JP2006179523A - High-frequency module - Google Patents

High-frequency module Download PDF

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Publication number
JP2006179523A
JP2006179523A JP2004368188A JP2004368188A JP2006179523A JP 2006179523 A JP2006179523 A JP 2006179523A JP 2004368188 A JP2004368188 A JP 2004368188A JP 2004368188 A JP2004368188 A JP 2004368188A JP 2006179523 A JP2006179523 A JP 2006179523A
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Prior art keywords
circuit board
frequency module
cover
recess
land portion
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JP2004368188A
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Japanese (ja)
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Shuichi Takeda
秀一 武田
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Priority to JP2004368188A priority Critical patent/JP2006179523A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-frequency module wherein soldering performance againt a cover is superior and which is compact and highly reliable of connection to a mother board. <P>SOLUTION: The high-frequency module is provided with a wiring pattern 3 wherein a circuit board 1 comprised of multilayer boards connected with an electronic part 5, a plurality of bottom recesses 1c formed on the circuit board 1 and a cover 7 fitted onto the circuit board 1. The cover 7 is provided with a fitting part 7d which is bent from the lower side of a side plate 7b so that it may be parallel to an upper plate 7a and a project 7c projecting downward from the side plate 7b. Since the fitting part 7d is soldered to a land 2b formed on the upper surface 1a of the circuit board 1 or the bottom surface of the recess 1c while the project 7c is positioned within the recess 1c, a solder to fit the fitting part 7d in the cover 7 is prevented from flowing to the lower side of the circuit board 1, and soldering performance of the fitting part 7d becomes high and the flatness of the circuit board 1 against a mother board 8 is improved, thus ensuring soldering. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は電圧制御発振器等に使用して好適な高周波モジュールに関する。   The present invention relates to a high frequency module suitable for use in a voltage controlled oscillator or the like.

従来の高周波モジュールの図面を説明すると、図９は従来の高周波モジュールの斜視図、図１０は従来の高周波モジュールに係る回路基板の斜視図、図１１は従来の高周波モジュールに係り、回路基板の製造方法を示す説明図である。   FIG. 9 is a perspective view of a conventional high-frequency module, FIG. 10 is a perspective view of a circuit board according to the conventional high-frequency module, and FIG. 11 relates to the conventional high-frequency module. It is explanatory drawing which shows a method.

次に、従来の高周波モジュールの構成を図９，図１０に基づいて説明すると、多層基板からなる四角形状の回路基板５１は、上面５１ａから下面５１ｂにわたって貫通した状態で、角部に設けられた切り欠きによって形成された第１の凹部５１ｃ、及び、側面５１ｄに設けられた切り欠きによって形成された第２の凹部５１ｅを有する。   Next, the configuration of a conventional high-frequency module will be described with reference to FIGS. 9 and 10. A rectangular circuit board 51 made of a multilayer board is provided at a corner in a state of penetrating from the upper surface 51a to the lower surface 51b. It has the 1st recessed part 51c formed by the notch, and the 2nd recessed part 51e formed by the notch provided in the side surface 51d.

この第１の凹部５１ｃの内壁には、サイド電極部である第１の電極部５２が設けられると共に、第２の凹部５１ｅの内壁には、第２の電極部５３が設けられている。
そして、ここでは図示しないが、回路基板５１の上面５１ａには、配線パターンが設けられており、この配線パターンが第１，第２の電極部５２，５３に接続されると共に、配線パターン上には、種々の電子部品が搭載されて、所望の電気回路が形成されている。 A first electrode portion 52 as a side electrode portion is provided on the inner wall of the first recess 51c, and a second electrode portion 53 is provided on the inner wall of the second recess 51e.
Although not shown here, a wiring pattern is provided on the upper surface 51a of the circuit board 51, and this wiring pattern is connected to the first and second electrode portions 52 and 53, and on the wiring pattern. A variety of electronic components are mounted to form a desired electrical circuit.

金属板から成る箱形のカバー５４は、上面板５４ａと、この上面板５４ａの４辺から下方に折り曲げられた４つの側面板５４ｂと、側面板５４ｂから下方に延びる４つの取付脚５４ｃを有する。   The box-shaped cover 54 made of a metal plate has a top plate 54a, four side plates 54b bent downward from four sides of the top plate 54a, and four mounting legs 54c extending downward from the side plates 54b. .

