JP5196976B2 - Piezoelectric devices for surface mounting - Google Patents
Piezoelectric devices for surface mounting Download PDFInfo
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- JP5196976B2 JP5196976B2 JP2007310136A JP2007310136A JP5196976B2 JP 5196976 B2 JP5196976 B2 JP 5196976B2 JP 2007310136 A JP2007310136 A JP 2007310136A JP 2007310136 A JP2007310136 A JP 2007310136A JP 5196976 B2 JP5196976 B2 JP 5196976B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
本発明は圧電材を水晶等とした表面実装用の圧電デバイス（以下、表面実装デバイスとする）を技術分野とし、特に例えばパチンコの遊技台に設置される表面実装デバイスに関する。 The present invention relates to a surface mount piezoelectric device (hereinafter, referred to as a surface mount device) in which a piezoelectric material is a crystal or the like, and more particularly to a surface mount device installed on a pachinko game machine.
（発明の背景）
表面実装デバイス例えば表面実装発振器は小型・軽量であることから、各種の電子機器に周波数や時間の基準源として内蔵される。近年では、表面実装発振器は多種多様のデジタル制御機器に内蔵され、このようなものの一つに遊技台としてのパチンコ台への設置が検討されている。
(Background of the Invention)
Surface mount devices such as surface mount oscillators are small and light, and are built into various electronic devices as frequency and time reference sources. In recent years, surface-mounted oscillators are built into a wide variety of digital control devices, and installation of one of these on a pachinko machine as a game machine is being studied.
（従来技術の一例）
第４図は一従来例を説明する図で、同図（ａ）は表面実装発振器の断面図、同図（ｂ）は同底面図、同図（ｃ）は水晶片の平面図である。
(Example of conventional technology)
4A and 4B are views for explaining a conventional example. FIG. 4A is a cross-sectional view of a surface mount oscillator, FIG. 4B is a bottom view thereof, and FIG. 4C is a plan view of a crystal piece.
表面実装発振器は積層セラミックからなる凹状として内壁段部を有する容器本体１にＩＣチップ２と水晶片３とを収容し、金属カバー４を被せて密閉封入する。容器本体１は内底面に図示しない回路端子を、内壁段部の表面に一対の水晶端子を有する。一対の水晶端子は内底面の回路端子に図示しない導電路を経て電気的に接続する。そして、容器本体１の外底面の４角部には実装端子５を有し、積層面を経て内底面の回路端子と電気的に接続する。 The surface-mount oscillator accommodates an IC chip 2 and a crystal piece 3 in a container body 1 having an inner wall step as a concave shape made of a laminated ceramic, and a metal cover 4 is covered and hermetically sealed. The container body 1 has a circuit terminal (not shown) on the inner bottom surface and a pair of crystal terminals on the surface of the inner wall step. The pair of crystal terminals are electrically connected to circuit terminals on the inner bottom surface through a conductive path (not shown). And the mounting terminal 5 is provided in the 4 corner | angular part of the outer bottom face of the container main body 1, and it electrically connects with the circuit terminal of an inner bottom face through a lamination | stacking surface.
ＩＣチップ２は発振回路を集積化し、回路機能面のＩＣ端子が回路端子にバンプ６を用いた超音波熱圧着によって固着する。水晶片３は両主面に励振電極７ａを有し、例えば一端部両側に引出電極７ｂを延出する。そして、引出電極７ｂの延出した一端部両側が導電性接着剤８によって水晶端子に固着する。 The IC chip 2 integrates the oscillation circuit, and the IC terminal on the circuit function surface is fixed to the circuit terminal by ultrasonic thermocompression bonding using the bump 6. The quartz crystal piece 3 has excitation electrodes 7a on both main surfaces, and for example, extraction electrodes 7b extend on both sides of one end. Then, both ends of the extended end portion of the extraction electrode 7 b are fixed to the crystal terminal by the conductive adhesive 8.
