JP2000309328A - Tray and designing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably perform reception operation by a suction nozzle by determining lower and upper limit values of a size of a housing so that a tray has a predetermined clearance in longitudinal and lateral directions for an electronic component to be stored and so that the maximum rotation angle of the electronic component is a predetermined value or less. SOLUTION: When a square semiconductor electronic component 10 with a side of (a) is to be received in an approximately square housing 21 with a side of Y, the tray is designed so that the distance Y between opposite housing walls of the housing has a predetermined clearance C for the component 10, that is, Y>=a+C is satisfied. The clearance is preferably 0.5 mm or more. In addition, the distance Y is specified so that the maximum rotation angle θof the component is in a predetermined range or less, that is Y<=a.sinθ+a.cosθ is satisfied. The maximum rotation angle θ preferably 30 degree or less.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tray for storing semiconductor electronic components such as IC chips (hereinafter sometimes simply referred to as "electronic components"), and a method for designing the same.

[0002]

2. Description of the Related Art Electronic components mounted on a circuit board and constituting an electronic circuit board are generally stored in a tray and conveyed in a process until they are mounted on the circuit board.

FIG. 10 shows a method of forming a bump (protruding electrode) made of a metal such as gold or solder on an electrode of an electronic component before the electronic component is mounted on the circuit board in order to establish an electrical connection between the electronic component and the circuit board. 1 is a schematic perspective view of an example of the bump bonding apparatus of FIG.

In FIG. 10, reference numerals 900a and 900b denote trays, reference numeral 918 denotes an electronic component, reference numeral 921 denotes a processing stage for mounting electronic components, and reference numeral 922 denotes an electronic component housed in the tray 900a, which is transferred to the processing stage 921. A transfer device for transferring electronic components on the processing stage 921 to the tray 900b, 923 is a capillary for forming a bump on an electrode on the upper surface of the electronic component 918, and 924 is a bump material supplied to the capillary 923. Is a gold wire reel on which the gold wire is wound.

The electronic components supplied while being stored in the tray 900a are transferred one by one to the processing stage 921 by the transfer device 922. The transfer device 922 is provided with a suction nozzle at the tip, vacuum-suctions and lifts the upper surface of the electronic component, and transfers the electronic component while being sucked by the suction nozzle. On the processing stage 921, bumps are formed on the electrodes on the upper surface of the electronic component 918 using the capillary 923. After that, the electronic component 918 is sucked again by the transfer device 922, transferred and stored on the tray 900b.

FIG. 11 is a perspective view showing a schematic configuration of an example of a general tray. As shown, the tray 90
No. 0 has a storage section 901 partitioned by a storage wall 902 formed in a grid pattern. The number of storage portions 901 formed in one tray is not limited to four as shown in FIG. 11, but may be three or less, or five or more. Electronic components having a substantially rectangular planar shape are stored one by one in one storage unit 901 of the tray shown in FIG. 11 and transported in the process.

FIG. 12 is a schematic view of an example of a suction nozzle for sucking an electronic component. FIG.
(B) is a bottom view. In FIG. 12, reference numeral 910 denotes a suction nozzle; 911, a suction surface having a substantially rectangular planar shape;
Reference numerals a and 912b denote inclined surfaces formed on two opposite sides of the suction surface 911, 913 denotes a suction hole, and 914 denotes a positioning notch. An arrow 915 indicates the direction of suction of air in the suction hole 913, and a suction pump is connected in the direction of the arrow. A two-dot chain line 918 is an electronic component having a substantially rectangular planar shape.

FIG. 13 is a cross-sectional view showing a state in which the electronic component 918 stored in the storage section 901 of the tray 900 is sucked by the suction nozzle 910. The suction surface 911 of the suction nozzle 910 is aligned with the storage unit 901 of the tray,
By sucking air in the direction of arrow 915, a negative pressure is generated between the upper surface of electronic component 918 and suction surface 911, and electronic component 918 is sucked by suction surface 911 of suction nozzle 910.

The interval between the opposite storage walls 902 of the tray 900 is set to be slightly larger than the outer diameter of the electronic component 918, so that the electronic component 918 is offset to one of the storage walls 902 in the storage portion 901, It rotates with respect to the storage wall 902. Suction surface 9 of suction nozzle 910
The inclined surfaces 912a and 912b formed on the surface 11 correct such deviation or rotation of the electronic component during suction (a function of correcting the inclined surface). As a result, as shown in FIG. 12, the electronic component is almost at the center of the suction surface 911 of the suction nozzle 910.
A pair of opposing sides of the electronic component are inclined surfaces 912a, 912
Adsorbed substantially in parallel with b.

