JP6930189B2 - Module manufacturing method, solder, and module - Google Patents

Description

The present invention relates to a method of manufacturing a module, solder, and a module.

Conventionally, a module in which an insulating substrate and a heat sink are joined by solder is known (see, for example, Patent Documents 1-3).
Patent Document 1 Japanese Patent Application Laid-Open No. 2010-062203 Patent Document 2 Japanese Patent Application Laid-Open No. 2013-229363 Patent Document 3 Japanese Patent Application Laid-Open No. 2013-115297

However, in the conventional module, it is necessary to provide a jig for aligning the insulating substrate and the heat radiating plate.

In the first aspect of the present invention, a first solder having a plate portion including the first surface and the second surface and a first protrusion portion protruding from the plate portion to the first surface side is prepared, and the first solder is prepared. A module in which a first member to be joined including a recess for inserting a protrusion is provided on the first surface side, and the first solder and the first member to be joined are reflowed with the first protrusion inserted in the recess. Provide a manufacturing method.

The first solder may further have a second protrusion protruding from the plate portion toward the second surface side.

A second member to be joined, which is different from the first member to be joined, may be provided on the second surface side, and the second protrusion may be brought into contact with the end portion of the second member to be joined. The first solder and the second member to be joined may be reflowed with the second protrusion in contact with the end of the second member to be joined.

The first member to be joined may include a heat radiating plate to be joined to the first surface side. The second member to be joined may include a first circuit pattern that is joined to the second surface side.

In a plan view, the first protrusion and the second protrusion may be provided point-symmetrically with respect to the center of the plate portion of the first solder.

The first protrusion may have an opening angle of 45 degrees or more and 90 degrees or less with respect to the first surface.

The width of the recess may be 1.5 times or more and 2 times or less the thickness of the first solder.

A second solder having a plate portion including the third surface and the fourth surface and a third protrusion portion protruding from the plate portion to the third surface side may be prepared. A third member to be joined may be provided on the third surface side, including a recess for inserting the third protrusion. The second solder and the third member to be joined may be reflowed with the third protrusion inserted in the recess.

The second solder may further have a fourth protrusion protruding from the plate portion of the second solder to the fourth surface side.

The fourth protrusion may be brought into contact with the end of the fourth member to be joined, which is different from the third member to be joined. The second solder and the fourth member to be joined may be reflowed with the fourth protrusion in contact with the end of the fourth member to be joined.

The third member to be joined may include an insulating substrate to be joined to the third surface side. The fourth member to be joined may include a semiconductor element to be joined to the fourth surface side.

The third member to be joined may have a recess for inserting the third protrusion, and may further include a second circuit pattern provided between the third surface and the insulating substrate. The recess of the second circuit pattern may penetrate the second circuit pattern.

The ratio of the recess of the third member to be joined to the outer circumference of the third member to be joined may be larger than the ratio of the recess of the first member to be joined to the outer circumference of the first member to be joined.

A third having a plate portion including the fifth and sixth surfaces, a fifth protrusion protruding from the plate portion to the fifth surface side, and a sixth protrusion projecting from the plate portion to the sixth surface side. Solder may be prepared. A first element aligned with the first solder on the first member to be joined and a second element aligned with the third solder on the first member to be joined may be provided. On the side where the first element and the second element face each other, the first protrusion may face the sixth protrusion and the second protrusion may face the fifth protrusion.

In the second aspect of the present invention, there is provided a solder having a plate portion including the first surface and the second surface, and a first protrusion portion protruding from the plate portion toward the first surface side.

It may further have a second protruding portion protruding from the plate portion toward the second surface side.

The solder may have a plurality of first protrusions and a plurality of second protrusions. The first protrusion and the second protrusion may be arranged with the four corners of the plate portion interposed therebetween.

The solder may be provided in a plan view, and the first protrusion and the second protrusion may be provided point-symmetrically with respect to the center point of the plate portion.

In the third aspect of the present invention, a module is provided with a solder and a first member to be joined having a recess provided on the outer periphery of the solder, and the recess is provided so as to partially surround the outer periphery of the solder. offer.

The solder may include a first solder and a third solder. The module may include a first element joined by the first solder on the first member to be joined and a second element joined by the third solder on the first member to be joined. On the side where the first element and the second element face each other, the recess provided corresponding to the first element does not have to face the recess provided corresponding to the second element.

The outline of the above invention does not list all the features of the present invention. Sub-combinations of these feature groups can also be inventions.