金属カバー４は、例えば容器本体１の開口端面に設けられた図示しない金属リングにシーム溶接によって接合される。そして、これらによる表面実装発振器は例えばパチンコ台の裏側に設けられる制御装置の図示しないセット基板に表面実装として取り付けられる。 For example, the metal cover 4 is joined to a metal ring (not shown) provided on the opening end surface of the container body 1 by seam welding. And the surface mount oscillator by these is attached as surface mounting to the set board | substrate which is not shown of the control apparatus provided in the back side of a pachinko machine, for example.
（従来技術の問題点）
しかしながら、上記構成の表面実装発振器は、例えばセット基板に対して表面実装であるため、パチンコ台に取り付けたセット基板の表面上からの取り外しが比較的に容易となる。したがって、現行では、第５図（正面図）に示したようにリードピン（リード端子）９を有する金属ベース１０にＩＣチップや水晶振動子等を配置して金属カバー１１を被せたリードピン型の水晶発振器が採用される。
(Problems of conventional technology)
However, since the surface-mounted oscillator having the above configuration is surface-mounted with respect to the set substrate, for example, it is relatively easy to remove it from the surface of the set substrate attached to the pachinko machine. Therefore, at present, as shown in FIG. 5 (front view), a lead pin type quartz crystal in which an IC chip, a crystal resonator and the like are placed on a metal base 10 having lead pins (lead terminals) 9 and covered with a metal cover 11. An oscillator is adopted.
これによれば、セット基板に搭載する際には、セット基板に設けた貫通孔にリードピン９を挿入してセット基板の反対面で半田付けされる。したがって、セット基板からの表面実装発振器の取り外しを困難にする。このことから、リードピン型の水晶発振器が採用され、表面実装発振器の採用は見送られる問題があった。 According to this, when mounting on the set substrate, the lead pins 9 are inserted into the through holes provided in the set substrate and soldered on the opposite surface of the set substrate. Therefore, it is difficult to remove the surface mount oscillator from the set substrate. For this reason, a lead pin type crystal oscillator has been adopted, and the adoption of a surface mount oscillator has been a problem that has been postponed.
（発明の目的）
本発明はリードピン型として兼用できる表面実装発振器を提供することを目的とする。
(Object of invention)
It is an object of the present invention to provide a surface mount oscillator that can also be used as a lead pin type.
本発明は、特許請求の範囲（請求項１）に示したように、最下位層の外底面に実装端子を有した積層セラミックからなる容器本体に少なくとも圧電片を密閉封入した表面実装用の圧電デバイスにおいて、前記容器本体における前記最下位層は前記最下位層に対する上位層の平面外形よりも大きくする突出部を有し、前記突出部の外底面には前記実装端子を有するとともにリードピンの挿入される貫通孔を有する構成とする。 According to the present invention, as shown in the claims (Claim 1), at least a piezoelectric piece is hermetically sealed in a container body made of a multilayer ceramic having mounting terminals on the outer bottom surface of the lowest layer. In the device, the lowermost layer of the container body has a protruding portion that is larger than the planar outer shape of the upper layer with respect to the lowermost layer, the mounting terminal is provided on the outer bottom surface of the protruding portion, and lead pins are inserted. It is set as the structure which has a through-hole.
このような構成であれば、容器本体の最下位層には実装端子及び貫通孔を有する突出部を設けたので、リードピンを貫通孔に自在に挿入して固定できる。したがって、表面実装デバイスをリードピン型として適用できる。 With such a configuration, since the projecting portion having the mounting terminal and the through hole is provided in the lowest layer of the container body, the lead pin can be freely inserted into the through hole and fixed. Therefore, the surface mount device can be applied as a lead pin type.
