WO2016127334A1 - Broche d'élément électronique, et élément électronique - Google Patents

Broche d'élément électronique, et élément électronique Download PDF

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Publication number
WO2016127334A1
WO2016127334A1 PCT/CN2015/072746 CN2015072746W WO2016127334A1 WO 2016127334 A1 WO2016127334 A1 WO 2016127334A1 CN 2015072746 W CN2015072746 W CN 2015072746W WO 2016127334 A1 WO2016127334 A1 WO 2016127334A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
pin
circuit board
convex portion
protrusion
Prior art date
Application number
PCT/CN2015/072746
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English (en)
Chinese (zh)
Inventor
易源
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201580002429.7A priority Critical patent/CN106104931A/zh
Priority to PCT/CN2015/072746 priority patent/WO2016127334A1/fr
Publication of WO2016127334A1 publication Critical patent/WO2016127334A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member

Definitions

  • Embodiments of the present invention relate to electronic technologies, and in particular, to an electronic component pin and an electronic component.
  • Double In-line Package is a kind of integrated circuit packaging method, which means that the integrated circuit is packaged in a dual in-line form. Most small and medium-sized integrated circuits use this package. Integrated circuits packaged in DIP are called DIP devices and are rectangular in shape with two rows of parallel metal pins on either side of the DIP device. Integrated circuits packaged in DIP need to be plugged into a chip socket with a DIP structure, or soldered directly to a Printed Circuit Board (PCB) with the same number of jacks and geometric arrangement. In the process of wave soldering, if the center of gravity of the DIP device is not stable or the quality is light, there will be instability such as tilt and offset. In order to prevent the above instability, the mushroom head fixed foot or hook type is generally used. The DIP device is fixed by the foot. In addition, the pin of the DIP device can be set to the "K" type for the purpose of fixing.
  • PCB Printed Circuit Board
  • FIG. 1 is a schematic diagram of a mushroom head fixing leg of a DIP device.
  • the mushroom head fixing leg 11 of the DIP device is a plurality of plastic hollow plastic columns, and the DIP device is inserted in an insert manner.
  • the plastic column of the mushroom head fixing foot of the DIP device is pressed and deformed, and after the mushroom head fixing foot is fully inserted, the plastic column of the mushroom head fixing foot is opened again to restore the original shape, so that the mushroom head
  • the fixed feet are clamped to the bottom of the PCB.
  • 2 is a schematic diagram of a hook-type fixing leg of the DIP device. As shown in FIG.
  • FIG. 2 is a schematic diagram of the "K" type fixed leg of the DIP device.
  • the pin 31 of the DIP device is set to the "K” type.
  • the maximum width of the "K” type pin is larger than that of the PCB board 32.
  • the hole diameter is large.
  • the manner in which the DIP device is fixed on the PCB adopts the above several methods,
  • the above method has the same problem, that is, only one thickness of the PCB can be adapted, and the degree of normalization of the device is low.
  • Embodiments of the present invention provide an electronic component pin and an electronic component to solve the problem that the device fixing method in the prior art can only adapt to a PCB of one thickness, and the degree of normalization of the device is low.
  • an embodiment of the present invention provides an electronic component pin for relatively fixing an electronic component body and a circuit board, including: a lead body and at least one protrusion;
  • the protrusion is disposed on the lead body, and a protrusion apex of at least one of the protrusions is spaced apart from a lower surface of the electronic component body by a minimum thickness of the circuit board to which the electronic component is applied, for Cooperating with the pin body to latch the pin body in the circuit board insert hole;
  • the lead body is coupled to the electronic component body.
  • the raised portion comprises a spherical bump or an arcuate ridge.
  • the convex portion is an arc-shaped ridge
  • the protruding apex of the convex portion is multiple a distance between a topmost protrusion apex of the convex portion and a lower surface of the electronic component body is smaller than a minimum thickness of a circuit board to which the electronic component is applied
  • a highest position protrusion apex of the convex portion is the protrusion The apex of the protrusion having the smallest distance from the lower surface of the electronic component body.
  • the first possible implementation manner of the first aspect, or the second possible implementation manner of the first aspect, in a third possible implementation manner of the first aspect The number is two, and the two raised portions are sequentially disposed on the lead body along the longitudinal direction of the lead body.
  • the maximum height of the convex portion along the convex direction The sum of the thicknesses of the lead bodies is greater than the diameter of the board insert holes.
  • the protruding apex of the convex portion and the circuit is in hard contact.
  • an embodiment of the present invention provides an electronic component including an electronic component body and a plurality of electronic component pins according to the first aspect, the first to fifth possible implementations of the first aspect.