An example of a plan view and a cross-sectional view of the solder 10 is shown. This is an example of a solder material 40 for forming the solder 10 according to FIG. 1. An example of a plan view and a cross-sectional view of the module 100 being assembled is shown. An example of the plan view and the cross-sectional view of the module 100 after the reflow is shown. It is a figure for demonstrating the protrusion 12 and the recess 21. An example of the configuration of the module 100 being assembled is shown. An example of the plan view and the cross-sectional view of the module 100 after the reflow is shown. An example of the arrangement method of the solder 10 and the solder 60 is shown. An example of the structure of the solder 10 is shown. It is a flowchart which shows an example of the manufacturing method of a module 100. An example of the positioning process of the module 500 according to the comparative example is shown.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the inventions that fall within the scope of the claims. Also, not all combinations of features described in the embodiments are essential to the means of solving the invention.

FIG. 1 shows an example of a plan view and a cross-sectional view of the solder 10. The plan view shows the solder 10 viewed from the positive side to the negative side in the Z-axis direction. The cross-sectional view shows a cross-sectional view taken along the line AA'of the plan view of the solder 10. The solder 10 includes a plate portion 11, a protrusion 12, and a protrusion 13.

The plate portion 11 is a member formed in a plane shape of the solder 10. The plate portion 11 includes a first surface and a second surface. In the present specification, the first surface side of the plate portion 11 is the negative side of the Z axis, and the second surface side of the plate portion 11 is the positive side of the Z axis. The plate portion 11 of this example is formed by processing a solder material. The shape of the plate portion 11 is square in a plan view, but may have other shapes such as a circle and a rectangle. The second surface may be a surface facing the first surface. Further, the first surface and the second surface may be parallel to each other.

The protruding portion 12 projects from the plate portion 11 toward the first surface side. The protrusion 12 is formed by bending the solder material to the negative side of the Z axis at the end of the plate 11. The protrusion 12 of this example has four protrusions of a protrusion 12a, a protrusion 12b, a protrusion 12c, and a protrusion 12d. The protrusions 12a to 12d are provided on each side of the plate 11 when the plate 11 has a quadrangular shape. The protrusions 12a to 12d are arranged clockwise on each side of the plate 11 in a plan view. The protrusion 12 is an example of the first protrusion.

The protruding portion 13 projects from the plate portion 11 to the second surface side. The protrusion 13 is formed by bending the solder material to the positive side of the Z axis at the end of the plate 11. The protrusion 13 of this example has four protrusions of a protrusion 13a, a protrusion 13b, a protrusion 13c, and a protrusion 13d. When the shape of the plate portion 11 is quadrangular, the protrusions 13a to 13d are provided on each side of the plate portion 11. The protrusions 13a to 13d are arranged clockwise on each side of the plate 11 in a plan view. The protrusions 13a to 13d of this example are provided on the same side of each of the protrusions 12a to 12d and the plate portion 11. The protrusion 13 is an example of the second protrusion. It is preferable that the lengths of the protrusions 12 and the protrusions 13 along the sides of the plate 11 are equal to each other. In particular, it is preferable that the length along the side of the plate portion 11 of the protrusions 12a to 12d and the length along the side of the plate portion 11 of the protrusions 13a to 13d are equal to each other. This eliminates the need to check the top, bottom, left, and right of the solder 10 during assembly. However, the lengths of the protrusions 12 and the protrusions 13 along the sides of the plate portion 11 may be different.

FIG. 2 is an example of a solder material 40 for forming the solder 10. The solder material 40 of this example is an example of a solder material for forming the solder 10 according to FIG. 1, but is not limited to this.

The solder material 40 is a flat plate made of the same material as the solder 10. The solder material 40 is formed by cutting a rolled plate (that is, a ribbon) into a predetermined shape and size by a mold. For example, the solder material 40 can be obtained by processing a rolled plate having a thickness of 50 to 1000 μm. The shape of the solder material 40 of this example is substantially quadrangular. The shape of the solder material 40 may be square or rectangular. The solder material 40 has a plurality of notches 41.

The notch 41 is a notch provided at the end of the solder material 40. It is preferable that the plurality of cut portions 41 are provided at the same positions with respect to each side of the solder material 40. The solder material 40 of this example has four notches 41a, a notch 41b, a notch 41c, and a notch 41d. The cut portion 41a to the cut portion 41d are provided at the center of each side of the solder material 40. However, the cut portion 41 may be provided at an arbitrary position on each side of the solder material 40. By providing the notch 41 in the solder material 40, the left and right sides of the notch 41 are folded in a mountain fold and a valley fold to form a protrusion.

The solder material 40 forms the solder 10 including the protrusion 12 and the protrusion 13 by bending the end portion of the solder material 40 toward the first surface side or the second surface side at the notch 41. In the solder material 40 of this example, by providing a notch 41 at the center of each side of the solder material 40, protrusions 12 and 13 having the same width are formed. For example, the protrusion 12a is formed by bending the end of the solder material 40 on the negative side of the X-axis of the notch 41a to the negative side of the Z-axis. Further, the protrusion 13a is formed by bending the end portion of the solder material 40 on the positive side of the X-axis of the cut portion 41a to the positive side of the Z-axis.