[0010]

However, the outer diameters of electronic components used in actual processes are diversified, and unless a tray having a storage unit size corresponding to the outer diameter of the electronic components is used, the following will occur. Problem arises.

If the size of the storage portion is too large relative to the size of the electronic component, the degree to which the electronic component is shifted or rotated to one side in the storage portion becomes larger.

FIG. 14 is a side view showing a state in which an electronic component which is largely deviated to one side in the storage unit is sucked.
The electronic component 918 is sucked while protruding outside the outer peripheral end of the inclined surface 912b. In such a case, the above-described function of correcting the inclined surface does not function effectively.

FIG. 15 is a view showing a state in which the electronic component which has been largely rotated in the storage section is sucked.
FIG. 15A is a side view, and FIG. 15B is a bottom view. The electronic component 918 is sucked while protruding outside the outer peripheral ends of the inclined surfaces 912a and 912b. In such a case, the above-described function of correcting the inclined surface does not function effectively.

When the electronic component sucked in the state shown in FIGS. 14 and 15 is transferred to a predetermined processing stage, the electronic component cannot be placed at a predetermined position on the processing stage in a predetermined direction. Cause trouble.

On the other hand, if the size of the storage section is too small with respect to the size of the electronic component, the following problem occurs.

FIG. 16 is a cross-sectional view showing a state where the electronic component 918 sucked slightly shifted from the suction nozzle 910 has been conveyed to the storage section 901 of the tray. The distance between the opposite storage walls 902 of the tray is determined by the electronic components 918.
Is formed to be slightly larger than the outer diameter dimension of. Accordingly, if the electronic component 918 is sucked with a slight shift with respect to the suction nozzle 910, even if the suction nozzle 910 is accurately positioned on the tray storage section 901, the electronic component 918 will be placed on the upper surface of the tray storage wall 902. Part 9
The electronic component cannot be stored in the storage portion 901 because the lower surface of the electronic component 18 contacts the storage portion 901. Therefore, for example, in the case where the electronic component is transferred from the processing stage to the storage portion of the tray, there is a problem that the electronic component cannot be stored in the storage portion.

The problem of picking up the electronic component from the storage section shown in FIGS. 14 and 15 is considered when the shift and the rotation angle of the electronic component are detected and the suction nozzle is aligned with the storage section. This can be solved by performing the correction described above. In addition, the problem of storing the electronic component in the storage unit illustrated in FIG. 16 can be solved by detecting the suction state of the electronic component and performing a correction that takes this into account when positioning the suction nozzle in the storage unit. be able to. However, all of these methods complicate the apparatus and increase the cost.

According to the present invention, there is provided a tray in which electronic components stored in a tray can be sucked by a suction nozzle and electronic components sucked by the suction nozzle can be stored in the tray in a simple manner without the above-mentioned problems. And a method for designing such a tray.

[0019]

The present invention has the following configuration to achieve the above object.

That is, the tray according to the first configuration of the present invention includes a storage portion formed by a storage wall, and is a tray for storing and using semiconductor electronic components in the storage portion. The one side is a substantially square of Y, and the semiconductor electronic component housed in the housing part is a substantially square of a side, and the clearances in the vertical and horizontal directions are C (C> C).
0), the following relationship is satisfied.

[0021]

[Formula 7] Y ≧ a + C

According to this configuration, the operation of storing the electronic component in the storage section by the suction nozzle can be reliably performed.

Further, the tray according to the second configuration of the present invention is provided with a storage section formed by a storage wall, and is a tray for storing and using semiconductor electronic components in the storage section. When one side is a substantially square of Y, and the semiconductor electronic component housed in the housing portion is a substantially square of a side, and the maximum rotation angle of the semiconductor electronic component in the housing portion is θ, Is satisfied.

[0024]

[Equation 8] Y ≦ a · sin θ + a · cos θ

According to this configuration, the electronic components stored in the storage section can be suctioned by the suction nozzle and transferred to the processing stage without any problem.

A tray according to a third aspect of the present invention is provided with a storage section formed by a storage wall, and is a tray for storing and using semiconductor electronic components in the storage section. The one side is a substantially square of Y, and the semiconductor electronic component housed in the housing part is a substantially square of a side, and the clearances in the vertical and horizontal directions are C (C> C).
0), wherein the following relationship is satisfied when the maximum rotation angle of the semiconductor electronic component in the storage portion is θ.

[0027]

## EQU9 ## a + C ≦ Y ≦ a · sin θ + a · cos θ

According to this configuration, the electronic components housed in the tray are sucked by the suction nozzle and transferred to the processing stage, and the electronic components on the processing stage are sucked by the suction nozzle and stored in the tray in a predetermined manner. A series of operations of storing in a unit can be performed without any problem.