  • the plurality of electronic component pins are symmetrically disposed on opposite sides of the electronic component body.
  • the electronic component pin and the electronic component are disposed on the lead body of the electronic component pin, and the protrusion apex of the convex portion and the lower surface of the electronic component body are smaller than the applicable electronic component.
  • the minimum thickness of the circuit board so that when the DIP device having the electronic component pin is inserted into the circuit board insertion hole, the protruding portion of the electronic component pin can cooperate with the pin body to clamp the pin body to the circuit board
  • the plug hole is fixed to serve as a fixing function. Since the boss portion is used for chucking the pin body in the circuit board insert hole, the DIP device fixing method is only applicable to a specific thickness circuit board in the prior art.
  • the electronic component pins of the present embodiment are adapted to circuit boards of different thicknesses, and the devices having the pins of the electronic components can be reused, and the device is highly normalized.
  • Figure 1 is a schematic view of a mushroom head fixing foot of a DIP device
  • FIG. 2 is a schematic diagram of a hook-type fixing leg of a DIP device
  • Figure 3 is a schematic view of a "K" type fixed leg of a DIP device
  • FIG. 4 is a schematic structural view of a first embodiment of an electronic component lead according to the present invention.
  • FIG. 5 is a schematic structural view of a second embodiment of an electronic component lead according to the present invention.
  • FIG. 6 is a schematic structural view of a third embodiment of an electronic component lead according to the present invention.
  • Figure 7 is a schematic view of the electronic component of the present invention inserted into the hole of the circuit board insert;
  • FIG. 9 is a schematic structural view of an embodiment of an electronic component of the present invention.
  • FIG. 4 is a schematic structural diagram of a first embodiment of an electronic component lead according to the present invention.
  • the electronic component pin of the embodiment is used for fixing the electronic component body and the circuit board relatively.
  • the electronic component pin of the embodiment can be
  • the lead body 41 and the at least one convex portion 42 are disposed, wherein the convex portion 42 is disposed on the lead body 41, and the distance between the protruding vertex of one convex portion 42 and the lower surface of the electronic component body 43 is smaller than that of the electronic component.
  • the minimum thickness of the circuit board is used to cooperate with the pin body 41 to chuck the pin body 41 in the circuit board insert hole, and the pin body 41 is connected to the electronic component body 43.
  • the protrusion apex of the convex portion 42 is the highest point of the convex portion along the convex direction, and specifically may be the protrusion apex 421 as shown in FIG. 4 .
  • the electronic component pin may be a pin of the DIP device, and the pin body 41 may be a flat metal pin of the DIP device.
  • the foot is carded with other electronic components, and the DIP device is not limited here.
  • At least one raised portion 42 is disposed on the lead body 41.
  • the number of the raised portions may be 1, 2, or 3, etc., wherein the protruding apex of the at least one raised portion 42 and the electronic component body
  • the distance of the lower surface is smaller than the minimum thickness of the circuit board to which the electronic component is applied. Specifically, the thickness of the circuit board to which the different electronic components are applied may be different.
  • the electronic component is a DC power socket, and the DC power socket usually needs to be installed.
  • the electronic component On a circuit board having a thickness of between 1 mm and 2 mm, the electronic component is a headphone jack, which usually needs to be mounted on a circuit board having a thickness of between 0.6 mm and 1.2 mm, due to the electronic component pins on the present embodiment.
  • the distance between the protrusion apex of one protrusion and the lower surface of the electronic component body is smaller than that of the electronic component
  • the minimum thickness of the circuit board so no matter which thickness of the circuit board uses the electronic component pins of the embodiment, the pin body can be clamped in the circuit board insert hole, and the above example is further explained, the electronic
  • the minimum thickness of the circuit board to which the electronic component is applied is 1 mm, and then the distance between the protruding vertex of one convex portion of the electronic component of the electronic component and the lower surface of the electronic component body is less than 1 mm, and further
  • the pin body of the electronic component pin can be clamped in the board insert hole, and when the electronic component is the headphone jack, the circuit suitable for the electronic component
  • the minimum thickness of the board is 0.6 mm, and then the distance between the protrusion apex of one convex portion of the
  • the protrusion apex of one convex portion is disposed at a smaller distance from the lower surface of the electronic component than the minimum thickness of the circuit board to which the electronic component is applied, so that the pin body 41 can be stuck in the circuit board insertion hole, and
