CN210306423U - Fixing device for welding wafer - Google Patents
Fixing device for welding wafer Download PDFInfo
- Publication number
- CN210306423U CN210306423U CN201920817995.9U CN201920817995U CN210306423U CN 210306423 U CN210306423 U CN 210306423U CN 201920817995 U CN201920817995 U CN 201920817995U CN 210306423 U CN210306423 U CN 210306423U
- Authority
- CN
- China
- Prior art keywords
- combining
- stop
- stopper
- engaging groove
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 title claims abstract description 11
- 235000012431 wafers Nutrition 0.000 claims description 15
- 230000007547 defect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a fixing device of welding wafer, it includes: a first body, one side of two ends of which horizontally extends a first combining part respectively, each first combining part is provided with a combining groove, the other side of the first body is provided with at least one first stop part, and the top surface or the bottom surface of the first body is provided with at least one second stop part; and one side of the two ends of the second body horizontally extends to form a second combining part respectively, each second combining part is provided with a combining piece, each combining piece is inserted into each first combining groove, so that a hollow part is formed between the first body and the second body, the other side of the second body is provided with at least one third stop piece, and the top surface or the bottom surface of the second body is provided with at least one fourth stop piece.
Description
Technical Field
The present invention relates to a fixing device, and more particularly to a fixing device for a thin circuit board during soldering electronic components and wafers, so as to fix the electronic components and the wafers and prevent the thin circuit board from warping.
Background
Due to the development of electronic technology, the volume of electronic products is smaller and smaller, and the substrate (PCB) is thinner and thinner, when electronic components are soldered, the substrate is too thin, so that the electronic components are prone to shaking and twisting, displacement is prone to occurring during soldering, and assembly errors are prone to occurring.
Therefore, how to eliminate the above-mentioned defects is the technical difficulty that the inventors of the present invention want to solve; then, the inventor of the present invention has tried and improved the present invention based on the experience of the related industries for many years through many years of studies of sexual interest and research, and finally succeeded in developing the present invention, and the present invention can be born to improve the efficacy.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned defect, the utility model discloses fixing device for welding wafer, it includes: a first body, one side of two ends of which horizontally extends a first combining part respectively, each first combining part is provided with a combining groove, the other side of the first body is provided with at least one first stop part, and the top surface or the bottom surface of the first body is provided with at least one second stop part; and one side of the two ends of the second body horizontally extends to form a second combining part respectively, each second combining part is provided with a combining piece, each combining piece is inserted into each first combining groove, a hollow part is formed between the first body and the second body, the other side of the second body is provided with at least one third stop piece, and the top surface or the bottom surface of the second body is provided with at least one fourth stop piece.
Preferably, the first stopper and the second stopper are perpendicular to the first body, a first engaging groove is concavely formed on inner side surfaces of the first stopper and the second stopper, the third stopper and the fourth stopper are perpendicular to the second body, and a second engaging groove is concavely formed on inner side surfaces of the third stopper and the fourth stopper.
Preferably, a first stop portion and a second stop portion are formed on one side of the first engaging groove and one side of the second engaging groove, respectively.
The utility model provides another kind of embodiment, a fixing device of welding wafer, it includes:
the first body is provided with at least one first stop piece on one side, and the top surface or the bottom surface of the first body is provided with at least one second stop piece; and
and one side of the second body is provided with at least one third stop piece, the top surface or the bottom surface of the second body is provided with at least one fourth stop piece, and the end surface of the other side of the second body and the end surface of the other side of the first body abut against a wafer.
Preferably, the first stopper and the second stopper are perpendicular to the first body, a first engaging groove is concavely formed on inner side surfaces of the first stopper and the second stopper, the third stopper and the fourth stopper are perpendicular to the second body, and a second engaging groove is concavely formed on inner side surfaces of the third stopper and the fourth stopper.
Preferably, a first stop portion and a second stop portion are formed on one side of the first engaging groove and one side of the second engaging groove, respectively.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is an exploded perspective view of the present invention.
Fig. 3 is a schematic view of a usage status of another embodiment of the present invention.
Description of the reference numerals
1 fixing device for welding wafer
10 first body
11 first joining part
111 combination groove
12 first stop
13 second stop
14 first catch groove
141 first stop part
20 second body
21 second joint part
211 conjunction
22 third stop
23 fourth stop
24 second clamping groove
241 second stop part
30 hollow-out part
40 circuit board
50 wafers.
Detailed Description
For the purpose of illustrating the invention and the achieved effect, the accompanying drawings illustrate specific embodiments.
Referring to fig. 1 and 2, the fixing device 1 for welding a wafer of the present invention includes: a first body 10, a first combining portion 11 horizontally extends from one side of each of two ends of the first body 10, a combining groove 111 is formed on each of the first combining portions 11, at least one first stop member 12 is disposed on the other side of the first body 10, at least one second stop member 13 is disposed on the top surface or the bottom surface of the first body 10, in this embodiment, two first stop members 12 are disposed at intervals on the other side of the first body 10, and the second stop members 13 are disposed on the bottom surface of the first body 10.