Further, a tray according to a fourth configuration of the present invention is provided with a storage section formed by a storage wall, and is a tray for storing and using semiconductor electronic components in the storage section. The semiconductor electronic component housed in the housing portion is a substantially rectangular shape having a width of a and a height of b, and the clearances in the horizontal and vertical directions are respectively C1, C2. When (C1> 0, C2> 0), the following relationship is satisfied.

[0030]

X ≧ a + C1 Y ≧ b + C2

According to this configuration, the operation of storing the electronic component in the storage section by the suction nozzle can be reliably performed.

A tray according to a fifth aspect of the present invention is provided with a storage section formed by a storage wall, and is a tray for storing and using semiconductor electronic components in the storage section. The semiconductor electronic component accommodated in the storage part is a substantially rectangular shape having a width a and a height b, and a maximum rotation of the semiconductor electronic component in the storage part. When the angle is θ, the following relationship is satisfied.

[0033]

X ≦ a · cos θ + b · sin θ Y ≦ b · cos θ + a · sin θ

According to such a configuration, the electronic component stored in the storage section can be suctioned by the suction nozzle and transferred to the processing stage without any problem.

A tray according to a sixth aspect of the present invention includes a storage section formed by a storage wall, and is a tray for storing and using semiconductor electronic components in the storage section. The semiconductor electronic component housed in the housing portion is a substantially rectangular shape having a width of a and a height of b, and the clearances in the horizontal and vertical directions are respectively C1, C2. (C1> 0, C2> 0), and the following relationship is satisfied when the maximum rotation angle of the semiconductor electronic component in the housing portion is θ.

[0036]

A + C1 ≦ X ≦ a · cos θ + b · sin θ b + C2 ≦ Y ≦ b · cos θ + a · sin θ

According to this configuration, the electronic components stored in the tray are sucked by the suction nozzles and transferred to the processing stage, and the electronic components on the processing stage are sucked by the suction nozzles and stored in the tray. A series of operations of storing in a unit can be performed without any problem.

Further, the tray designing method according to the first configuration of the present invention is a substantially rectangular storage portion for storing a substantially rectangular semiconductor electronic component (including both a square and a rectangle; the same applies hereinafter). A method of designing a tray comprising: determining a lower limit value of the size of the storage unit so as to have a predetermined clearance in a vertical direction and a horizontal direction with respect to the stored semiconductor electronic component. I do. According to this configuration, it is possible to provide a tray that can reliably perform an operation of storing the electronic component in the storage unit by the suction nozzle.

A tray designing method according to a second configuration of the present invention is a tray designing method having a substantially rectangular storage portion for storing a substantially rectangular semiconductor electronic component, wherein the tray is provided within the storage portion. The upper limit value of the size of the housing portion is determined so that the maximum rotation angle of the semiconductor electronic component is equal to or less than a predetermined value. According to this configuration, it is possible to provide a tray capable of sucking the electronic components stored in the storage unit with the suction nozzle and transferring the electronic components to the processing stage without any problem.

A third aspect of the present invention is a tray designing method for designing a tray having a substantially rectangular storage portion for storing a substantially rectangular semiconductor electronic component. The lower limit value of the size of the storage portion is determined so as to have a predetermined clearance in the vertical direction and the horizontal direction with respect to the semiconductor electronic component, and the maximum rotation angle of the semiconductor electronic component in the storage portion is equal to or less than a predetermined value. The upper limit value of the size of the storage portion is determined so as to be as follows. According to this configuration, the electronic components stored in the tray are suctioned by the suction nozzle and transferred to the processing stage, and the electronic components on the processing stage are suctioned by the suction nozzle and stored in the predetermined storage portion of the tray. It is possible to provide a tray capable of performing a series of operations without performing any problem. By preparing a finite number of trays in which the sizes of the storage units are changed stepwise at appropriate intervals according to the present design method, any number of electronic components of any size can be stored in these finite number of trays. There is always at least one tray that is most suitable for the application. Therefore, it is not necessary to prepare trays by the number of electronic components.

[0041]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be specifically described with reference to the embodiments of the present invention.

(Embodiment 1) A case will be described in which the planar shape of each of the storage portions for the electronic components and the tray is square.

The space between the opposite storage walls of the storage portion of the tray is formed larger by a predetermined amount than the outer diameter of the electronic component. Due to the gap (“clearance”) between the outer peripheral end of the electronic component and the inner wall surface of the storage wall facing the electronic component, the electronic component is shifted or rotated to one side in the storage portion.