このカバー５４は、回路基板５１の上面５１ａ（電子部品）を覆った状態で、取付脚５４ｃを第２の凹部５１ｅ内に挿入すると共に、側面板５４ｂの下端を上面５１ａに当接させ、取付脚５４ｃと第２の電極部５３を半田付けして、カバー５４が回路基板５１に取り付けられる。（特許文献１参照）   The cover 54 covers the upper surface 51a (electronic component) of the circuit board 51, inserts the mounting leg 54c into the second recess 51e, and abuts the lower end of the side plate 54b against the upper surface 51a. The cover 54 is attached to the circuit board 51 by soldering the leg 54 c and the second electrode portion 53. (See Patent Document 1)

この時、第２の凹部５１ｅが上下に貫通した状態で設けられているため、取付脚５４ｃと第２の電極部５３を接続する半田は、回路基板５１の下面５１ｂから下方に垂れて、半田が下面５１ｂから下方に突出した状態となると共に、取付脚５４ｃと第２の電極５３との間の半田付性が悪くなる。   At this time, since the second recess 51e is provided so as to penetrate vertically, the solder connecting the mounting leg 54c and the second electrode portion 53 hangs down from the lower surface 51b of the circuit board 51, and the solder Protrudes downward from the lower surface 51b, and the solderability between the mounting leg 54c and the second electrode 53 deteriorates.

このような構成を有する高周波モジュールは、回路基板５１の下面がマザー基板（図示せず）上に載置され、第１の電極部５２がマザー基板の回路に接続されるようになっている。   In the high-frequency module having such a configuration, the lower surface of the circuit board 51 is placed on a mother board (not shown), and the first electrode portion 52 is connected to the circuit of the mother board.

しかし、回路基板５１がマザー基板上に載置された際、取付脚５４ｃと第２の電極部５３を接続する半田が下面５１ｂから下方に突出した状態となっているため、マザー基板に対する回路基板５１の平坦度が悪く、半田付け不良を生じる。   However, when the circuit board 51 is placed on the mother board, the solder connecting the mounting legs 54c and the second electrode portion 53 protrudes downward from the lower surface 51b. The flatness of 51 is poor, resulting in poor soldering.

また、図１１は従来の高周波モジュールに係る回路基板５１の製造方法を示し、先ず、複数枚の絶縁シート５５が積層された状態で、第１の凹部５１ｃを形成するための円形状の貫通孔５６と、第２の凹部５１ｅを形成するための略楕円状の貫通孔５７を形成する。   FIG. 11 shows a method of manufacturing the circuit board 51 according to the conventional high-frequency module. First, a circular through-hole for forming the first recess 51c in a state where a plurality of insulating sheets 55 are laminated. 56 and a substantially elliptical through hole 57 for forming the second recess 51e.

次に、この絶縁シート５５が貫通孔５６，５７上に位置する線Ａ１，Ａ２に沿って切断されると、第１，第２の凹部５１ｃ、５１ｅを有した複数個の回路基板５１が製造されるようになっている。（特許文献１参照）   Next, when the insulating sheet 55 is cut along the lines A1 and A2 located on the through holes 56 and 57, a plurality of circuit boards 51 having the first and second recesses 51c and 51e are manufactured. It has come to be. (See Patent Document 1)

特開平１０−２８４９３５号公報Japanese Patent Laid-Open No. 10-284935

従来の高周波モジュールは、カバー５４の取付脚５４ｃを取り付けるための回路基板５１に設けられた第２の凹部５１ｅが上下方向に貫通して形成されているため、取付脚５４ｃと第２の電極部５３を接続する半田が下面５１ｂから下方に突出して、取付脚５４ｃと第２の電極５３との間の半田付性が悪くなる上に、マザー基板に対する回路基板５１の平坦度が悪くなって、半田付け不良を起こすという問題がある。   In the conventional high-frequency module, since the second recess 51e provided in the circuit board 51 for attaching the attachment leg 54c of the cover 54 is formed so as to penetrate in the vertical direction, the attachment leg 54c and the second electrode part are formed. 53, the solder connecting 53 protrudes downward from the lower surface 51b, the solderability between the mounting leg 54c and the second electrode 53 deteriorates, and the flatness of the circuit board 51 with respect to the mother board deteriorates, There is a problem of causing poor soldering.

そこで、本発明はカバーの半田付性が良く、且つ、小型で、マザー基板への接続の信頼性の高い高周波モジュールを提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide a high-frequency module having a cover with good solderability, a small size, and high reliability in connection to a mother board.