A second body 20, wherein one side of the two ends of the second body respectively horizontally extends to form a second combining portion 21, each second combining portion 21 is provided with a combining member 211, and each combining member 211 is inserted into each first combining groove 111, so that a hollow portion 30 is formed between the first body 10 and the second body 20;
the other side of the second body 20 is provided with at least one third stop member 22, the top surface or the bottom surface of the second body is provided with at least one fourth stop member 23, in this embodiment, the other side of the second body 20 is provided with two third stop members 22 at intervals, and the fourth stop member 13 is arranged on the top surface of the second body 20.
The first stopper 12 and the second stopper 13 are perpendicular to the first body 10, and a first engaging groove 14 is concavely formed on the inner side surfaces of the first stopper 12 and the second stopper 13, so that a first stopper 141 is formed on one side of the first engaging groove 14;
the third stopper 22 and the fourth stopper 23 are perpendicular to the second body 20, and a second engaging groove 24 is concavely formed on inner side surfaces of the third stopper 22 and the fourth stopper 23, so that a second stopping portion 241 is formed on one side of the second engaging groove 24.
The utility model discloses when fixing device 1 of welding wafer used, fixed periphery and the bottom surface at a circuit board with first backstop part 12, second backstop part 13, third backstop part 22 and fourth backstop part 23's first card groove 14 and first backstop portion 141 card respectively, made first body 10 and second body 20 be located the top surface of circuit board, and fretwork portion 30 provides the holding and fixes a position an electronic component (like CPU, wafer) to in order to carry out weldment work.
Referring to fig. 3, another embodiment of the present invention is shown, in which some structures are the same as those of the previous embodiments, and thus the description of the same parts is omitted.
A first body 10, one side of which is provided with at least one first stop member 12, and the top surface or the bottom surface of the first body 10 is provided with at least one second stop member 13; and a second body 20 having at least one third stopper 22 at one side thereof, and at least one fourth stopper 23 at the top or bottom surface of the second body 20.
When in use, the first locking groove 14 and the first stopping portion 141 of the first stopper 12, the second stopper 13, the third stopper 22 and the fourth stopper 23 are respectively locked and fixed on the periphery and the bottom surface of a circuit board 40, so that the first body 10 and the second body 20 are positioned on the top surface of the circuit board, and a wafer 50 is abutted through the end surface on the other side of the second body 20 and the end surface on the other side of the first body 10, thereby facilitating the welding operation.
It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Claims (6)
1. A fixing device for welding wafers is characterized by comprising:
a first body, one side of two ends of which horizontally extends a first combining part respectively, each first combining part is provided with a combining groove, the other side of the first body is provided with at least one first stop part, and the top surface or the bottom surface of the first body is provided with at least one second stop part; and
and one side of each of the two ends of the second body horizontally extends to form a second combining part, each second combining part is provided with a combining piece, each combining piece is inserted into each first combining groove, so that a hollow part is formed between the first body and the second body, the other side of the second body is provided with at least one third stop piece, and the top surface or the bottom surface of the second body is provided with at least one fourth stop piece.
2. The apparatus of claim 1, wherein the first and second stops are perpendicular to the first body, and a first engaging groove is formed on inner surfaces of the first and second stops, the third and fourth stops are perpendicular to the second body, and a second engaging groove is formed on inner surfaces of the third and fourth stops.
3. The device as claimed in claim 2, wherein a first stop portion and a second stop portion are formed on one side of the first engaging groove and one side of the second engaging groove, respectively.
4. A fixing device for welding wafers is characterized by comprising:
the first body is provided with at least one first stop piece on one side, and the top surface or the bottom surface of the first body is provided with at least one second stop piece; and
and one side of the second body is provided with at least one third stop piece, the top surface or the bottom surface of the second body is provided with at least one fourth stop piece, and the end surface of the other side of the second body and the end surface of the other side of the first body abut against a wafer.
5. The device as claimed in claim 4, wherein the first and second stoppers are perpendicular to the first body, and a first engaging groove is formed on inner surfaces of the first and second stoppers, the third and fourth stoppers are perpendicular to the second body, and a second engaging groove is formed on inner surfaces of the third and fourth stoppers.
6. The device as claimed in claim 5, wherein a first stop portion and a second stop portion are formed on one side of the first engaging groove and one side of the second engaging groove, respectively.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107217219U TWM577593U (en) | 2018-12-19 | 2018-12-19 | Fixing device for wafer soldering |
| TW107217219 | 2018-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210306423U true CN210306423U (en) | 2020-04-14 |
Family
ID=67353777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920817995.9U Expired - Fee Related CN210306423U (en) | 2018-12-19 | 2019-05-31 | Fixing device for welding wafer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN210306423U (en) |
| TW (1) | TWM577593U (en) |
-
2018
- 2018-12-19 TW TW107217219U patent/TWM577593U/en not_active IP Right Cessation
-
2019
- 2019-05-31 CN CN201920817995.9U patent/CN210306423U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWM577593U (en) | 2019-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200414 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |