JP4322748B2 - Adsorption nozzle structure for electronic components - Google Patents

Adsorption nozzle structure for electronic components Download PDF

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JP4322748B2
JP4322748B2 JP2004204647A JP2004204647A JP4322748B2 JP 4322748 B2 JP4322748 B2 JP 4322748B2 JP 2004204647 A JP2004204647 A JP 2004204647A JP 2004204647 A JP2004204647 A JP 2004204647A JP 4322748 B2 JP4322748 B2 JP 4322748B2
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suction
suction nozzle
electronic component
concave
nozzle structure
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JP2006032403A (en
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直也 羽場
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

本発明はプリント基板等に搬送する部品装着装置に使用して好適な電子部品の吸着ノズル構造に関する。   The present invention relates to a suction nozzle structure for an electronic component that is suitable for use in a component mounting apparatus that transports a printed board or the like.

従来の電子部品の吸着ノズル構造の図面を説明すると、図９は従来の電子部品の吸着ノズル構造に係り、側面から見た断面図、図１０は従来の電子部品の吸着ノズル構造に係り、正面から見た断面図、図１１は従来の電子部品の吸着ノズル構造を示す下面図、図１２は従来の電子部品の吸着ノズル構造に係り、凹面部よりも径の小さい空芯コイルを吸着した状態を示す説明図である。   FIG. 9 relates to a suction nozzle structure of a conventional electronic component, a cross-sectional view seen from the side, and FIG. 10 relates to a suction nozzle structure of a conventional electronic component. FIG. 11 is a bottom view showing the suction nozzle structure of a conventional electronic component, and FIG. 12 relates to the suction nozzle structure of the conventional electronic component, in which an air-core coil having a diameter smaller than that of the concave portion is sucked. It is explanatory drawing which shows.

次に、従来の電子部品の吸着ノズル構造の構成を図９〜図１２に基づいて説明すると、筒状の吸着ノズル５１は、内部に設けられた吸着孔５２と、下部に設けられた電子部品吸着用の凹状面からなる吸着面５３を有する。   Next, the structure of a conventional suction nozzle structure of an electronic component will be described with reference to FIGS. 9 to 12. The cylindrical suction nozzle 51 includes a suction hole 52 provided in the interior and an electronic component provided in the lower portion. It has a suction surface 53 consisting of a concave surface for suction.

更に詳述すると、吸着面５３は、吸着ノズル５１の延びる方向の軸芯線Ｇ１に対して直交する方向に設けられた半円形状の凹面部５４で形成されると共に、凹面部５４の頂部に位置する頂部線Ｃ１上に位置して凹面部５４に到る状態で、間隔を置いて配置された２個の吸着孔５２が設けられている。   More specifically, the suction surface 53 is formed by a semicircular concave surface portion 54 provided in a direction orthogonal to the axial core line G1 in the direction in which the suction nozzle 51 extends, and is positioned at the top of the concave surface portion 54. Two suction holes 52 arranged at intervals are provided so as to reach the concave surface portion 54 located on the top line C1.

電子部品である空芯コイル５５は、円形状に巻回された巻回部５５ａと、この巻回部５５ａの両端部に設けられた端子部５５ｂを有している。
そして、空芯コイル５５を所定の位置（例えば、プリント基板）に搬送する場合、空芯コイル５５は、端子部５５ｂを下方にした状態で部品供給装置（図示せず）に送られると共に、空芯コイル５５の巻回部５５ａの上方に吸着ノズル５１が移動して、頂部線Ｃ１上に位置する２個の吸着孔５２によって巻回部５５ａの頂部を吸着し、且つ、吸着面５３である凹面部５４で巻回部５５ａを保持した状態で、所定の位置に搬送されるようになっている。（例えば、特許文献１参照） The air-core coil 55, which is an electronic component, has a winding portion 55a wound in a circular shape, and terminal portions 55b provided at both ends of the winding portion 55a.
When the air-core coil 55 is transported to a predetermined position (for example, a printed board), the air-core coil 55 is sent to a component supply device (not shown) with the terminal portion 55b facing downward, The suction nozzle 51 moves above the winding portion 55 a of the core coil 55, and the top portion of the winding portion 55 a is sucked by the two suction holes 52 located on the top line C <b> 1 and is the suction surface 53. The winding portion 55a is held by the concave surface portion 54 and is conveyed to a predetermined position. (For example, see Patent Document 1)

