JP4744251B2 - Carrier tape - Google Patents

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JP4744251B2
JP4744251B2 JP2005268965A JP2005268965A JP4744251B2 JP 4744251 B2 JP4744251 B2 JP 4744251B2 JP 2005268965 A JP2005268965 A JP 2005268965A JP 2005268965 A JP2005268965 A JP 2005268965A JP 4744251 B2 JP4744251 B2 JP 4744251B2
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electronic component
main body
carrier tape
lead terminal
component main
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JP2007076713A (en
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憲正 橋爪
英夫 大塚
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帝国通信工業株式会社
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Description

本発明は、固定抵抗器等の電子部品を収納する収納部を多数備えたキャリアテープに関するものである。   The present invention relates to a carrier tape having a large number of storage units for storing electronic components such as fixed resistors.

従来、可撓性を有する帯状のテープに等間隔に連続して凹状の収納部を形成し、各収納部内にそれぞれ固定抵抗器等の電子部品を収納するキャリアテープがある（例えば特許文献１の図３）。このキャリアテープはその上に各収納部を覆う覆いテープが貼り付けられる。この種のキャリアテープは例えばフープ状に巻き回されて保管・搬送され、使用時は前記巻き回されたキャリアテープを引き出しながら覆いテープを剥がし、各収納部に収納した電子部品を吸着ヘッドによって一つずつ取り出す。取り出された電子部品は所望の回路基板上に載置されてリフロー等により回路基板上に面実装される。   Conventionally, there is a carrier tape in which concave storage portions are formed continuously at equal intervals on a strip-shaped tape having flexibility, and electronic components such as fixed resistors are stored in the respective storage portions (for example, Patent Document 1). FIG. 3). The carrier tape has a covering tape for covering each storage portion attached thereto. This type of carrier tape is wound and stored and transported, for example, in a hoop shape, and when used, the covering tape is peeled off while pulling out the wound carrier tape, and the electronic components stored in each storage section are collected by a suction head. Take out one by one. The extracted electronic component is placed on a desired circuit board and surface-mounted on the circuit board by reflow or the like.

図６は電子部品５３０を収納したキャリアテープ５００の一部拡大概略断面図である。同図に示すようにキャリアテープ５００は、可撓性を有する帯状のテープ５１０に等間隔に連続して凹状（略矩形状）の収納部５１１を形成して構成され、各収納部５１１内にそれぞれ固定抵抗器等の電子部品５３０が収納されると共に、その上に覆いテープ５５０が貼り付けられる。そして前述のように電子部品５３０を取り出す場合は、覆いテープ５５０を剥がし、収納部５１１内の電子部品５３０の円柱状の電子部品本体部５３１の外周面の上面中央部分に図示しない吸着ヘッドの吸着面を吸着して電子部品５３０を吸い付けて収納部５１１から引き出す。   FIG. 6 is a partially enlarged schematic sectional view of the carrier tape 500 in which the electronic component 530 is accommodated. As shown in the figure, the carrier tape 500 is formed by forming concave (substantially rectangular) storage portions 511 continuously at equal intervals on a strip-shaped tape 510 having flexibility, and in each storage portion 511. Each of the electronic components 530 such as a fixed resistor is accommodated, and a covering tape 550 is attached thereon. When the electronic component 530 is taken out as described above, the covering tape 550 is peeled off, and a suction head (not shown) is attached to the central portion of the upper surface of the columnar electronic component main body 531 of the electronic component 530 in the storage portion 511. The electronic component 530 is sucked by sucking the surface and pulled out from the storage portion 511.

しかしながら上記電子部品５３０は収納部５１１内に所定の遊びを持った状態で収納されているので、覆いテープ５５０を剥がした際に電子部品５３０が収納部５１１内の吸着に最適な位置に位置していない場合があり、また場合によっては電子部品５３０が回転していて電子部品５００のリード端子５３３が横向きや上向きとなったりしている場合があり、従って電子部品５３０の吸着ヘッドへの吸着がうまく行えない場合があった。特に電子部品本体部５３１が円柱状の場合、その外周面が湾曲しているので正確な位置で吸着しないとその吸着がうまく行えない。この問題を解決するには、例えば特許文献１に示すように、覆いテープ５５０を剥がした際の電子部品５３０の収納部５１１内での位置を検出し、その位置に合わせて吸着ヘッドを制御する方法も考えられる。しかしながらこのように構成すると、電子部品５３０の位置を検出する装置が必要になる等、装置が大掛かりとなり、電子部品実装装置のコストが高くなってしまう。
特開２００２−３５３６９３号公報 However, since the electronic component 530 is stored in the storage portion 511 with a predetermined play, the electronic component 530 is positioned at an optimum position for suction in the storage portion 511 when the cover tape 550 is peeled off. In some cases, the electronic component 530 may rotate and the lead terminal 533 of the electronic component 500 may be sideways or upward, so that the electronic component 530 is sucked to the suction head. There were cases where it could not be done well. In particular, when the electronic component main body 531 has a cylindrical shape, the outer peripheral surface is curved, so that the suction cannot be performed well unless it is sucked at an accurate position. In order to solve this problem, for example, as shown in Patent Document 1, the position of the electronic component 530 in the storage unit 511 when the cover tape 550 is peeled is detected, and the suction head is controlled according to the position. A method is also conceivable. However, when configured in this manner, the apparatus becomes large, for example, a device for detecting the position of the electronic component 530 is required, and the cost of the electronic component mounting apparatus increases.
JP 2002-353893 A