上記課題を解決するための第１の解決手段として、ランド部を有する配線パターンが設けられ、前記ランド部に電子部品が接続された多層基板で構成される回路基板と、この回路基板に設けられた複数の有底の凹部と、前記電子部品を覆った状態で、前記回路基板に取り付けられた金属板からなる箱形のカバーとを備え、前記カバーは、上面板と、この上面板から下方に折り曲げられた複数の側面板と、前記上面板と平行になるように、前記側面板の下方側から折り曲げられた取付部と、前記側面板から下方に突出する突出部を有し、前記カバーは、前記突出部が前記凹部内に位置決めされた状態で、前記取付部が前記回路基板の上面、又は前記凹部の底面に設けられた前記ランド部に半田付けされた構成とした。   As a first means for solving the above-mentioned problems, a circuit board comprising a multilayer substrate in which a wiring pattern having a land portion is provided, and an electronic component is connected to the land portion, and the circuit board is provided. A plurality of bottomed recesses and a box-shaped cover made of a metal plate attached to the circuit board in a state of covering the electronic component, the cover being an upper surface plate and a lower side from the upper surface plate A plurality of side plates that are bent to each other; a mounting portion that is bent from a lower side of the side plate so as to be parallel to the upper surface plate; and a protruding portion that protrudes downward from the side plate. The mounting portion is soldered to the land portion provided on the upper surface of the circuit board or the bottom surface of the concave portion in a state where the protruding portion is positioned in the concave portion.

また、第２の解決手段として、前記突出部の先端部には、前記取付部が設けられ、前記突出部が前記凹部内に位置決めされると共に、前記取付部が前記凹部の前記底面に設けられた前記ランド部に半田付けされた構成とした。   Further, as a second solving means, the attachment portion is provided at the tip of the protrusion, the protrusion is positioned in the recess, and the attachment is provided on the bottom surface of the recess. In addition, the structure was soldered to the land portion.

また、第３の解決手段として、前記側面板の下端部に形成された前記取付部が前記回路基板の前記上面に設けられた前記ランド部に半田付けされると共に、前記取付部と異なる位置に設けられた前記突出部が前記凹部内に位置決めされた構成とした。
また、第４の解決手段として、前記回路基板の下面に設けられたキャビティ内には、フリップチップ部品が取り付けられると共に、前記回路基板の下面には、外部接続用のランド部が設けられた構成とした。 As a third solution, the attachment portion formed on the lower end portion of the side plate is soldered to the land portion provided on the upper surface of the circuit board, and at a position different from the attachment portion. The protrusion provided was positioned in the recess.
As a fourth solution, a flip chip component is mounted in a cavity provided on the lower surface of the circuit board, and a land portion for external connection is provided on the lower surface of the circuit board. It was.

本発明の高周波モジュールは、ランド部を有する配線パターンが設けられ、ランド部に電子部品が接続された多層基板で構成される回路基板と、この回路基板に設けられた複数の有底の凹部と、電子部品を覆った状態で、回路基板に取り付けられた金属板からなる箱形のカバーとを備え、カバーは、上面板と、この上面板から下方に折り曲げられた複数の側面板と、上面板と平行になるように、側面板の下方側から折り曲げられた取付部と、側面板から下方に突出する突出部を有し、カバーは、突出部が凹部内に位置決めされた状態で、取付部が回路基板の上面、又は凹部の底面に設けられたランド部に半田付けされた構成とした。
即ち、突出部が凹部内に位置して、カバーの位置決めができると共に、取付部が回路基板の上面、又は凹部の底面に設けられたランド部に半田付けされるため、半田は、回路基板の下方への流出が阻止され、従って、取付部の半田付性が良くなると共に、マザー基板に対する回路基板の平坦度が良くなって、半田付が確実で、マザー基板への接続の信頼性の高い高周波モジュールを提供することができる。 A high-frequency module according to the present invention is provided with a circuit board including a multilayer substrate in which a wiring pattern having a land portion is provided, and an electronic component is connected to the land portion, and a plurality of bottomed recesses provided in the circuit substrate. A box-shaped cover made of a metal plate attached to the circuit board in a state of covering the electronic component, the cover including an upper surface plate, a plurality of side plates bent downward from the upper surface plate, The cover has a mounting part that is bent from the lower side of the side plate so as to be parallel to the face plate, and a protruding part that protrudes downward from the side plate, and the cover is mounted with the protruding part positioned in the recess. The portion was soldered to a land portion provided on the top surface of the circuit board or the bottom surface of the recess.
In other words, the protrusion is positioned in the recess so that the cover can be positioned, and the mounting portion is soldered to the top surface of the circuit board or the land portion provided on the bottom surface of the recess. The downward flow is prevented, so that the solderability of the mounting portion is improved, the flatness of the circuit board with respect to the mother board is improved, the soldering is reliable, and the connection to the mother board is highly reliable. A high frequency module can be provided.