（実施態様項）
本発明の請求項２では、請求項１において、前記貫通孔の内周面及び前記外底面の反対面には、前記外部端子と電気的に接続した金属膜を有する。これにより、半田を用いた場合のリードピンとの接合強度を高められる。
(Embodiment section)
According to a second aspect of the present invention, in the first aspect, a metal film electrically connected to the external terminal is provided on the inner peripheral surface of the through hole and the surface opposite to the outer bottom surface. Thereby, the joint strength with the lead pin when using solder can be increased.
同請求項３では、請求項１において、前記リードピンは一端側を釘頭状とする。これによれば、釘頭状のリードピンを突出部の貫通孔に挿入して固着してリードピン型の表面実装発振器を形成する。そして、表面実装発振器のリードピンの他端側をセット基板の貫通孔に挿入して反対面で固着した場合、リードピンを釘頭状としたので、セット基板の表面側からは取り外せない。 In the third aspect of the present invention, in the first aspect, the one end side of the lead pin has a nail head shape. According to this, a lead pin type surface mount oscillator is formed by inserting and fixing a nail head shaped lead pin into the through hole of the protruding portion. When the other end side of the lead pin of the surface mount oscillator is inserted into the through hole of the set substrate and fixed on the opposite surface, the lead pin has a nail head shape and cannot be removed from the surface side of the set substrate.
同請求項４では、請求項１において、前記容器本体は内壁段部を有した凹状とし、前記凹部底面にはＩＣチップが固着され、前記段部には圧電片が保持される。これにより、表面実装デバイスをさらに明確にし、具体的な構造とした表面実装発振器に特定される。 In the fourth aspect of the present invention, in the first aspect, the container body has a concave shape having an inner wall step portion, an IC chip is fixed to the bottom surface of the concave portion, and a piezoelectric piece is held on the step portion. As a result, the surface mount device is further clarified and specified as a surface mount oscillator having a specific structure.
第１図は本発明の一実施形態を説明する表面実装発振器の図で、同図（ａ）は断面図、同図（ｂ）は底面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。 FIG. 1 is a diagram of a surface mount oscillator for explaining an embodiment of the present invention. FIG. 1 (a) is a sectional view and FIG. 1 (b) is a bottom view. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.
表面実装発振器は、前述したように、積層セラミックからなる凹状とした容器本体１の内底面にＩＣチップ２を固着し、内壁段部に水晶片３の一端部両側を固着する。そして、この実施形態では容器本体１の実装端子５の設けられた最下位層例えば底壁層はその上位層よりも平面外形を大きくして突出部１２を有する。ここでは、最下位層の長さ方向の両端側に突出部１２を設ける。但し、底壁層が複数層からなる場合は少なくとも最下位層を突出すればよい。 As described above, the surface mount oscillator has the IC chip 2 fixed to the inner bottom surface of the concave container body 1 made of multilayer ceramic, and both ends of one end of the crystal piece 3 fixed to the inner wall step. In this embodiment, the lowermost layer, for example, the bottom wall layer, provided with the mounting terminals 5 of the container body 1 has a projecting portion 12 with a planar outer shape larger than that of the upper layer. Here, the protrusions 12 are provided on both end sides in the length direction of the lowest layer. However, when the bottom wall layer is composed of a plurality of layers, at least the lowest layer may be projected.
そして、容器本体１の外底面の４角部及び突出部１２の外底面には実装端子５を有する。突出部１２には内周に貫通孔１３が形成され（所謂スルーホール）、貫通孔の内周及び外底面の反対面となる上面にも金属膜５ａが設けられる。これらの金属膜５ａは実装端子５と電気的に接続する。そして、突出部１２には釘頭状としたリードピン１４が挿入され、釘頭状とした頭部が図示しない半田によって上面の金属膜５ａに固着される。この場合、半田は貫通孔内１３にも侵入して接続強度を高める。 And the mounting terminal 5 is provided in the four corner | angular part of the outer bottom face of the container main body 1, and the outer bottom face of the protrusion part 12. As shown in FIG. A through hole 13 is formed in the inner periphery of the protrusion 12 (so-called through hole), and a metal film 5a is also provided on the upper surface opposite to the inner periphery and outer bottom surface of the through hole. These metal films 5 a are electrically connected to the mounting terminals 5. A lead pin 14 having a nail head shape is inserted into the projecting portion 12, and the head portion having a nail head shape is fixed to the upper metal film 5a by solder (not shown). In this case, the solder also enters the through hole 13 to increase the connection strength.