本発明は上述の点に鑑みてなされたものでありその目的は、収納部内における電子部品の位置決めが精度良く自動的に行われ、電子部品の取り出しが容易に行えるキャリアテープを提供することにある。   The present invention has been made in view of the above-described points, and an object of the present invention is to provide a carrier tape in which positioning of an electronic component in a storage unit is automatically performed with high accuracy and the electronic component can be easily taken out. .

本願請求項１に記載の発明は、電子部品本体部の両端面からリード端子を突出してなる構造の電子部品を収納する収納部を有するキャリアテープにおいて、前記電子部品本体部は、棒状であってその両端に金属キャップを取り付けて構成され、一方前記リード端子は金属棒の一端を前記金属キャップの外側面に固定することで電子部品本体部の両端面から突出させその先端側の部分を略直角に折り曲げて第１折り曲げ部とし、さらに第１折り曲げ部の先端側の部分を折り返してその先端側の部分を面実装用当接部として構成され、前記収納部の底部の中央に台部を設け、この台部の上面中央に凹部からなりこの収納部に収納した前記電子部品の電子部品本体部を載置して位置決めする位置決め部を設け、これによって位置決め部の両側に前記屈曲した電子部品のリード端子を収納するリード端子収納部を形成し、一方前記収納部の一対の対向する内側面には、前記位置決め部に載置した電子部品本体部の端部の金属キャップの外周面に向かって突出する横ブレ防止用突部が少なくとも一対設けられていることを特徴とするキャリアテープにある。 The invention according to claim 1 of the present application is a carrier tape having a storage portion for storing an electronic component having a structure in which a lead terminal protrudes from both end faces of the electronic component main body portion , wherein the electronic component main body portion is rod-shaped. A metal cap is attached to both ends of the lead terminal. On the other hand, the lead terminal protrudes from the both end surfaces of the electronic component main body by fixing one end of the metal rod to the outer surface of the metal cap, and the tip side portion is substantially perpendicular. The first bent portion is bent into a first bent portion, the distal end portion of the first bent portion is folded back, and the distal end portion is configured as a surface mounting contact portion, and a base portion is provided at the center of the bottom portion of the storage portion. the positioning portion for positioning and mounting the electronic component body of the electronic component housed in the housing part consists of the recess at the center of the upper surface of the base portion is provided, the both sides of the positioning unit by which A lead terminal storage portion for storing the lead terminal of the bent electronic component is formed. On the other hand, a pair of opposing inner side surfaces of the storage portion is provided with a metal cap at an end portion of the electronic component main body portion placed on the positioning portion. The carrier tape is characterized in that at least one pair of lateral blur preventing projections projecting toward the outer peripheral surface is provided.

請求項１に記載の発明によれば、位置決め部によって収納部内における電子部品の位置決めが精度良く自動的に行われる。これによって電子部品の収納部からの取り出しが容易に行えるようになる。   According to the first aspect of the present invention, the positioning of the electronic component in the storage unit is automatically performed with high accuracy by the positioning unit. Thus, the electronic component can be easily taken out from the storage unit.

請求項１に記載の発明によれば、電子部品のリード端子がこの電子部品を面実装するように屈曲されていても、このリード端子をリード端子収納部に収納することで、何ら問題なく位置決め部による電子部品の位置決めを精度良く自動的に行うことができる。 According to the first aspect of the present invention, even if the lead terminal of the electronic component is bent so that the electronic component is surface-mounted, positioning can be performed without any problem by storing the lead terminal in the lead terminal storing portion. The electronic component can be positioned automatically and accurately by the unit.

請求項１に記載の発明によれば、横ブレ防止用突部を設けたので、電子部品本体部の横ブレが防止でき、従って横ブレによって電子部品がリード端子ごと回転することを確実に防止できる。これによっても収納部内における電子部品の位置決めが精度良く自動的に行われ、電子部品の収納部からの取り出しが容易に行えるようになる。 According to the first aspect of the present invention, since the lateral blur prevention protrusion is provided, the lateral blur of the electronic component main body can be prevented, and therefore the electronic component can be reliably prevented from rotating together with the lead terminals due to the lateral blur. it can. This also makes it possible to position the electronic component in the storage portion automatically and accurately, and to easily take out the electronic component from the storage portion.