FIG. 1 is an enlarged plan view showing a state in which the electronic components stored in the storage portion of the tray are shifted to one side. FIG. 2 is an enlarged plan view showing a state in which the electronic components stored in the storage portion of the tray have rotated most. Figure 1,
In FIG. 2, reference numeral 10 denotes an electronic component having a square planar shape;
Reference numeral 1 denotes a tray storage section having a square planar shape, and reference numeral 22 denotes a tray storage wall. In FIG. 1, C is the clearance, and in FIG. 2, θ is the angle between the outer peripheral surface of the electronic component 10 and the inner surface of the tray storage wall 22 (hereinafter referred to as “rotation angle”; θ ≦ 45 °).

FIG. 3 shows a bump bonding apparatus (FIG. 10).
When the clearance C is variously changed, the electronic component on the processing stage is sucked by the suction nozzle, transported to the tray, and stored in the storage section of the tray.
FIG. 9 is a diagram illustrating a relationship between a clearance C and a success rate of a storing operation. As the electronic parts, one having a side of 6 mm and one having a side of 12 mm were used, and the clearance was changed for each electronic part 100,000 times each. The results shown in FIG. 3 were obtained for all the electronic components. When the clearance is small, as shown in FIG. 16, even if the electronic component is slightly shifted and sucked by the suction nozzle, the electronic component cannot be stored in the storage unit. From the results in FIG. 3, it can be seen that when the clearance is less than 0.5 mm, the success rate of the storing operation sharply decreases.

FIG. 4 shows the rotation angle θ and the success rate of the suction operation when the operation of sucking the electronic components stored in the tray storage portion by the suction nozzle is performed while changing the rotation angle θ of the electronic components. FIG. Here, the success of the suction operation means that the rotation of the electronic component is corrected by the correction function of the inclined surface of the suction nozzle, and the electronic component is transferred to the processing stage in a predetermined direction without any problem. As the electronic components, one having a side of 6 mm and one having a side of 12 mm were used, and each electronic component was performed 100,000 times while changing the rotation angle. The results shown in FIG. 4 were obtained for all the electronic components. When the rotation angle is increased, the function of correcting the inclined surface is not exhibited, and the electronic component is sucked in the state shown in FIG. 15 and is placed on the processing stage while being rotated. From the results in FIG. 4, it can be seen that when the rotation angle exceeds 30 degrees, the rotation angle of the electronic component is not corrected, which hinders the process after transfer by the suction nozzle.

From the above results, the electronic components housed in the tray are sucked by the suction nozzle and transferred to the processing stage. After performing a predetermined process on the processing stage, the electronic components are suctioned again by the suction nozzle and the tray In order to perform a series of operations of storing in a predetermined storage part without any problem, the clearance of the storage part with respect to the electronic component is 0.5 mm or more,
In addition, it is necessary to use a tray having a storage unit designed so that the rotation angle θ is 30 degrees or less.

FIG. 5 shows a storage section 21 having a square shape of Y on one side.
FIG. 3 is a plan view showing a state in which a square electronic component 10 having a side a is housed. Electronic component 10 shown by solid line
Is the maximum rotation angle θ so that the four corners contact the inner wall of the storage wall
Indicates a rotating state, and indicates a state in which the electronic component 10 indicated by the two-dot chain line is offset to the lower left corner of the storage unit.

Here, in order to reliably perform the operation of storing the electronic component 10 in the storage portion 21 by the suction nozzle, the interval Y between the storage walls facing the storage portion has a predetermined clearance C with respect to the electronic component. That is, it is necessary to configure so as to satisfy Y ≧ a + C. In particular, as described with reference to FIG. 3, since the clearance C is preferably 0.5 mm or more, it is preferable to satisfy Y ≧ a + 0.5 (mm).

The electronic component 1 stored in the storage section 21
In order to adsorb 0 by the adsorption nozzle and transfer it to the processing stage in a predetermined direction without any problem, the interval Y between the opposing storage walls of the storage unit is set so that the maximum rotation angle θ of the electronic component is equal to or smaller than a predetermined range. In other words, it is necessary to configure so as to satisfy Y ≦ a · sin θ + a · cos θ. Particularly, as described with reference to FIG. 4, it is preferable that the maximum rotation angle θ is 30 degrees or less.
It is preferable to satisfy ≦ a · sin 30 ° + a · cos 30 °.

As described above, the planar shape of the storage portion of the tray suitable for an electronic component whose planar shape is a square whose one side is a is a square whose side is Y (mm) which satisfies the following expression.

[0052]

A + 0.5 ≦ Y ≦ a · sin 30 ° + a · cos 30 °

When the above [Equation 13] is modified, the following is obtained.

