US10356947B2 - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
- Publication number
- US10356947B2 US10356947B2 US15/634,844 US201715634844A US10356947B2 US 10356947 B2 US10356947 B2 US 10356947B2 US 201715634844 A US201715634844 A US 201715634844A US 10356947 B2 US10356947 B2 US 10356947B2
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- US
- United States
- Prior art keywords
- conducting sheet
- heat
- heat conducting
- planar surface
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Definitions
- the present invention relates to an electronic apparatus in which an electronic component to generate heat is arranged in a chassis.
- Some of electronic components mounted in an electronic apparatus such as a tablet personal computer (a tablet PC) or a smartphone greatly generate heat.
- the heat generated from the electronic components is required to be smoothly diffused in a chassis and released to the outside.
- Patent Document 1 discloses a constitution in which a heat sink is arranged on one surface of an electronic component via a graphite sheet having thermal conductivity. In this constitution, the heat from the electronic component is conducted to the heat sink via the graphite sheet, diffused, and then released therefrom.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2008-78564
- a vaper chamber for the above-described heat sink, a vaper chamber, a heat pipe, a metal block having a high thermal conductivity such as copper or aluminum, or the like is generally used.
- Such a heat sink has a high heat releasing performance, but a certain level of thickness is necessary. Hence, when an outer shape area of the heat sink is increased to further enhance the heat releasing performance, a reduction in thickness of the chassis of the electronic apparatus is inhibited.
- a portable type electronic apparatus e.g., the above-described tablet PC or smartphone, or a laptop personal computer (a laptop PC)
- the reduction in thickness of the chassis is strongly demanded. Therefore, it is often difficult to acquire a space to increase an outer shape area of the heat sink in the chassis of such an electronic apparatus.
- the present invention has been achieved in view of the above-described problems in the conventional technology, and it is an object of the present invention to provide an electronic apparatus which can accomplish both a reduction in thickness of a chassis and an improvement in a heat releasing performance.
- An electronic apparatus includes a chassis having an electronic component arranged therein; a heat sink which is provided in the chassis and whose one surface is arranged to enable conduction of heat from the electronic component so that the heat generated from the electronic component is absorbed; and a first heat conducting sheet which is provided in the chassis, closely arranged on the other surface on the side opposite to the one surface of the heat sink, has an outer shape area larger than an outer shape area of the heat sink, and extends to the outside of the outer shape of the heat sink.
- the heat generated from the electronic component is conducted from the heat sink to the heat conducting sheet, diffused, and then released. That is, in the electronic apparatus, its releasing area is increased by using the heat conducting sheet which can be thinned more than the heat sink, both the reduction in thickness of the chassis and the improvement in a heat releasing performance can be achieved.
- the electronic apparatus may be a constitution including second heat conducting sheet which is closely arranged on the one surface of the heat sink, has an outer shape area larger than the outer shape area of the heat sink, and extends to the outside of the outer shape of the heat sink. According to this constitution, the heat generated from the electronic component can be diffused and released from both the surfaces of the heat sink, and the higher heat releasing performance can be obtained.
- the electronic apparatus may include a constitution in which the heat sink has the outer shape area larger than that of the electronic component, and the second heat conducting sheet has a notch portion which avoids the electronic component arranged on the one surface of the heat sink, and is closely arranged on the one surface of the heat sink exposed around the electronic component. According to this constitution, the thickness due to the second heat conducting sheet does not affect the thickness of the chassis, and hence the heat releasing performance can be improved.
- the electronic apparatus may include a constitution in which the first heat conducting sheet and the second heat conducting sheet have a heat releasing section where their portions extending to the outside of the outer shape of the heat sink join together. According to this constitution, the heat from both the surfaces of the heat sink can be efficiently released from the heat releasing section having a certain level of thickness.
- the present invention may be a constitution in which the first heat conducting sheet and the second heat conducting sheet are formed by splitting a portion of one heat conducting sheet into two layers in a thickness direction, and the other portion of the one heat conducting sheet forms the heat releasing section.
- the first heat conducting sheet and the second heat conducting sheet arranged on both the surfaces of the heat sink can be thinned as much as possible.
- the heat releasing section becomes an area having a certain level of thickness where the first heat conducting sheet and the second heat conducting sheet join together, and hence the high heat releasing performance can be acquired.
- the present invention may be a constitution in which the heat releasing section is formed by bonding the portions of the first heat conducting sheet and the second heat conducting sheet which extend to the outside of the outer shape of the heat sink. According to this constitution, production efficiency is excellent, costs can be reduced, and simultaneously the high heat releasing performance can be acquired.
- the electronic apparatus may include a constitution in which a battery device is arranged in the chassis, and the heat releasing section is arranged on a surface of the battery device. That is, on the surface of the battery device, a constitution where a gap that is a space for various kinds of wiring lines is provided is often acquired.
- the heat releasing section for the heat conducting sheet can be arranged in an extra space in this gap, which enhances a use efficiency of the space.
