WO2016127334A1

WO2016127334A1 - Electronic element pin and electronic element

Info

Publication number: WO2016127334A1
Application number: PCT/CN2015/072746
Authority: WO
Inventors: 易源
Original assignee: 华为技术有限公司
Priority date: 2015-02-11
Filing date: 2015-02-11
Publication date: 2016-08-18
Also published as: CN106104931A

Abstract

An electronic element pin and an electronic element. The electronic element pin comprises: a pin body (41) and at least one protrusion portion (42), a distance between a protrusion vertex of the at least one protrusion portion (42) and a lower surface of an electronic element body (43) being smaller than a minimum thickness of a circuit board applicable to an electronic element. The electronic element pin is adaptive to circuit boards with different thicknesses, and a device having the electronic element pin can be repeatedly utilized and is high in degree of normalization.

Description

Electronic component leads and electronic components

Technical field

Embodiments of the present invention relate to electronic technologies, and in particular, to an electronic component pin and an electronic component.

Background technique

Double In-line Package (DIP) is a kind of integrated circuit packaging method, which means that the integrated circuit is packaged in a dual in-line form. Most small and medium-sized integrated circuits use this package. Integrated circuits packaged in DIP are called DIP devices and are rectangular in shape with two rows of parallel metal pins on either side of the DIP device. Integrated circuits packaged in DIP need to be plugged into a chip socket with a DIP structure, or soldered directly to a Printed Circuit Board (PCB) with the same number of jacks and geometric arrangement. In the process of wave soldering, if the center of gravity of the DIP device is not stable or the quality is light, there will be instability such as tilt and offset. In order to prevent the above instability, the mushroom head fixed foot or hook type is generally used. The DIP device is fixed by the foot. In addition, the pin of the DIP device can be set to the "K" type for the purpose of fixing.

Specifically, FIG. 1 is a schematic diagram of a mushroom head fixing leg of a DIP device. As shown in FIG. 1 , the mushroom head fixing leg 11 of the DIP device is a plurality of plastic hollow plastic columns, and the DIP device is inserted in an insert manner. In the process of the PCB board 12, the plastic column of the mushroom head fixing foot of the DIP device is pressed and deformed, and after the mushroom head fixing foot is fully inserted, the plastic column of the mushroom head fixing foot is opened again to restore the original shape, so that the mushroom head The fixed feet are clamped to the bottom of the PCB. 2 is a schematic diagram of a hook-type fixing leg of the DIP device. As shown in FIG. 2, the DIP device is clamped to the bottom surface of the PCB board 22 by the plastic post of the hook-type fixing leg 21. Figure 3 is a schematic diagram of the "K" type fixed leg of the DIP device. The pin 31 of the DIP device is set to the "K" type. As shown in FIG. 3, the maximum width of the "K" type pin is larger than that of the PCB board 32. The hole diameter is large. During the process of inserting the K" pin of the DIP device into the PCB jack, the K" pin is squeeze-deformed. After the "K" pin is fully inserted into the PCB jack, "K" The type pin is restored to its original shape, and the tip end portion of the "K" type pin is stuck under the PCB jack.

In the prior art, the manner in which the DIP device is fixed on the PCB adopts the above several methods, However, the above method has the same problem, that is, only one thickness of the PCB can be adapted, and the degree of normalization of the device is low.

Summary of the invention

Embodiments of the present invention provide an electronic component pin and an electronic component to solve the problem that the device fixing method in the prior art can only adapt to a PCB of one thickness, and the degree of normalization of the device is low.

In a first aspect, an embodiment of the present invention provides an electronic component pin for relatively fixing an electronic component body and a circuit board, including: a lead body and at least one protrusion;

The protrusion is disposed on the lead body, and a protrusion apex of at least one of the protrusions is spaced apart from a lower surface of the electronic component body by a minimum thickness of the circuit board to which the electronic component is applied, for Cooperating with the pin body to latch the pin body in the circuit board insert hole;

The lead body is coupled to the electronic component body.

In conjunction with the first aspect, in a first possible implementation of the first aspect, the raised portion comprises a spherical bump or an arcuate ridge.

