Ａ５においても、電子装置Ａ４と同様に、実装信頼性を確保しつつ、放熱性を向上できる。また、電子装置Ａ５においても、電子装置Ａ４と同様に、溝部２１１３の外方への接合材３の広がりを抑制できる。これにより、平面視における電子部品１Ａの外周１９部分において、電子装置Ａ５の接合材３の厚さが意図せず小さくなることを抑制できる。 Similarly to the electronic device A4, in the electronic device A5, heat dissipation can be improved while ensuring mounting reliability. Further, in the electronic device A5 as well, the spread of the bonding material 3 outward of the groove portion 2113 can be suppressed, similarly to the electronic device A4. Thereby, it is possible to prevent the thickness of the bonding material 3 of the electronic device A5 from becoming unintentionally small in the outer periphery 19 portion of the electronic component 1A in plan view.
　図１６は、第１実施形態の第５変形例にかかる電子装置Ａ６を示している。電子装置Ａ６は、電子装置Ａ４と比較して、次の点で異なる。すなわち、電子装置Ａ６の溝部２１１３の平面視形状は、電子装置Ａ４の溝部２１１３の平面視形状と異なる。 FIG. 16 shows an electronic device A6 according to a fifth modification of the first embodiment. Electronic device A6 differs from electronic device A4 in the following points. That is, the shape of the groove 2113 of the electronic device A6 in plan view is different from the shape of the groove 2113 of the electronic device A4 in plan view.
　電子装置Ａ６では、第２面２１０ｂは、平面視において、電子部品１Ａの外方から電子部品１Ａまで延び出た部分を有する。この延び出た部分は、平面視において、機能部１１に重なる。また、第１面２１０ａは、平面視において、電子部品１Ａの四隅に重なる。 In the electronic device A6, the second surface 210b has a portion extending from the outside of the electronic component 1A to the electronic component 1A in plan view. This extended portion overlaps the functional section 11 in plan view. Further, the first surface 210a overlaps the four corners of the electronic component 1A in a plan view.
　電子装置Ａ６では、電子装置Ａ４と同様に、第２面２１０ｂの少なくとも一部が平面視において機能部１１に重なる。したがって、電子装置Ａ６は、電子装置Ａ４と同様に、放熱性を向上できる。また、電子装置Ａ６では、第１面２１０ａは、平面視において、電子部品１Ａの四隅に重なるので、搭載部２１１に対する電子部品１Ａの実装信頼性を向上できる。以上のことから、電子装置Ａ６は、電子装置Ａ４と同様に、実装信頼性を確保しつつ、放熱性を向上できる。なお、電子装置Ａ６に示す例から理解されるように、本開示の電子装置においては、第２面２１０ｂが機能部１１の少なくとも一部に重なれば、電子部品１Ａ（機能部１１）の発熱に対する放熱性が向上する。 In the electronic device A6, like the electronic device A4, at least a portion of the second surface 210b overlaps the functional section 11 in a plan view. Therefore, electronic device A6 can improve heat dissipation similarly to electronic device A4. Furthermore, in the electronic device A6, the first surface 210a overlaps the four corners of the electronic component 1A in a plan view, so that the mounting reliability of the electronic component 1A on the mounting portion 211 can be improved. From the above, the electronic device A6, like the electronic device A4, can improve heat dissipation while ensuring mounting reliability. Note that, as understood from the example shown in electronic device A6, in the electronic device of the present disclosure, if the second surface 210b overlaps at least a portion of the functional section 11, the heat generation of the electronic component 1A (functional section 11) is reduced. Improves heat dissipation.
　第２実施形態：
　図１７～図２１は、第２実施形態にかかる電子装置Ｂ１を示している。電子装置Ｂ１は、電子装置Ａ１と比較して、主に次の点で異なる。第１に、電子装置Ｂ１は、電子部品１Ａの代わりに、電子部品１Ｂを備える。第２に、電子装置Ｂ１は、電子装置Ａ１とパッケージ構造が異なる。 Second embodiment:
17 to 21 show an electronic device B1 according to the second embodiment. The electronic device B1 differs from the electronic device A1 mainly in the following points. First, the electronic device B1 includes an electronic component 1B instead of the electronic component 1A. Second, the electronic device B1 has a different package structure from the electronic device A1.
　電子装置Ｂ１は、ＳＯＰ（Small Outline Package）型のパッケージ構造である。電子装置Ｂ１は、電子部品１Ｂ、第１リード２１、複数のリード２４、接合材３、複数の導通部材４３，４４，４５および樹脂部材５を備える。 The electronic device B1 has an SOP (Small Outline Package) type package structure. The electronic device B1 includes an electronic component 1B, a first lead 21, a plurality of leads 24, a bonding material 3, a plurality of conductive members 43, 44, 45, and a resin member 5.
　電子部品１Ｂは、機能部１１および制御部１２を有する。電子部品１Ｂの機能部１１は、電子部品１Ａの機能部１１と同様にパワートランジスタである。理解の便宜上、図１９において、機能部１１にドット柄を描画する。制御部１２は、機能部１１（パワートランジスタ）の制御を行う。たとえば、制御部１２は、その機能要素として、ゲート駆動回路を含む。その他、保護回路またはアクティブクランプ回路などの他の回路を含んでもよい。ゲート駆動回路は、外部から入力される制御信号に基づいて、機能部１１の駆動（パワートランジスタのスイッチング動作）を制御する駆動信号を生成する。 The electronic component 1B has a functional section 11 and a control section 12. The functional section 11 of the electronic component 1B is a power transistor like the functional section 11 of the electronic component 1A. For convenience of understanding, a dot pattern is drawn on the functional section 11 in FIG. 19. The control unit 12 controls the functional unit 11 (power transistor). For example, the control unit 12 includes a gate drive circuit as its functional element. In addition, other circuits such as a protection circuit or an active clamp circuit may be included. The gate drive circuit generates a drive signal that controls the drive of the functional section 11 (switching operation of the power transistor) based on a control signal input from the outside.
　図１８、図２０および図２１に示すように、電子部品１Ｂは、複数の電極１１４，１１５，１２１を有する。複数の電極１１４は、主面１０ａに配置され、機能部１１に導通する。電極１１５は、裏面１０ｂに配置され、機能部１１に導通する。電極１１５は、接合材３を介して、搭載部２１１に導通する。複数の電極１２１は、主面１０ａに配置され、制御部１２に導通する。 As shown in FIGS. 18, 20, and 21, the electronic component 1B has a plurality of electrodes 114, 115, and 121. The plurality of electrodes 114 are arranged on the main surface 10a and are electrically connected to the functional section 11. The electrode 115 is arranged on the back surface 10b and is electrically connected to the functional section 11. The electrode 115 is electrically connected to the mounting portion 211 via the bonding material 3. The plurality of electrodes 121 are arranged on the main surface 10a and are electrically connected to the control section 12.