一般に、吸着ノズルは、径の異なる空芯コイル５５に兼用されるようになっており、従って、従来の吸着ノズル５１も径の異なる空芯コイル５５に兼用され、吸着面５３である凹面部５４の径と空芯コイル５５の巻回部５５ａの径が同等である場合、巻回部５５ａの曲部が凹面部５４の内面全体に当接して、空芯コイル５５がガタツキを生じることなく保持される。   Generally, the suction nozzle is also used as an air core coil 55 having a different diameter. Therefore, the conventional suction nozzle 51 is also used as an air core coil 55 having a different diameter, and the concave surface portion 54 serving as the suction surface 53 is used. When the diameter of the winding part 55a of the air-core coil 55 is equal to the diameter of the winding part 55a, the curved part of the winding part 55a contacts the entire inner surface of the concave part 54, and the air-core coil 55 is held without rattling. Is done.

しかし、吸着面５３である凹面部５４の径よりも空芯コイル５５の巻回部５５ａの径が小さい場合、図１２に示すように、空芯コイル５５は、凹面部５４の端部（下端部）５４ａとの間に隙間が生じた状態で、巻回部５５ａの頂部が頂部線Ｃ１に位置する吸着孔５２によって吸着されるため、空芯コイル５５の保持が不安定であるばかりか、振動や衝撃によって空芯コイル５５の位置ずれを生じる。   However, when the diameter of the winding portion 55a of the air-core coil 55 is smaller than the diameter of the concave surface portion 54 that is the suction surface 53, the air-core coil 55 is connected to the end portion (lower end) of the concave surface portion 54 as shown in FIG. Part) 54a in a state where a gap is formed between the coiled part 55a and the top part of the winding part 55a is adsorbed by the adsorption hole 52 located on the top line C1, so that the holding of the air-core coil 55 is unstable. The displacement of the air-core coil 55 is caused by vibration or impact.

特許第３３５５５６６号公報Japanese Patent No. 3355666

従来の電子部品の吸着ノズル構造は、吸着孔５２が吸着面５３である凹面部５４の頂部線Ｃ１上に形成されているため、凹面部５４の径よりも空芯コイル５５の巻回部５５ａの径が小さい場合、コイル５５は、凹面部５４の端部（下端部）５４ａとの間に隙間が生じた状態で、巻回部５５ａの頂部が頂部線Ｃ１に位置する吸着孔５２によって吸着され、従って、空芯コイル５５の保持が不安定であるばかりか、振動や衝撃によって空芯コイル５５の位置ずれを生じるという問題がある。   In the conventional suction nozzle structure of an electronic component, the suction hole 52 is formed on the top line C1 of the concave surface portion 54 that is the suction surface 53, so that the winding portion 55a of the air-core coil 55 is larger than the diameter of the concave surface portion 54. When the diameter of the coil 55 is small, the coil 55 is adsorbed by the adsorbing hole 52 in which the top of the winding portion 55a is located on the top line C1 in a state where a gap is generated between the coil 55 and the end (lower end) 54a of the concave surface portion 54. Therefore, not only is the holding of the air core coil 55 unstable, but there is a problem that the air core coil 55 is displaced due to vibration or impact.

そこで、本発明は電子部品の吸着が安定して、位置ずれの無い電子部品の吸着ノズル構造を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component suction nozzle structure in which electronic component suction is stable and no positional deviation occurs.

上記課題を解決するための第１の解決手段として、電子部品吸着用の凹状面からなる吸着面が下部に設けられると共に、前記吸着面に到る状態で吸着孔が設けられた筒状の吸着ノズルを備え、前記吸着面は、前記吸着ノズルが延びる方向の軸芯線に対して直交する方向に長手方向を位置づけて設けられ、かつ、この長手方向の全域にわたって同一の径を有した半円筒形状の凹面部で形成されると共に、前記吸着面は、前記凹面部の頂部に位置し、かつ、その長手方向に延びる頂部線によって前記凹面部が２分される第１，第２の凹面を有し、前記吸着孔は、前記凹面部の長手方向では前記頂部線上を避け、前記頂部線から離れた位置の前記頂部線から等しい距離で、前記頂部線を挟んで前記第１，第２の凹面にそれぞれ配置された構成とした。 As a first means for solving the above problems, a cylindrical suction surface in which a suction surface made of a concave surface for suctioning electronic components is provided at the lower portion and suction holes are provided in a state reaching the suction surface. a nozzle, the suction surface, the provided position the longitudinal in a direction orthogonal to the direction of the axial line of the suction nozzle extends, and a semicircular cylinder having a same diameter over the entire the longitudinal together are formed in the shape of the concave portion, the suction surface is located on top of the concave portion, and first, second concave the concave portion is 2 minutes by the top lines extending in the longitudinal direction And the suction hole avoids the top line in the longitudinal direction of the concave surface part, and is at the same distance from the top line at a position away from the top line and sandwiches the first line and the second line across the top line. The configuration is arranged on the concave surface of each