以下、本発明の実施形態を図面に基づいて詳細に説明する。
図１は本発明の一実施形態にかかるキャリアテープ１０及びこのキャリアテープ１０に収納する電子部品５０とこのキャリアテープ１０を覆う覆いテープ１００とを示す要部拡大分解斜視図である。また図２（ａ）はキャリアテープ１０の要部拡大平面図、図２（ｂ）は図２（ａ）のＡ−Ａ断面図である。これらの図に示すようにキャリアテープ１０は、可撓性を有する帯状の合成樹脂フイルム１１に連続して等間隔に凹状の収納部１３を形成し、またキャリアテープ１０の幅方向（図２（ａ）の上下方向）の両端部にその長手方向（図２（ａ）の左右方向）に向かって多数の円形の貫通孔からなる送り穴４１を形成して構成されている。収納部１３の形成は、この実施形態では金型によるプレス成形を用いているが、圧空成形、真空成形等の他の各種手法を用いて形成しても良い。またキャリアテープ１０の材質としてこの実施形態ではポリスチレンフイルムを用いているが、ポリエチレンテレフタレートフイルム、ポリプロピレンフイルム等の他の各種合成樹脂フイルムであっても良い。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an enlarged exploded perspective view showing a main part of a carrier tape 10 according to an embodiment of the present invention, an electronic component 50 accommodated in the carrier tape 10 and a covering tape 100 covering the carrier tape 10. 2A is an enlarged plan view of a main part of the carrier tape 10, and FIG. 2B is a cross-sectional view taken along line AA in FIG. 2A. As shown in these drawings, the carrier tape 10 is formed with concave storage portions 13 formed at equal intervals in succession to the flexible strip-shaped synthetic resin film 11, and the width direction of the carrier tape 10 (FIG. 2 ( A feed hole 41 composed of a large number of circular through holes is formed at both end portions in the vertical direction (a) in the longitudinal direction (left-right direction in FIG. 2 (a)). In this embodiment, the storage portion 13 is formed by press molding using a mold, but may be formed by using various other methods such as pressure forming and vacuum forming. Further, in this embodiment, a polystyrene film is used as the material of the carrier tape 10, but other various synthetic resin films such as a polyethylene terephthalate film and a polypropylene film may be used.

収納部１３は略矩形状であって、その長手方向がキャリアテープ１０の幅方向を向き、これによって隣り合う収納部１３が並列（平行）に多数キャリアテープ１０の長手方向に向けて配置されるようにしている。収納部１３の底部１５の中央には台部１９が設けられ、台部１９の上面中央に位置決め部１７が形成されている。台部１９は、収納部１３の長手方向を向く一対の対向する内側面２２，２３の間を連結するように底部１５から上方向に略矩形状に突出して形成されている。そして位置決め部１７は、台部１９の上面中央に収納部１３の長手方向に向かう直線状でＶ字状の溝（凹部）によって形成されている。なお位置決め部１７の形状は、Ｖ字状の溝に限定されず、円弧状や矩形状やその他の形状の溝でも良く、要は下記する電子部品５０の電子部品本体部５１をその位置に載置して位置決めできる形状・構造であればどのような形状・構造であっても良い。台部１９の高さ、即ち位置決め部１７の底部１５からの高さは、キャリアテープ１０の上面である収納面Ｘ（図１参照）を超えない範囲で電子部品本体部５１が収納部１３に収納され更にはこの位置決め部１７上に下記する電子部品５０の電子部品本体部５１を載置した際に電子部品５０の下記するリード端子６１の面実装用当接部６５が底部１５から少し離れる高さに形成されている。そして以上のように位置決め部１７を収納部１３の底面１５から所定の高さの位置に設置することで、この位置決め部１７の両側に下記する電子部品５０のリード端子６１を収納する凹状のリード端子収納部２１を設けている。一方前記一対の対向する内側面２２，２３の前記位置決め部１７の両側の対向する部分には、上下方向に延び且つ収納部１３内に向かって突出する半円柱状の突起からなる二対の横ブレ防止用突部２５（計４個）が設けられている。   The storage portion 13 has a substantially rectangular shape, and its longitudinal direction faces the width direction of the carrier tape 10, whereby adjacent storage portions 13 are arranged in parallel (in parallel) toward the longitudinal direction of the carrier tape 10. I am doing so. A base 19 is provided at the center of the bottom 15 of the storage part 13, and a positioning part 17 is formed at the center of the upper surface of the base 19. The pedestal 19 is formed so as to protrude upward in a substantially rectangular shape from the bottom 15 so as to connect between a pair of opposed inner side surfaces 22, 23 facing the longitudinal direction of the storage portion 13. And the positioning part 17 is formed in the center of the upper surface of the base part 19 by the linear V-shaped groove | channel (recessed part) which goes to the longitudinal direction of the accommodating part 13. As shown in FIG. The shape of the positioning portion 17 is not limited to the V-shaped groove, and may be an arc shape, a rectangular shape, or other shape groove. In short, the electronic component main body 51 of the electronic component 50 described below is mounted at that position. Any shape / structure may be used as long as it can be positioned and positioned. The height of the base 19, that is, the height from the bottom 15 of the positioning portion 17 does not exceed the storage surface X (see FIG. 1) that is the upper surface of the carrier tape 10. Further, when the electronic component main body 51 of the electronic component 50 described below is placed on the positioning portion 17, the surface mounting contact portion 65 of the lead terminal 61 described below of the electronic component 50 is slightly separated from the bottom portion 15. It is formed at a height. As described above, the positioning portion 17 is installed at a predetermined height from the bottom surface 15 of the storage portion 13, so that the concave leads for storing the lead terminals 61 of the electronic components 50 described below on both sides of the positioning portion 17. A terminal storage portion 21 is provided. On the other hand, on the opposing portions on both sides of the positioning portion 17 of the pair of opposing inner side surfaces 22, 23, two pairs of sideways formed by semi-cylindrical protrusions extending in the vertical direction and projecting into the storage portion 13. Anti-shake projections 25 (four in total) are provided.