　複数のリード２４はそれぞれ、図１８に示すように、第１リード２１から離れている。複数のリード２４は、複数の導通部材４３，４４，４５を介して、電子部品１Ｂに導通する。図示された例では、複数のリード２４のうちの１つは、複数の導通部材４３，４４，４５のいずれも接続されず、電子部品１Ｂに導通しない。複数のリード２４は、第１リード２１（搭載部２１１）の周囲に配置され、図示された例では、第１リード２１に対して、第１方向ｘの一方側に配置されたものと、第１方向ｘの他方側に配置されたものとがある。複数のリード２４のうち、第１リード２１に対して、第１方向ｘの一方側に配置されたものは、第１方向ｘの一方側の樹脂側面５３から突き出る。複数のリード２４のうち、第１リード２１に対して、第１方向ｘの他方側に配置されたものは、第１方向ｘの他方側の樹脂側面５３から突き出る。複数のリード２４は、第１方向ｘの一方側および第２方向ｙの他方側のそれぞれにおいて、第２方向ｙに互いに離間する。 The plurality of leads 24 are each separated from the first lead 21, as shown in FIG. The plurality of leads 24 are electrically connected to the electronic component 1B via the plurality of conductive members 43, 44, and 45. In the illustrated example, one of the plurality of leads 24 is not connected to any of the plurality of conductive members 43, 44, and 45, and is not electrically connected to the electronic component 1B. The plurality of leads 24 are arranged around the first lead 21 (mounting part 211), and in the illustrated example, one is arranged on one side of the first lead 21 in the first direction x, and the other is arranged on one side of the first lead 21 in the first direction There is one placed on the other side of one direction x. Among the plurality of leads 24, those arranged on one side in the first direction x with respect to the first lead 21 protrude from the resin side surface 53 on one side in the first direction x. Among the plurality of leads 24, those arranged on the other side in the first direction x with respect to the first lead 21 protrude from the resin side surface 53 on the other side in the first direction x. The plurality of leads 24 are spaced apart from each other in the second direction y on one side in the first direction x and on the other side in the second direction y.
　複数のリード２４はそれぞれ、パッド部２４１および端子部２４２を含む。パッド部２４１は、樹脂部材５に覆われている。パッド部２４１は、複数の導通部材４３，４４，４５のいずれかが接続される。端子部２４２は、樹脂部材５に覆われた部分と樹脂部材５から露出する部分とを含む。端子部２４２は、パッド部２４１から第１方向ｘ外方に延びる。端子部２４２は、第２方向ｙに沿って見て、ガルウィング状に屈曲する。端子部２４２は、電子装置Ｂ１の外部端子として用いられる。 Each of the plurality of leads 24 includes a pad portion 241 and a terminal portion 242. The pad portion 241 is covered with the resin member 5. The pad portion 241 is connected to any one of the plurality of conductive members 43, 44, and 45. The terminal portion 242 includes a portion covered with the resin member 5 and a portion exposed from the resin member 5. The terminal portion 242 extends outward from the pad portion 241 in the first direction x. The terminal portion 242 is bent in a gullwing shape when viewed along the second direction y. The terminal section 242 is used as an external terminal of the electronic device B1.
　複数の導通部材４３，４４，４５はそれぞれ、たとえば金属ワイヤであり、ワイヤボンディングにより形成される。複数の導通部材４３，４４，４５の各組成は、金、アルミニウムまたは銅のいずれかを含む。複数の導通部材４３はそれぞれ、複数の電極１１４のいずれかと、複数のパッド部２４１のいずれかとに接合される。複数の導通部材４４はそれぞれ、複数の電極１２１のいずれかと、複数のパッド部２４１のいずれかとに接合される。複数の導通部材４５はそれぞれ、搭載部２１１と、複数のパッド部２４１のいずれかとに接合される。複数の導通部材４３，４４，４５により、複数のリード２４は、電極１１４に導通するものと、電極１１５に導通するものと、電極１２１に導通するものと含む。 Each of the plurality of conductive members 43, 44, and 45 is, for example, a metal wire, and is formed by wire bonding. The composition of each of the plurality of conductive members 43, 44, and 45 includes gold, aluminum, or copper. Each of the plurality of conductive members 43 is joined to one of the plurality of electrodes 114 and one of the plurality of pad sections 241. Each of the plurality of conductive members 44 is joined to one of the plurality of electrodes 121 and one of the plurality of pad sections 241. Each of the plurality of conductive members 45 is joined to the mounting section 211 and one of the plurality of pad sections 241. The plurality of leads 24 include one conductive to the electrode 114, one conductive to the electrode 115, and one conductive to the electrode 121 through the plurality of conductive members 43, 44, and 45.
　第２実施形態にかかる電子装置Ｂ１は、次の通り、電子装置Ａ１と同様の作用および効果を奏する。すなわち、電子装置Ｂ１の搭載部２１１は、電子部品１Ｂが接合された第１面２１０ａおよび第２面２１０ｂを有する。第１面２１０ａおよび第２面２１０ｂはそれぞれは、厚さ方向ｚの他方側（上方）を向く。第１面２１０ａは、厚さ方向ｚに見て、電子部品１Ｂの外周１９の少なくとも一部に重なる。第２面２１０ｂは、第１面２１０ａよりも厚さ方向ｚの上方に位置し、かつ、厚さ方向ｚに見て、機能部１１に重なる。したがって、電子装置Ｂ１は、電子装置Ａ１と同様に、第２面２１０ｂによって、発熱源となる機能部１１の厚さ方向ｚ下方において、搭載部２１１と電子部品１Ｂとの厚さ方向ｚに沿う距離が小さいので、電子部品１Ｂ（機能部１１）から搭載部２１１への熱伝導性を向上させることが可能となる。つまり、電子部品１Ｂの発熱に対する放熱性を向上できる。また、電子装置Ｂ１は、電子装置Ａ１と同様に、第１面２１０ａによって、電子部品１Ｂの外周１９の一部において、搭載部２１１と電子部品１Ｂとの厚さ方向ｚに沿う距離が大きいので、搭載部２１１と電子部品１Ｂとの挟まれた接合材３（第１接合部３１）の厚さを適度に確保することが可能となる。つまり、搭載部２１１に対する電子部品１Ｂの接合強度を適度に確保し、電子部品１Ｂの実装信頼性を向上できる。したがって、電子装置Ｂ１は、搭載部２１１に対する電子部品１Ｂの実装信頼性を確保しつつ、電子部品１Ｂ（機能部１１）の発熱に対する放熱性を向上することができる。 The electronic device B1 according to the second embodiment has the same functions and effects as the electronic device A1 as follows. That is, the mounting portion 211 of the electronic device B1 has a first surface 210a and a second surface 210b to which the electronic component 1B is bonded. The first surface 210a and the second surface 210b each face the other side (upward) in the thickness direction z. The first surface 210a overlaps at least a portion of the outer periphery 19 of the electronic component 1B when viewed in the thickness direction z. The second surface 210b is located above the first surface 210a in the thickness direction z, and overlaps the functional section 11 when viewed in the thickness direction z. Therefore, similarly to the electronic device A1, the electronic device B1 has a second surface 210b that extends along the thickness direction z between the mounting portion 211 and the electronic component 1B below the functional portion 11 that is a heat generation source in the thickness direction z. Since the distance is small, it is possible to improve thermal conductivity from the electronic component 1B (functional section 11) to the mounting section 211. In other words, it is possible to improve the heat dissipation performance for the heat generated by the electronic component 1B. Further, in the electronic device B1, like the electronic device A1, the distance along the thickness direction z between the mounting portion 211 and the electronic component 1B is large in a part of the outer periphery 19 of the electronic component 1B due to the first surface 210a. , it becomes possible to ensure an appropriate thickness of the bonding material 3 (first bonding portion 31) sandwiched between the mounting portion 211 and the electronic component 1B. In other words, the bonding strength of the electronic component 1B to the mounting portion 211 can be ensured appropriately, and the mounting reliability of the electronic component 1B can be improved. Therefore, the electronic device B1 can improve the heat dissipation of the heat generated by the electronic component 1B (functional section 11) while ensuring the mounting reliability of the electronic component 1B on the mounting section 211.