また、第２の解決手段として、前記第１，第２の凹面に設けられた前記吸着孔は、前記軸芯線に対して対称する位置に設けられた構成とした。
また、第３の解決手段として、前記吸着孔は、前記第１，第２の凹面のそれぞれ複数個設けられた構成とした。 As a second solution, the suction holes provided in the first and second concave surfaces are provided at positions symmetrical with respect to the axis.
Further, as a third solving means, the suction hole is provided with a plurality of the first and second concave surfaces.

本発明の電子部品の吸着ノズル構造は、電子部品吸着用の凹状面からなる吸着面が下部に設けられると共に、吸着面に到る状態で吸着孔が設けられた筒状の吸着ノズルを備え、吸着面は、吸着ノズルが延びる方向の軸芯線に対して直交する方向に設けられた半円形状の凹面部で形成されると共に、吸着面は、凹面部の頂部に位置する頂部線によって凹面部が２分される第１，第２の凹面を有し、吸着孔は、頂部線から離れた位置の頂部線から等しい距離で、頂部線を挟んで第１，第２の凹面にそれぞれ配置されたため、電子部品は、頂部を挟んで両側の曲部が吸着孔によって吸着されるようになって、電子部品の吸着が安定すると共に、振動や衝撃によっても位置ずれのない吸着ができる。   The electronic component suction nozzle structure of the present invention includes a cylindrical suction nozzle having a suction surface formed of a concave surface for electronic component suction at the bottom and provided with suction holes in a state reaching the suction surface, The suction surface is formed by a semicircular concave surface portion provided in a direction orthogonal to the axial center line in the direction in which the suction nozzle extends, and the suction surface is a concave surface portion by a top line located at the top portion of the concave surface portion. The suction holes are arranged on the first and second concave surfaces across the top line at an equal distance from the top line at a position away from the top line. For this reason, the curved parts on both sides of the top part of the electronic component are attracted by the suction holes, so that the electronic component is stably attracted and can be attracted without displacement due to vibration or impact.

また、第１，第２の凹面に設けられた吸着孔は、軸芯線に対して対称する位置に設けられたため、吸着孔形成位置の精度を良好にできる。   Further, since the suction holes provided in the first and second concave surfaces are provided at positions symmetrical with respect to the axial center line, the accuracy of the suction hole forming position can be improved.

また、吸着孔は、第１，第２の凹面のそれぞれ複数個設けられたため、電子部品の吸着がより安定すると共に、振動や衝撃によっても一層位置ずれのない吸着ができる。   In addition, since a plurality of suction holes are provided for each of the first and second concave surfaces, the suction of the electronic components is more stable, and the suction can be performed without further displacement due to vibration or impact.

本発明の電子部品の吸着ノズル構造の図面を説明すると、図１は本発明の電子部品の吸着ノズル構造の第１実施例に係る正面図、図２は本発明の電子部品の吸着ノズル構造の第１実施例に係り、正面から見た断面図、図３は本発明の電子部品の吸着ノズル構造の第１実施例に係る下面図、図４は本発明の電子部品の吸着ノズル構造の第１実施例に係る側面図、図５は本発明の電子部品の吸着ノズル構造の第１実施例に係り、側面から見た断面図である。
、 FIG. 1 is a front view according to a first embodiment of the suction nozzle structure of the electronic component of the present invention, and FIG. 2 is a view of the suction nozzle structure of the electronic component of the present invention. FIG. 3 is a bottom view according to the first embodiment of the suction nozzle structure of the electronic component of the present invention, and FIG. 4 is a first view of the suction nozzle structure of the electronic component of the present invention. FIG. 5 is a side view according to the first embodiment, and FIG. 5 is a sectional view of the electronic component suction nozzle structure according to the first embodiment of the present invention as seen from the side.
,

