TWM577593U - Fixing device for wafer soldering - Google Patents

Abstract

The fixing device of the welding wafer comprises: a first body, a first joint portion is horizontally extended on one side of each of the two ends, and each of the first joint portions is provided with a coupling groove, and the first body is further At least one first stop member is disposed on one side, at least one second stop member is disposed on a top surface or a bottom surface of the first body, and a second body has a second joint extending laterally from each other a coupling member is disposed on each of the second joint portions, and each of the joint members is inserted into each of the joint portions a hollow portion is formed between the first body and the second body, and the other side of the second body is provided with at least one third stopper, and the top surface or the bottom surface of the second body is provided At least one fourth stop.

Description

Solder wafer fixture

The present invention relates to a fixing device, and more particularly to a fixing device used for soldering electronic components and wafers on a thin circuit board for fixing electronic components and wafers, and to avoid distortion of a thin circuit board.

Due to the progress of electronic technology, the volume of electronic products is getting smaller and smaller, and the substrate (PCB) is getting thinner and thinner. When soldering electronic components, the substrate is too thin, so that it is easy to be shaken and twisted, making it easy to solder. Displacement occurs, causing assembly errors, so there is an urgent need for a fixture that overcomes this disadvantage to improve solder yield.

In view of this, how to eliminate the above-mentioned deficiencies is the technical difficulty point that the creators of this case want to solve; however, the creators of this case are based on years of experience in relevant industries, and after many years of painstaking research, trial improvement, finally Successfully developed and completed the case, and enabled the new model to be born to enhance the efficacy.

In view of the above-mentioned shortcomings, the fixing device of the soldering wafer comprises: a first body, a first joint portion is horizontally extended on one side of each of the two ends, and each of the first joint portions is provided with a joint groove. The other side of the first body is provided with at least one first stopper, the top surface or the bottom surface of the first body is provided with at least one second stopper; and a second body, one side of which is horizontally Extending a second joint portion, each of the second joint portions is provided with a joint member, and each joint member is inserted into each of the joint portions a hollow portion is formed between the first body and the second body, and the other side of the second body is provided with at least one third stopper, and the top surface or the bottom surface of the second body is provided At least one fourth stop.

In order to facilitate the description of the contents of the present invention and the achievable effects, the specific embodiments will be described with reference to the drawings. Referring to the first and second figures, the fixing device 1 for welding wafers includes: a first Each of the two ends of the first body 10 is provided with a first connecting portion 11 , and the first connecting portion 11 is provided with a coupling groove 111 . The other side of the first body 10 is provided with at least one first stop. The second surface of the first body 10 is provided with at least one second stopper 13 . In the embodiment, the other side of the first body 10 is provided with two first stoppers 12 . The second stopper 13 is disposed on the bottom surface of the first body 10 .

The second body 20 has a second joint portion 21 extending from a side of each of the two ends. Each of the second joint portions 21 is provided with a joint member 211. Each of the joint members 211 is inserted into each of the joint portions 211. A hollow portion 30 is formed between the first body 10 and the second body 20; the other side of the second body 20 is provided with at least one third stopper 22, the second body The top surface or the bottom surface is provided with at least one fourth stopper 23. In the embodiment, the other side of the second body 20 is provided with two third stoppers 22, and the fourth stopper 13 is The top surface of the second body 20.

The first stop member 12 and the second stop member 13 are perpendicular to the first body 10, and a first card is recessed on the inner side surface of the first stop member 12 and the second stop member 13 The groove 14 is such that a first stop portion 141 is formed on one side of the first latching groove 14;

The third stopper 22 and the fourth stopper 23 are perpendicular to the second body 20, and a second card is recessed on the inner side of the third stopper 22 and the fourth stopper 23 The groove 24 is such that a second stopper portion 241 is formed on one side of the second latching groove 24.