## EQU14 ## Y / (sin 30 ° + cos 30 °) ≦ a ≦ Y−0.5

As is apparent from the above [Equation 14], a satisfying [Equation 14] when Y is a specific value Y1.
Has a constant width. This means that there is a wide range of electronic component sizes that fit in a tray with a certain size of storage. That is, according to the present invention, it is not necessary to prepare trays in accordance with the size of the electronic components by the number of the sizes of the electronic components. If a finite number of trays in which the size Y of the storage section is changed stepwise at appropriate intervals are prepared, no matter how the size a of the electronic component changes, the tray always fits any one of the trays. Therefore, for electronic components of all sizes in a finite number of trays, the electronic components stored in the tray are always sucked by the suction nozzle and transferred to the processing stage, and after performing a predetermined process on the processing stage, Thus, a series of operations of sucking again into the suction nozzle and storing it in the predetermined storage portion of the tray can be performed without any problem. As a result, the storage space for the trays can be reduced, and the increase in cost due to manufacturing a large number of trays can be suppressed.

(Embodiment 2) The planar shape of the electronic component is a rectangle of width a × length b, and the storage portion of the tray is width X × length Y.
Will be described. Where X = a
+ C1, Y = b + C2 (C1, C2 are clearances in the horizontal and vertical directions, respectively).

In the present embodiment, as in the first embodiment, it is preferable that the clearances C1, C2 are 0.5 mm or more. If the clearances C1 and C2 are smaller than this, it becomes difficult to store the electronic components in the storage section even if the electronic components are slightly shifted by the suction nozzle and sucked.
The success rate of the storing operation drops sharply.

Also, as in the first embodiment, it is preferable that the rotation angle θ of the electronic component in the storage portion is 30 degrees or less. If the rotation angle θ is larger than this, the function of correcting the inclined surface of the suction nozzle is not exhibited, and the electronic component is mounted on the processing stage while being rotated, and the process after transfer by the suction nozzle is performed. It causes trouble.

Therefore, the electronic components stored in the tray are sucked by the suction nozzle and transferred to the processing stage, and after performing a predetermined process on the processing stage, the electronic components are suctioned again by the suction nozzle and stored in the tray in a predetermined manner. In order to perform a series of operations of storing the components in the tray without any problem, the clearances C1 and C2 of the tray storage portion with respect to the electronic components should be 0.5 mm or more and the rotation angle θ should be 30 degrees or less. It is necessary to use trays with designed storage.

FIG. 6 is a plan view showing a state in which a rectangular electronic component 10 having a width a and a length b is stored in a rectangular storage portion 21 having a width X and a length Y. The electronic component 10 indicated by a solid line indicates a state in which the four corners are rotated at the maximum rotation angle θ so that the four corners contact the inner wall of the storage wall, and the electronic component 10 indicated by the two-dotted line is offset to the lower left corner of the storage unit. It shows the state where it was turned on.

Here, in order to reliably perform the operation of storing the electronic component 10 in the storage portion 21 by the suction nozzle, the distances X and Y between the storage walls facing the storage portion should be a predetermined clearance C1 with respect to the electronic component. , C2, ie, X ≧ a
+ C1 and Y≥b + C2. Especially, clearance C1 and C2 are both 0.5.
mm or more, X ≧ a + 0.5
(Mm) and Y ≧ b + 0.5 (mm).

The electronic component 1 stored in the storage section 21
In order to adsorb 0 with the suction nozzle and transfer it to the processing stage in a predetermined direction without any problem, the interval X, Y between the opposing storage walls of the storage unit must be set so that the maximum rotation angle θ of the electronic component is less than a predetermined range. That is, X ≦ a · cos θ + b · sin θ, and Y
It is necessary to be configured to satisfy ≦ b · cos θ + a · sin θ. In particular, since the maximum rotation angle θ is preferably 30 degrees or less, it is preferable to satisfy X ≦ a · cos 30 ° + b · sin 30 ° and Y ≦ b · cos 30 ° + a · sin 30 °.

As described above, the planar shape of the tray storage portion suitable for an electronic component having a rectangular shape of horizontal a × vertical b is as follows.
It is a rectangle of width X × length Y (mm) that satisfies the following expression.

[0063]

A + 0.5 ≦ X ≦ a · cos 30 ° + b · sin 30 ° b + 0.5 ≦ Y ≦ b · cos 30 ° + a · sin 30 °

In the present embodiment, as in the first embodiment, if a finite number of trays in which the sizes X and Y of the storage portions are changed stepwise at appropriate intervals are prepared, electronic components can be manufactured. Regardless of how the sizes a and b change, they always fit in any of the trays. Therefore, for electronic components of all sizes in a finite number of trays, the electronic components stored in the tray are always sucked by the suction nozzle and transferred to the processing stage, and after performing a predetermined process on the processing stage, Thus, a series of operations of sucking again into the suction nozzle and storing it in the predetermined storage portion of the tray can be performed without any problem. As a result, the storage space for the trays can be reduced, and the increase in cost due to manufacturing a large number of trays can be suppressed.