　その他、電子装置Ｂ１は、各電子装置Ａ１～Ａ６と共通する構成によって、各電子装置Ａ１～Ａ６と同様の効果を奏する。 In addition, the electronic device B1 has the same configuration as each of the electronic devices A1 to A6, and thus achieves the same effects as each of the electronic devices A1 to A6.
　上記第２実施形態の電子装置Ｂ１では、第２面２１０ｂは、平面視において、機能部１１の外形と相似形に形成されているが、この構成とは異なり、第２面２１０ｂは、平面視において、電子部品１Ｂの外形（外周１９）と相似形に形成されていてもよい。この構成では、電子部品１Ｂに対して、第２面２１０ｂ、つまり、突出部２１１２が均等に配置されるので、電子部品１Ｂの姿勢が傾くことを抑制できる。 In the electronic device B1 of the second embodiment, the second surface 210b is formed to have a similar shape to the outer shape of the functional unit 11 when viewed from above, but unlike this configuration, the second surface 210b is , it may be formed to have a similar shape to the outer shape (outer periphery 19) of the electronic component 1B. In this configuration, since the second surface 210b, that is, the protruding portions 2112 are evenly arranged with respect to the electronic component 1B, it is possible to suppress the posture of the electronic component 1B from tilting.
　上記第２実施形態の電子装置Ｂ１では、搭載部２１１は、基部２１１１と突出部２１１２とを含む例を示したが、この構成とは異なり、搭載部２１１は、上記電子装置Ａ４～Ａ６と同様に、基部２１１１と溝部２１１３とを含む構成であってもよい。 In the electronic device B1 of the second embodiment, the mounting portion 211 includes the base portion 2111 and the protruding portion 2112, but unlike this configuration, the mounting portion 211 is similar to the electronic devices A4 to A6 described above. Alternatively, the structure may include a base portion 2111 and a groove portion 2113.
　上記第２実施形態において、電子装置Ｂ１は、ＳＯＰ型のパッケージ構造に限定されず、他のパッケージ構造を採用してもよい。たとえば、電子装置Ｂ１は、電子装置Ａ１と同様の端子挿通型のパッケージ構造であってもよいし、リードレス型のパッケージ構造であってもよい。リードレス型のパッケージ構造としては、たとえば、ＢＧＡ(Ball Grid Array)、ＬＧＡ(Land Grid Array)、ＤＦＮ（Dual Flatpack No-leaded）ＱＦＮ(Quad Flat No-leaded)などがある。つまり、本開示の電子装置のパッケージ構造は、何ら限定されない。 In the second embodiment, the electronic device B1 is not limited to the SOP type package structure, and may adopt other package structures. For example, the electronic device B1 may have a terminal insertion type package structure similar to the electronic device A1, or may have a leadless type package structure. Examples of leadless package structures include BGA (Ball Grid Array), LGA (Land Grid Array), DFN (Dual Flatpack No-leaded), and QFN (Quad Flat No-leaded). That is, the package structure of the electronic device of the present disclosure is not limited at all.
　第３実施形態：
　図２２～図２８は、第３実施形態にかかる電子装置Ｃ１を示している。電子装置Ｃ１は、電子装置Ａ１と比較して、主に、次の点で異なる。第１に、電子装置Ｃ１は、電子部品１Ａの代わりに、複数の電子部品１Ｃ，１Ｄを備える。第２に、電子装置Ｃ１は、電子装置Ａ１とパッケージ構造が異なる。 Third embodiment:
22 to 28 show an electronic device C1 according to the third embodiment. The electronic device C1 differs from the electronic device A1 mainly in the following points. First, the electronic device C1 includes a plurality of electronic components 1C and 1D instead of the electronic component 1A. Second, the electronic device C1 has a different package structure from the electronic device A1.
　電子装置Ｃ１は、複数の電子部品１Ｃ，１Ｄ、一対の支持基板６１１，６１２、一対の搭載部６２１，６２２、一対の配線基板６３１，６３２、２つの入力端子７１，７２、出力端子７３、一対の信号端子７４１，７４２，一対の信号端子７５１，７５２、複数の導通部材４６，４７，４８および樹脂部材５を備える。 The electronic device C1 includes a plurality of electronic components 1C and 1D, a pair of support boards 611 and 612, a pair of mounting parts 621 and 622, a pair of wiring boards 631 and 632, two input terminals 71 and 72, an output terminal 73, and a pair of support boards 611 and 612. signal terminals 741, 742, a pair of signal terminals 751, 752, a plurality of conductive members 46, 47, 48, and a resin member 5.
　複数の電子部品１Ｃ，１Ｄはそれぞれ、上述する電子部品１Ａと同様に構成される。つまり、複数の電子部品１Ｃ，１Ｄは、パワートランジスタが形成された機能部１１を含む。理解の便宜上、図２５において、複数の電子部品１Ｃ，１Ｄの各機能部１１にドット柄を描画する。また、複数の電子部品１Ｃ，１Ｄはそれぞれ、電子部品１Ａと同様に、主面１０ａ、裏面１０ｂ、第１電極１１１、第２電極１１２および第３電極１１３を有する。 Each of the plurality of electronic components 1C and 1D is configured similarly to the electronic component 1A described above. That is, the plurality of electronic components 1C and 1D include a functional section 11 in which a power transistor is formed. For convenience of understanding, in FIG. 25, a dot pattern is drawn on each functional section 11 of the plurality of electronic components 1C and 1D. Further, each of the plurality of electronic components 1C and 1D has a main surface 10a, a back surface 10b, a first electrode 111, a second electrode 112, and a third electrode 113, similarly to the electronic component 1A.
　複数の電子部品１Ｃは、電気的に並列に接続されている。つまり、複数の電子部品１Ｃの第１電極１１１同士は、互いに導通し、複数の電子部品１Ｃの第２電極１１２は、互いに導通する。また、複数の電子部品１Ｄは、電気的に並列に接続されている。つまり、複数の電子部品１Ｄの第１電極１１１同士は、互いに導通し、複数の電子部品１Ｄの第２電極１１２は、互いに導通する。 The plurality of electronic components 1C are electrically connected in parallel. That is, the first electrodes 111 of the plurality of electronic components 1C are electrically connected to each other, and the second electrodes 112 of the plurality of electronic components 1C are electrically connected to each other. Further, the plurality of electronic components 1D are electrically connected in parallel. That is, the first electrodes 111 of the plurality of electronic components 1D are electrically connected to each other, and the second electrodes 112 of the plurality of electronic components 1D are electrically connected to each other.
　一対の支持基板６１１，６１２は、一対の搭載部６２１，６２２を介して、複数の電子部品１Ｃ，１Ｄを支持する。一対の支持基板６１１，６１２はそれぞれ、たとえばＤＢＣ（Direct Bonded Copper）基板である。 A pair of support substrates 611 and 612 support a plurality of electronic components 1C and 1D via a pair of mounting parts 621 and 622. Each of the pair of support substrates 611 and 612 is, for example, a DBC (Direct Bonded Copper) substrate.
　一対の搭載部６２１，６２２は、一対の支持基板６１１，６１２にそれぞれ接合される。一対の搭載部６２１，６２２の各組成は、銅を含む。搭載部６２１には、複数の電子部品１Ｃが接合される。複数の電子部品１Ｃの第１電極１１１同士は、搭載部６２１を介して、導通する。搭載部６２２には、複数の電子部品１Ｄが接合される。複数の電子部品１Ｄの第１電極１１１同士は、搭載部６２２を介して導通する。 The pair of mounting parts 621 and 622 are joined to the pair of support substrates 611 and 612, respectively. Each composition of the pair of mounting parts 621 and 622 includes copper. A plurality of electronic components 1C are bonded to the mounting portion 621. The first electrodes 111 of the plurality of electronic components 1C are electrically connected to each other via the mounting portion 621. A plurality of electronic components 1D are bonded to the mounting portion 622. The first electrodes 111 of the plurality of electronic components 1D are electrically connected to each other via the mounting portion 622.
　一対の搭載部６２１，６２２はそれぞれ、第１面６２０ａ、第２面６２０ｂおよび裏面６２０ｄを有する。以下で説明する第１面６２０ａ、第２面６２０ｂおよび裏面６２０ｄは、特段の断りがない限り、各搭載部６２１，６２２で共通する。 The pair of mounting parts 621 and 622 each have a first surface 620a, a second surface 620b, and a back surface 620d. A first surface 620a, a second surface 620b, and a back surface 620d described below are common to each mounting portion 621, 622 unless otherwise specified.
　第１面６２０ａは、平面視において、第２面６２０ｂを囲うように配置される。第１面６２０ａは、たとえば平坦であり、ｘ－ｙ平面に沿って広がる。図２５に示すように、平面視において、搭載部６２１の第１面６２０ａは、各電子部品１Ｃの四隅に重なる。平面視において、搭載部６２２の第１面６２０ａは、各電子部品１Ｄの四隅に重なる。 The first surface 620a is arranged so as to surround the second surface 620b in plan view. The first surface 620a is, for example, flat and extends along the xy plane. As shown in FIG. 25, the first surface 620a of the mounting portion 621 overlaps the four corners of each electronic component 1C in plan view. In plan view, the first surface 620a of the mounting section 622 overlaps the four corners of each electronic component 1D.
　第２面６２０ｂは、第１面６２０ａよりも厚さ方向ｚ上方に位置する。第２面６２０ｂは、たとえば平坦であり、ｘ－ｙ平面に沿って広がる。第２面６２０ｂは、平面視において、第２方向ｙに延びる帯状である。図２５に示すように、平面視において、搭載部６２１の第２面６２０ｂは、複数の電子部品１Ｃに跨って形成され、各電子部品１Ｃの機能部１１に重なる。平面視において、搭載部６２２の第２面６２０ｂは、複数の電子部品１Ｄに跨って形成され、各電子部品１Ｄの機能部１１に重なる。 The second surface 620b is located above the first surface 620a in the thickness direction z. The second surface 620b is, for example, flat and extends along the xy plane. The second surface 620b has a band shape extending in the second direction y when viewed from above. As shown in FIG. 25, in plan view, the second surface 620b of the mounting section 621 is formed across the plurality of electronic components 1C, and overlaps with the functional section 11 of each electronic component 1C. In plan view, the second surface 620b of the mounting section 622 is formed across the plurality of electronic components 1D, and overlaps with the functional section 11 of each electronic component 1D.
　裏面６２０ｄは、厚さ方向ｚ下方を向く。つまり、裏面６２０ｄは、厚さ方向ｚにおいて、第１面６２０ａおよび第２面６２０ｂと反対側を向く。裏面６２０ｄは、たとえば平坦であり、ｘ－ｙ平面に沿って広がる。搭載部６２１の裏面６２０ｄは、支持基板６１１に接合され、搭載部６２２の裏面６２０ｄは、支持基板６１２に接合される。 The back surface 620d faces downward in the thickness direction z. That is, the back surface 620d faces the opposite side to the first surface 620a and the second surface 620b in the thickness direction z. The back surface 620d is, for example, flat and extends along the xy plane. A back surface 620d of the mounting portion 621 is joined to the support substrate 611, and a back surface 620d of the mounting portion 622 is joined to the support substrate 612.
　一対の搭載部６２１，６２２はそれぞれ、基部６２０１および突出部６２０２を含む。以下で説明する基部６２０１および突出部６２０２はそれぞれ、各搭載部６２１，６２２で共通する。 The pair of mounting parts 621 and 622 each include a base part 6201 and a protrusion part 6202. A base portion 6201 and a protrusion portion 6202, which will be described below, are common to each of the mounting portions 621 and 622, respectively.
　基部６２０１は、平面視において、突出部６２０２を囲む。突出部６２０２の厚さ（厚さ方向ｚの寸法）は、基部６２０１の厚さ（厚さ方向ｚの寸法）よりも大きい。突出部６２０２は、基部６２０１よりも厚さ方向ｚ上方に突き出る。上述した第１面６２０ａは、基部６２０１の上面である。上述した第２面６２０ｂは、突出部６２０２の上面である。上述した裏面６２０ｄは、基部６２０１の下面および突出部６２０２の下面である。 The base 6201 surrounds the protrusion 6202 in plan view. The thickness of the protrusion 6202 (dimension in the thickness direction z) is larger than the thickness of the base 6201 (dimension in the thickness direction z). The protrusion 6202 protrudes higher than the base 6201 in the thickness direction z. The first surface 620a described above is the upper surface of the base 6201. The second surface 620b described above is the upper surface of the protrusion 6202. The above-mentioned back surface 620d is the lower surface of the base 6201 and the lower surface of the protrusion 6202.
　一対の配線基板６３１，６３２は、一対の搭載部６２１，６２２にそれぞれ接合される。一対の配線基板６３１，６３２は、たとえば各支持基板６１１，６１２と同様に、ＤＢＣ基板により構成される。配線基板６３１は、各電子部品１Ｃの駆動信号および検出信号を伝送する。配線基板６３２は、各電子部品１Ｄの駆動信号および検出信号を伝送する。 The pair of wiring boards 631 and 632 are joined to the pair of mounting parts 621 and 622, respectively. The pair of wiring boards 631 and 632 are configured of DBC boards, for example, like the support boards 611 and 612. The wiring board 631 transmits drive signals and detection signals for each electronic component 1C. The wiring board 632 transmits drive signals and detection signals for each electronic component 1D.
　２つの入力端子７１，７２、出力端子７３、複数の信号端子７４１，７４２，７５１，７５２はそれぞれ、樹脂部材５に覆われた部分と樹脂部材５から露出する部分とを含む。入力端子７１は、複数の電子部品１Ｃの第１電極１１１に導通する。入力端子７２は、複数の電子部品１Ｄの第２電極１１２に導通する。出力端子７３は、複数の電子部品１Ｃの第２電極１１２および複数の電子部品１Ｄの第１電極１１１に導通する。信号端子７４１は、配線基板６３１を介して、複数の電子部品１Ｃの第３電極１１３に導通する。信号端子７４２は、配線基板６３２を介して、複数の電子部品１Ｄの第３電極１１３に導通する。信号端子７５１は、配線基板６３１を介して、複数の電子部品１Ｃの第２電極１１２に導通する。信号端子７５２は、配線基板６３２を介して、複数の電子部品１Ｄの第２電極１１２に導通する。 The two input terminals 71 and 72, the output terminal 73, and the plurality of signal terminals 741, 742, 751, and 752 each include a portion covered with the resin member 5 and a portion exposed from the resin member 5. The input terminal 71 is electrically connected to the first electrode 111 of the plurality of electronic components 1C. The input terminal 72 is electrically connected to the second electrode 112 of the plurality of electronic components 1D. The output terminal 73 is electrically connected to the second electrode 112 of the plurality of electronic components 1C and the first electrode 111 of the plurality of electronic components 1D. The signal terminal 741 is electrically connected to the third electrode 113 of the plurality of electronic components 1C via the wiring board 631. The signal terminal 742 is electrically connected to the third electrode 113 of the plurality of electronic components 1D via the wiring board 632. The signal terminal 751 is electrically connected to the second electrode 112 of the plurality of electronic components 1C via the wiring board 631. The signal terminal 752 is electrically connected to the second electrode 112 of the plurality of electronic components 1D via the wiring board 632.