また、突出部の先端部には、取付部が設けられ、突出部が凹部内に位置決めされると共に、取付部が凹部の底面に設けられたランド部に半田付けされたため、突出部と取付部を一カ所に纏めることができて、材料取りが良く、安価なものが得られる。   In addition, a mounting portion is provided at the tip of the protruding portion, the protruding portion is positioned in the recess, and the mounting portion is soldered to a land portion provided on the bottom surface of the recess. Can be put together in one place, and the material is good and cheap.

また、側面板の下端部に形成された取付部が回路基板の上面に設けられたランド部に半田付けされると共に、取付部と異なる位置に設けられた突出部が凹部内に位置決めされたため、取付部と電子部品を半田付けするためのランド部が上面に纏めることができて、生産性の良いものが得られる。   In addition, the mounting portion formed at the lower end portion of the side plate is soldered to the land portion provided on the upper surface of the circuit board, and the protruding portion provided at a position different from the mounting portion is positioned in the recess, Land portions for soldering the mounting portion and the electronic component can be collected on the upper surface, and a product with good productivity can be obtained.

また、回路基板の下面に設けられたキャビティ内には、フリップチップ部品が取り付けられると共に、回路基板の下面には、外部接続用のランド部が設けられたため、小型化を図ることができる。   In addition, flip chip components are attached in the cavity provided on the lower surface of the circuit board, and a land portion for external connection is provided on the lower surface of the circuit board, so that the size can be reduced.

本発明の高周波モジュールの図面を説明すると、図１は本発明の高周波モジュールの第１実施例に係る要部断面図、図２は本発明の高周波モジュールの第１実施例に係る回路基板の斜視図、図３は本発明の高周波モジュールの第１実施例に係り、カバーを裏返した状態の斜視図、図４は本発明の高周波モジュールの第１実施例に係り、回路基板の製造方法を示す説明図である。   Referring to the drawings of the high-frequency module of the present invention, FIG. 1 is a cross-sectional view of an essential part according to the first embodiment of the high-frequency module of the present invention, and FIG. FIG. 3 is a perspective view of the high-frequency module according to the first embodiment of the present invention, with the cover turned over, and FIG. 4 is a circuit board manufacturing method according to the first embodiment of the high-frequency module of the present invention. It is explanatory drawing.

また、図５は本発明の高周波モジュールの第２実施例に係る要部断面図、図６は本発明の高周波モジュールの第２実施例に係る回路基板の斜視図、図７は本発明の高周波モジュールの第２実施例に係り、カバーを裏返した状態の斜視図、図８は本発明の高周波モジュールの第２実施例に係り、回路基板の製造方法を示す説明図である。   FIG. 5 is a cross-sectional view of a main part according to a second embodiment of the high-frequency module of the present invention, FIG. 6 is a perspective view of a circuit board according to the second embodiment of the high-frequency module of the present invention, and FIG. FIG. 8 is an explanatory view showing a circuit board manufacturing method according to the second embodiment of the high-frequency module of the present invention, according to the second embodiment of the module, and FIG.

次に、本発明の高周波モジュールにおける第１実施例の構成を図１〜図３に基づいて説明すると、多層基板からなる四角形状の回路基板１は、角部において、上面１ａから下面１ｂ側に向けて非貫通状態で形成された複数個の有底の凹部１ｃと、下面１ｂに設けられた凹状のキャビティ１ｄを有する。
この凹部１ｃは、回路基板１の外周に位置する側面１ｅに設けられた切り欠きによって形成されている。 Next, the configuration of the first embodiment of the high-frequency module according to the present invention will be described with reference to FIGS. It has a plurality of bottomed recesses 1c formed in a non-penetrating state and a concave cavity 1d provided on the lower surface 1b.
The recess 1 c is formed by a notch provided in the side surface 1 e located on the outer periphery of the circuit board 1.