また、図６は本発明の電子部品の吸着ノズル構造の第１実施例に係り、凹面部よりも径の小さい空芯コイルを吸着した状態を示す説明図、図７は本発明の電子部品の吸着ノズル構造の第２実施例に係る下面図、図８は本発明の電子部品の吸着ノズル構造の第３実施例に係る下面図である。   FIG. 6 relates to the first embodiment of the suction nozzle structure of the electronic component of the present invention, and is an explanatory view showing a state in which an air core coil having a diameter smaller than the concave portion is sucked, and FIG. 7 shows the electronic component of the present invention. FIG. 8 is a bottom view according to the third embodiment of the suction nozzle structure of the electronic component of the present invention.

次に、本発明の電子部品の吸着ノズル構造の第１実施例に係る構成を図１〜図５に基づいて説明すると、筒状の吸着ノズル１は、内部に設けられた吸着孔２と、下部に設けられた電子部品吸着用の凹状面からなる吸着面３を有する。   Next, the configuration according to the first embodiment of the suction nozzle structure of the electronic component of the present invention will be described with reference to FIGS. 1 to 5. The cylindrical suction nozzle 1 includes a suction hole 2 provided inside, It has a suction surface 3 formed of a concave surface for sucking electronic components provided in the lower part.

更に詳述すると、吸着面３は、吸着ノズル１の延びる方向の軸芯線Ｇに対して直交する方向に設けられた半円形状の凹面部４で形成されると共に、吸着面３は、凹面部４の頂部に位置する頂部線Ｃによって凹面部４が２分される第１，第２の凹面４ａ、４ｂを有する。   More specifically, the suction surface 3 is formed by a semicircular concave surface portion 4 provided in a direction orthogonal to the axial line G in the direction in which the suction nozzle 1 extends, and the suction surface 3 is a concave surface portion. 4 has a first concave surface 4a and a second concave surface 4b, which are divided into two by a top line C located at the top.

また、吸着孔２は、頂部線Ｃから離れた位置の頂部線Ｃから等しい距離で、頂部線Ｃを挟んだ状態で第１，第２の凹面４ａ、４ｂのそれぞれに１個ずつ配置されている。
そして、この２個の吸着孔２は、凹面部４に到るように形成されると共に、軸芯線Ｇに対して対称位置で、且つ、頂部線Ｃに対して直交する一直線上に配置されている。 In addition, one suction hole 2 is arranged on each of the first and second concave surfaces 4a and 4b with the top line C sandwiched between the top line C at a distance away from the top line C. Yes.
The two suction holes 2 are formed so as to reach the concave surface portion 4 and are arranged in a symmetric position with respect to the axial line G and on a straight line perpendicular to the top line C. Yes.

電子部品である空芯コイル５は、円形状に巻回された巻回部５ａと、この巻回部５ａの両端部に設けられた端子部５ｂを有している。
そして、空芯コイル５を所定の位置（例えば、プリント基板）に搬送する場合、空芯コイル５は、端子部５ｂを下方にした状態で部品供給装置（図示せず）に送られると共に、空芯コイル５の巻回部５ａの上方に吸着ノズル１が移動して、頂部線Ｃから離れた位置にある２個の吸着孔２によって、巻回部５ａの頂部を挟んで両側の曲部を吸着し、且つ、吸着面３である凹面部４で巻回部５ａを保持した状態で、所定の位置に搬送されるようになっている。 The air-core coil 5 which is an electronic component has a winding part 5a wound in a circular shape and terminal parts 5b provided at both ends of the winding part 5a.
When the air-core coil 5 is transported to a predetermined position (for example, a printed board), the air-core coil 5 is sent to a component supply device (not shown) with the terminal portion 5b facing downward, The suction nozzle 1 moves above the winding part 5a of the core coil 5, and the two curved holes on both sides of the top part of the winding part 5a are sandwiched by the two suction holes 2 located away from the top line C. It is sucked and conveyed to a predetermined position in a state where the winding part 5a is held by the concave part 4 that is the suction surface 3.