　複数の導通部材４６，４７はそれぞれ、たとえば金属ワイヤであり、ワイヤボンディングにより形成される。複数の導通部材４６，４７の各組成は、金、アルミニウムまたは銅のいずれかを含む。複数の導通部材４６はそれぞれ、複数の電子部品１Ｃ，１Ｄのいずれかと、一対の配線基板６３１，６３２とのいずれとに接合される。複数の導通部材４６には、電子部品１Ｃの第３電極１１３と配線基板６３１とを導通させるもの、電子部品１Ｃの第２電極１１２と配線基板６３１とを導通させるもの、電子部品１Ｄの第３電極１１３と配線基板６３２とを導通させるもの、および、電子部品１Ｄの第２電極１１２と配線基板６３２とを導通させるものとを含む。複数の導通部材４７は、一対の配線基板６３１，６３２のいずれかと複数の信号端子７４１，７４２，７５１，７５２のいずれかとに接合される。複数の導通部材４７には、配線基板６３１と信号端子７４１とを導通させるもの、配線基板６３１と信号端子７５１とを導通させるもの、配線基板６３２と信号端子７４２とを導通させるもの、および、配線基板６３２と信号端子７５２とを導通させるものとを含む。 Each of the plurality of conductive members 46 and 47 is, for example, a metal wire, and is formed by wire bonding. The composition of each of the plurality of conductive members 46 and 47 includes gold, aluminum, or copper. Each of the plurality of conductive members 46 is joined to one of the plurality of electronic components 1C, 1D and one of the pair of wiring boards 631, 632. The plurality of conductive members 46 include one that connects the third electrode 113 of the electronic component 1C and the wiring board 631, one that connects the second electrode 112 of the electronic component 1C and the wiring board 631, and a third conductive member of the electronic component 1D. It includes one that connects the electrode 113 and the wiring board 632 and another that connects the second electrode 112 of the electronic component 1D and the wiring board 632. The plurality of conductive members 47 are joined to either one of the pair of wiring boards 631, 632 and one of the plurality of signal terminals 741, 742, 751, 752. The plurality of conductive members 47 include one that connects the wiring board 631 and the signal terminal 741, one that connects the wiring board 631 and the signal terminal 751, one that connects the wiring board 632 and the signal terminal 742, and one that connects the wiring board 631 and the signal terminal 742. The circuit board 632 and the signal terminal 752 are electrically connected to each other.
　複数の導通部材４８はそれぞれ、たとえば金属クリップである。複数の導通部材４８の各組成は、たとえば銅を含む。複数の導通部材４８はそれぞれ、導電性接合材を介して、複数の電子部品１Ｃの第２電極１１２のいずれかと、搭載部６２２とに接合される。よって、複数の電子部品１Ｃの第２電極１１２と、搭載部６２２とは、複数の導通部材４８を介して、導通する。 Each of the plurality of conductive members 48 is, for example, a metal clip. The composition of each of the plurality of conductive members 48 includes, for example, copper. Each of the plurality of conductive members 48 is bonded to one of the second electrodes 112 of the plurality of electronic components 1C and the mounting portion 622 via a conductive bonding material. Therefore, the second electrodes 112 of the plurality of electronic components 1C and the mounting portions 622 are electrically connected via the plurality of conductive members 48.
　第３実施形態にかかる電子装置Ｃ１は、次の通り、各電子装置Ａ１，Ｂ１と同様の作用および効果を奏する。すなわち、電子装置Ｃ１の搭載部６２１は、各電子部品１Ｃが接合された第１面６２０ａおよび第２面６２０ｂを有する。第１面６２０ａおよび第２面６２０ｂの各々は、厚さ方向ｚの他方側（上方）を向く。第１面６２０ａは、厚さ方向ｚに見て、各電子部品１Ｃの外周１９の少なくとも一部に重なる。第２面６２０ｂは、第１面６２０ａよりも厚さ方向ｚの他方側（上方）に位置し、且つ、厚さ方向ｚに見て、機能部１１に重なる。したがって、電子装置Ｃ１は、各電子装置Ａ１，Ｂ１と同様に、第２面６２０ｂによって、発熱源となる機能部１１の厚さ方向ｚ下方において、搭載部６２１と電子部品１Ｂとの厚さ方向ｚに沿う距離が小さいので、各電子部品１Ｃ（機能部１１）から搭載部６２１への熱伝導性を向上させることが可能となる。つまり、各電子部品１Ｃの発熱に対する放熱性を向上できる。また、電子装置Ｃ１は、各電子装置Ａ１，Ｂ１と同様に、第１面６２０ａによって、各電子部品１Ｃの外周１９の一部において、搭載部６２１と各電子部品１Ｃとの厚さ方向ｚに沿う距離が大きいので、搭載部６２１と各電子部品１Ｃとの挟まれた接合材３（第１接合部３１）の厚さを適度に確保することが可能となる。つまり、搭載部６２１に対する各電子部品１Ｃの接合強度を適度に確保し、各電子部品１Ｃの実装信頼性を向上できる。したがって、電子装置Ｃ１は、搭載部６２１に対する各電子部品１Ｃの実装信頼性を確保しつつ、各電子部品１Ｃ（機能部１１）の発熱に対する放熱性を向上できる。このことは、各電子部品１Ｄと搭載部６２２との関係においても同様である。つまり、電子装置Ｃ１は、搭載部６２２に対する各電子部品１Ｄの実装信頼性を確保しつつ、各電子部品１Ｄ（機能部１１）の発熱に対する放熱性を向上できる。 The electronic device C1 according to the third embodiment has the same functions and effects as the electronic devices A1 and B1, as follows. That is, the mounting portion 621 of the electronic device C1 has a first surface 620a and a second surface 620b to which each electronic component 1C is bonded. Each of the first surface 620a and the second surface 620b faces the other side (upward) in the thickness direction z. The first surface 620a overlaps at least a portion of the outer periphery 19 of each electronic component 1C when viewed in the thickness direction z. The second surface 620b is located on the other side (upper side) in the thickness direction z than the first surface 620a, and overlaps with the functional section 11 when viewed in the thickness direction z. Therefore, like each of the electronic devices A1 and B1, the second surface 620b allows the electronic device C1 to connect the mounting portion 621 and the electronic component 1B in the thickness direction below the functional portion 11, which is a heat generation source, in the thickness direction z. Since the distance along z is small, it is possible to improve thermal conductivity from each electronic component 1C (functional section 11) to the mounting section 621. In other words, it is possible to improve the heat dissipation performance for the heat generated by each electronic component 1C. Further, like each of the electronic devices A1 and B1, the electronic device C1 has a first surface 620a that extends in the thickness direction z between the mounting portion 621 and each electronic component 1C at a part of the outer periphery 19 of each electronic component 1C. Since the distance along the mounting portion 621 is large, it is possible to ensure an appropriate thickness of the bonding material 3 (first bonding portion 31) sandwiched between the mounting portion 621 and each electronic component 1C. In other words, the bonding strength of each electronic component 1C to the mounting portion 621 can be ensured appropriately, and the mounting reliability of each electronic component 1C can be improved. Therefore, the electronic device C1 can improve the heat dissipation of heat generated by each electronic component 1C (functional unit 11) while ensuring the mounting reliability of each electronic component 1C on the mounting section 621. This also applies to the relationship between each electronic component 1D and the mounting section 622. In other words, the electronic device C1 can improve the heat dissipation of heat generated by each electronic component 1D (functional unit 11) while ensuring the mounting reliability of each electronic component 1D on the mounting section 622.