これらは、例えば第２図に示したように、底壁及び枠壁となるシート状のグリーンシート（底壁シート１Ｂ、枠壁シート１Ｃ）を積層した容器本体シート１Ａの焼成後、縦横の分割線Ａ−Ａ及びＢ―Ｂ線に沿って個々の容器本体１に分割される。この場合、底壁シート１Ｂは平板として、容器本体１の突出部１２を含む４角部の外底面の４角部に、実装端子５の下地電極（ＷやＭo）が印刷される。そして、突出部１２に貫通孔１３を設けて、貫通孔１３の内周及び上面に金属膜５ａの下地電極が印刷される。 For example, as shown in FIG. 2, these are divided into vertical and horizontal directions after firing the container body sheet 1A in which sheet-like green sheets (bottom wall sheet 1B and frame wall sheet 1C) serving as a bottom wall and a frame wall are laminated. Divided into individual container bodies 1 along lines AA and BB. In this case, the bottom wall sheet 1 </ b> B is a flat plate, and the base electrode (W or Mo) of the mounting terminal 5 is printed on the four corners of the outer bottom surface of the four corners including the protruding portion 12 of the container body 1. And the through-hole 13 is provided in the protrusion part 12, and the base electrode of the metal film 5a is printed on the inner periphery and upper surface of the through-hole 13. As shown in FIG.
枠壁シート１Ｂは容器本体１の収容部に相当する複数の第１開口部１５ａを有し、さらに底壁の突出部１２上の空間に相当する第２開口部１５ｂを第１開口部１５ａの両側に有する。そして、これらを積層して容器本体シート１を形成して一体的に焼成される。焼成後には、実装端子５及び金属膜５ａの下地電極上にＮi及びＡu膜がメッキによって形成され、その後、個々の各容器本体１に分割される。 The frame wall sheet 1B has a plurality of first openings 15a corresponding to the accommodating portions of the container body 1, and further a second opening 15b corresponding to the space on the protruding portion 12 of the bottom wall of the first opening 15a. Have on both sides. And these are laminated | stacked, the container main body sheet | seat 1 is formed, and it bakes integrally. After firing, Ni and Au films are formed on the base electrodes of the mounting terminals 5 and the metal film 5a by plating, and then divided into individual container bodies 1.
このような構成であれば、容器本体１の底壁を突出して貫通孔１３を設けたので、リードピン１４を必要に応じて形成でき、表面実装発振器をリードピン型として適用できる。ここでは、リードピン１４を釘頭状として貫通孔１４に固着する。したがって、例えば第３図のセット基板に対する装着断面図に示したように、リードピン１４が貫通したセット基板１６の裏面側で半田付けすれば、リードピン型とした表面実装発振器をセット基板１６の表面側からの取り外しを困難とする。 With such a configuration, the bottom wall of the container body 1 protrudes and the through hole 13 is provided, so that the lead pin 14 can be formed as necessary, and the surface mount oscillator can be applied as a lead pin type. Here, the lead pin 14 is fixed to the through-hole 14 in the shape of a nail head. Therefore, for example, as shown in the mounting cross-sectional view of the set substrate shown in FIG. 3, if the soldering is performed on the back surface side of the set substrate 16 through which the lead pins 14 penetrate, a surface mount oscillator having a lead pin type can be obtained. It is difficult to remove it from.
このことから、この実施形態でのリードピン型とした表面実装発振器であれば、遊技台としてのパチンコに搭載できる。なお、遊技台としてはパチンコのみならずスロット等の遊技台にも適用できることは勿論である。 From this, the lead-pin type surface mount oscillator in this embodiment can be mounted on a pachinko as a game table. Needless to say, the game machine can be applied not only to a pachinko machine but also to a game machine such as a slot.