  • the circuit board for the thickness of the electronic component can be mounted in the circuit board insert hole.
  • the pin body 41 is connected to the electronic component body.
  • the lead body 41 can be connected to the circuit inside the electronic component body.
  • the device in the electrical connection, the electronic component body includes an internal integrated circuit and an external plastic package body, and the electronic component body may be a device body of the DIP device.
  • the DIP device can have a plurality of electronic component pins of the present embodiment.
  • the material of the protrusion portion may be an elastic material for facilitating insertion of the electronic component pin into the circuit board insertion hole.
  • the material of the protrusion portion may also be a hard metal material, and the electron is guided by the curvature of the protrusion portion.
  • the component pins are inserted into the board insert holes.
  • the embodiments of the present invention are not limited thereto.
  • the protrusion apex of the protrusion is spaced from the lower surface of the electronic component body by a minimum thickness of the circuit board to which the electronic component is applied, thereby
  • the protruding portion of the electronic component pin can cooperate with the pin body to clamp the pin body into the circuit board insertion hole, thereby
  • the fixing function is because the protruding portion is the card portion and the pin body being locked in the circuit board insertion hole, so compared with the DIP device fixing method which is only applicable to a specific thickness circuit board in the prior art,
  • the implemented electronic component pins are adapted to boards of different thicknesses, and the devices having the electronic component pins can be reused, and the device is highly normalized.
  • the protruding portion 42 of the electronic component lead of the present embodiment may be an arc-shaped ridge, that is, the raised portion has a certain length and curvature.
  • the convex portion Regardless of whether the convex portion is an arc-shaped convex strip or a spherical convex portion, the convex portion has a certain curvature, and the curvature of the convex portion can facilitate insertion of the electronic component pin into the circuit board insertion hole.
  • the protrusion has a plurality of protrusion vertices, that is, a plurality of protrusion vertices are equal in distance from the lead body 41.
  • the protrusion The distance between the highest position projection apex of the portion and the lower surface of the electronic component body is smaller than the minimum thickness of the circuit board to which the electronic component is applied, and the highest position projection apex of the convex portion is the distance of the convex portion from the lower surface of the electronic component body.
  • the protrusion can be matched with the pin body to clamp the pin body in the circuit board insertion hole, thereby realizing the fixing of the electronic component on the circuit board.
  • FIG. 6 is a schematic structural view of a third embodiment of an electronic component lead according to the present invention. As shown in FIG. 6, further on the lead of the electronic component shown in FIG. 4, the convex portion of the electronic component lead of the embodiment is shown in FIG.
  • the number of the protrusions may be two, and the two protrusions are sequentially disposed on the lead body along the length direction of the lead body. It should be noted that the number of the protrusions may also be one or three, etc. The number of parts can be flexibly set according to requirements, which is not limited here.
  • the electronic component pins can be adapted to the circuit boards of different thicknesses, and the electronic components can be better fixed, for example, two protrusions are provided.
  • the protruding portion wherein the protruding portion closer to the lower surface of the electronic component body can clamp the electronic component pin in the circuit board insert hole, but a further protrusion portion can better serve the fixing function.
  • the convex portion may be disposed on either side of the two sides of the lead body. It is understood that since the lead body is a metal foil, the convex portion may be disposed on any one surface of the metal foil, which can be understood.
  • the sum of the maximum height of the protrusion in the protrusion direction and the thickness of the lead body is larger than the diameter of the board insert hole, specifically, the maximum height of the protrusion along the protrusion direction and the pin
  • the sum of the thicknesses of the bodies may be slightly larger than the diameter of the board insert holes, so that the electronic component pins can penetrate into the board insert holes and be stuck therein.
  • the convex portion can be
  • the basic dimension of the sum of the maximum height in the direction of the protrusion and the thickness of the body of the lead is designed to be slightly smaller than the diameter of the hole of the board insert, so that the basic size plus the deviation in the actual production process can realize the protrusion along the protrusion
  • the maximum height of the direction and the actual size of the thickness of the lead body are slightly larger than the diameter of the board insert hole.