次に図１に示す覆いテープ１００は、前記キャリアテープ１０よりも小さい幅寸法の可撓性を有する帯状の平板状の合成樹脂フイルム１０１によって構成されている。覆いテープ１００の材質も、キャリアテープ１０と同様に、ポリスチレンフイルムを用いているが、ポリエチレンテレフタレートフイルム、ポリプロピレンフイルム等の可撓性を有する他の各種合成樹脂フイルムであっても良い。   Next, the covering tape 100 shown in FIG. 1 is composed of a strip-shaped flat plate-shaped synthetic resin film 101 having flexibility smaller in width than the carrier tape 10. As the material of the covering tape 100, a polystyrene film is used similarly to the carrier tape 10, but other various synthetic resin films having flexibility such as a polyethylene terephthalate film and a polypropylene film may be used.

図３は電子部品５０を示す図であり、図３（ａ）は平面図、図３（ｂ）は正面図、図３（ｃ）は右側面図、図３（ｄ）は電子部品本体部５１の内部構造説明図である。図１及び図３に示すように電子部品５０は、電子部品本体部５１の両端面（電子部品本体部５１の長手方向に垂直な両端面）からリード端子６１，６１を突出して構成されている。ここで電子部品本体部５１は、この実施形態では図３（ｄ）に示すように、円柱状のセラミック製の絶縁棒５３の周囲に酸化金属被膜５５を被覆し、抵抗値を調整するためにこの酸化金属被膜５５をスパイラル状にカットしてカット溝５７を設け、絶縁棒５３の両端に金属キャップ５９，５９を取り付け、これら金属キャップ５９，５９の外側面中央にそれぞれ金属棒からなるリード端子６１，６１の一端をスポット溶接等によって固定し、さらに金属キャップ５９，５９を含む絶縁棒５３全体を絶縁塗料６３によって絶縁被覆して構成されている。そして両リード端子６１，６１は、電子部品本体部５１の両端面から突出した両突出部６１ａ，６１ａを円柱状の電子部品本体部５１の半径方向において同一方向に略直角に折り曲げてその先端側を第１折り曲げ部６１ｂ，６１ｂとし、さらに第１折り曲げ部６１ｂ，６１ｂの先端側の部分を両第１折り曲げ部６１ｂ，６１ｂの下側に折り返してその先端側の部分を第２折り曲げ部６１ｃ，６１ｃとし、この直線状の第２折り曲げ部６１ｃ，６１ｃの部分を面実装用当接部６５，６５としている。第１折り曲げ部６１ｂと第２折り曲げ部６１ｃの屈曲角度は略３０°であり、両第２折り曲げ部６１ｃ，６１ｃは平行である。   3A and 3B are diagrams showing the electronic component 50. FIG. 3A is a plan view, FIG. 3B is a front view, FIG. 3C is a right side view, and FIG. 3D is an electronic component main body. It is internal structure explanatory drawing of 51. FIG. As shown in FIGS. 1 and 3, the electronic component 50 is configured by projecting lead terminals 61 and 61 from both end surfaces of the electronic component main body 51 (both end surfaces perpendicular to the longitudinal direction of the electronic component main body 51). . In this embodiment, as shown in FIG. 3 (d), the electronic component main body 51 is coated with a metal oxide film 55 around a cylindrical ceramic insulating rod 53 to adjust the resistance value. The metal oxide film 55 is cut in a spiral shape to provide a cut groove 57, metal caps 59, 59 are attached to both ends of the insulating rod 53, and lead terminals made of a metal rod at the center of the outer surface of the metal caps 59, 59, respectively. One end of 61, 61 is fixed by spot welding or the like, and the entire insulating rod 53 including the metal caps 59, 59 is further covered with an insulating coating 63. The two lead terminals 61, 61 are bent at substantially right angles in the same direction in the radial direction of the columnar electronic component main body 51 by projecting both protruding portions 61a, 61a from both end faces of the electronic component main body 51. Are the first bent portions 61b, 61b, and further, the distal end portions of the first bent portions 61b, 61b are folded back to the lower sides of the first bent portions 61b, 61b, and the distal end portions thereof are second bent portions 61c, 61c, and the straight second bent portions 61c and 61c are surface mounting contact portions 65 and 65, respectively. The bending angle of the first bent portion 61b and the second bent portion 61c is approximately 30 °, and both the second bent portions 61c and 61c are parallel.