The four corners of the solder material 40 are cut out into squares. As a result, the solder material 40 can bend the end portion of the solder material 40 in a predetermined direction by using the cut portion 41. The squares cut out at the four corners of the solder material 40 preferably have sides having the same length as the depth of the cut portion 41.

FIG. 3A shows an example of a plan view and a cross-sectional view of the module 100 being assembled. The module 100 being assembled in this example includes a heat radiating plate 25, a solder 10, a circuit pattern 22, an insulating substrate 23, and a circuit pattern 24 in this order. In the plan view of the module 100, the circuit pattern 22, the insulating substrate 23, and the circuit pattern 24 are omitted for the sake of brevity.

The heat radiating plate 25 is connected to the insulating substrate 23 via the solder 10, and dissipates heat generated by the semiconductor elements laminated on the insulating substrate 23. The heat radiating plate 25 of this example is provided on the first surface side of the plate portion 11. The heat radiating plate 25 has a recess 21 for inserting the protrusion 12. The heat radiating plate 25 is an example of a first member to be joined including a recess for inserting the protrusion 12.

The protrusion 12 is inserted into the recess 21, and the solder 10 before reflow is fixed at a predetermined position. The recess 21 is provided on the outer circumference of the solder 10. The recess 21 of this example is provided so as to partially surround the outer circumference of the solder 10. Further, the recess 21 has a width and a depth corresponding to the shape of the protrusion 12. A protrusion 12c is inserted into the recess 21 of this example. The module 100 is reflowed with the protrusion 12 inserted in the recess 21. By reflowing the solder 10 and the heat radiating plate 25, the insulating substrate 23 and the heat radiating plate 25 are fixed at predetermined positions.

The circuit pattern 22 is connected to the lower surface side of the insulating substrate 23. In the present specification, the lower surface side refers to the negative side of the Z axis. The circuit pattern 22 is joined to the solder 10. In particular, the circuit pattern 22 is joined to the plate portion 11 of the solder 10 on the lower surface side of the circuit pattern 22. The protrusion 13 is in contact with the end of the circuit pattern 22. Further, the solder 10 and the circuit pattern 22 are reflowed in a state where the protrusion 13 is in contact with the end of the circuit pattern 22. In this way, the protrusion 13 fixes the position of the component before the solder melts. The circuit pattern 22 is an example of the first circuit pattern, and is an example of the second member to be joined to be joined to the solder 10.

FIG. 3B shows an example of a plan view and a cross-sectional view of the module 100 after reflow. The melted and solidified solder 10 forms fillets around the circuit pattern 22. In the module 100 after reflow, the parts corresponding to the protrusions 12 and 13 before reflow are shown by the same reference numerals, but the shape of the solder 10 after reflow depends on the solder material, the conditions of reflow, and the like. Can change. However, the protrusion 12 of this example is held inside or near the recess 21 before and after the reflow. Further, the protrusion 13 of this example is in contact with the side wall of the circuit pattern 22 before and after the reflow. The reflow may melt the solder 10 and wet and spread on the surface of the circuit pattern 22. Further, the molten solder 10 may wet and spread on all sides of the circuit pattern 22.

The insulating substrate 23 is an insulating substrate bonded to the circuit pattern 22. The insulating substrate 23 is provided to insulate the semiconductor elements laminated on the upper surface side of the insulating substrate 23. In the present specification, the upper surface side refers to the positive side of the Z axis.

The circuit pattern 24 is joined to the upper surface side of the insulating substrate 23. The circuit pattern 24 may be joined to the upper surface of the insulating substrate 23 by soldering. The circuit pattern 24 may be electrically connected to the semiconductor element.

Here, the protrusion 12 and the protrusion 13 are provided point-symmetrically with respect to the center of the plate 11 in a plan view. For example, the protrusion 12a and the protrusion 13a are provided point-symmetrically with the protrusion 12c and the protrusion 13c. Further, the protrusion 12b and the protrusion 13b are provided point-symmetrically with the protrusion 12d and the protrusion 13d. The protrusions 12 and 13 are provided point-symmetrically to prevent the center of the solder 10 from shifting before and after the reflow. For example, even when a rotational stress is generated in the solder 10 during reflow, the solder 10 is provided point-symmetrically, so that the center can be easily held. As described above, the protrusions 12 and 13 have a flow prevention action and a rotation prevention action of the parts, and prevent the parts from being displaced.

The solder 10 of this example has a plurality of protrusions 12 and a plurality of protrusions 13. The protrusions 12 and the protrusions 13 are arranged so as to sandwich the four corners of the plate portion 11, respectively. That is, if the protrusion 12 and the protrusion 13 are point-symmetric with respect to the center of the plate portion 11, they do not need to be line-symmetric with respect to the plate portion 11.