  • the protruding apex of the protruding portion of the electronic component pin is in hard contact with the inner wall of the circuit board insertion hole, that is, the convex portion and the circuit
  • the inner wall of the plate insert hole interferes to achieve a fixed effect.
  • the convex portion is a spherical bump
  • the convex portion is in point contact with the inner wall of the insert hole to achieve a fixed effect.
  • the convex portion is an arc-shaped convex strip
  • the convex portion is in line contact with the inner wall of the insert hole. , thus playing a better fixed effect.
  • FIG. 7 is a schematic diagram of the electronic component pin inserted into the hole of the circuit board of the circuit board of the present invention
  • FIG. 8 is a schematic view of the electronic component pin inserted into the hole of the circuit board of the circuit board, and the protrusion of the protruding portion of the electronic component pin
  • the apex can be placed on the inner wall of the board insert hole 71, so the electronic component pins can be adapted to boards of different thicknesses.
  • the convex portion of the electronic component pin is spherical
  • the protruding apex of the spherical convex portion is disposed on the inner wall of the circuit board insertion hole 71, and two different thicknesses are given in FIG.
  • the circuit board 72 (thickness 1, thickness 2) can be fixed by the electronic component pins of the present invention.
  • the thickness 1 can be understood as the minimum thickness of the circuit board to which the electronic component is applied in the prior art.
  • the convex portion of the lead of the electronic component is an arc-shaped ridge, and the convex portion can be in line contact with the inner wall of the circuit board insert hole, and the electronic component pin having the curved ridge It can also be inserted into the plug hole of the board of different thickness.
  • the protrusion may be made of a resilient material having a certain elasticity to facilitate insertion of the electronic component pins into the board insertion hole.
  • FIG. 9 is a schematic structural view of an embodiment of an electronic component according to the present invention.
  • the electronic component of the present embodiment includes: an electronic component body 91 and an electronic component pin 92, wherein the electronic component pin 92 can be as shown in FIG. Figure 6 shows the structure of any embodiment, its implementation principle and technical effect class Like, it will not be repeated here.
  • the shape of the electronic component pin 92 in FIG. 9 is only schematically illustrated, and is not limited thereto.
  • a plurality of electronic component pins of the electronic component are symmetrically disposed on both sides of the electronic component body, so that when the electronic component is inserted into the circuit board insertion hole, the better The electronic components act as a fix.
  • the electronic component pins may be disposed according to different setting requirements, that is, the electronic component pin electronic components having the plurality of embodiments, and the electronic component pins may be formed.
  • Different types of pin arrays such as symmetric rectangular arrays, triangular arrays, etc., are not limited herein.
  • the electronic component of the embodiment can be applied to circuit boards of different thicknesses, effectively improving the adaptability of the electronic components to the thickness of the circuit board, reducing the types of the same electronic components, and greatly reducing the cost of the electronic components in practical applications.
  • the device fixing method in the prior art when the device is adapted to a thicker circuit board, and then the device is used for a thin circuit board, the fixing method cannot be fixed, and needs Compared with the prior art, the electronic component of the present invention can effectively simplify the tooling design and save man-hours by adding additional tooling design and man-hour operation.
  • the disclosed apparatus and method may be implemented in other manners.
  • the device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, ie, It can be located in one place or it can be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une broche d'élément électronique et un élément électronique. La broche d'élément électronique comprend : un corps de broche (41) et au moins une partie en saillie (42), la distance entre un sommet de saillie de ladite ou desdites parties en saillie (42) et une surface inférieure d'un corps d'élément électronique (43) étant inférieure à une épaisseur minimale d'une carte de circuit imprimé applicable à un élément électronique. La broche d'élément électronique peut s'adapter à des cartes de circuit imprimé dotées de différentes épaisseurs, et un dispositif ayant la broche d'élément électronique peut être utilisé à plusieurs reprises et présente un degré de normalisation élevé.
PCT/CN2015/072746 2015-02-11 2015-02-11 Broche d'élément électronique, et élément électronique WO2016127334A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201580002429.7A CN106104931A (zh) 2015-02-11 2015-02-11 电子元件引脚和电子元件
PCT/CN2015/072746 WO2016127334A1 (fr) 2015-02-11 2015-02-11 Broche d'élément électronique, et élément électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/072746 WO2016127334A1 (fr) 2015-02-11 2015-02-11 Broche d'élément électronique, et élément électronique