　その他、電子装置Ｃ１は、各電子装置Ａ１～Ａ６，Ｂ１と共通する構成によって、各電子装置Ａ１～Ａ６，Ｂ１と同様の効果を奏する。 In addition, the electronic device C1 has the same configuration as each of the electronic devices A1 to A6, B1, and thus achieves the same effects as each of the electronic devices A1 to A6, B1.
　上記第３実施形態では、突出部２１１２が、複数の電子部品１Ｃに跨って形成された例を示したが、この例と異なり、各電子部品１Ｃに対して突出部２１１２が１つずつ設けられてもよい。この場合、各突出部２１１２は、電子装置Ａ１～Ａ３の突出部２１１２と同様に構成される。このことは、複数の電子部品１Ｄに対する突出部２１１２においても同様である。 In the third embodiment, the protrusion 2112 is formed across a plurality of electronic components 1C, but unlike this example, one protrusion 2112 is provided for each electronic component 1C. It's okay. In this case, each protrusion 2112 is configured similarly to the protrusion 2112 of the electronic devices A1 to A3. This also applies to the protrusions 2112 for the plurality of electronic components 1D.
　図２９は、第３実施形態の第１変形例にかかる電子装置Ｃ２を示している。電子装置Ｃ２は、電子装置Ｃ１と比較して、次の点で異なる。すなわち、電子装置Ｃ２の各搭載部６２１，６２２は、突出部６２０２の代わりに、溝部６２０３を含んでいる。 FIG. 29 shows an electronic device C2 according to a first modification of the third embodiment. The electronic device C2 differs from the electronic device C1 in the following points. That is, each mounting section 621, 622 of the electronic device C2 includes a groove section 6203 instead of the protrusion section 6202.
　各搭載部６２１，６２２において、溝部６２０３は、基部６２０１から厚さ方向ｚに窪む。溝部６２０３の厚さ（厚さ方向ｚの寸法）は、基部６２０１の厚さ（厚さ方向ｚの寸法）よりも小さい。基部６２０１の下面と溝部６２０３の下面とは面一である。図２９に示すように、溝部６２０３は、平面視において、第２方向ｙに延びる帯状に形成されている。本実施形態では、図２９に示すように、各搭載部６２１，６２２において、溝部６２０３は、第１方向ｘに離間する２つの部分を有する。この２つの部分の一方は、複数の電子部品１Ｃ（１Ｄ）の第１方向ｘ一方側の角部に跨っており、２つの部分の他方は、複数の電子部品１Ｃ（１Ｄ）の第１方向ｘ他方側の角部に跨っている。 In each mounting portion 621, 622, the groove portion 6203 is depressed from the base portion 6201 in the thickness direction z. The thickness of the groove portion 6203 (dimension in the thickness direction z) is smaller than the thickness of the base portion 6201 (dimension in the thickness direction z). The lower surface of the base 6201 and the lower surface of the groove 6203 are flush with each other. As shown in FIG. 29, the groove portion 6203 is formed in a band shape extending in the second direction y when viewed from above. In this embodiment, as shown in FIG. 29, in each mounting portion 621, 622, the groove portion 6203 has two portions spaced apart in the first direction x. One of these two parts straddles the corner of the plurality of electronic components 1C (1D) in the first direction x one side, and the other of the two parts extends in the first direction x of the plurality of electronic components 1C (1D). x straddles the corner on the other side.
　電子装置Ｃ２においても、各電子装置Ａ４～Ａ６と同様に、第２面６２０ｂによって、発熱源となる各電子部品１Ｃの機能部１１の厚さ方向ｚ下方において、搭載部６２１と各電子部品１Ｃとの厚さ方向ｚに沿う距離を小さくできる。したがって、各電子部品１Ｃ（機能部１１）から搭載部６２１への熱伝導性を向上させることが可能となる。また、第１面６２０ａによって、各電子部品１Ｃの外周１９の少なくとも一部において、搭載部６２１と各電子部品１Ｃとの厚さ方向ｚに沿う距離を大きくできる。つまり、電子装置Ｃ２は、各電子装置Ａ４～Ａ６と同様に、搭載部６２１に対する各電子部品１Ｃの実装信頼性を確保しつつ、各電子部品１Ｃ（機能部１１）の発熱に対する放熱性を向上することができる。このことは、電子装置Ｃ２の各電子部品１Ｄと搭載部６２２との関係においても同様である。つまり、電子装置Ｃ２は、搭載部６２２に対する各電子部品１Ｄの実装信頼性を確保しつつ、各電子部品１Ｄ（機能部１１）の発熱に対する放熱性を向上できる。 In the electronic device C2, similarly to each of the electronic devices A4 to A6, the second surface 620b allows the mounting portion 621 and each electronic component 1C to be connected to each other in the thickness direction z below the functional portion 11 of each electronic component 1C, which is a heat generation source. The distance along the thickness direction z can be reduced. Therefore, it is possible to improve the thermal conductivity from each electronic component 1C (functional section 11) to the mounting section 621. Moreover, the distance along the thickness direction z between the mounting portion 621 and each electronic component 1C can be increased in at least a portion of the outer periphery 19 of each electronic component 1C by the first surface 620a. In other words, like the electronic devices A4 to A6, the electronic device C2 improves the heat dissipation of heat generated by each electronic component 1C (functional section 11) while ensuring the mounting reliability of each electronic component 1C on the mounting section 621. can do. This also applies to the relationship between each electronic component 1D of the electronic device C2 and the mounting section 622. In other words, the electronic device C2 can improve the heat dissipation of heat generated by each electronic component 1D (functional unit 11) while ensuring the mounting reliability of each electronic component 1D on the mounting section 622.
　その他、電子装置Ｃ２は、電子装置Ｃ１と共通する構成によって、電子装置Ｃ１と同様の効果を奏する。 In addition, the electronic device C2 has the same configuration as the electronic device C1, and has the same effects as the electronic device C1.
　上記各実施形態および上記各変形例における各部の構成は、技術的な矛盾が生じない範囲において相互に組み合わせ可能である。 The configurations of each part in each of the above embodiments and each modification example can be combined with each other within the range that does not cause technical contradiction.