As described above, the module 100 realizes the alignment between the heat radiating plate 25 and the insulating substrate 23 by providing the heat radiating plate 25 with the recess 21 corresponding to the protrusion 12. As a result, the module 100 realizes the alignment of the solder 10 without using the alignment jig. Therefore, the module 100 of this example can be assembled using the same process as the reflow process using the alignment jig.

In this way, the module 100 is positioned for each model without changing the process at the time of assembly, even when the solder 10 is prepared for each size of the component (that is, the semiconductor element or the insulating substrate). There is no need to prepare jigs and tools. Therefore, a huge investment is not required to prepare the positioning jig and tool.

FIG. 4 is a diagram for explaining the protrusion 12 and the recess 21. The protrusion 12 is formed at a predetermined opening angle θ.

The opening angle θ is an angle between the first surface of the plate portion 11 and the direction in which the protrusion 12 extends. That is, the opening angle θ corresponds to the bending angle when the protrusion 12 is bent and formed. In one example, the protrusion 12 has an opening angle θ greater than 0 degrees and 90 degrees or less. Further, the protrusion 12 preferably has an opening angle θ of 45 degrees or more and 90 degrees or less. The protrusion 12 of this example has an opening angle θ of 90 degrees. The opening angle θ may be any angle at which the solder 10 can be aligned according to the width of the protrusion 12 and the size of the recess 21. In this example, the opening angle θ of the protrusion 12 has been described, but the same may apply to the opening angle θ of the protrusion 13.

The folded-back dimension L refers to the distance between the first surface of the plate portion 11 and the tip of the protrusion of the protrusion 12. The folded-back dimension L is set to a length such that the solder 10 and the heat radiating plate 25 are aligned at the time of reflow by inserting the protrusion 12 into the recess 21. In one example, the folded-back dimension L is 1.0 times or more and 1.5 times or less the thickness D of the plate portion 11. Further, in this example, the folded-back dimension L of the protruding portion 12 has been described, but the same may be applied to the folded-back dimension L of the protruding portion 13.

The recess 21 has a predetermined width W and depth H. The width of the recess 21 is set to a size that allows the protrusion 12 to be inserted. Further, the width of the recess 21 is preferably set to be larger than the thickness of the protrusion 12 in order to facilitate the alignment of the solder 10. In one example, the width W of the recess 21 is 1.5 times or more and 2 times or less the thickness of the solder 10. In the present specification, the thickness of the solder 10 corresponds to the thickness of the plate portion 11. In this example, since the protrusion 12 is formed by bending the solder material 40, the thickness of the plate portion 11 is equal to the thickness of the protrusion 12.

The depth H of the recess 21 is set according to the shape of the protrusion 12. In one example, the depth H of the recess 21 is 1.0 times or more the folded-back dimension L of the solder 10. More preferably, the depth H of the recess 21 is 1.5 times or more and 2.0 times or less the folded-back dimension L of the solder 10. By making the depth H of the recess 21 larger than the folded-back dimension L of the solder 10, a space is created in which a part of the molten solder 10 flows into the recess 21.

FIG. 5A shows an example of the configuration of the module 100 being assembled. The module 100 being assembled in this example includes a heat sink 25, a solder 10, a circuit pattern 22, an insulating substrate 23, a circuit pattern 24, a solder 50, and an element 30 in this order. The solder 50 is provided on the upper surface side of the insulating substrate 23.

The solder 50 joins the element 30 and the insulating substrate 23. The solder 50 includes a plate portion 51, a protrusion 52, and a protrusion 53. The solder 50 may have the same shape as the solder 10, and the plate portion 51, the protrusion 52, and the protrusion 53 correspond to the plate 11, the protrusion 12, and the protrusion 13, respectively. The solder 10 connects the insulating substrate 23 and the heat radiating plate 25, whereas the solder 50 connects the element 30 and the insulating substrate 23.

The plate portion 51 is a member formed in a plane shape of the solder 50. The plate portion 51 includes a third surface and a fourth surface. In the present specification, the third surface side of the plate portion 51 is the negative side of the Z axis, and the fourth surface side of the plate portion 51 is the positive side of the Z axis. The plate portion 51 of this example is formed by processing a solder material. The shape of the plate portion 51 is square in a plan view, but may have other shapes such as a circle and a rectangle. The fourth surface may be a surface facing the third surface. Further, the third surface and the fourth surface may be parallel to each other.

The protrusion 52 projects from the plate 51 toward the third surface. The protrusion 52 is formed by bending the solder material to the negative side of the Z axis at the end of the plate 51. The protrusion 52 of this example has four protrusions, a protrusion 52a, a protrusion 52b, a protrusion 52c, and a protrusion 52d. The protrusions 52a to 52d are provided on each side of the plate 51 when the plate 51 has a quadrangular shape. The protrusions 52a to 52d are arranged clockwise on each side of the plate 51 in a plan view. The protrusion 52 is an example of the third protrusion.