(Embodiment 3) FIG. 7 is a diagram for explaining the configuration and functions of a tray according to this embodiment.
FIG. 7A is a plan view of the tray, and FIG. 7B is a cross-sectional view illustrating a state where electronic components housed in the tray are sucked.
In FIG. 7, 30 is a tray, 31 is a storage section for storing electronic components, 32 is a storage wall, 33 is a through hole, and 35 is a chamfer.

As shown in FIG. 7A, the tray 30 of the present embodiment has a chamfer 3 at one of the four corners of the outer peripheral surface.
Five. The chamfer 35 functions as a mark for confirming the direction of the tray. If the position of the chamfer 35 and the direction of the stored electronic components have regularity, the electronic components taken out from the tray can always be aligned in a fixed direction only by controlling the direction of the tray. .
In particular, in the tray of the present invention, since the maximum rotation angle of the electronic components in the storage portion is suppressed to a certain angle or less, the accuracy of the orientation of the electronic components taken out of the tray is further improved by a synergistic effect of the both.

The tray 30 is provided with a through hole 33 substantially at the center of the bottom surface of each storage section 31. FIG. 7 (b)
As shown in (2), the through-hole 33 is formed at a position and a size such that the through-hole 33 is located within the bottom surface of the electronic component 10 when the electronic component 10 is stored. When the electronic component 10 stored in the storage unit 31 is sucked by the suction nozzle 910, the bottom surface of the electronic component 10 does not become negative pressure due to the presence of the through-hole 33. As a result, a trouble that the suction nozzle 910 cannot suction the electronic component 10 is less likely to occur, and for example, in a bump bonding process, the yield due to a suction error can be improved.

FIG. 8 is a diagram showing another configuration of the tray according to the present embodiment. FIG. 8 (a) is a plan view, and FIG. 8 (b) is an arrow II in FIG. 8 (a). Sectional view seen from the direction, FIG. 8
FIG. 9C is a cross-sectional view showing another configuration, viewed from the same direction as FIG. 8B. 8, 40 is a tray, 41 is a storage unit for storing electronic components, 42 is a storage wall,
Reference numerals 44 and 44 'denote grooves formed so as to cross the storage wall 42 from the storage part 41, and reference numeral 45 denotes a chamfer.

As shown in FIGS. 8A and 8B, the tray 40 has grooves 44 formed in the storage walls 42 at the four corners of each storage portion 41. Therefore, when the electronic component stored in the storage section 41 is sucked by the suction nozzle, the air can easily flow around the electronic component through the groove 44, so that the bottom side of the electronic component does not easily become negative pressure. As a result, a trouble that the suction nozzle cannot suction the electronic component is less likely to occur.

Note that, as shown in FIG.
Is formed deeply so that the groove 44 ′ is also formed on the bottom surface of the storage portion 41, since air wrap around to the bottom surface side of the electronic component becomes better, which is preferable.

In this example, as shown in FIG. 8A, a chamfer 45 for confirming the direction of the tray is formed.

FIG. 9 is a plan view showing still another configuration of the tray of the present embodiment. As shown in FIG. 9, in the tray 50 of the present embodiment, grooves 54 are formed in four sides of the storage walls 52 surrounding the storage parts 51 so as to cross the storage walls 52. The tray 40 shown in FIG.
Is the same as 8, the air can easily flow around the electronic component through the groove 54, similarly to the tray 40 of FIG. 8, so that the bottom side of the electronic component is less likely to be under negative pressure. As a result, a trouble that the suction nozzle cannot suction the electronic component is less likely to occur.

The positions and widths of the grooves 54 need to be provided in consideration of the fact that the electronic parts stored in the storage portion 51 do not rotate and the corners thereof do not engage with the grooves 54. In the tray 40 shown in FIG. 8, the grooves 44 are provided at the four corners of the storage section, and it is not necessary to take this into account.

In this example, as shown in FIG. 9, a chamfer 55 for confirming the direction of the tray is formed.

In the trays of FIGS. 7 to 9 described above, the interval between the opposite storage walls forming the storage section is determined according to the first and second embodiments according to the size of the electronic components to be stored.

Further, the tray having four storage sections has been described as an example, but the present embodiment is not limited to this, and the number of storage sections may be smaller or larger. Further, the shape of the storage section may be any of a square and a rectangle.