　本開示にかかる電子装置は、上記した実施形態に限定されるものではない。本開示の電子装置の各部の具体的な構成は、種々に設計変更自在である。たとえば、本開示は、以下の付記に記載された実施形態を含む。
付記１．
　機能部を有する第１電子部品と、
　前記第１電子部品が搭載された搭載部と、
　前記第１電子部品と前記搭載部とを接合する接合材と、
を備え、
　前記搭載部は、前記第１電子部品の厚さ方向の一方側を向く裏面と、前記厚さ方向の他方側を向き、かつ前記第１電子部品が接合された第１面および第２面と、を有し、
　前記第２面は、前記第１面よりも前記厚さ方向の他方側に位置し、
　前記第１面は、前記厚さ方向に見て、前記第１電子部品の外周の少なくとも一部に重なり、
　前記第２面は、前記厚さ方向に見て、前記機能部に重なる、電子装置。
付記２．
　前記第１電子部品は、前記厚さ方向に見て矩形状であり、
　前記第２面は、前記第１電子部品の四隅のいずれにも重ならない、付記１に記載の電子装置。
付記３．
　前記厚さ方向に見て、前記第２面の全ては、前記第１電子部品に重なり、
　前記厚さ方向に見て、前記第１面は、前記第１電子部品の外周の全てに重なる、付記１または付記２に記載の電子装置。
付記４．
　前記厚さ方向において、前記搭載部に対して他方側に位置する第２電子部品をさらに備え、
　前記第２面は、前記厚さ方向に見て、前記第１電子部品および前記第２電子部品に跨る、付記１または付記２に記載の電子装置。
付記５．
　前記搭載部は、基部と、前記基部から前記厚さ方向の他方側に突き出た突出部とを含み、
　前記基部は、前記第１面を有し、
　前記突出部は、前記第２面を有する、付記１ないし付記４のいずれかに記載の電子装置。
付記６．
　前記搭載部は、基部と、前記基部から前記厚さ方向の一方側に窪んだ溝部とを含み、
　前記溝部は、前記第１面を有し、
　前記基部は、前記第１面よりも高い第３面を有する、付記１ないし付記４のいずれかに記載の電子装置。
付記７．
　前記溝部は、前記第２面を有する、付記６に記載の電子装置。
付記８．
　前記第２面は、前記第３面よりも前記厚さ方向の一方側に位置し、
　前記溝部には、前記第１電子部品の一部が収容される、付記７に記載の電子装置。
付記９．
　前記機能部は、パワートランジスタである、付記１ないし付記８のいずれかに記載の電子装置。
付記１０．
　前記第１電子部品は、前記パワートランジスタを制御する制御部を有する、付記９に記載の電子装置。
付記１１．
　前記第１電子部品を覆う樹脂部材をさらに備え、
　前記樹脂部材は、前記搭載部の一部を覆う、付記１ないし付記１０のいずれかに記載の電子装置。
付記１２．
　前記裏面は、前記樹脂部材から露出する、付記１１に記載の電子装置。
付記１３．
　前記第１電子部品に導通するリードをさらに備え、
　前記リードは、前記樹脂部材に覆われた部位と前記樹脂部材から露出する部位とを含む、付記１１または付記１２に記載の電子装置。
付記１４．
　前記第１電子部品と前記搭載部とは、前記接合材を介して導通する、付記１ないし付記１３のいずれかに記載の電子装置。 The electronic device according to the present disclosure is not limited to the embodiments described above. The specific configuration of each part of the electronic device of the present disclosure can be modified in various ways. For example, the present disclosure includes the embodiments described in the appendix below.
Additional note 1.
a first electronic component having a functional section;
a mounting section on which the first electronic component is mounted;
a bonding material for bonding the first electronic component and the mounting section;
Equipped with
The mounting portion has a back surface facing one side in the thickness direction of the first electronic component, and a first surface and a second surface facing the other side in the thickness direction and to which the first electronic component is bonded. , has
The second surface is located on the other side in the thickness direction than the first surface,
The first surface overlaps at least a portion of the outer periphery of the first electronic component when viewed in the thickness direction,
The second surface overlaps the functional section when viewed in the thickness direction of the electronic device.
Appendix 2.
The first electronic component has a rectangular shape when viewed in the thickness direction,
The electronic device according to supplementary note 1, wherein the second surface does not overlap any of the four corners of the first electronic component.
Appendix 3.
When viewed in the thickness direction, all of the second surface overlaps the first electronic component,
The electronic device according to appendix 1 or 2, wherein the first surface overlaps the entire outer periphery of the first electronic component when viewed in the thickness direction.
Appendix 4.
further comprising a second electronic component located on the other side with respect to the mounting portion in the thickness direction,
The electronic device according to appendix 1 or 2, wherein the second surface extends over the first electronic component and the second electronic component when viewed in the thickness direction.
Appendix 5.
The mounting portion includes a base and a protrusion protruding from the base to the other side in the thickness direction,
The base has the first surface,
The electronic device according to any one of Supplementary Notes 1 to 4, wherein the protruding portion has the second surface.
Appendix 6.
The mounting portion includes a base and a groove recessed from the base to one side in the thickness direction,
The groove portion has the first surface,
The electronic device according to any one of Supplementary Notes 1 to 4, wherein the base has a third surface that is higher than the first surface.
Appendix 7.
The electronic device according to appendix 6, wherein the groove portion has the second surface.
Appendix 8.
The second surface is located on one side of the third surface in the thickness direction,
The electronic device according to appendix 7, wherein a part of the first electronic component is accommodated in the groove.
Appendix 9.
The electronic device according to any one of attachments 1 to 8, wherein the functional unit is a power transistor.
Appendix 10.
The electronic device according to appendix 9, wherein the first electronic component includes a control section that controls the power transistor.
Appendix 11.
further comprising a resin member covering the first electronic component,
The electronic device according to any one of Supplementary notes 1 to 10, wherein the resin member covers a part of the mounting section.
Appendix 12.
The electronic device according to appendix 11, wherein the back surface is exposed from the resin member.
Appendix 13.
further comprising a lead electrically connected to the first electronic component,
The electronic device according to attachment 11 or attachment 12, wherein the lead includes a portion covered with the resin member and a portion exposed from the resin member.
Appendix 14.
The electronic device according to any one of Supplementary Notes 1 to 13, wherein the first electronic component and the mounting portion are electrically connected via the bonding material.