The fixing device 1 of the new welding wafer is used as the first latching groove 14 of the first stopping member 12, the second stopping member 13, the third stopping member 22 and the fourth stopping member 23, respectively. The first stopping portion 141 is fastened to the periphery and the bottom surface of the circuit board, so that the first body 10 and the second body 20 are located on the top surface of the circuit board, and the hollow portion 30 is provided for accommodating and positioning an electronic component (such as a CPU, Wafer) to facilitate soldering work.

Please refer to the third embodiment, which is another embodiment of the present invention. In this embodiment, the part of the structure is the same as that of the foregoing embodiment, and therefore the same portions will not be described again.

a first body 10 having at least one first stopper 12 on one side thereof, at least one second stopper 13 on the top surface or the bottom surface of the first body 10, and a second body 20 At least one third stopper 22 is disposed on the side, and the top surface or the bottom surface of the second body 20 is provided with at least one fourth stopper 23 .

When in use, the first latching groove 14 and the first latching portion 141 of the first, second, second, and fourth stops are respectively fastened to the first and second stops The first body 10 and the second body 20 are located on the top surface of the circuit board 40, and the other end surface of the second body 20 abuts the end surface of the other side of the first body 10 A wafer 50 is provided to facilitate the soldering work.

The detailed description above is a detailed description of one of the possible embodiments of the present invention, and the embodiments are not intended to limit the scope of the present invention, and equivalent implementations or modifications that are not departing from the spirit of the present invention should be included in the present invention. In the scope of patents.

1‧‧‧Fixed wafer fixture

10‧‧‧First Ontology

11‧‧‧ First Joint Department

111‧‧‧ joint slot

12‧‧‧First stop

13‧‧‧Second stop

14‧‧‧First card slot

141‧‧‧First stop

20‧‧‧Second ontology

21‧‧‧ Second Joint Department

211‧‧‧Connected parts

22‧‧‧ Third stop

23‧‧‧fourth stop

24‧‧‧Second card slot

241‧‧‧Second stop

30‧‧‧镂空部

40‧‧‧ boards

50‧‧‧ wafer

The first figure is a three-dimensional appearance of the new model.

The second figure is an exploded perspective view of the new model.

The third figure is a schematic view showing the state of use of another embodiment of the present invention.

Claims (6)

A fixing device for soldering a wafer, comprising: a first body, wherein one side of each of the two ends extends horizontally to a first joint portion, and each of the first joint portions is provided with a joint groove, and the first body has another At least one first stop member is disposed on one side, at least one second stop member is disposed on a top surface or a bottom surface of the first body, and a second body has a second joint extending laterally from each other a coupling member is disposed on each of the second joint portions, and each of the joint members is inserted into each of the joint portions a hollow portion is formed between the first body and the second body, and the other side of the second body is provided with at least one third stopper, and the top surface or the bottom surface of the second body is provided At least one fourth stop. The fixing device for welding a wafer according to claim 1, wherein the first stopper and the second stopper are perpendicular to the first body, and the first stopper and the second stopper a first latching groove is recessed on the inner side surface, the third stopping member and the fourth stopping member are perpendicular to the second body, and the third stopping member and the fourth stopping member are inside A second latching groove is recessed on the side surface. The fixing device for soldering a wafer according to claim 2, wherein one side of the first latching groove and the second latching groove respectively form a first stopping portion and a second stopping portion. A fixing device for welding a wafer, comprising: a first body having at least one first stopper on one side thereof, at least one second stopper being disposed on a top surface or a bottom surface of the first body; a second body having at least one third stopper on one side thereof, and a top surface or a bottom surface of the second body is provided with at least one fourth stopper, and the end surface of the other side of the second body is The end face on the other side of the first body abuts against a wafer. The fixing device for soldering a wafer according to claim 4, wherein the first stopper and the second stopper are perpendicular to the first body, and the first stopper and the second stopper a first latching groove is recessed on the inner side surface, the third stopping member and the fourth stopping member are perpendicular to the second body, and the third stopping member and the fourth stopping member are inside A second latching groove is recessed on the side surface. The fixing device of the soldering wafer of claim 5, wherein the first latching slot and the second latching slot respectively form a first stopping portion and a second stopping portion.