図５は前記電子部品５０を回路基板８０上に面実装する一例を示す斜視図である。同図に示すように回路基板８０上に設けた一対の回路パターン８１，８１上に、それぞれ電子部品５０の面実装用当接部６５，６５を載置し、半田リフロー等によって電子部品５０を回路基板８０上に面実装する。このとき電子部品本体部５１は回路基板８０の上面から所定距離離間した状態で設置できるので、この電子部品５０が発熱を伴なう固定抵抗器等であっても回路基板８０及びこれに取り付けた他の各種電子部品を破壊する恐れはない。   FIG. 5 is a perspective view showing an example of mounting the electronic component 50 on the circuit board 80. As shown in the figure, surface mounting contact portions 65, 65 of the electronic component 50 are placed on a pair of circuit patterns 81, 81 provided on the circuit board 80, and the electronic component 50 is mounted by solder reflow or the like. Surface mounted on the circuit board 80. At this time, the electronic component main body 51 can be installed with a predetermined distance from the upper surface of the circuit board 80. Therefore, even if the electronic component 50 is a fixed resistor or the like that generates heat, it is attached to the circuit board 80 and the circuit board 80. There is no risk of destroying other various electronic components.

そして図１において、キャリアテープ１０の収納部１３内に電子部品５０を収納する。図４はキャリアテープ１０の収納部１３内に電子部品５０を収納した状態を示す図であり、図４（ａ）は平面図（但し覆いテープ１００の記載を省略）、図４（ｂ）は概略側断面図である。図４に示すように電子部品本体部５１はその中央部分が位置決め部１７上に載置され、同時に両リード端子６１，６１はリード端子収納部２１，２１内に収納される。このとき前述のようにリード端子６１の面実装用当接部６５はリード端子収納部２１の底部１５から所定寸法離れている。またこのとき電子部品本体部５１の両端近傍である金属キャップ５９が位置する部分の外周面（外周側面）に対向する位置にはそれぞれ所定の狭い空間を介して、円柱状の電子部品本体部５１が収納部１３内においてキャリアテープ１０の長手方向にずれるのを抑える横ブレ防止用突部２５が対向している。   In FIG. 1, the electronic component 50 is stored in the storage portion 13 of the carrier tape 10. 4 is a view showing a state in which the electronic component 50 is housed in the housing portion 13 of the carrier tape 10. FIG. 4 (a) is a plan view (however, the description of the covering tape 100 is omitted), and FIG. It is a schematic sectional side view. As shown in FIG. 4, the central part of the electronic component main body 51 is placed on the positioning part 17, and at the same time, both lead terminals 61 and 61 are housed in the lead terminal housing parts 21 and 21. At this time, as described above, the surface mounting contact portion 65 of the lead terminal 61 is separated from the bottom portion 15 of the lead terminal storage portion 21 by a predetermined dimension. At this time, the cylindrical electronic component main body 51 is located at a position facing the outer peripheral surface (outer peripheral side surface) of the portion where the metal cap 59 is located near both ends of the electronic component main body 51 through a predetermined narrow space. Is opposed to the lateral blur preventing projection 25 that prevents the carrier tape 10 from shifting in the longitudinal direction of the carrier tape 10.