Ａ１～Ａ６，Ｂ１，Ｃ１，Ｃ２：電子装置
１Ａ，１Ｂ，１Ｃ，１Ｄ：電子部品
３：接合材　　　　４：導通部材
５：樹脂部材　　　　１０ａ：主面
１０ｂ：裏面　　　　１１：機能部
１２：制御部　　　　１９：外周
２１：第１リード　　　　２２：第２リード
２３：第３リード　　　　２４：リード
３０：フィレット部　　　　３１：第１接合部
３２：第２接合部　　　　４１：第１部材
４２：第２部材　　　　４３～４８：導通部材
４９：導電性接合材　　　　５１：樹脂主面
５２：樹脂裏面　　　　５３，５４：樹脂側面
５５：開口　　　　５６：取付孔
７１，７２：入力端子　　　　７３：出力端子
１１０：半導体層　　　　１１１：第１電極
１１２：第２電極　　　　１１３：第３電極
１１４，１１５，１２１：電極　　　　２１０ａ：第１面
２１０ｂ：第２面　　　　２１０ｃ：第３面
２１０ｄ：裏面　　　　２１１：搭載部
２１１Ａ：貫通孔　　　　２１２：端子部
２２１：パッド部　　　　２２２：端子部
２３１：パッド部　　　　２３２：端子部
２４１：パッド部　　　　２４２：端子部
６１１，６１２：支持基板　　　　６２０ａ：第１面
６２０ｂ：第２面　　　　６２０ｄ：裏面
６２１，６２２：搭載部　　　　６３１，６３２：配線基板
７４１，７４２，７５１，７５２：信号端子　　　　２１１１：基部
２１１２：突出部　　　　２１１３：溝部
６２０１：基部　　　　６２０２：突出部
６２０３：溝部 A1 to A6, B1, C1, C2: Electronic devices 1A, 1B, 1C, 1D: Electronic component 3: Bonding material 4: Conductive member 5: Resin member 10a: Main surface 10b: Back surface 11: Functional section 12: Control section 19 : Outer circumference 21: First lead 22: Second lead 23: Third lead 24: Lead 30: Fillet part 31: First joint part 32: Second joint part 41: First member 42: Second member 43-48: Conductive member 49: Conductive bonding material 51: Resin main surface 52: Resin back surface 53, 54: Resin side surface 55: Opening 56: Mounting holes 71, 72: Input terminal 73: Output terminal 110: Semiconductor layer 111: First electrode 112 : Second electrode 113: Third electrode 114, 115, 121: Electrode 210a: First surface 210b: Second surface 210c: Third surface 210d: Back surface 211: Mounting section 211A: Through hole 212: Terminal section 221: Pad section 222: Terminal section 231: Pad section 232: Terminal section 241: Pad section 242: Terminal section 611, 612: Support board 620a: First surface 620b: Second surface 620d: Back surface 621, 622: Mounting section 631, 632: Wiring Substrate 741, 742, 751, 752: Signal terminal 2111: Base 2112: Projection 2113: Groove 6201: Base 6202: Projection 6203: Groove

Claims (14)

  1. 　機能部を有する第１電子部品と、
    　前記第１電子部品が搭載された搭載部と、
    　前記第１電子部品と前記搭載部とを接合する接合材と、
    を備え、
    　前記搭載部は、前記第１電子部品の厚さ方向の一方側を向く裏面と、前記厚さ方向の他方側を向き、かつ前記第１電子部品が接合された第１面および第２面と、を有し、
    　前記第２面は、前記第１面よりも前記厚さ方向の他方側に位置し、
    　前記第１面は、前記厚さ方向に見て、前記第１電子部品の外周の少なくとも一部に重なり、
    　前記第２面は、前記厚さ方向に見て、前記機能部に重なる、電子装置。     a first electronic component having a functional section;
    a mounting section on which the first electronic component is mounted;
    a bonding material for bonding the first electronic component and the mounting section;
    Equipped with
    The mounting portion has a back surface facing one side in the thickness direction of the first electronic component, and a first surface and a second surface facing the other side in the thickness direction and to which the first electronic component is bonded. , has
    The second surface is located on the other side in the thickness direction than the first surface,
    The first surface overlaps at least a portion of the outer periphery of the first electronic component when viewed in the thickness direction,
    The second surface overlaps the functional section when viewed in the thickness direction of the electronic device.
  2. 　前記第１電子部品は、前記厚さ方向に見て矩形状であり、
    　前記第２面は、前記第１電子部品の四隅のいずれにも重ならない、請求項１に記載の電子装置。     The first electronic component has a rectangular shape when viewed in the thickness direction,
    The electronic device according to claim 1, wherein the second surface does not overlap any of the four corners of the first electronic component.
  3. 　前記厚さ方向に見て、前記第２面の全ては、前記第１電子部品に重なり、
    　前記厚さ方向に見て、前記第１面は、前記第１電子部品の外周の全てに重なる、請求項１または請求項２に記載の電子装置。     When viewed in the thickness direction, all of the second surface overlaps the first electronic component,
    The electronic device according to claim 1 or 2, wherein the first surface overlaps the entire outer periphery of the first electronic component when viewed in the thickness direction.
  4. 　前記厚さ方向において、前記搭載部に対して他方側に位置する第２電子部品をさらに備え、
    　前記第２面は、前記厚さ方向に見て、前記第１電子部品および前記第２電子部品に跨る、請求項１または請求項２に記載の電子装置。     further comprising a second electronic component located on the other side with respect to the mounting portion in the thickness direction,
    The electronic device according to claim 1 or 2, wherein the second surface extends over the first electronic component and the second electronic component when viewed in the thickness direction.
  5. 　前記搭載部は、基部と、前記基部から前記厚さ方向の他方側に突き出た突出部とを含み、
    　前記基部は、前記第１面を有し、
    　前記突出部は、前記第２面を有する、請求項１ないし請求項４のいずれかに記載の電子装置。     The mounting portion includes a base and a protrusion protruding from the base to the other side in the thickness direction,
    The base has the first surface,
    The electronic device according to any one of claims 1 to 4, wherein the protrusion has the second surface.
  6. 　前記搭載部は、基部と、前記基部から前記厚さ方向の一方側に窪んだ溝部とを含み、
    　前記溝部は、前記第１面を有し、
    　前記基部は、前記第１面よりも高い第３面を有する、請求項１ないし請求項４のいずれかに記載の電子装置。     The mounting portion includes a base and a groove recessed from the base to one side in the thickness direction,
    The groove portion has the first surface,
    The electronic device according to any one of claims 1 to 4, wherein the base has a third surface that is higher than the first surface.
  7. 　前記溝部は、前記第２面を有する、請求項６に記載の電子装置。 The electronic device according to claim 6, wherein the groove portion has the second surface.
  8. 　前記第２面は、前記第３面よりも前記厚さ方向の一方側に位置し、
    　前記溝部には、前記第１電子部品の一部が収容される、請求項７に記載の電子装置。     The second surface is located on one side of the third surface in the thickness direction,
    The electronic device according to claim 7, wherein a part of the first electronic component is accommodated in the groove.
  9. 　前記機能部は、パワートランジスタである、請求項１ないし請求項８のいずれかに記載の電子装置。 The electronic device according to any one of claims 1 to 8, wherein the functional section is a power transistor.
  10. 　前記第１電子部品は、前記パワートランジスタを制御する制御部を有する、請求項９に記載の電子装置。 The electronic device according to claim 9, wherein the first electronic component includes a control section that controls the power transistor.
  11. 　前記第１電子部品を覆う樹脂部材をさらに備え、
    　前記樹脂部材は、前記搭載部の一部を覆う、請求項１ないし請求項１０のいずれかに記載の電子装置。     further comprising a resin member covering the first electronic component,
    The electronic device according to any one of claims 1 to 10, wherein the resin member covers a part of the mounting section.
  12. 　前記裏面は、前記樹脂部材から露出する、請求項１１に記載の電子装置。 The electronic device according to claim 11, wherein the back surface is exposed from the resin member.
  13. 　前記第１電子部品に導通するリードをさらに備え、
    　前記リードは、前記樹脂部材に覆われた部位と前記樹脂部材から露出する部位とを含む、請求項１１または請求項１２に記載の電子装置。     further comprising a lead electrically connected to the first electronic component,
    13. The electronic device according to claim 11, wherein the lead includes a portion covered with the resin member and a portion exposed from the resin member.
  14. 　前記第１電子部品と前記搭載部とは、前記接合材を介して導通する、請求項１ないし請求項１３のいずれかに記載の電子装置。 The electronic device according to any one of claims 1 to 13, wherein the first electronic component and the mounting section are electrically connected via the bonding material.
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JP2021093473A (en) * 2019-12-12 2021-06-17 ローム株式会社 Semiconductor device and semiconductor device manufacturing method

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