In conjunction with the first possible implementation of the first aspect, in a second possible implementation manner of the first aspect, if the convex portion is an arc-shaped ridge, the protruding apex of the convex portion is multiple a distance between a topmost protrusion apex of the convex portion and a lower surface of the electronic component body is smaller than a minimum thickness of a circuit board to which the electronic component is applied, and a highest position protrusion apex of the convex portion is the protrusion The apex of the protrusion having the smallest distance from the lower surface of the electronic component body.

With reference to the first aspect, the first possible implementation manner of the first aspect, or the second possible implementation manner of the first aspect, in a third possible implementation manner of the first aspect, The number is two, and the two raised portions are sequentially disposed on the lead body along the longitudinal direction of the lead body.

With reference to the first aspect, the first to the third possible implementation manners of the first aspect, in the fourth possible implementation manner of the first aspect, the maximum height of the convex portion along the convex direction The sum of the thicknesses of the lead bodies is greater than the diameter of the board insert holes.

With reference to the first aspect, the first to fourth possible implementation manners of the first aspect, in a fifth possible implementation manner of the first aspect, the protruding apex of the convex portion and the circuit The inner wall of the plate insert hole is in hard contact.

In a second aspect, an embodiment of the present invention provides an electronic component including an electronic component body and a plurality of electronic component pins according to the first aspect, the first to fifth possible implementations of the first aspect.

In conjunction with the second aspect, in a first possible implementation of the second aspect, the plurality of electronic component pins are symmetrically disposed on opposite sides of the electronic component body.

In the embodiment of the present invention, the electronic component pin and the electronic component are disposed on the lead body of the electronic component pin, and the protrusion apex of the convex portion and the lower surface of the electronic component body are smaller than the applicable electronic component. The minimum thickness of the circuit board, so that when the DIP device having the electronic component pin is inserted into the circuit board insertion hole, the protruding portion of the electronic component pin can cooperate with the pin body to clamp the pin body to the circuit board The plug hole is fixed to serve as a fixing function. Since the boss portion is used for chucking the pin body in the circuit board insert hole, the DIP device fixing method is only applicable to a specific thickness circuit board in the prior art. The electronic component pins of the present embodiment are adapted to circuit boards of different thicknesses, and the devices having the pins of the electronic components can be reused, and the device is highly normalized.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description of the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any inventive labor.

Figure 1 is a schematic view of a mushroom head fixing foot of a DIP device;

2 is a schematic diagram of a hook-type fixing leg of a DIP device;

Figure 3 is a schematic view of a "K" type fixed leg of a DIP device;

4 is a schematic structural view of a first embodiment of an electronic component lead according to the present invention;

5 is a schematic structural view of a second embodiment of an electronic component lead according to the present invention;

6 is a schematic structural view of a third embodiment of an electronic component lead according to the present invention;

Figure 7 is a schematic view of the electronic component of the present invention inserted into the hole of the circuit board insert;

8 is a second schematic view of the electronic component pin inserted into the hole of the circuit board insert;

FIG. 9 is a schematic structural view of an embodiment of an electronic component of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is a partial embodiment of the invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

4 is a schematic structural diagram of a first embodiment of an electronic component lead according to the present invention. As shown in FIG. 4, the electronic component pin of the embodiment is used for fixing the electronic component body and the circuit board relatively. The electronic component pin of the embodiment can be The lead body 41 and the at least one convex portion 42 are disposed, wherein the convex portion 42 is disposed on the lead body 41, and the distance between the protruding vertex of one convex portion 42 and the lower surface of the electronic component body 43 is smaller than that of the electronic component. The minimum thickness of the circuit board is used to cooperate with the pin body 41 to chuck the pin body 41 in the circuit board insert hole, and the pin body 41 is connected to the electronic component body 43.

The protrusion apex of the convex portion 42 is the highest point of the convex portion along the convex direction, and specifically may be the protrusion apex 421 as shown in FIG. 4 .