即ちこの実施形態においては、キャリアテープ１０の収納部１３の底部１５にこの収納部１３に収納した電子部品５０の電子部品本体部５１を載置して位置決めする位置決め部１７が設けられ、またリード端子６１は電子部品５０を面実装するように屈曲されてその所定部分が面実装用当接部６５とされ、一方位置決め部１７は収納部１３の底面１５から所定の高さの位置に設置されることでこの位置決め部１７の両側に前記屈曲した電子部品５０のリード端子６１を収納するリード端子収納部２１を設け、また収納部１３の内側面２２，２３の対向する位置に二対、位置決め部１７上に載置した電子部品本体部５１の外周面に向かって突出する横ブレ防止用突部２５を設けている。   In other words, in this embodiment, the positioning part 17 is provided to place and position the electronic component main body 51 of the electronic component 50 accommodated in the accommodating part 13 on the bottom 15 of the accommodating part 13 of the carrier tape 10. The terminal 61 is bent so as to surface-mount the electronic component 50, and a predetermined portion thereof is used as a surface mounting contact portion 65, while the positioning portion 17 is installed at a predetermined height from the bottom surface 15 of the storage portion 13. Thus, the lead terminal accommodating portion 21 for accommodating the lead terminal 61 of the bent electronic component 50 is provided on both sides of the positioning portion 17, and two pairs are positioned at opposing positions of the inner side surfaces 22 and 23 of the accommodating portion 13. Protrusions 25 for preventing lateral blur that project toward the outer peripheral surface of the electronic component main body 51 placed on the portion 17 are provided.

以上のようにキャリアテープ１０の収納部１３を構成すれば、図４に示すように、電子部品５０はその電子部品本体部５１が位置決め部１７に位置決めされて収納部１３の中央に位置する。即ち少なくともキャリアテープ１０を水平に設置した場合はたとえ電子部品本体部５１が収納部１３の中央以外の位置に移動していたとしても電子部品５０の自重によって必ず位置決め部１７に自動的に入り込んで収納部１３の中央に位置する。即ち収納部１３内における電子部品５０の位置決めが精度良く自動的に行われる。このときこの実施形態においては、前述のようにリード端子６１の面実装用当接部６５がリード端子収納部２１の底部１５から所定寸法離れているので、面実装用当接部６５全体が底部１５に当接することによって電子部品本体部５１が自動的に位置決め部１７に入り込むことを妨害されることはない。従って覆いテープ１００を剥がしてキャリアテープ１０を水平にした状態で収納部１３の中央位置Ｂに吸着ヘッドの吸着面を下降すれば、常に正確に電子部品本体部５１の中央部分を吸着でき、その吸着ミスを防止することができ、電子部品５０の取り出しが別途特別な装置等を用いることなく容易に行える。   If the storage part 13 of the carrier tape 10 is configured as described above, as shown in FIG. 4, the electronic component main body 51 of the electronic component 50 is positioned by the positioning part 17 and is positioned at the center of the storage part 13. That is, at least when the carrier tape 10 is installed horizontally, even if the electronic component main body 51 is moved to a position other than the center of the storage unit 13, it always enters the positioning unit 17 by its own weight. Located in the center of the storage portion 13. That is, positioning of the electronic component 50 in the storage unit 13 is automatically performed with high accuracy. At this time, in this embodiment, since the surface mounting contact portion 65 of the lead terminal 61 is separated from the bottom portion 15 of the lead terminal storage portion 21 by a predetermined dimension as described above, the entire surface mounting contact portion 65 is the bottom portion. Therefore, the electronic component main body 51 is not prevented from automatically entering the positioning portion 17. Therefore, if the suction surface of the suction head is lowered to the central position B of the storage portion 13 with the covering tape 100 peeled off and the carrier tape 10 being leveled, the central portion of the electronic component main body 51 can always be suctioned accurately. An adsorption mistake can be prevented, and the electronic component 50 can be easily taken out without using a special device.