また、回路基板１は、低温焼成等によって形成されるセラミックや、ガラスエポキシ系等からなる熱可塑性樹脂によって構成され、この回路基板１の上面１ａ、下面１ｂ、及び積層間には、ランド部２ａ、２ｂ、２ｃを有する配線パターン３が設けられると共に、接続導体４によって、下面１ｂに設けられた外部接続用のランド部２ｃに引き出されている。
更に、ランド部２ａは、後述する電子部品５の接続用として上面１ａに設けられると共に、接地用のランド部２ｂは、後述するカバー７の取付用として凹部１ｃの底面に設けられている。 The circuit board 1 is made of a ceramic formed by low-temperature firing or the like, or a thermoplastic resin made of glass epoxy or the like. Between the upper surface 1a, the lower surface 1b, and the stack of the circuit board 1, a land portion 2a is formed. A wiring pattern 3 having 2b and 2c is provided, and is drawn out by a connecting conductor 4 to a land portion 2c for external connection provided on the lower surface 1b.
Further, the land portion 2a is provided on the upper surface 1a for connecting an electronic component 5 described later, and the grounding land portion 2b is provided on the bottom surface of the recess 1c for mounting a cover 7 described later.

このような構成を有する回路基板１の上面１ａに設けられた配線パターン３のランド部２ａ上には、チップ型のコンデンサや抵抗等の種々の電子部品５が半田付けされると共に、フリップチップ部品６が下面１ｂのキャビティ１ｄ内に収納された状態で、バンプ等によって配線パターン３に接続されて、所望の電気回路が形成されている。   On the land portion 2a of the wiring pattern 3 provided on the upper surface 1a of the circuit board 1 having such a configuration, various electronic components 5 such as chip-type capacitors and resistors are soldered, and flip-chip components. In a state where 6 is accommodated in the cavity 1d of the lower surface 1b, it is connected to the wiring pattern 3 by a bump or the like to form a desired electric circuit.

金属板から成る箱形のカバー７は、上面板７ａと、この上面板７ａの４辺から下方に折り曲げられた４つの側面板７ｂと、側面板７ｂから下方に延びる４つの突出部７ｃと、上面板７ａと平行になるように、突出部７ｃの先端部から折り曲げられた取付部７ｄを有する。   A box-shaped cover 7 made of a metal plate includes an upper surface plate 7a, four side surface plates 7b bent downward from four sides of the upper surface plate 7a, four projecting portions 7c extending downward from the side surface plate 7b, The mounting portion 7d is bent from the tip of the protruding portion 7c so as to be parallel to the upper surface plate 7a.

このカバー７は、回路基板１の上面１ａ、及び電子部品５を覆った状態で、突出部７ｃを凹部１ｃ内に挿入して、カバー７の位置決めを行った状態で、側面板７ｂの下端を上面１ａに当接させ、且つ、取付部７ｄと凹部１ｃの底面に設けられたランド部２ｂを半田付けして、カバー７が回路基板１に取り付けられる。   The cover 7 covers the upper surface 1a of the circuit board 1 and the electronic component 5, and the protrusion 7c is inserted into the recess 1c to position the cover 7, and the lower end of the side plate 7b is covered. The cover 7 is attached to the circuit board 1 by being brought into contact with the upper surface 1a and soldering the land portion 2b provided on the bottom surface of the mounting portion 7d and the recess 1c.

なお、この実施例では、側面板７ｂを上面１ａに当接するようにしたが、取付部７ｄの下面を凹部１ｃの底面に当接するようにしても良い。   In this embodiment, the side plate 7b is in contact with the upper surface 1a, but the lower surface of the mounting portion 7d may be in contact with the bottom surface of the recess 1c.

この時、凹部１ｃは、ランド部２ｂを設けた下面によって塞がれているので、取付部７ｄとランド部２ｂを接続する半田は、回路基板１の下面１ｂ側への流出が防止され、半田が下面１ｂから下方に突出しないようになる。   At this time, since the concave portion 1c is closed by the lower surface provided with the land portion 2b, the solder connecting the mounting portion 7d and the land portion 2b is prevented from flowing out to the lower surface 1b side of the circuit board 1, and the solder. Does not protrude downward from the lower surface 1b.

このような構成を有する高周波モジュールは、回路基板１の下面１ｂがマザー基板８上に載置され、下面１ｂに設けられた外部接続用のランド部２ｃがマザー基板８の回路（図示せず）に半田付けされて接続されるようになっている。   In the high-frequency module having such a configuration, the lower surface 1b of the circuit board 1 is placed on the mother board 8, and the land portion 2c for external connection provided on the lower surface 1b is a circuit of the mother board 8 (not shown). It is connected with soldering.