通常、吸着ノズルは、径の異なる空芯コイル５に兼用されるようになっており、本発明の吸着ノズル１も径の異なる空芯コイル５に兼用される。
そして、吸着面３である凹面部４の径と空芯コイル５の巻回部５ａの径が同等である場合、巻回部５ａの曲部が凹面部４の内面全体に当接して、空芯コイル５がガタツキを生じることなく保持される。 Usually, the suction nozzle is also used as an air core coil 5 having a different diameter, and the suction nozzle 1 of the present invention is also used as an air core coil 5 having a different diameter.
And when the diameter of the concave surface part 4 which is the adsorption surface 3 and the diameter of the winding part 5a of the air-core coil 5 are equivalent, the curved part of the winding part 5a contacts the whole inner surface of the concave surface part 4, and empty The core coil 5 is held without rattling.

また、吸着面３である凹面部４の径よりも空芯コイル５の巻回部５ａの径が小さい場合、図６に示すように、空芯コイル５は、凹面部４の端部（下端部）４ｃとの間に隙間が生じた状態で吸着されるが、この時、巻回部５ａは、頂部を挟んで両側の曲部の位置が２個の吸着孔２によって吸着されるようになって、空芯コイル５の吸着が安定すると共に、振動や衝撃によっても位置ずれのない吸着ができる。   Further, when the diameter of the winding portion 5a of the air-core coil 5 is smaller than the diameter of the concave surface portion 4 that is the attracting surface 3, the air-core coil 5 has an end portion (lower end) of the concave surface portion 4 as shown in FIG. Part) 4c is adsorbed in a state where there is a gap between them, and at this time, the winding part 5a is adsorbed by the two adsorbing holes 2 at the positions of the curved parts on both sides across the top. As a result, the suction of the air-core coil 5 is stabilized, and the suction without positional deviation can be achieved even by vibration or impact.

なお、上記実施例では、空芯コイル５からなる電子部品で説明したが、柱状のチップコンデンサや抵抗器等からなる電子部品に適用しても良い。   In the above embodiment, the electronic component including the air-core coil 5 has been described. However, the present invention may be applied to an electronic component including a columnar chip capacitor and a resistor.

また、図７は本発明の電子部品の吸着ノズル構造の第２実施例を示し、この第２実施例は、２個の吸着孔２が斜向かいの状態で、軸芯線Ｇに対して対称に配置されたものである。
その他の構成は、上記第１実施例と同様の構成を有し、同一部品に同一番号を付し、ここではその説明を省略する。 FIG. 7 shows a second embodiment of the suction nozzle structure for an electronic component according to the present invention. This second embodiment is symmetrical with respect to the axis G with the two suction holes 2 facing diagonally. It is arranged.
Other configurations are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

また、図８は本発明の電子部品の吸着ノズル構造の第３実施例を示し、この第３実施例は、第１，第２の凹面４ａ、４ｂのそれぞれに複数個（この実施例では２個）の吸着孔２が設けられ、これ等の吸着孔２が軸芯線Ｇに対して対称に配置されたものである。
その他の構成は、上記第１実施例と同様の構成を有し、同一部品に同一番号を付し、ここではその説明を省略する。
FIG. 8 shows a third embodiment of the suction nozzle structure for an electronic component according to the present invention. This third embodiment includes a plurality (two in this embodiment) of the first and second concave surfaces 4a and 4b. ) Suction holes 2 are provided, and these suction holes 2 are arranged symmetrically with respect to the axis G.
Other configurations are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

本発明の電子部品の吸着ノズル構造の第１実施例に係る正面図。The front view which concerns on 1st Example of the suction nozzle structure of the electronic component of this invention. 本発明の電子部品の吸着ノズル構造の第１実施例に係り、正面から見た断面図。The sectional view seen from the front concerning the 1st example of the adsorption nozzle structure of the electronic parts of the present invention. 本発明の電子部品の吸着ノズル構造の第１実施例に係る下面図。The bottom view which concerns on 1st Example of the suction nozzle structure of the electronic component of this invention. 本発明の電子部品の吸着ノズル構造の第１実施例に係る側面図。The side view which concerns on 1st Example of the suction nozzle structure of the electronic component of this invention. 本発明の電子部品の吸着ノズル構造の第１実施例に係り、側面から見た断面図。The sectional view seen from the side concerning the 1st example of the adsorption nozzle structure of the electronic parts of the present invention. 本発明の電子部品の吸着ノズル構造の第１実施例に係り、凹面部よりも径の小さい空芯コイルを吸着した状態を示す説明図。Explanatory drawing which shows the state which concerns on 1st Example of the suction nozzle structure of the electronic component of this invention, and adsorb | sucked the air-core coil whose diameter is smaller than a concave surface part. 本発明の電子部品の吸着ノズル構造の第２実施例に係る下面図。The bottom view which concerns on 2nd Example of the suction nozzle structure of the electronic component of this invention. 本発明の電子部品の吸着ノズル構造の第３実施例に係る下面図。The bottom view which concerns on 3rd Example of the suction nozzle structure of the electronic component of this invention. 従来の電子部品の吸着ノズル構造に係り、側面から見た断面図。Sectional drawing seen from the side regarding the suction nozzle structure of the conventional electronic component. 従来の電子部品の吸着ノズル構造に係り、正面から見た断面図。Sectional drawing seen from the front in connection with the suction nozzle structure of the conventional electronic component. 従来の電子部品の吸着ノズル構造を示す下面図。The bottom view which shows the suction nozzle structure of the conventional electronic component. 従来の電子部品の吸着ノズル構造に係り、凹面部よりも径の小さい空芯コイルを吸着した状態を示す説明図。Explanatory drawing which shows the state which concerns on the suction nozzle structure of the conventional electronic component, and adsorb | sucked the air-core coil whose diameter is smaller than a concave surface part.

