TWM521806U - Heat dissipation plate - Google Patents

Heat dissipation plate Download PDF

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Publication number
TWM521806U
TWM521806U TW104220293U TW104220293U TWM521806U TW M521806 U TWM521806 U TW M521806U TW 104220293 U TW104220293 U TW 104220293U TW 104220293 U TW104220293 U TW 104220293U TW M521806 U TWM521806 U TW M521806U
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Taiwan
Prior art keywords
heat sink
display surface
memory
positioning
positioning component
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TW104220293U
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Chinese (zh)
Inventor
Chi-Hsien Huang
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Brimo Technology Inc
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Application filed by Brimo Technology Inc filed Critical Brimo Technology Inc
Priority to TW104220293U priority Critical patent/TWM521806U/en
Publication of TWM521806U publication Critical patent/TWM521806U/en

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Description

散熱片 heat sink

本創作係提供一種散熱片,尤指散熱片頂面二側彎角處設有一顯示面,其顯示面可標示內部所裝設之記憶體規格,當裝有其散熱片之記憶體安裝於電腦主機板所對應之插槽內時,其使用者不需把使記憶體拔起,亦可透過顯示面來觀看其記憶體規格。 The present invention provides a heat sink, in particular, a display surface is provided at two corners of the top surface of the heat sink, and the display surface can indicate the memory size of the internal device. When the memory with the heat sink is mounted on the computer When the motherboard is in the corresponding slot, the user does not need to pull up the memory, and can also view the memory specifications through the display surface.

按,現今電腦科技以日新月異的速度成長,其電腦之發展趨勢亦朝運算功能強、速度快之方向邁進,且隨著電腦相關領域的設計朝向高速、高頻發展,使得主機內部許多電子元件和記憶體模組的設計也愈來愈精密、執行運作的處理速度也愈來愈快,則在運作過程中,便容易發熱而產生熱源,而以記憶體模組存取的頻寬來看,從早期PC100的頻寬為800MB/s,拓展至現今DDR500的頻寬已達4.0GB/s,甚至是到了雙通道的平臺,則可將頻寬增加至兩倍,無論是工作時脈或傳輸頻寬,明顯的都是往高速發展,以配合處理器高速度的運算,而於高速度運算之狀態下,勢必將導致記憶體模組相應產生之熱源溫度會持續上升,並影響其執行效能,更甚者,亦會造成記憶體模組之機能失效。 According to the current trend, computer technology is growing at an ever-changing speed. The development trend of its computer is also moving toward the direction of high computing power and speed. With the design of computer-related fields moving towards high-speed and high-frequency development, many electronic components inside the host computer The design of the memory module is becoming more and more precise, and the processing speed of the operation is getting faster and faster. In the course of operation, it is easy to generate heat and generate heat, and in terms of the bandwidth of the memory module access, From the early PC100 bandwidth of 800MB / s, to the current DDR500 bandwidth has reached 4.0GB / s, even to the dual channel platform, you can increase the bandwidth to double, whether it is working clock or transmission The bandwidth is obviously developed at a high speed to match the high-speed operation of the processor. In the state of high-speed operation, the temperature of the heat source corresponding to the memory module will continue to rise and affect its performance. What's more, it will also cause the function of the memory module to fail.

然而,為了解決記憶體模組因高溫所造成之機能失效這項缺失,便有業者研發出一種包覆於記憶體上以輔助記憶體散熱之片體,而 由於目前市面上記憶體係呈板片狀,則包覆於外部之散熱片亦需配合記憶體而呈板片狀,並透過夾持的方式來固定接觸於記憶體上,以達到輔助記憶體進行散熱之效果。 However, in order to solve the problem of the failure of the memory module due to the high temperature, a manufacturer has developed a sheet that is coated on the memory to assist the heat dissipation of the memory. Since the memory system on the market is in the form of a sheet, the heat sink wrapped on the outside is also required to be in the form of a sheet with the memory, and is fixedly contacted with the memory by clamping to achieve the auxiliary memory. The effect of heat dissipation.

再者,請參閱第七、八圖所示,係為習用散熱片之使用狀態圖及第七圖b部分之放大圖,其中該習用之散熱片A為裝設於記憶體B上,當裝設有散熱片A之記憶體B安裝於電子裝置C內部主機板C1上之插槽C11內時,若使用者欲知曉其記憶體B的規格(如DDR1、DDR2、DDR3或DDR4),其必須先關閉電子裝置C的電源,再將記憶體B從主機板C1之插槽C11內拔出,再使散熱片A分離於記憶體B,才可從記憶體B側面觀看所標示之規格,觀看完後再重新將散熱片A裝設於記憶體B上,並重新使記憶體B安裝於主機板C1之插槽C11內,非常不方便。 Furthermore, please refer to the seventh and eighth figures, which are the use state diagram of the conventional heat sink and the enlarged view of the seventh figure b, wherein the conventional heat sink A is mounted on the memory B, when loaded When the memory B provided with the heat sink A is mounted in the slot C11 on the internal motherboard C1 of the electronic device C, if the user wants to know the specifications of the memory B (such as DDR1, DDR2, DDR3 or DDR4), it must First turn off the power of the electronic device C, then pull the memory B out of the slot C11 of the motherboard C1, and then separate the heat sink A from the memory B, and then view the marked specifications from the side of the memory B, and watch After that, the heat sink A is reinstalled on the memory B, and the memory B is reinstalled in the slot C11 of the motherboard C1, which is very inconvenient.

是以,要如何解決上述習用之問題與缺失,即為從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and shortcomings in the past is the direction for the relevant manufacturers engaged in this industry to research and improve.

故,創作人有鑑於上述之問題與缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種散熱片之新型誕生。 Therefore, in view of the above-mentioned problems and deficiencies, the creators have collected relevant information, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, we have designed a new type of heat sink. .

本創作之主要目的乃在於該散熱片頂面二側彎角處為設有與頂面呈一角度之顯示面,以供標示產品之規格,當散熱片欲裝設於記憶體上時,即可選取顯示面上標示有內部所裝設之記憶體規格的散熱片,以供裝有散熱片之記憶體安裝於電子裝置主機板內部所對應之插槽時,其使 用者只需透過觀看顯示面所標示的規格來了解散熱片內部所裝設之記憶體的規格,以節省使用者拆裝散熱片與記憶體的時間,進而達到增加使用上方便性之目的。 The main purpose of the creation is that the two sides of the top surface of the heat sink are provided with a display surface at an angle to the top surface for indicating the specifications of the product. When the heat sink is to be mounted on the memory, The heat sink can be selected on the display surface with the memory size of the internal device, so that the memory with the heat sink is installed in the slot corresponding to the inside of the electronic device motherboard, The user only needs to understand the specifications of the memory installed inside the heat sink by watching the specifications indicated on the display surface, so as to save the user's time for disassembling the heat sink and the memory, thereby increasing the convenience of use.

本創作之次要目的乃在於該散熱片之頂面二側彎角處為設有顯示面,所以散熱片二側表面不必加註不必要之文字、圖案或商標,即可減少各式文字、圖案或商標等對散熱片的散熱功效造成阻礙,以達到維持良好的散熱效果之目的。 The secondary purpose of the creation is that the display surface is provided at the two corners of the top surface of the heat sink, so that the two sides of the heat sink do not need to be filled with unnecessary characters, patterns or trademarks, thereby reducing various characters, Patterns or trademarks hinder the heat dissipation of the heat sink to achieve a good heat dissipation effect.

本創作之另一目的乃在於該散熱片為透過顯示面來讓使用者了解散熱片內部所裝設之記憶體的規格,所以散熱片不需多次組裝及拆卸於記憶體上,以達到避免記憶體之記憶單元因受到多次組裝與拆卸時而產生之外力,所造成記憶單元損壞之現象。 Another purpose of the creation is that the heat sink is configured to allow the user to understand the specifications of the memory installed inside the heat sink through the display surface, so that the heat sink does not need to be assembled and disassembled on the memory multiple times to avoid The memory unit of the memory generates external force due to multiple assembly and disassembly, resulting in damage to the memory unit.

1‧‧‧散熱片 1‧‧‧ Heat sink

11‧‧‧定位元件 11‧‧‧ Positioning components

110‧‧‧容置空間 110‧‧‧ accommodating space

111‧‧‧基部 111‧‧‧ base

112‧‧‧扣持部 112‧‧‧Detention Department

1121‧‧‧卡塊 1121‧‧‧ block

113‧‧‧顯示面 113‧‧‧ Display surface

114‧‧‧結合部 114‧‧‧Combination Department

1141‧‧‧支臂 1141‧‧‧ Arm

1142‧‧‧卡持片 1142‧‧‧Card pieces

12‧‧‧金屬片 12‧‧‧metal pieces

121‧‧‧貼合面 121‧‧‧Fitting surface

122‧‧‧固定部 122‧‧‧Fixed Department

1221‧‧‧固定片 1221‧‧‧Fixed piece

123‧‧‧定位部 123‧‧‧ Positioning Department

1231‧‧‧定位片 1231‧‧‧ Positioning film

2‧‧‧記憶體 2‧‧‧ memory

21‧‧‧記憶單元 21‧‧‧ memory unit

3‧‧‧電腦 3‧‧‧ computer

31‧‧‧主機板 31‧‧‧ motherboard

311‧‧‧插槽 311‧‧‧ slots

A‧‧‧散熱片 A‧‧‧Heatsink

B‧‧‧記憶體 B‧‧‧ memory

C‧‧‧電子裝置 C‧‧‧Electronic device

C1‧‧‧主機板 C1‧‧‧ motherboard

C11‧‧‧插槽 C11‧‧‧ slots

第一圖 係為本創作之立體外觀圖。 The first picture is a three-dimensional appearance of the creation.

第二圖 係為本創作之立體分解圖。 The second picture is a three-dimensional exploded view of the creation.

第三圖 係為本創作另一視角之立體分解圖。 The third figure is a three-dimensional exploded view of another perspective of the creation.

第四圖 係為本創作較佳實施例之立體分解圖。 The fourth figure is a perspective exploded view of the preferred embodiment of the present invention.

第五圖 係為本創作較佳實施例之使用狀態圖。 The fifth diagram is a state diagram of the use of the preferred embodiment of the present invention.

第六圖 係為本創作第五圖a部份之放大圖。 The sixth picture is an enlarged view of part a of the fifth picture of the creation.

第七圖 係為習用散熱片之使用狀態圖。 The seventh figure is a state diagram of the use of the conventional heat sink.

第八圖 係為習用第七圖b部分之放大圖。 The eighth figure is an enlarged view of the part of the seventh figure b.

為達成上述目的及功效,本創作所採用之技術手段及其構造,茲繪圖就本創作之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。 In order to achieve the above objectives and effects, the technical means and structure of the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions are as follows.

請參閱第一、二、三圖所示,係為本創作之立體外觀圖、立體分解圖及另一視角之立體分解圖,由圖中所示可以清楚看出,本創作之散熱片1係包括有定位元件11及二金屬片12,其中: Please refer to the first, second and third figures, which are the three-dimensional external view, the three-dimensional exploded view and the three-dimensional exploded view of another perspective. As can be clearly seen from the figure, the heat sink 1 of this creation is The positioning element 11 and the two metal sheets 12 are included, wherein:

該定位元件11為具有一基部111,並於基部111底部凹設有容置空間110,且容置空間110開口處設有扣持部112,其扣持部112具有相對向內凸設之複數卡塊1121,而基部111頂面二側彎角處分別設有顯示面113,再於各顯示面113延伸彎折有結合部114,且結合部114具有二支臂1141,並於二支臂1141端部分別相對向內彎折有卡持片1142。 The positioning component 11 has a base portion 111, and a receiving space 110 is recessed in the bottom of the base portion 111, and a latching portion 112 is disposed at the opening of the receiving space 110, and the latching portion 112 has a plurality of relatively inwardly protruding portions. The block 1121 is provided with a display surface 113 at the two corners of the top surface of the base portion 111, and a joint portion 114 is extended and extended on each display surface 113, and the joint portion 114 has two arms 1141 and two arms. The end portions of 1141 are respectively bent inwardly with the holding piece 1142.

該二金屬片12係為呈相對形式設計,而二金屬片12相對內側設有貼合面121,並於各金屬片12上緣設有固定部122,且固定部122位於上緣二側處分別連續彎折有固定片1221,而各金屬片12下緣設有定位部123,且定位部123位於下緣二側處分別延伸凸設有定位片1231。 The two metal sheets 12 are designed in a relative manner, and the two metal sheets 12 are provided with a bonding surface 121 on the inner side, and a fixing portion 122 is disposed on the upper edge of each metal sheet 12, and the fixing portion 122 is located on the upper side of the upper edge. The fixing piece 1221 is not continuously stretched, and the positioning portion 123 is disposed on the lower edge of each of the metal pieces 12, and the positioning piece 1231 is respectively extended and protruded at the two sides of the lower edge.

再者,上述定位元件11較佳實施為塑膠材質,但於實際應用時,亦可為金屬材質所製成;而該定位元件11之基部111較佳實施為矩形且一體成型製成,但於實際應用時,亦可為二個板材所組構成;又該定位元件11之複數顯示面113與定位元件11之頂面的夾角θ為位於5~85度間;且該定位元件11之複數顯示面113上可設置必要 的產品規格、文字、圖案或商標等,即可透過位於顯示面113上之產品規格、文字、圖案或商標等,輕易辨識散熱片1的款式、型號或廠商等相關資訊;而該複數顯示面113較佳實施為斜面,但於實際應用時,亦可為可供標示產品規格、文字、圖案或商標之弧面。 In addition, the positioning component 11 is preferably made of a plastic material, but may be made of a metal material in practical applications; and the base portion 111 of the positioning component 11 is preferably rectangular and integrally formed, but In actual application, it can also be composed of two plates; the angle θ between the plurality of display surfaces 113 of the positioning component 11 and the top surface of the positioning component 11 is between 5 and 85 degrees; and the plurality of positioning elements 11 are displayed. Face 113 can be set Product specifications, text, graphics or trademarks, etc., can easily identify the style, model or manufacturer of the heat sink 1 through product specifications, text, graphics or trademarks located on the display surface 113; and the plural display surface 113 is preferably implemented as a bevel, but in practical applications, it can also be a curved surface for indicating product specifications, characters, patterns or trademarks.

請參閱第四、五、六圖所示,係為本創作較佳實施例之立體分解圖、較佳實施例之使用狀態圖及第五圖a部份之放大圖,由圖中所示可以清楚看出,本創作之散熱片1於實際應用時,該定位元件11之複數顯示面113與定位元件11之頂面的夾角θ為呈60度,而該定位元件11與二金屬片12係先結合成為一體,其二金屬片12的固定部122之複數固定片1221分別扣持於定位元件11的扣持部112之複數卡塊1121上,而定位元件11的結合部114之複數支臂1141位於二金屬片12外側,且各結合部114之卡持片1142擋止於定位部123之定位片1231底面處,而若欲將散熱片1組裝在記憶體2外部時,便可先於記憶體2二側外部襯墊具散熱效果之散熱膠片(圖中未示出),亦或者於散熱片1之貼合面121上塗抹散熱膏,藉此填補組合後散熱片1與記憶體2間之間隙,且亦可保護記憶體2二側上的複數記憶單元21,之後便可將散熱片1組裝於記憶體2外部,其記憶體2頂部便會位於散熱片1定位元件11之容置空間110內,且散熱片1之複數金屬片12予以罩覆在記憶體2二側各記憶單元21外部,並透過二金屬片12相對內側之貼合面121緊貼附於複數記憶單元21表面上,以具有良好的熱傳導效能、增加散熱功效。 Please refer to the fourth, fifth and sixth figures, which are perspective exploded views of the preferred embodiment of the present invention, a state of use diagram of the preferred embodiment, and an enlarged view of a portion of the fifth diagram, which may be shown in the figure. It is clear that when the heat sink 1 of the present invention is applied, the angle θ between the plurality of display surfaces 113 of the positioning component 11 and the top surface of the positioning component 11 is 60 degrees, and the positioning component 11 and the two metal sheets 12 are Firstly, the plurality of fixing pieces 1221 of the fixing portions 122 of the two metal pieces 12 are respectively fastened on the plurality of blocks 1121 of the fastening portions 112 of the positioning member 11, and the plurality of arms of the coupling portion 114 of the positioning member 11 are integrated. 1141 is located on the outer side of the two metal sheets 12, and the holding piece 1142 of each joint portion 114 is blocked at the bottom surface of the positioning piece 1231 of the positioning portion 123, and if the heat sink 1 is to be assembled outside the memory 2, it can be prior to The heat-dissipating film (not shown) having a heat-dissipating effect on the outer side of the memory 2 or the heat-dissipating paste on the bonding surface 121 of the heat sink 1 is used to fill the combined heat-dissipating film 1 and the memory 2 a gap between the two, and can also protect the plurality of memory units 21 on the two sides of the memory 2, The heat sink 1 can be assembled on the outside of the memory 2, and the top of the memory 2 is located in the accommodating space 110 of the locating component 11 of the heat sink 1, and the plurality of metal sheets 12 of the heat sink 1 are covered in the memory 2. The two sides of the memory unit 21 on the two sides are closely attached to the surface of the plurality of memory units 21 through the opposite surface of the two metal sheets 12 to have good heat conduction performance and heat dissipation.

然而,上述之散熱片1欲裝設於記憶體2上時,應事先視 記憶體2側面上所標示的產品規格後,再選取散熱片1之顯示面113上標示有符合其記憶體2之產品規格的散熱片1,才可將散熱片1裝設於記憶體2外部。 However, when the heat sink 1 described above is to be mounted on the memory 2, it should be viewed in advance. After the product specifications indicated on the side of the memory 2 are selected, the heat sink 1 corresponding to the product specification of the memory 2 is displayed on the display surface 113 of the heat sink 1 to mount the heat sink 1 outside the memory 2. .

本創作之記憶體2安裝於電子裝置3內部主機板31上之插槽311內,且使用者欲觀看記憶體2的規格時,其不需先將電子裝置3的電源進行關閉,再從主機板31上之插槽311內將記憶體2拔出,並使散熱片1分離於記憶體2,再予以觀看記憶體2上所標示之規格,且觀看完後又將散熱片1重複組裝於記憶體2上,並將記憶體2安裝於主機板31上之插槽311內,其使用者只需透過觀看定位元件11之顯示面113所標示的規格來了解散熱片1內部所裝設之記憶體2的規格,以節省使用者拆裝散熱片1與記憶體2的時間,進而達到增加使用上方便性之效果。 The memory 2 of the present invention is installed in the slot 311 on the main board 31 of the electronic device 3, and when the user wants to view the specifications of the memory 2, the power of the electronic device 3 does not need to be turned off first, and then the host is not turned off. The memory 2 is pulled out in the slot 311 on the board 31, and the heat sink 1 is separated from the memory 2, and then the specifications indicated on the memory 2 are viewed. After the viewing, the heat sink 1 is repeatedly assembled. The memory 2 is mounted on the slot 311 of the motherboard 31, and the user only needs to know the specifications indicated on the display surface 113 of the positioning component 11 to understand the interior of the heat sink 1. The specification of the memory 2 is to save the user's time for disassembling the heat sink 1 and the memory 2, thereby achieving an effect of increasing the convenience of use.

再者,本創作散熱片1之定位元件11頂面二側彎角處為設有顯示面113,所以散熱片1之二金屬片12外表面便不需加註不必要之文字、圖案或商標,即可減少各式文字、圖案或商標等對散熱片1的散熱功效造成阻礙,以達到維持良好的散熱之效果。 Furthermore, the positioning surface 113 of the top surface of the positioning element 11 of the heat sink 1 is provided with a display surface 113, so that the outer surface of the two metal sheets 12 of the heat sink 1 does not need to be filled with unnecessary characters, patterns or trademarks. In order to reduce the heat dissipation effect of the heat sink 1 by various characters, patterns or trademarks, the effect of maintaining good heat dissipation can be achieved.

另外,本創作之散熱片1為透過顯示面113來讓使用者了解散熱片1內部所裝設之記憶體2的規格,所以使用者不需將散熱片1多次組裝及拆卸於記憶體2上,以使記憶體2之記憶單元21避免受到多次組裝與拆卸時所產生之外力,而造成記憶單元21損壞之現象。 In addition, the heat sink 1 of the present invention allows the user to understand the specifications of the memory 2 mounted in the heat sink 1 through the display surface 113. Therefore, the user does not need to assemble and disassemble the heat sink 1 in the memory 2 multiple times. In order to prevent the memory unit 21 of the memory 2 from being subjected to external forces generated during multiple assembly and disassembly, the memory unit 21 is damaged.

是以,本創作為主要針對該散熱片之設計,該散熱片1之定位元件11頂面二側彎角處為設有顯示面113,以供標示產品之規格 ,當散熱片1裝設於記憶體2上時,即可於顯示面113上標示內部所裝設之記憶體2的規格,以供使用者只需透過觀看定位元件11之顯示面113所標示的規格來了解散熱片1內部所裝設之記憶體2的規格,以節省使用者拆裝散熱片1與記憶體2的時間,進而達到增加使用上方便性之效果,故舉凡可達成前述效果之結構、裝置皆應受本創作所涵蓋,此種簡易修飾及等效結構變化,均應同理包含於本創作之專利範圍內,合予陳明。 Therefore, the present invention is mainly for the design of the heat sink. The top surface of the positioning member 11 of the heat sink 1 is provided with a display surface 113 for the specification of the product. When the heat sink 1 is mounted on the memory 2, the specification of the internal memory 2 can be indicated on the display surface 113 for the user to simply mark the display surface 113 of the positioning component 11. The specification is to understand the specifications of the memory 2 installed in the heat sink 1, so as to save the time for the user to disassemble the heat sink 1 and the memory 2, thereby achieving the effect of increasing the convenience of use, so that the foregoing effects can be achieved. The structure and device shall be covered by this creation. Such simple modifications and equivalent structural changes shall be included in the scope of this creation patent and shall be combined with Chen Ming.

綜上所述,本創作上述散熱片於使用時,為確實能達到其功效及目的,故本創作誠為一實用性優異之創作,為符合新型專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障創作人之辛苦創作,倘若 鈞局審委有任何稽疑,請不吝來函指示,創作人定當竭力配合,實感德便。 In summary, the above-mentioned heat sink is used to achieve its efficacy and purpose. Therefore, this creation is a practical and excellent creation. In order to meet the requirements of the new patent application, it is required to apply according to law. The Commission will grant this case as soon as possible to protect the hard work of the creators. If there is any doubt in the arbitral tribunal, please do not hesitate to give instructions to the creators, and the creators will try their best to cooperate with them.

1‧‧‧散熱片 1‧‧‧ Heat sink

11‧‧‧定位元件 11‧‧‧ Positioning components

111‧‧‧基部 111‧‧‧ base

113‧‧‧顯示面 113‧‧‧ Display surface

114‧‧‧結合部 114‧‧‧Combination Department

1141‧‧‧支臂 1141‧‧‧ Arm

1142‧‧‧卡持片 1142‧‧‧Card pieces

12‧‧‧金屬片 12‧‧‧metal pieces

121‧‧‧貼合面 121‧‧‧Fitting surface

122‧‧‧固定部 122‧‧‧Fixed Department

1221‧‧‧固定片 1221‧‧‧Fixed piece

123‧‧‧定位部 123‧‧‧ Positioning Department

1231‧‧‧定位片 1231‧‧‧ Positioning film

2‧‧‧記憶體 2‧‧‧ memory

21‧‧‧記憶單元 21‧‧‧ memory unit

Claims (10)

一種包覆於預設記憶體之散熱片,該散熱片係包括具矩形狀基部之定位元件,且基部內部具有中空狀之容置空間,再於基部外側頂面二側彎角處為分別設有供標示產品規格之顯示面。 The heat sink is covered by the preset memory, and the heat sink comprises a positioning component having a rectangular base, and the inside of the base has a hollow receiving space, and is respectively disposed at two corners of the top side of the base. There is a display surface for marking product specifications. 如申請專利範圍第1項所述之散熱片,其中該定位元件為具有金屬材質一體成型製成或二個金屬板材所組構成之基部。 The heat sink according to claim 1, wherein the positioning component is a base formed by integrally forming a metal material or two metal plates. 如申請專利範圍第1項所述之散熱片,其中該顯示面為一斜面或弧面。 The heat sink of claim 1, wherein the display surface is a slope or a curved surface. 如申請專利範圍第1項所述之散熱片,其中該顯示面與頂面的夾角介於5~85度之間,其較佳實施為60度。 The heat sink of claim 1, wherein the display surface and the top surface are at an angle of between 5 and 85 degrees, preferably 60 degrees. 一種包覆於預設記憶體之散熱片,係包括有定位元件及二金屬片,其中:該定位元件為具有一基部,並於基部底部凹設有包覆預設記憶體頂部之容置空間,且容置空間開口處設有扣持部,而基部頂面二側彎角處分別設有供標示產品規格之顯示面,再於各顯示面延伸彎折有結合部;及該金屬片係為呈相對形式設計,而二金屬片相對內側設有貼覆於預設記憶體側面之貼合面,並於各金屬片上緣設有固定於扣持部上之固定部,再於各金屬片下緣設有結合於結合部上之定位部。 The heat sink coated on the preset memory comprises a positioning component and two metal sheets, wherein: the positioning component has a base portion, and a receiving space covering the top of the preset memory body is recessed at the bottom of the base portion. And a fastening portion is arranged at the opening of the accommodating space, and a display surface for indicating the product specification is respectively arranged at the two corners of the top surface of the base, and then a joint portion is extended and bent at each display surface; and the metal sheet is The utility model is designed in a relative form, and the two metal sheets are provided with a bonding surface which is attached to the side surface of the preset memory body on the inner side, and a fixing portion fixed on the fastening portion is arranged on the upper edge of each metal sheet, and then the metal pieces are respectively arranged. The lower edge is provided with a positioning portion coupled to the joint portion. 如申請專利範圍第5項所述之散熱片,其中該定位元件之扣持部為具有相對向內凸設之複數卡塊,而該各金屬片之固定部位於上緣二側處分別連續彎折有扣持於卡塊上之固定片。 The heat sink of claim 5, wherein the fastening portion of the positioning member has a plurality of blocks protruding inwardly, and the fixing portions of the metal sheets are respectively bent at two sides of the upper edge. Fold the fixed piece that is fastened to the block. 如申請專利範圍第5項所述之散熱片,其中該定位元件之顯示面為一斜面或弧面。 The heat sink of claim 5, wherein the display surface of the positioning component is a bevel or a curved surface. 如申請專利範圍第5項所述之散熱片,其中該定位元件之顯示面與頂面的角度介於5~85度之間。 The heat sink of claim 5, wherein an angle between the display surface of the positioning component and the top surface is between 5 and 85 degrees. 如申請專利範圍第8項所述之散熱片,其中該定位元件之顯示面與頂面的角度較佳實施為60度。 The heat sink of claim 8, wherein the angle between the display surface and the top surface of the positioning component is preferably 60 degrees. 如申請專利範圍第5項所述之散熱片,其中該定位元件之結合部為具有位於二金屬片相對外側之二支臂,並於二支臂端部分別相對向內彎折有卡持片,而該金屬片之定位部位於下緣二側處分別延伸凸設有擋止於卡持片上之定位片。 The heat sink according to claim 5, wherein the joint portion of the positioning member has two arms on opposite sides of the two metal sheets, and the opposite ends of the two arm portions are respectively bent inwardly with the holding pieces. And the positioning portion of the metal piece is located at two sides of the lower edge and respectively protrudes and protrudes from the positioning piece on the holding piece.
TW104220293U 2015-12-17 2015-12-17 Heat dissipation plate TWM521806U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI832086B (en) * 2021-01-04 2024-02-11 日商東芝股份有限公司 Connector, method for connecting contact pin, contact pin, and storage medium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI832086B (en) * 2021-01-04 2024-02-11 日商東芝股份有限公司 Connector, method for connecting contact pin, contact pin, and storage medium

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