Specifically, the electronic component pin may be a pin of the DIP device, and the pin body 41 may be a flat metal pin of the DIP device. Of course, those skilled in the art may also use the electronic component of the present implementation. The foot is carded with other electronic components, and the DIP device is not limited here. At least one raised portion 42 is disposed on the lead body 41. The number of the raised portions may be 1, 2, or 3, etc., wherein the protruding apex of the at least one raised portion 42 and the electronic component body The distance of the lower surface is smaller than the minimum thickness of the circuit board to which the electronic component is applied. Specifically, the thickness of the circuit board to which the different electronic components are applied may be different. For example, the electronic component is a DC power socket, and the DC power socket usually needs to be installed. On a circuit board having a thickness of between 1 mm and 2 mm, the electronic component is a headphone jack, which usually needs to be mounted on a circuit board having a thickness of between 0.6 mm and 1.2 mm, due to the electronic component pins on the present embodiment. The distance between the protrusion apex of one protrusion and the lower surface of the electronic component body is smaller than that of the electronic component The minimum thickness of the circuit board, so no matter which thickness of the circuit board uses the electronic component pins of the embodiment, the pin body can be clamped in the circuit board insert hole, and the above example is further explained, the electronic When the component is a DC power socket, the minimum thickness of the circuit board to which the electronic component is applied is 1 mm, and then the distance between the protruding vertex of one convex portion of the electronic component of the electronic component and the lower surface of the electronic component body is less than 1 mm, and further For different board thicknesses (1 mm to 2 mm) of the circuit board to which the electronic component is applied, the pin body of the electronic component pin can be clamped in the board insert hole, and when the electronic component is the headphone jack, the circuit suitable for the electronic component The minimum thickness of the board is 0.6 mm, and then the distance between the protrusion apex of one convex portion of the electronic component lead of the electronic component and the lower surface of the electronic component body is less than 0.6 mm, and thus different boards of the circuit board suitable for the electronic component Thick (0.6mm~1.2mm) can be used to pin the pin body of the electronic component pin in the board insert hole. Therefore, in this embodiment, the protrusion apex of one convex portion is disposed at a smaller distance from the lower surface of the electronic component than the minimum thickness of the circuit board to which the electronic component is applied, so that the pin body 41 can be stuck in the circuit board insertion hole, and The circuit board for the thickness of the electronic component can be mounted in the circuit board insert hole. The pin body 41 is connected to the electronic component body. Specifically, the lead body 41 can be connected to the circuit inside the electronic component body. The device in the electrical connection, the electronic component body includes an internal integrated circuit and an external plastic package body, and the electronic component body may be a device body of the DIP device.

The DIP device can have a plurality of electronic component pins of the present embodiment. The material of the protrusion portion may be an elastic material for facilitating insertion of the electronic component pin into the circuit board insertion hole. The material of the protrusion portion may also be a hard metal material, and the electron is guided by the curvature of the protrusion portion. The component pins are inserted into the board insert holes. The embodiments of the present invention are not limited thereto.

In this embodiment, by providing a protrusion on the pin body of the electronic component pin, the protrusion apex of the protrusion is spaced from the lower surface of the electronic component body by a minimum thickness of the circuit board to which the electronic component is applied, thereby When the electronic component having the electronic component pin is inserted into the circuit board insertion hole, the protruding portion of the electronic component pin can cooperate with the pin body to clamp the pin body into the circuit board insertion hole, thereby The fixing function is because the protruding portion is the card portion and the pin body being locked in the circuit board insertion hole, so compared with the DIP device fixing method which is only applicable to a specific thickness circuit board in the prior art, The implemented electronic component pins are adapted to boards of different thicknesses, and the devices having the electronic component pins can be reused, and the device is highly normalized.

5 is a schematic structural view of a second embodiment of an electronic component lead according to the present invention. As shown in FIG. 5, the protruding portion 42 of the electronic component lead of the present embodiment may be an arc-shaped ridge, that is, the raised portion has a certain length and curvature.

Regardless of whether the convex portion is an arc-shaped convex strip or a spherical convex portion, the convex portion has a certain curvature, and the curvature of the convex portion can facilitate insertion of the electronic component pin into the circuit board insertion hole.