The protruding portion 53 protrudes from the plate portion 51 toward the fourth surface side. The protrusion 53 is formed by bending the solder material to the positive side of the Z axis at the end of the plate 51. The protrusion 53 of this example has four protrusions of a protrusion 53a, a protrusion 53b, a protrusion 53c, and a protrusion 53d. The protrusions 53a to 53d are provided on each side of the plate 51 when the plate 51 has a quadrangular shape. The protrusions 53a to 53d are arranged clockwise on each side of the plate 51 in a plan view. The protrusions 53a to 53d of this example are provided on the same side of the plate 51 as each of the protrusions 52a to 52d. The protrusion 53 is an example of the fourth protrusion.

The insulating substrate 23 includes a recess 26 for inserting the protrusion 52. The insulating substrate 23 is provided on the lower surface side of the solder 50.

The protrusion 52 is inserted into the recess 26, and the solder 50 before reflow is fixed at a predetermined position. The recess 26 is provided on the outer circumference of the solder 50. The recess 26 of this example is provided so as to partially surround the outer circumference of the solder 50. Further, the recess 26 has a width and a depth corresponding to the shape of the protrusion 52. The module 100 is reflowed with the protrusion 52 inserted in the recess 26. By reflowing the solder 50 and the insulating substrate 23, the insulating substrate 23 and the element 30 are fixed at predetermined positions.

The element 30 is provided on the fourth surface side of the solder 50. The element 30 is an example of the fourth member to be joined. In one example, the element 30 is a semiconductor element such as an IGBT.

The circuit pattern 24 is provided between the solder 50 and the insulating substrate 23. In the circuit pattern 24 of this example, the upper surface side is in contact with the plate portion 51, and the lower surface side is in contact with the insulating substrate 23. Further, the protrusion 52 is in contact with the end of the circuit pattern 24. The solder 50 and the circuit pattern 24 are reflowed with the protrusion 52 in contact with the end of the circuit pattern 24. In this way, the protrusion 52 fixes the position of the component before the solder melts. Further, the circuit pattern 24 may have a recess for inserting the protrusion 52 and may be provided between the third surface of the solder 50 and the insulating substrate 23. Then, the recess of the circuit pattern 24 may penetrate the circuit pattern 24. In this case, the protrusion 52 may penetrate the recess of the circuit pattern 24 and be inserted into the recess 26 of the insulating substrate 23. Since the protrusion 52 penetrates the recess of the circuit pattern 24, the solder 50 before the reflow can easily fix the circuit pattern 24.

Here, the arrangement pattern of the recesses 26 formed on the insulating substrate 23 and the arrangement pattern of the recesses 21 formed on the heat radiating plate 25 may be the same or different. In one example, the ratio of the recess 26 of the insulating substrate 23 to the outer circumference of the insulating substrate 23 is larger than the ratio of the recess 21 of the heat radiating plate 25 to the outer circumference of the heat radiating plate 25. Further, the ratio of the recess 26 of the insulating substrate 23 to the outer circumference of the insulating substrate 23 may be smaller than the ratio of the recess 21 of the heat radiating plate 25 to the outer circumference of the heat radiating plate 25.

The module 100 is reflowed with the protrusion 52 inserted in the recess 26. Here, the reflow of the solder 50 may be executed at the same time as the reflow of the solder 10, or may be executed separately. By reflowing the solder 50 and the insulating substrate 23, the element 30 and the insulating substrate 23 are fixed at predetermined positions via the solder 50.

The protrusion 53 is in contact with the end of the element 30. The module 100 is reflowed with the protrusion 53 in contact with the end of the element 30. By reflowing the solder 50 and the element 30, the element 30, the insulating substrate 23, and the circuit pattern 24 are fixed at predetermined positions.

FIG. 5B shows an example of a plan view and a cross-sectional view of the module 100 after reflow. The melted and solidified solder 10 and solder 50 form fillets around the circuit pattern 22 and the element 30, respectively. In the module 100 after the reflow, the parts corresponding to the protrusions 12, the protrusions 13, the protrusions 52 and the protrusions 53 before the reflow are shown by the same reference numerals, but depending on the solder material, the conditions of the reflow, and the like. The shapes of the solder 10 and the solder 50 after the reflow can change. However, the protrusion 12 of this example is held inside or near the recess 21 before and after the reflow. Further, the protrusion 13 of this example is in contact with the side wall of the circuit pattern 22 before and after the reflow. Then, the protrusion 52 comes into contact with the side wall of the circuit pattern 24 before the reflow, is held inside the recess 26 and in the vicinity thereof, and crawls up on the circuit pattern 24 after the reflow. The molten solder may or may not remain in the recess 26. Further, the protrusion 53 of this example comes into contact with the side wall of the element 30 before the reflow, and after the reflow, wets and spreads on the circuit pattern 24.