Publications (1)

Publication Number Publication Date
WO2016127334A1 true WO2016127334A1 (fr) 2016-08-18

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PCT/CN2015/072746 WO2016127334A1 (fr) 2015-02-11 2015-02-11 Broche d'élément électronique, et élément électronique

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WO (1) WO2016127334A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114071891B (zh) * 2021-10-28 2023-08-15 浪潮(山东)计算机科技有限公司 一种用于pcb的电子元件固定脚

Citations (4)

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Publication number Priority date Publication date Assignee Title
CN101790277A (zh) * 2009-04-21 2010-07-28 华为技术有限公司 用于制作印刷电路板的方法、印刷电路板及装置
CN201797065U (zh) * 2010-09-19 2011-04-13 上海航天科工电器研究院有限公司 一种与印刷电路板压配连接的引脚
CN103972678A (zh) * 2013-02-05 2014-08-06 富士康(昆山)电脑接插件有限公司 电连接器及其系统
CN204067621U (zh) * 2014-06-11 2014-12-31 苏州倍辰莱电子科技有限公司 一种方便引脚插接的印刷电路板

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
US4464007A (en) * 1982-05-25 1984-08-07 Amp Incorporated Pin terminal mounting system
US4735587A (en) * 1986-02-12 1988-04-05 Specialty Electronics, Inc. Pin header with board retention tail
JP2005005091A (ja) * 2003-06-11 2005-01-06 Honda Tsushin Kogyo Co Ltd 固定・接続用脚部
DE102008002558A1 (de) * 2008-06-20 2009-12-24 Robert Bosch Gmbh Kontaktstift für eine elektronische Schaltung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101790277A (zh) * 2009-04-21 2010-07-28 华为技术有限公司 用于制作印刷电路板的方法、印刷电路板及装置
CN201797065U (zh) * 2010-09-19 2011-04-13 上海航天科工电器研究院有限公司 一种与印刷电路板压配连接的引脚
CN103972678A (zh) * 2013-02-05 2014-08-06 富士康(昆山)电脑接插件有限公司 电连接器及其系统
CN204067621U (zh) * 2014-06-11 2014-12-31 苏州倍辰莱电子科技有限公司 一种方便引脚插接的印刷电路板

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