It can be understood that, if the convex portion is an arc-shaped ridge, the protrusion has a plurality of protrusion vertices, that is, a plurality of protrusion vertices are equal in distance from the lead body 41. In this case, the protrusion The distance between the highest position projection apex of the portion and the lower surface of the electronic component body is smaller than the minimum thickness of the circuit board to which the electronic component is applied, and the highest position projection apex of the convex portion is the distance of the convex portion from the lower surface of the electronic component body. With the smallest protrusion apex, the protrusion can be matched with the pin body to clamp the pin body in the circuit board insertion hole, thereby realizing the fixing of the electronic component on the circuit board.

6 is a schematic structural view of a third embodiment of an electronic component lead according to the present invention. As shown in FIG. 6, further on the lead of the electronic component shown in FIG. 4, the convex portion of the electronic component lead of the embodiment is shown in FIG. The number of the protrusions may be two, and the two protrusions are sequentially disposed on the lead body along the length direction of the lead body. It should be noted that the number of the protrusions may also be one or three, etc. The number of parts can be flexibly set according to requirements, which is not limited here.

By providing a plurality of protrusions on the pin body of the electronic component pins, the electronic component pins can be adapted to the circuit boards of different thicknesses, and the electronic components can be better fixed, for example, two protrusions are provided. The protruding portion, wherein the protruding portion closer to the lower surface of the electronic component body can clamp the electronic component pin in the circuit board insert hole, but a further protrusion portion can better serve the fixing function.

Further, the convex portion may be disposed on either side of the two sides of the lead body. It is understood that since the lead body is a metal foil, the convex portion may be disposed on any one surface of the metal foil, which can be understood. An electronic component having a plurality of electronic component pins of the embodiment, wherein the plurality of electronic component pins form an array of pins, wherein the raised portion may be disposed on a side of the electronic component pin body facing the central axis of the pin array Alternatively, it may be disposed on a side of the electronic component pin body away from the central axis of the pin array.

Further, the sum of the maximum height of the protrusion in the protrusion direction and the thickness of the lead body is larger than the diameter of the board insert hole, specifically, the maximum height of the protrusion along the protrusion direction and the pin The sum of the thicknesses of the bodies may be slightly larger than the diameter of the board insert holes, so that the electronic component pins can penetrate into the board insert holes and be stuck therein. It should be noted that, in the actual application process, considering that the maximum height of the convex portion along the convex direction and the actual size of the thickness of the lead body are deviated from the given size at the time of design, the convex portion can be The basic dimension of the sum of the maximum height in the direction of the protrusion and the thickness of the body of the lead is designed to be slightly smaller than the diameter of the hole of the board insert, so that the basic size plus the deviation in the actual production process can realize the protrusion along the protrusion The maximum height of the direction and the actual size of the thickness of the lead body are slightly larger than the diameter of the board insert hole.

Optionally, when the electronic component pin of the embodiment is inserted into the circuit board insertion hole, the protruding apex of the protruding portion of the electronic component pin is in hard contact with the inner wall of the circuit board insertion hole, that is, the convex portion and the circuit The inner wall of the plate insert hole interferes to achieve a fixed effect. It can be understood that when the convex portion is a spherical bump, the convex portion is in point contact with the inner wall of the insert hole to achieve a fixed effect. When the convex portion is an arc-shaped convex strip, the convex portion is in line contact with the inner wall of the insert hole. , thus playing a better fixed effect.