FIG. 6 shows an example of an arrangement method of the solder 10 and the solder 60. In this example, two solders, a solder 10 and a solder 60, are provided. The solder 10 is an example of the first solder, and the solder 60 is an example of the third solder. The solder 10 and the solder 60 are provided on a common heat dissipation plate 25.

The solder 60 includes a plate portion 61, a protrusion 62, and a protrusion 63. The solder 60 may have the same shape as the solder 10, and the plate portion 61, the protrusion 62, and the protrusion 63 correspond to the plate portion 11, the protrusion 12, and the protrusion 13, respectively.

On the solder 10, a first element composed of an insulating substrate 23 and an element 30 as shown in FIGS. 5A and 5B is formed. As a result, the first element is joined to the heat radiating plate 25 via the solder 10. The first element is aligned with the solder 10. In FIG. 6, the first element is omitted for the sake of brevity.

On the solder 60, a second element composed of the insulating substrate 23 and the element 30 as shown in FIGS. 5A and 5B is formed. As a result, the second element is joined to the heat radiating plate 25 via the solder 60. The second element is aligned with the solder 60. In FIG. 6, the second element is omitted for the sake of brevity.

The plate portion 61 is a member formed in a plane shape of the solder 60. The plate portion 61 includes a fifth surface and a sixth surface. In the present specification, the fifth surface side of the plate portion 61 is the negative side of the Z axis, and the sixth surface side of the plate portion 61 is the positive side of the Z axis. The plate portion 61 of this example is formed by processing a solder material. The shape of the plate portion 61 is square in a plan view, but may have other shapes such as a circle and a rectangle. The sixth surface may be a surface facing the fifth surface. Further, the fifth surface and the sixth surface may be parallel to each other.

The protrusion 62 projects from the plate 61 toward the fifth surface. The protrusion 62 is formed by bending the solder material to the negative side of the Z axis at the end of the plate 61. The protrusion 62 of this example has four protrusions of a protrusion 62a, a protrusion 62b, a protrusion 62c, and a protrusion 62d. The protrusions 62a to 62d are provided on each side of the plate 61 when the plate 61 has a quadrangular shape. The protrusions 62a to 62d are arranged clockwise on each side of the plate 61 in a plan view. The protrusion 62 is an example of the fifth protrusion.

The protrusion 63 projects from the plate 61 toward the sixth surface. The protrusion 63 is formed by bending the solder material to the positive side of the Z axis at the end of the plate 61. The protrusion 63 of this example has four protrusions of a protrusion 63a, a protrusion 63b, a protrusion 63c, and a protrusion 63d. The protrusions 63a to 63d are provided on each side of the plate 61 when the plate 61 has a quadrangular shape. The protrusions 63a to 63d are arranged clockwise on each side of the plate 61 in a plan view. The protrusions 63a to 63d of this example are provided on the same side of the plate 61 as each of the protrusions 62a to 62d. The protrusion 63 is an example of the sixth protrusion.

In this example, on the side where the first element and the second element face each other, the protrusion 12 faces the protrusion 63, and the protrusion 13 faces the protrusion 62. For example, the protrusion 12c faces the protrusion 63a, and the protrusion 13c faces the protrusion 62a. That is, the recess 21 provided corresponding to the first element does not face the recess 21 provided corresponding to the second element. By alternately arranging the recesses 21 on the solder 10 side and the recesses 21 on the solder 60 side in this way, contact between the solder 10 melted during reflow and the solder 60 is prevented. Therefore, the molten solder 10 and the solder 60 come into contact with each other, and the position of the element is less likely to shift due to the one solder being sucked by the other solder.

FIG. 7 shows an example of the configuration of the solder 10. The solder 10 of this example has protrusions whose protrusions are formed at different positions from those of the solder 10 of FIG. The solder 10 of this example has a plate portion 11, a protrusion 12, and a protrusion 13.

The protrusion 12 includes eight protrusions 12a to 12h. The protrusions 12a to 12h are provided at both ends of each side of the plate 11. For example, protrusions 12a and 12b are provided at both ends of the positive side of the plate 11 in the Y-axis direction. Protrusions 12c and 12d are provided at both ends of the positive side of the plate 11 in the X-axis direction. Protrusions 12e and 12f are provided at both ends of the negative side of the plate 11 in the Y-axis direction. Protrusions 12g and protrusions 12h are provided at both ends of the negative side of the plate 11 in the X-axis direction.

The protrusion 13 includes four protrusions 13a to 13d. The protrusions 13a to 13d are provided at the center of each side of the plate 11. Both ends of the protrusions 13a to 13d are sandwiched between the protrusions 12a to 12h. For example, both ends of the protrusion 13a are sandwiched between the protrusion 12a and the protrusion 12b. Both ends of the protrusion 13b are sandwiched between the protrusion 12c and the protrusion 12d. Both ends of the protrusion 13c are sandwiched between the protrusion 12e and the protrusion 12f. Both ends of the protrusion 13d are sandwiched between the protrusion 12g and the protrusion 12h.