またこの実施形態においては、前述のように横ブレ防止用突部２５が電子部品本体部５１の外周面に向かって突出していて両者間の隙間を所定の狭いものとしているので、電子部品本体部５１が電子部品本体部５１の中心軸方向に直交する水平方向（図４（ａ）に示すＣ方向）に大きく横ブレすることはない。従って横ブレによって電子部品５０がリード端子６１ごと回転（電子部品５０の両リード端子６１を結ぶ直線を回転中心軸とした回転）することはなく、リード端子６１が左右を向いたり上下を向いたりすることを確実に防止できる。即ちこの横ブレ防止用突部２５によっても、収納部１３内における電子部品５０の位置決めが精度良く自動的に行われる。また横ブレ防止用突部２５は突起で構成され、且つその位置は電子部品本体部５１の両端部近傍の金属キャップ５９が位置する部分の外周面に対向する位置なので、電子部品５０を吸着するために図示しない吸着ヘッドを電子部品本体部５１の上面中央（図４（ａ）の点Ｂの位置）に下降する際の邪魔にならず、同時に電子部品本体部５１よりもその外形寸法の大きいリード端子６１の収納部１３への収納・取り出しの邪魔にもならない。   Further, in this embodiment, as described above, the lateral blur preventing protrusion 25 protrudes toward the outer peripheral surface of the electronic component main body 51 and the gap between the two is made a predetermined narrow width. 51 does not greatly sway in the horizontal direction (C direction shown in FIG. 4A) perpendicular to the central axis direction of the electronic component main body 51. Therefore, the electronic component 50 does not rotate together with the lead terminals 61 due to lateral blurring (rotation about the straight line connecting both the lead terminals 61 of the electronic component 50 as the rotation center axis), and the lead terminals 61 face left and right or face up and down. Can be surely prevented. In other words, the positioning of the electronic component 50 in the storage unit 13 is automatically performed with high accuracy by the lateral blur preventing projection 25. Further, the lateral blur preventing projection 25 is constituted by a projection, and the position thereof is opposed to the outer peripheral surface of the portion where the metal cap 59 in the vicinity of both ends of the electronic component main body 51 is located. For this reason, the suction head (not shown) does not hinder the lowering of the suction head to the center of the upper surface of the electronic component main body 51 (the position of the point B in FIG. It does not interfere with the storage and removal of the lead terminal 61 from the storage unit 13.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載のない何れの形状・構造・材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば電子部品本体部５１は円柱状以外の棒状、例えば八角形状等の多角形状でも良い。また上記実施形態では固定抵抗器としてセラミック製の絶縁棒に酸化金属被膜を被覆した固定抵抗器を示したが、他の各種構造の固定抵抗器であっても良く、さらに固定抵抗器以外のコンデンサやダイオード等の他の電子部品であっても良い。要は電子部品本体部の両端面からリード端子を突出してなる構造の電子部品であればどのような機能のものであっても良い。またリード端子６１の屈曲形状も上記実施形態に限定されず、種々の異なる屈曲形状としても良い。そしてその所定部分を面実装用当接部とし、一対の面実装用当接部を回路基板上に載置することで電子部品を面実装できるものであれば良い。その際電子部品本体部は回路基板から所定距離離れていることが好ましい。なお場合によってはリード端子６１を屈曲させず、電子部品本体部５１の両端面から突出したリード端子６１をその突出方向にそのまま直線状に突出したままとしても良い。また上記実施形態では収納部１３の形状を略矩形状としたが、他の各種形状であっても良い。また上記実施形態では、キャリアテープ１０の両端部に送り穴４１を設けたが、送り穴４１はキャリアテープ１０の一端部側のみに設けても良い。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, the electronic component main body 51 may have a rod shape other than a cylindrical shape, for example, a polygonal shape such as an octagonal shape. In the above embodiment, a fixed resistor in which a ceramic insulating rod is coated with a metal oxide film is shown as a fixed resistor. However, other fixed resistors may be used, and capacitors other than fixed resistors may be used. Or other electronic components such as a diode. In short, any electronic component having a structure in which lead terminals protrude from both end faces of the electronic component main body may be used. Further, the bent shape of the lead terminal 61 is not limited to the above embodiment, and various different bent shapes may be used. The predetermined part is used as a surface mounting contact portion, and any electronic component can be surface mounted by placing the pair of surface mounting contact portions on the circuit board. In that case, it is preferable that the electronic component main body is separated from the circuit board by a predetermined distance. In some cases, the lead terminal 61 may not be bent, and the lead terminal 61 protruding from both end faces of the electronic component main body 51 may be projected straight in the protruding direction. Moreover, although the shape of the accommodating part 13 was made into the substantially rectangular shape in the said embodiment, other various shapes may be sufficient. In the above embodiment, the feed holes 41 are provided at both ends of the carrier tape 10. However, the feed holes 41 may be provided only on one end side of the carrier tape 10.

キャリアテープ１０と電子部品５０と覆いテープ１００とを示す要部拡大分解斜視図である。FIG. 2 is an enlarged exploded perspective view of a main part showing a carrier tape 10, an electronic component 50, and a covering tape 100. 図２（ａ）はキャリアテープ１０の要部拡大平面図、図２（ｂ）は図２（ａ）のＡ−Ａ断面図である。2A is an enlarged plan view of a main part of the carrier tape 10, and FIG. 2B is a cross-sectional view taken along line AA in FIG. 2A. 電子部品５０を示す図であり、図３（ａ）は平面図、図３（ｂ）は正面図、図３（ｃ）は右側面図、図３（ｄ）は電子部品本体部５１の内部構造説明図である。3A is a plan view, FIG. 3B is a front view, FIG. 3C is a right side view, and FIG. 3D is an internal view of the electronic component main body 51. It is structure explanatory drawing. キャリアテープ１０の収納部１３内に電子部品５０を収納した状態を示す図であり、図４（ａ）は平面図（但し覆いテープ１００の記載を省略）、図４（ｂ）は概略側断面図である。FIGS. 4A and 4B are views showing a state in which the electronic component 50 is housed in the housing portion 13 of the carrier tape 10. FIG. 4A is a plan view (however, the cover tape 100 is omitted), and FIG. FIG. 電子部品５０を回路基板８０上に面実装する一例を示す斜視図である。4 is a perspective view showing an example of surface mounting the electronic component 50 on a circuit board 80. FIG. キャリアテープ５００の一部拡大概略断面図である。2 is a partially enlarged schematic cross-sectional view of a carrier tape 500. FIG. 横ブレ防止用突部２５の各種参考例を示す図である。It is a figure which shows the various reference examples of the protrusion 25 for horizontal blur prevention.