FIG. 7 is a schematic diagram of the electronic component pin inserted into the hole of the circuit board of the circuit board of the present invention, and FIG. 8 is a schematic view of the electronic component pin inserted into the hole of the circuit board of the circuit board, and the protrusion of the protruding portion of the electronic component pin The apex can be placed on the inner wall of the board insert hole 71, so the electronic component pins can be adapted to boards of different thicknesses. Specifically, as shown in FIG. 7, the convex portion of the electronic component pin is spherical, and the protruding apex of the spherical convex portion is disposed on the inner wall of the circuit board insertion hole 71, and two different thicknesses are given in FIG. The circuit board 72 (thickness 1, thickness 2) can be fixed by the electronic component pins of the present invention. It should be noted that the thickness 1 can be understood as the minimum thickness of the circuit board to which the electronic component is applied in the prior art. In another case, as shown in FIG. 8, the convex portion of the lead of the electronic component is an arc-shaped ridge, and the convex portion can be in line contact with the inner wall of the circuit board insert hole, and the electronic component pin having the curved ridge It can also be inserted into the plug hole of the board of different thickness.

Optionally, the protrusion may be made of a resilient material having a certain elasticity to facilitate insertion of the electronic component pins into the board insertion hole.

9 is a schematic structural view of an embodiment of an electronic component according to the present invention. As shown in FIG. 9, the electronic component of the present embodiment includes: an electronic component body 91 and an electronic component pin 92, wherein the electronic component pin 92 can be as shown in FIG. Figure 6 shows the structure of any embodiment, its implementation principle and technical effect class Like, it will not be repeated here. The shape of the electronic component pin 92 in FIG. 9 is only schematically illustrated, and is not limited thereto.

Further, as shown in FIG. 4, a plurality of electronic component pins of the electronic component are symmetrically disposed on both sides of the electronic component body, so that when the electronic component is inserted into the circuit board insertion hole, the better The electronic components act as a fix.

Of course, in addition to the above manner of symmetrically setting the pins of the electronic component, the electronic component pins may be disposed according to different setting requirements, that is, the electronic component pin electronic components having the plurality of embodiments, and the electronic component pins may be formed. Different types of pin arrays, such as symmetric rectangular arrays, triangular arrays, etc., are not limited herein.

The electronic component of the embodiment can be applied to circuit boards of different thicknesses, effectively improving the adaptability of the electronic components to the thickness of the circuit board, reducing the types of the same electronic components, and greatly reducing the cost of the electronic components in practical applications. The device fixing method in the prior art, when the device is adapted to a thicker circuit board, and then the device is used for a thin circuit board, the fixing method cannot be fixed, and needs Compared with the prior art, the electronic component of the present invention can effectively simplify the tooling design and save man-hours by adding additional tooling design and man-hour operation.

In the several embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, ie, It can be located in one place or it can be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.

Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims

An electronic component pin for relatively fixing an electronic component body and a circuit board, characterized by comprising: a lead body and at least one protrusion;

The protrusion is disposed on the lead body, and a protrusion apex of at least one of the protrusions is spaced apart from a lower surface of the electronic component body by a minimum thickness of the circuit board to which the electronic component is applied, for Cooperating with the pin body to latch the pin body in the circuit board insert hole;

The lead body is coupled to the electronic component body.
The electronic component lead according to claim 1, wherein the convex portion comprises a spherical bump or an arcuate ridge.
The electronic component lead according to claim 2, wherein if the convex portion is an arc-shaped ridge, the protrusion apex of the convex portion is plural, and the highest position of the convex portion protrudes from the apex a distance from a lower surface of the electronic component body that is smaller than a minimum thickness of a circuit board to which the electronic component is applied, a highest position protrusion apex of the convex portion is a distance from the convex portion to a lower surface of the electronic component body The distance is the smallest protrusion apex.
The electronic component lead according to any one of claims 1 to 3, wherein the number of the convex portions is two, and the two convex portions are sequentially arranged along the length direction of the lead body. Set on the pin body.
The electronic component lead according to any one of claims 1 to 4, wherein a sum of a maximum height of the convex portion in a convex direction and a thickness of the lead body is larger than the circuit board insertion hole diameter of.
The electronic component lead according to any one of claims 1 to 5, characterized in that the protruding apex of the convex portion is in hard contact with the inner wall of the circuit board insertion hole.
An electronic component comprising: an electronic component body and a plurality of electronic component pins according to any one of claims 1 to 6;
The electronic component according to claim 7, wherein said plurality of electronic component pins are symmetrically disposed on both sides of said electronic component body.