そして、回路基板１がマザー基板８上に載置された際、取付部７ｄとランド部２ｂを接続する半田は、凹部１ｃの底面によって下面１ｂ側への流出が防止されて、半田が下面１ｂから突出せず、従って、マザー基板８に対する回路基板１の平坦度が良好で、確実な接続ができる。   Then, when the circuit board 1 is placed on the mother board 8, the solder connecting the mounting portion 7d and the land portion 2b is prevented from flowing out to the lower surface 1b side by the bottom surface of the recess 1c, and the solder is exposed to the lower surface 1b. Therefore, the flatness of the circuit board 1 with respect to the mother board 8 is good, and a reliable connection can be made.

次に、本発明の高周波モジュールの第１実施例における回路基板１の製造方法を図４に基づいて説明すると、配線パターン３を設けた複数の回路基板１（ここでは４個）を形成するための１枚の大判基板９を用意すると共に、この大判基板９には、回路基板１の角部に対応する位置に有底の凹部１ｃが設けられており、且つ、凹部１ｃの底面に設けられたランド部２ｂは、上部に露出した状態となっている。   Next, a method for manufacturing the circuit board 1 in the first embodiment of the high-frequency module of the present invention will be described with reference to FIG. 4. In order to form a plurality of circuit boards 1 (four in this case) provided with wiring patterns 3. The large-sized substrate 9 is provided with a bottomed concave portion 1c at a position corresponding to the corner of the circuit board 1 and on the bottom surface of the concave portion 1c. The land portion 2b is exposed at the top.

次に、電子部品５やフリップチップ部品６が大判基板９に取り付けられた後、各回路基板１に対応して、カバー７は、突出部７ｃが凹部１ｃ内に位置決めされた状態で、取付部７ｄがランド部２ｂに半田付けされて回路基板１に取り付けられ、しかる後、切断線Ｚ１に沿って大判基板９が切断されると、複数個の本発明の高周波モジュールが製造されるようになっている。   Next, after the electronic component 5 and the flip chip component 6 are attached to the large substrate 9, the cover 7 is attached to the attachment portion in a state where the protrusion 7c is positioned in the recess 1c corresponding to each circuit board 1. 7d is soldered to the land portion 2b and attached to the circuit board 1, and then, when the large substrate 9 is cut along the cutting line Z1, a plurality of high frequency modules of the present invention are manufactured. ing.

なお、上記実施例では、突出部７ｃと取付部７ｄが回路基板１の角部に位置したもので説明したが、突出部７ｃと取付部７ｄは、角部以外の箇所に配置しても良い。   In the above embodiment, the protruding portion 7c and the attaching portion 7d are described as being located at the corners of the circuit board 1. However, the protruding portion 7c and the attaching portion 7d may be disposed at a place other than the corner portions. .

また、図５〜図７は本発明の高周波モジュールの第２実施例を示し、この第２実施例の構成を説明すると、回路基板１に設けられた有底の凹部１ｃが角部から離れた位置に配置されると共に、カバー７を取り付けるためのラウンド部２ｂが回路基板１の上面１ａの角部に設けられている。   5 to 7 show a second embodiment of the high-frequency module according to the present invention. The configuration of the second embodiment will be described. The bottomed recess 1c provided on the circuit board 1 is separated from the corner. The round part 2b for attaching the cover 7 is provided in the corner | angular part of the upper surface 1a of the circuit board 1 while arrange | positioning in a position.

また、カバー７に設けられた突出部７ｃと取付部７ｄは、互いに異なる位置に配設され、突出部７ｃは、カバー７の角部から離れた位置で下方に突出するすると共に、取付部７ｄは、カバー７の角部の位置で、側面板７ｂの下端部に形成されており、このようなカバー７は、突出部７ｃが凹部１ｃ内に位置決めされた状態で、取付部７ｄが上面１ａに設けられたランド部２ｂに半田付けされて、回路基板１に取り付けられている。   Further, the protruding portion 7c and the mounting portion 7d provided on the cover 7 are disposed at different positions, and the protruding portion 7c protrudes downward at a position away from the corner portion of the cover 7, and the mounting portion 7d. Is formed at the lower end portion of the side plate 7b at the position of the corner of the cover 7. The cover 7 has the projection 7c positioned in the recess 1c and the mounting portion 7d on the upper surface 1a. Soldered to a land portion 2 b provided on the circuit board 1 and attached to the circuit board 1.