The protrusions 12 and 13 of this example are provided point-symmetrically with respect to the center of the plate 11 in a plan view. Further, the protrusions 12 and 13 of this example are provided line-symmetrically with respect to the X-axis and the Y-axis. Since the solder 10 of this example has a highly symmetric shape, the solder material tends to melt uniformly during reflow, and stability can be improved.

Here, the shape of the solder 10 may be appropriately selected from the viewpoint of ease of processing of the solder 10, the viewpoint of positioning the solder 10 and the recess 21, and the like. For example, from the viewpoint of ease of processing of the solder 10, it is preferable that the number of cut portions 41 provided in the solder material 40 is small. Further, it is preferable that the number of protrusions 12 and 13 is small. As a result, the number of the protrusions 12 and 13 to be bent is reduced. On the other hand, from the viewpoint of aligning the solder 10 and the recess 21, it is preferable that the protrusion 12 and the protrusion 13 have high symmetry. Further, it is preferable that the protrusion 12 and the protrusion 13 have a shape and arrangement that can be easily inserted into the recess 21.

FIG. 8 is a flowchart showing an example of a manufacturing method of the module 100. In step S100, a solder 10 having a plate portion 11 including the first surface and the second surface and a protrusion portion 12 protruding from the plate portion 11 to the first surface side is prepared. In step S100, the protrusion 13 may be formed on the solder 10. Further, in step S100, a solder 50 having a plate portion 51 including the third surface and the fourth surface and a protrusion 52 protruding from the plate portion 51 toward the third surface may be prepared.

In step S102, a member to be joined (for example, a heat radiating plate 25) including a recess 21 for inserting the protrusion 12 is provided on the first surface side of the solder 10. Further, in step S102, a member to be joined (for example, a circuit pattern 22) different from the heat radiating plate 25 may be provided on the second surface side. In this case, the protrusion 13 is brought into contact with the end of the circuit pattern 22. Then, in step S102, a member to be joined (for example, the insulating substrate 23) including the recess 26 for inserting the protrusion 52 may be provided on the third surface side of the solder 50.

In step S104, the solder 10 and the heat radiating plate 25 are reflowed with the protrusion 12 inserted in the recess 21 of the heat radiating plate 25. Further, in step S104, the solder 50 and the insulating substrate 23 may be reflowed at the same time as the solder 10 with the protrusions 52 inserted in the recesses 26 of the insulating substrate 23.

FIG. 9 shows an example of the positioning process of the module 500 according to the comparative example. The module 500 is joined by a reflow process in which each member of the module 500 is brought into contact with the heat radiating plate 525 using the positioning jig 550. The module 500 includes a solder 510 laminated on the heat radiating plate 525, a circuit pattern 522, an insulating substrate 523, a circuit pattern 524, a solder 515, and an element 530.

The module 500 requires a positioning jig 550 to prevent leakage and flow of parts due to solder melting. Here, the positioning jig 550 needs to be prepared for at least the number of batches at the time of reflow for each model of the module 500. Therefore, in mass production with a wide variety of products, a huge investment is required to prepare the positioning jig 550. Further, the attachment / detachment of the positioning jig 550 may cause damage to the positioning jig 550 or damage to the module 500.

On the other hand, in the method of manufacturing the module 100 using the solder 10 of this example, it is not necessary to use a positioning jig because of the self-alignment function of the solder 10. Further, in the manufacturing method of the module 100 of this example, if the solder 10 is prepared for each model of the insulating substrate 23 and the element 30, it is not necessary to change the process at the time of assembly. As described above, in the manufacturing method of the module 100 of this example, a huge cost for the positioning jig and tool can be reduced.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that such modified or improved forms may also be included in the technical scope of the present invention.

The order of execution of operations, procedures, steps, steps, etc. in the devices, systems, programs, and methods shown in the claims, specification, and drawings is particularly "before" and "prior to". It should be noted that it can be realized in any order unless the output of the previous process is used in the subsequent process. Even if the scope of claims, the specification, and the operation flow in the drawings are explained using "first", "next", etc. for convenience, it means that it is essential to carry out in this order. It's not a thing.