（他の事項）
上記実施形態ではパチンコ等の遊技台を対象として説明したが、必要に応じて各種の用途に適用できる。表面実装デバイスは表面実装発振器として説明したが、圧電材としての水晶片等のみを収容して密閉封入した表面実装振動子にも適用でき、圧電材としての水晶を収容した圧電デバイスであれば適用できる。
(Other matters)
Although the above embodiment has been described for a game machine such as a pachinko machine, the present invention can be applied to various applications as necessary. The surface mount device has been described as a surface mount oscillator, but it can also be applied to a surface mount oscillator that contains only a crystal piece as a piezoelectric material and is hermetically sealed, and is applicable to any piezoelectric device that contains crystal as a piezoelectric material. it can.
そして、表面実装発振器の貫通孔１３に釘頭状としたリードピン１４を予め装着したが、例えばセット基板に直線状のリードピンが予めけられた場合でも、表面実装発振器の貫通孔を挿入すれば装着できる。したがって、貫通孔１３を有する突出部１２を形成したものは本発明の技術的範囲に属する。 And, the lead pin 14 having a nail head shape is attached in advance to the through hole 13 of the surface mount oscillator. For example, even if a linear lead pin is provided in advance on the set substrate, it is attached if the through hole of the surface mount oscillator is inserted. it can. Therefore, what formed the protrusion part 12 which has the through-hole 13 belongs to the technical scope of this invention.
１ 容器本体、２ ＩＣチップ、３ 水晶片、４、１１ 金属カバー、５ 実装端子、６ バンプ、７ 励振及び引出電極、８ 導電性接着剤、９、１４ リードピン、１０ 金属ベース、１２ 突出部、１３ 貫通孔、１５ 開口部、１６ セット基板。
DESCRIPTION OF SYMBOLS 1 Container body, 2 IC chip, 3 Crystal piece, 4,11 Metal cover, 5 Mounting terminal , 6 Bump, 7 Excitation and extraction electrode, 8 Conductive adhesive, 9, 14 Lead pin, 10 Metal base, 12 Protrusion part, 13 through-holes, 15 openings, 16 set substrates.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007310136A JP5196976B2 (en) | 2007-11-30 | 2007-11-30 | Piezoelectric devices for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007310136A JP5196976B2 (en) | 2007-11-30 | 2007-11-30 | Piezoelectric devices for surface mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009135745A JP2009135745A (en) | 2009-06-18 |
| JP5196976B2 true JP5196976B2 (en) | 2013-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2007310136A Expired - Fee Related JP5196976B2 (en) | 2007-11-30 | 2007-11-30 | Piezoelectric devices for surface mounting |
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Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5472696A (en) * | 1977-11-21 | 1979-06-11 | Citizen Watch Co Ltd | Package for super miniature size piezoelectric oscillator |
| JPS6079758A (en) * | 1983-10-06 | 1985-05-07 | Fuji Electric Co Ltd | Semiconductor device |
| JPH0533566U (en) * | 1991-10-04 | 1993-04-30 | 日本電気株式会社 | Integrated circuit component mounting structure |
| JP3129058B2 (en) * | 1993-09-08 | 2001-01-29 | 富士電機株式会社 | Semiconductor device package |
| JP3025617U (en) * | 1995-10-04 | 1996-06-21 | 株式会社シンエイ・ハイテック | Airtight body for surface mount oscillator |
| JP2001060842A (en) * | 1999-08-23 | 2001-03-06 | Fujimaru Kogyo Kk | Small-sized electronic part |
| JP4571012B2 (en) * | 2005-05-25 | 2010-10-27 | 日本電波工業株式会社 | Crystal unit with pedestal |
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| JP2009135745A (en) | 2009-06-18 |
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