その他の構成は、前記第１実施例と同様であるので、同一部品に同一番号を付し、ここではその説明を省略する。   Since other configurations are the same as those of the first embodiment, the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

次に、本発明の高周波モジュールの第２実施例における回路基板１の製造方法を図８に基づいて説明すると、配線パターン３を設けた複数の回路基板１（ここでは４個）を形成するための１枚の大判基板９を用意すると共に、この大判基板９には、各回路基板１の角部から離れた位置に有底の凹部１ｃが設けられており、且つ、ランド部２ｂは、各回路基板１の上面１ａの角部に設けられている。   Next, a method for manufacturing the circuit board 1 in the second embodiment of the high-frequency module of the present invention will be described with reference to FIG. 8. In order to form a plurality of circuit boards 1 (four in this case) provided with wiring patterns 3. The large-sized board 9 is provided with a bottomed recess 1c at a position away from the corner of each circuit board 1, and each of the land parts 2b includes It is provided at the corner of the upper surface 1 a of the circuit board 1.

次に、電子部品５やフリップチップ部品６が大判基板９に取り付けられた後、各回路基板１に対応して、カバー７は、突出部７ｃが凹部１ｃ内に位置決めされた状態で、取付部７ｄがランド部２ｂに半田付けされて回路基板１に取り付けられ、しかる後、切断線Ｚ１に沿って大判基板９が切断されると、複数個の本発明の高周波モジュールが製造されるようになっている。   Next, after the electronic component 5 and the flip chip component 6 are attached to the large substrate 9, the cover 7 is attached to the attachment portion in a state where the protrusion 7c is positioned in the recess 1c corresponding to each circuit board 1. 7d is soldered to the land portion 2b and attached to the circuit board 1, and then, when the large substrate 9 is cut along the cutting line Z1, a plurality of high frequency modules of the present invention are manufactured. ing.

なお、上記実施例では、突出部７ｃが角部から離れた位置に、また、取付部７ｄが角部の位置に設けられたもので説明したが、突出部７ｃが角部に配置され、取付部７ｄが角部以外の箇所に配置する等、突出部７ｃと取付部７ｄは、その位置を種々選択し得るものである。   In the above embodiment, the projection 7c is provided at a position away from the corner and the mounting portion 7d is provided at the corner. However, the projection 7c is disposed at the corner and attached. The positions of the projecting part 7c and the attaching part 7d can be variously selected such that the part 7d is arranged at a place other than the corner part.

本発明の高周波モジュールの第１実施例に係る要部断面図。The principal part sectional drawing which concerns on 1st Example of the high frequency module of this invention. 本発明の高周波モジュールの第１実施例に係る回路基板の斜視図。The perspective view of the circuit board which concerns on 1st Example of the high frequency module of this invention. 本発明の高周波モジュールの第１実施例に係り、カバーを裏返した状態の斜視図。The perspective view of the state which turned on the cover according to 1st Example of the high frequency module of this invention. 本発明の高周波モジュールの第１実施例に係り、回路基板の製造方法を示す説明図。Explanatory drawing which shows the manufacturing method of a circuit board in connection with 1st Example of the high frequency module of this invention. 本発明の高周波モジュールの第２実施例に係る要部断面図。Sectional drawing of the principal part which concerns on 2nd Example of the high frequency module of this invention. 本発明の高周波モジュールの第２実施例に係る回路基板の斜視図。The perspective view of the circuit board which concerns on 2nd Example of the high frequency module of this invention. 本発明の高周波モジュールの第２実施例に係り、カバーを裏返した状態の斜視図。The perspective view of the state which turned on the cover according to 2nd Example of the high frequency module of this invention. 本発明の高周波モジュールの第２実施例に係り、回路基板の製造方法を示す説明図。Explanatory drawing which shows the manufacturing method of a circuit board in connection with 2nd Example of the high frequency module of this invention. 従来の高周波モジュールの斜視図。The perspective view of the conventional high frequency module. 従来の高周波モジュールに係る回路基板の斜視図。The perspective view of the circuit board concerning the conventional high frequency module. 従来の高周波モジュールに係り、回路基板の製造方法を示す説明図。Explanatory drawing which shows the manufacturing method of a circuit board in connection with the conventional high frequency module.