Also, chamfering has been described as an example of a mark for confirming the direction of the tray, but the present embodiment is not limited to this, and it is possible to change to another configuration having the same function. . For example, instead of chamfering, a mark such as a concave portion (for example, a dent or a groove) or a convex portion (for example, a protrusion or a rib-like protrusion) may be provided, or a mark or coloring may be given by printing or the like. . Further, the position of the mark can be provided at an appropriate place such as the upper surface, the outer peripheral surface, or the lower surface of the peripheral wall of the tray.

[0078]

According to the present invention, the electronic components stored in the tray are sucked by the suction nozzle and transferred to the processing stage.
Further, it is possible to provide a tray capable of performing a series of operations of causing electronic components on a processing stage to be sucked by a suction nozzle and stored in a predetermined storage portion of the tray without any problem.

Further, by preparing a finite number of trays in which the sizes of the storage portions are changed stepwise at appropriate intervals in accordance with the design method of the present invention, these finite numbers of electronic components of any size can be prepared. There is always at least one optimal tray among the individual trays. Therefore, it is not necessary to prepare trays by the number of electronic components.

[Brief description of the drawings]

FIG. 1 is an enlarged plan view showing a state in which electronic components stored in a storage section of a tray are offset to one side.

FIG. 2 is an enlarged plan view showing a state in which electronic components stored in a storage portion of a tray have rotated most.

FIG. 3 is a diagram showing the relationship between the clearance and the success rate of the storing operation when the operation of storing the electronic component in the storing section of the tray using the suction nozzle is performed while changing the clearance variously.

FIG. 4 shows the relationship between the rotation angle and the success rate of the suction operation when the operation of sucking the electronic component stored in the storage portion of the tray to the suction nozzle is performed while changing the rotation angle of the electronic component. FIG.

FIG. 5 is a plan view showing a state in which a square electronic component having a side a is stored in a storage portion having a square Y. FIG.

FIG. 6 is a plan view showing a state in which a rectangular electronic component having a width of a and a height of b is stored in a rectangular storage portion having a width of X and a height of Y;

FIGS. 7A and 7B are diagrams for explaining the configuration and functions of a tray according to a third embodiment of the present invention. FIG. 7A is a plan view of the tray, and FIG. 7B is an electronic component housed in the tray. FIG. 4 is a cross-sectional view showing a state in which is absorbed.

8A and 8B are diagrams illustrating another configuration of the tray according to the third embodiment of the present invention. FIG. 8A is a plan view, and FIG. 8B is a view taken along a line II in FIG. 8A. Sectional view seen from the direction of the arrow, FIG.
(C) is sectional drawing which showed another structure.

FIG. 9 is a plan view showing still another configuration of the tray according to the third embodiment of the present invention.

FIG. 10 is a schematic perspective view of an example of a bump bonding apparatus for forming a bump on an electrode of an electronic component.

FIG. 11 is a perspective view showing a schematic configuration of an example of a conventional tray.

12A and 12B are schematic views of an example of a suction nozzle for sucking an electronic component, wherein FIG. 12A is a cross-sectional view and FIG. 12B is a bottom view.

FIG. 13 is a cross-sectional view illustrating a state in which electronic components housed in a housing section of the tray are sucked by a suction nozzle.

FIG. 14 is a side view showing a state where an electronic component that has been largely deviated to one side in the storage unit is sucked.

15A and 15B are diagrams illustrating a state where an electronic component that has been largely rotated in the storage unit is sucked, wherein FIG. 15A is a side view and FIG. 15B is a bottom view.

FIG. 16 is a cross-sectional view illustrating a state in which the electronic component sucked by the suction nozzle with a slight shift is conveyed to the storage unit of the tray.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electronic component 21 Storage part 22 Storage wall 30 Tray 31 Storage part 32 Storage wall 33 Through hole 35 Chamfer 40 Tray 41 Storage part 42 Storage wall 44,44 'Groove 45 Chamfer 50 Tray 51 Storage part 52 Storage wall 54 Groove 55 Chamfer 900 , 900a, 900b Tray 901 Storage unit 902 Storage wall 910 Suction nozzle 911 Suction surface 912a, 912b Inclined surface 913 Suction hole 914 Positioning notch 915 Air suction direction 918 Electronic component 921 Processing stage 922 Transfer device 923 Capillary 924 Gold wire reel

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Shinji Kanayama 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. (reference) 3E033 AA10 DE12 GA03 3E096 AA09 BA08 BB05 CA06 FA09 FA15 FA25 GA04

Claims (18)