符号の説明Explanation of symbols

１０ キャリアテープ
１３ 収納部
１５ 底部
１７ 位置決め部
１９ 台部
２１ リード端子収納部
２２，２３ 内側面
２５ 横ブレ防止用突部
５０ 電子部品
５１ 電子部品本体部
６１ リード端子
６５ 面実装用当接部
１００ 覆いテープ DESCRIPTION OF SYMBOLS 10 Carrier tape 13 Storage part 15 Bottom part 17 Positioning part 19 Base part 21 Lead terminal storage part 22,23 Inner side surface 25 Side | surface blur prevention protrusion 50 Electronic component 51 Electronic component main body part 61 Lead terminal 65 Surface mounting contact part 100 Covering tape

Claims (1)

電子部品本体部の両端面からリード端子を突出してなる構造の電子部品を収納する収納部を有するキャリアテープにおいて、
前記電子部品本体部は、棒状であってその両端に金属キャップを取り付けて構成され、一方前記リード端子は金属棒の一端を前記金属キャップの外側面に固定することで電子部品本体部の両端面から突出させその先端側の部分を略直角に折り曲げて第１折り曲げ部とし、さらに第１折り曲げ部の先端側の部分を折り返してその先端側の部分を面実装用当接部として構成され、
前記収納部の底部の中央に台部を設け、この台部の上面中央に凹部からなりこの収納部に収納した前記電子部品の電子部品本体部を載置して位置決めする位置決め部を設け、これによって位置決め部の両側に前記屈曲した電子部品のリード端子を収納するリード端子収納部を形成し、
一方前記収納部の一対の対向する内側面には、前記位置決め部に載置した電子部品本体部の端部の金属キャップの外周面に向かって突出する横ブレ防止用突部が少なくとも一対設けられていることを特徴とするキャリアテープ。 In a carrier tape having a storage portion for storing an electronic component having a structure in which a lead terminal protrudes from both end surfaces of the electronic component main body,
The electronic component main body is rod-shaped and is configured by attaching metal caps to both ends thereof, while the lead terminal is fixed to one end of the metal rod on the outer surface of the metal cap so that both end surfaces of the electronic component main body are fixed. The first bent portion is bent at a substantially right angle and protruded from the first bent portion, and the distal end portion of the first bent portion is folded back to constitute the surface mounting contact portion.
A pedestal is provided at the center of the bottom of the storage unit, and a positioning unit is provided for positioning the electronic component main body of the electronic component stored in the storage unit. Forming a lead terminal storage part for storing the lead terminal of the bent electronic component on both sides of the positioning part,
On the other hand, at least a pair of protrusions for preventing lateral blur that protrude toward the outer peripheral surface of the metal cap at the end of the electronic component main body placed on the positioning part is provided on a pair of opposed inner side surfaces of the storage part. Carrier tape characterized by
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JPH08119326A (en) * 1994-10-18 1996-05-14 Hitachi Ltd Carrier tape package and its sealing method
JPH0966964A (en) * 1995-08-30 1997-03-11 Kaneko Denki Kk Carrier tape
JP2003072835A (en) * 2001-09-03 2003-03-12 Toshiba Corp Carrier tape for electronic component, and electronic component mounting method
JP2003081331A (en) * 2001-09-17 2003-03-19 Gold Kogyo Kk Embossing tape for electronic parts, its manufacturing method and pocket forming die

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0390872U (en) * 1989-12-28 1991-09-17
JPH08119326A (en) * 1994-10-18 1996-05-14 Hitachi Ltd Carrier tape package and its sealing method
JPH0966964A (en) * 1995-08-30 1997-03-11 Kaneko Denki Kk Carrier tape
JP2003072835A (en) * 2001-09-03 2003-03-12 Toshiba Corp Carrier tape for electronic component, and electronic component mounting method
JP2003081331A (en) * 2001-09-17 2003-03-19 Gold Kogyo Kk Embossing tape for electronic parts, its manufacturing method and pocket forming die

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