符号の説明Explanation of symbols

１：吸着ノズル
２：吸着孔
３：吸着面
４：凹面部
４ａ：第１の凹面
４ｂ：第２の凹面
４ｃ：端部
Ｇ：軸芯線
Ｃ：頂部線
1: Adsorption nozzle 2: Adsorption hole 3: Adsorption surface 4: Concave surface portion 4a: First concave surface 4b: Second concave surface 4c: End portion G: Core wire C: Top line

Claims (3)

電子部品吸着用の凹状面からなる吸着面が下部に設けられると共に、前記吸着面に到る状態で吸着孔が設けられた筒状の吸着ノズルを備え、
前記吸着面は、
前記吸着ノズルが延びる方向の軸芯線に対して直交する方向に長手方向を位置づけて設けられ、かつ、この長手方向の全域にわたって同一の径を有した半円筒形状の凹面部で形成されると共に、前記凹面部の頂部に位置し、かつ、その長手方向に延びる頂部線によって前記凹面部が２分される第１，第２の凹面を有し、
前記吸着孔は、
前記凹面部の長手方向では前記頂部線上を避け、前記頂部線から離れた位置の前記頂部線から等しい距離で、前記頂部線を挟んで前記第１，第２の凹面にそれぞれ配置されたことを特徴とする電子部品の吸着ノズル構造。 A suction surface composed of a concave surface for electronic component suction is provided at the bottom, and includes a cylindrical suction nozzle provided with suction holes in a state reaching the suction surface,
The adsorption surface is
The provided positioned in the longitudinal direction in a direction orthogonal to the direction of the axial line of the suction nozzle extends, and are formed by the concave portion of the longitudinal direction have the same diameter over the entire semicircular cylindrical shape Doo both located at the top of the concave portion, and having a first, second concave the concave portion is 2 minutes by the top lines extending in the longitudinal direction,
The adsorption hole is
In the longitudinal direction of the concave surface portion, avoiding the top line and being disposed on the first and second concave surfaces across the top line at an equal distance from the top line at a position away from the top line. Features a suction nozzle structure for electronic components. 前記第１，第２の凹面に設けられた前記吸着孔は、前記軸芯線に対して対称する位置に設けられたことを特徴とする請求項１記載の電子部品の吸着ノズル構造。 2. The suction nozzle structure for an electronic component according to claim 1, wherein the suction hole provided in the first and second concave surfaces is provided at a position symmetrical to the axial line. 前記吸着孔は、前記第１，第２の凹面のそれぞれ複数個設けられたことを特徴とする請求項１、又は２記載の電子部品の吸着ノズル構造。
3. The suction nozzle structure for an electronic component according to claim 1, wherein a plurality of the suction holes are provided on each of the first and second concave surfaces.
JP2004204647A 2004-07-12 2004-07-12 Adsorption nozzle structure for electronic components Expired - Fee Related JP4322748B2 (en)

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JP4322748B2 true JP4322748B2 (en) 2009-09-02

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Publication number Priority date Publication date Assignee Title
JP2012204779A (en) * 2011-03-28 2012-10-22 Sony Corp Suction nozzle, mounting apparatus, mounting method of electronic components, and manufacturing method of mounting substrate

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