符号の説明Explanation of symbols

１：回路基板
１ａ：上面
１ｂ：下面
１ｃ：凹部
１ｄ：キャビティ
１ｅ：側面
２ａ、２ｂ、２ｃ：ランド部
３：配線パターン
４：接続導体
５：電子部品
６：フリップチップ部品
７：カバー
７ａ：上面板
７ｂ：側面板
７ｃ：突出部
７ｄ：取付部
８：マザー基板
９：大判基板
Ｚ１：切断線
1: Circuit board 1a: Upper surface 1b: Lower surface 1c: Recess 1d: Cavity 1e: Side surface 2a, 2b, 2c: Land portion 3: Wiring pattern 4: Connection conductor 5: Electronic component 6: Flip chip component 7: Cover 7a: Upper Face plate 7b: Side plate 7c: Protruding part 7d: Mounting part 8: Mother board 9: Large format board Z1: Cutting line

Claims (4)

ランド部を有する配線パターンが設けられ、前記ランド部に電子部品が接続された多層基板で構成される回路基板と、この回路基板に設けられた複数の有底の凹部と、前記電子部品を覆った状態で、前記回路基板に取り付けられた金属板からなる箱形のカバーとを備え、前記カバーは、上面板と、この上面板から下方に折り曲げられた複数の側面板と、前記上面板と平行になるように、前記側面板の下方側から折り曲げられた取付部と、前記側面板から下方に突出する突出部を有し、前記カバーは、前記突出部が前記凹部内に位置決めされた状態で、前記取付部が前記回路基板の上面、又は前記凹部の底面に設けられた前記ランド部に半田付けされたことを特徴とする高周波モジュール。 A circuit board comprising a multilayer substrate having a wiring pattern having a land portion and having an electronic component connected to the land portion, a plurality of bottomed recesses provided on the circuit substrate, and covering the electronic component. A box-shaped cover made of a metal plate attached to the circuit board, the cover comprising an upper surface plate, a plurality of side plates bent downward from the upper surface plate, and the upper surface plate. A mounting portion bent from the lower side of the side plate so as to be parallel, and a protruding portion protruding downward from the side plate, and the cover is in a state where the protruding portion is positioned in the recess The high frequency module is characterized in that the mounting portion is soldered to the land portion provided on the upper surface of the circuit board or the bottom surface of the recess. 前記突出部の先端部には、前記取付部が設けられ、前記突出部が前記凹部内に位置決めされると共に、前記取付部が前記凹部の前記底面に設けられた前記ランド部に半田付けされたことを特徴とする請求項１記載の高周波モジュール。 The mounting portion is provided at the tip of the protruding portion, the protruding portion is positioned in the concave portion, and the mounting portion is soldered to the land portion provided on the bottom surface of the concave portion. The high-frequency module according to claim 1. 前記側面板の下端部に形成された前記取付部が前記回路基板の前記上面に設けられた前記ランド部に半田付けされると共に、前記取付部と異なる位置に設けられた前記突出部が前記凹部内に位置決めされたことを特徴とする請求項１記載の高周波モジュール。 The mounting portion formed at the lower end portion of the side plate is soldered to the land portion provided on the upper surface of the circuit board, and the protruding portion provided at a position different from the mounting portion is the recess. The high-frequency module according to claim 1, wherein the high-frequency module is positioned inside. 前記回路基板の下面に設けられたキャビティ内には、フリップチップ部品が取り付けられると共に、前記回路基板の下面には、外部接続用のランド部が設けられたことを特徴とする請求項１から３の何れかに記載の高周波モジュール。
4. A flip chip component is mounted in a cavity provided on the lower surface of the circuit board, and a land portion for external connection is provided on the lower surface of the circuit board. The high frequency module according to any one of the above.
JP2004368188A 2004-12-20 2004-12-20 High-frequency module Withdrawn JP2006179523A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009259874A (en) * 2008-04-11 2009-11-05 Kenwood Corp Electronic apparatus and noise shielding method thereof
JP2019134014A (en) * 2018-01-30 2019-08-08 京セラ株式会社 Motherboard for mounting electronic device, board for mounting electronic device, and electronic apparatus
CN112164689A (en) * 2020-08-25 2021-01-01 江苏长电科技股份有限公司 Air tightness packaging structure for preventing metal cover from shifting

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009259874A (en) * 2008-04-11 2009-11-05 Kenwood Corp Electronic apparatus and noise shielding method thereof
JP2019134014A (en) * 2018-01-30 2019-08-08 京セラ株式会社 Motherboard for mounting electronic device, board for mounting electronic device, and electronic apparatus
JP7391494B2 (en) 2018-01-30 2023-12-05 京セラ株式会社 Motherboards for mounting electronic devices, substrates for mounting electronic devices, and electronic devices
CN112164689A (en) * 2020-08-25 2021-01-01 江苏长电科技股份有限公司 Air tightness packaging structure for preventing metal cover from shifting

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