[Claims] 1. A tray provided with a storage section formed by a storage wall, wherein a tray is used for storing semiconductor electronic components in the storage section, wherein the storage section has a substantially square shape with one side Y. Wherein the semiconductor electronic component accommodated in the tray is substantially square with one side a, and the following relationship is satisfied when clearances in the vertical and horizontal directions are C (C> 0). [Equation 1] Y ≧ a + C 2. A tray provided with a storage part formed by a storage wall, wherein the storage part is used to store semiconductor electronic components, wherein the storage part has a substantially square shape with one side Y. Wherein the semiconductor electronic component accommodated in the tray has a substantially square shape with one side a, and the following relationship is satisfied when the maximum rotation angle of the semiconductor electronic component in the accommodation portion is θ. [Equation 2] Y ≦ a · sin θ + a · cos θ 3. A tray provided with a storage section formed by a storage wall, wherein the storage section is used to store semiconductor electronic components, wherein the storage section has a substantially square shape with one side Y. The semiconductor electronic component accommodated in the housing is substantially square with one side a, the vertical and horizontal clearances are C (C> 0), and the maximum rotation angle of the semiconductor electronic component in the accommodation portion is θ. A tray which satisfies the following relationship at times. ## EQU3 ## a + C ≦ Y ≦ a · sin θ + a · cos θ 4. The tray according to claim 1, wherein the clearance C is 0.5 mm. 5. The tray according to claim 2, wherein the maximum rotation angle θ is 30 °. 6. A tray provided with a storage section formed by a storage wall, and storing and using semiconductor electronic components in the storage section, wherein the storage section has a substantially rectangular shape with a horizontal X and a vertical Y. The semiconductor electronic component accommodated in the accommodating portion is a substantially rectangular shape having a horizontal dimension of a and a vertical dimension of b, and the clearances in the horizontal and vertical directions are respectively C1, C2 (C1> 0, C2> 0).
And a tray satisfying the following relationship. [Expression 4] X ≧ a + C1 Y ≧ b + C2 7. A tray provided with a storage section formed by a storage wall, and storing and using semiconductor electronic components in the storage section, wherein the storage section is a substantially rectangular shape having a horizontal X and a vertical Y. The semiconductor electronic component housed in the housing is substantially rectangular with a horizontal and b vertical, and the following relationship is satisfied when the maximum rotation angle of the semiconductor electronic component in the housing is θ. Tray. X ≦ a · cos θ + b · sin θ Y ≦ b · cos θ + a · sin θ 8. A tray provided with a storage portion formed by a storage wall, wherein the storage portion is used to store semiconductor electronic components, and the storage portion is substantially rectangular with a horizontal X and a vertical Y. The semiconductor electronic component accommodated in the accommodating portion has a substantially rectangular shape having a horizontal a and a vertical b, and has clearances C1 and C2 (C1> 0, C2>) in the horizontal and vertical directions, respectively.
0), wherein the following relationship is satisfied when the maximum rotation angle of the semiconductor electronic component in the storage section is θ. A + C1 ≦ X ≦ a · cos θ + b · sin θ b + C2 ≦ Y ≦ b · cos θ + a · sin θ 9. The tray according to claim 6, wherein the clearances C1 and C2 are both 0.5 mm. 10. The tray according to claim 7, wherein the maximum rotation angle θ is 30 °. 11. The tray according to claim 1, wherein a through hole is provided in a bottom surface of the storage section. 12. The tray according to claim 1, wherein a groove is formed across the storage wall. 13. The tray according to claim 1, wherein a mark for confirming the direction of the tray is formed. 14. A method for designing a tray having a substantially rectangular storage portion for storing a substantially rectangular semiconductor electronic component,
A tray designing method for determining a lower limit value of the size of the storage portion so as to have a predetermined clearance in a vertical direction and a horizontal direction with respect to the semiconductor electronic component to be stored. 15. A method of designing a tray having a substantially rectangular storage portion for storing a substantially rectangular semiconductor electronic component,
A tray designing method for determining an upper limit value of the size of the storage portion such that a maximum rotation angle of the semiconductor electronic component in the storage portion is equal to or less than a predetermined value. 16. A method for designing a tray having a substantially rectangular accommodating portion for accommodating a substantially rectangular semiconductor electronic component,
The lower limit value of the size of the storage portion is determined so as to have a predetermined clearance in the vertical direction and the horizontal direction with respect to the stored semiconductor electronic component, and a maximum rotation angle of the semiconductor electronic component in the storage portion is determined. A tray designing method for determining an upper limit value of the size of the storage portion so as to be equal to or less than a predetermined value. 17. The tray designing method according to claim 14, wherein the lower limit value of the size of the storage section is determined so that the clearance is 0.5 mm or more. 18. An upper limit value of the size of the storage portion is determined so that the maximum rotation angle is 30 ° or less.
Or the tray design method according to 16.