10 ... Solder, 11 ... Plate part, 12 ... Projection part, 13 ... Projection part, 21 ... Recession, 22 ... Circuit pattern, 23 ... Insulation substrate, 24 ... -Circuit pattern, 25 ... heat dissipation plate, 26 ... recess, 30 ... element, 40 ... solder material, 41 ... notch, 50 ... solder, 51 ... plate , 52 ... protrusion, 53 ... protrusion, 60 ... solder, 61 ... plate part, 62 ... protrusion, 63 ... protrusion, 100 ... module, 500 ... Module, 510 ... Solder, 515 ... Solder, 522 ... Circuit pattern, 523 ... Insulated substrate, 524 ... Circuit pattern, 525 ... Heat dissipation plate, 530 ... Element, 550 ... Positioning Jig Tool

Claims (15)

A plate portion including the first surface and the second surface, a plurality of first protrusions protruding from the plate portion toward the first surface side, and a plurality of second protrusions protruding from the plate portion toward the second surface side. Prepare the first solder with the part and
A first member to be joined including a recess for inserting the first protrusion is provided on the first surface side.
With the first protrusion inserted in the recess, the first solder and the first member to be joined are reflowed .
Wherein the first protrusion and the second protrusion, the production method of each of the plate portions at four corners that are arranged across the module. It has a plate portion including the first surface and the second surface, a first projection portion protruding from the plate portion toward the first surface side, and a second projection portion protruding from the plate portion toward the second surface side. Prepare the first solder,
A first member to be joined including a recess for inserting the first protrusion is provided on the first surface side.
With the first protrusion inserted in the recess, the first solder and the first member to be joined are reflowed.
A second member to be joined, which is different from the first member to be joined, is provided on the second surface side.
The second protrusion is brought into contact with the end of the second member to be joined.
The first solder and the second member to be joined are reflowed in a state where the second protrusion is in contact with the end portion of the second member to be joined.
Module method of manufacturing. The first member to be joined includes a heat radiating plate to be joined to the first surface side.
The second bonding member, a manufacturing method of a module according to claim 2 comprising a first circuit pattern is bonded to the second surface side. The module according to any one of claims 1 to 3 , wherein the first protrusion and the second protrusion are provided point-symmetrically with respect to the center of the plate portion of the first solder in a plan view. Production method. The method for manufacturing a module according to any one of claims 1 to 4 , wherein the first protrusion has an opening angle of 45 degrees or more and 90 degrees or less with respect to the first surface. The method for manufacturing a module according to any one of claims 1 to 5 , wherein the width of the recess is 1.5 times or more and 2 times or less the thickness of the first solder. A first solder having a plate portion including the first surface and the second surface and a first protrusion portion protruding from the plate portion to the first surface side is prepared.
A first member to be joined including a recess for inserting the first protrusion is provided on the first surface side.
With the first protrusion inserted in the recess, the first solder and the first member to be joined are reflowed.
A second solder having a plate portion including the third surface and the fourth surface and a third protrusion portion protruding from the plate portion to the third surface side is prepared.
A third member to be joined including a recess for inserting the third protrusion is provided on the third surface side.
With the third protrusion inserted in the recess, the second solder and the third member to be joined are reflowed.
Module method of manufacturing. The method for manufacturing a module according to claim 7 , wherein the second solder further has a fourth protrusion protruding from the plate portion of the second solder to the fourth surface side. The fourth protrusion is brought into contact with the end of the fourth member to be joined, which is different from the third member to be joined.
The method for manufacturing a module according to claim 8 , wherein the second solder and the fourth member to be joined are reflowed in a state where the fourth protrusion is in contact with the end portion of the fourth member to be joined. The third member to be joined includes an insulating substrate to be joined to the third surface side.
The method for manufacturing a module according to claim 9 , wherein the fourth member to be joined includes a semiconductor element bonded to the fourth surface side. The third member to be joined has a recess for inserting the third protrusion, and further includes a second circuit pattern provided between the third surface and the insulating substrate.
The method for manufacturing a module according to claim 10 , wherein the recess of the second circuit pattern penetrates the second circuit pattern. The third ratio with respect to the outer peripheral of the third members to be joined of said recess having the workpieces, the first said recess of said first greater claim than the ratio for the outer periphery of the bonded members 11 having the bonded members The method for manufacturing a module described in. It has a plate portion including the first surface and the second surface, a first projection portion protruding from the plate portion toward the first surface side, and a second projection portion protruding from the plate portion toward the second surface side. Prepare the first solder,
A first member to be joined including a recess for inserting the first protrusion is provided on the first surface side.
With the first protrusion inserted in the recess, the first solder and the first member to be joined are reflowed.
It has a plate portion including the fifth surface and the sixth surface, a fifth protrusion protruding from the plate portion toward the fifth surface side, and a sixth protrusion protruding from the plate portion toward the sixth surface side. Prepare the third solder,
A first element aligned with the first solder on the first member to be joined and a second element aligned with the third solder on the first member to be joined are provided.
On the side where the first element and the second element face each other, the first protrusion faces the sixth protrusion, and the second protrusion faces the fifth protrusion.
Module method of manufacturing. A plate portion including the first surface and the second surface, a plurality of first protrusions protruding from the plate portion toward the first surface side, and a plurality of second protrusions protruding from the plate portion toward the second surface side. have a part and,
Solder the first protrusion and the second protrusion, that is arranged across the four corners of the plate portion. The solder according to claim 14 , wherein the first protrusion and the second protrusion are provided point-symmetrically with respect to the center point of the plate in a plan view.

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