- the electronic apparatus may include a constitution in which the electronic component is connected to an electronic substrate arranged on a side of the battery device, a wiring line connected to another electronic component different from the electronic component is connected to the electronic substrate, and the wiring line is arranged to run through a position which is on the surface of the battery device and which does not overlap the heat releasing section.
- the electronic apparatus may include a constitution in which a battery device is arranged in the chassis, and a portion of the first heat conducting sheet which extends to the outside of the outer shape of the heat sink is arranged on a surface of the battery device.
- heat generated from the electronic component is conducted from the heat sink to the heat conducting sheet, diffused and then released, and hence both the reduction in thickness of the chassis and the improvement in a heat releasing performance can be achieved.
- FIG. 1 is a plan view schematically showing an internal structure of an electronic apparatus according to an embodiment of the present invention
- FIG. 2 is a side sectional view schematically showing the internal structure of the electronic apparatus depicted in FIG. 1 ;
- FIG. 3 is a side sectional view schematically showing an internal structure of an electronic apparatus including a heat conducting sheet according to a first modification
- FIG. 4 is a side sectional view schematically showing an internal structure of an electronic apparatus including a heat conducting sheet according to a second modification
- FIG. 5 is a side sectional view schematically showing an internal structure of an electronic apparatus including a heat conducting sheet according to a third modification.
- FIG. 1 is a plan view schematically showing an internal structure of an electronic apparatus 10 according to an embodiment of the present invention.
- FIG. 2 is a side sectional view schematically showing an internal structure of the electronic apparatus 10 depicted in FIG. 1 .
- a tablet PC will be exemplified as the electronic apparatus 10 .
- the electronic apparatus 10 may be other than the tablet PC, and it may be, e.g., a laptop PC, a smartphone, a mobile phone, or an electronic notebook.
- the electronic apparatus 10 includes a chassis 12 and a display 14 .
- the chassis 12 is formed into a flat box shape having a space to accommodate various kinds of electronic components formed therein.
- the chassis 12 has an exterior cover 12 a which covers a back surface to an outer peripheral side surface of the electronic apparatus 10 .
- a front surface of the chassis 12 is closed by the display 14 .
- the exterior cover 12 a is a thin plate made of, e.g., a resin or a metal.
- the display 14 is constituted of a liquid crystal display on which a touch operation is possible.
- chassis 12 there are arranged various non-illustrated electronic components of an electronic substrate 16 , an electronic component 18 , a heat sink 20 , a heat conducting sheet (a first heat conducting sheet) 22 , a battery device 24 , a memory and others.
- the electronic component 18 is a heating element, which generates heat during an operation of the electronic apparatus 10 , such as an arithmetic unit like a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), an image chip or a component for cameras, or the like.
- an arithmetic unit like a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), an image chip or a component for cameras, or the like.
- the heat sink 20 is a tabular heat releasing instrument which absorbs heat generated from the electronic component 18 and releases it to the outside.
- the heat sink 20 is constituted of, e.g., a vaper chamber, a heat pipe, a block member made of copper or aluminum, or the like.
- One surface 20 a of the heat sink 20 which is a surface on the display 14 side is arranged to enable conduction of the heat from the electronic component 18 .
- the one surface 20 a of the heat sink 20 and a surface of the electronic component 18 directly abut on or are close to each other, or they abut on each other via a paste member, an adhesive, or the like having thermal conductivity.
- the heat sink 20 has an outer shape area larger than that of the electronic component 18 in planar view, and has a board thickness of, e.g., approximately 0.5 mm to several mm.
- a portion of the one surface 20 a of the heat sink 20 which extends to the outside of the outer shape of the electronic component 18 constitutes an exposed surface 20 b exposed to a periphery of the electronic component 18 .
- Reference numeral 26 in FIG. 1 denotes a screw to fix the heat sink 20 on the electronic substrate 16 .
- the heat conducting sheet 22 is a thin heat releasing sheet to further diffuse the heat from the electronic component 18 absorbed by the heat sink 20 and release it to the outside.
- the heat conducting sheet 22 is made of, e.g., a graphite sheet, an aluminum sheet, or a copper sheet.
- the heat conducting sheet 22 is closely arranged on the other surface 20 c of the heat sink 20 provided on the side opposite to the one surface 20 a of the same so that the heat can be conducted.
- the heat conducting sheet 22 has an outer shape area larger than that of the heat sink 20 in planar view, and has a thickness of approximately 0.05 mm to 0.1 mm.
- the heat conducting sheet 22 has a heat absorbing section 22 a which is a portion pressed against the other surface 20 c of the heat sink 20 and a heat releasing section 22 b which is a portion extending outward from the outer shape of the other surface 20 c .
- the heat releasing section 22 b is arranged to extend on a surface 24 a of the battery device 24 .
- the battery device 24 is arranged on a side of the electronic substrate 16 in the chassis 12 .
- the battery device 24 is arranged between its surface 24 a on a side opposite to its surface on the display 14 side and the exterior cover 12 a via a gap G.
- the electronic components 28 and 29 different from the electronic component 18 are arranged.
- the electronic component 28 is, e.g., a substrate to control the display 14 .
- the electronic component 29 is, e.g., a sub-card for communication.
- These electronic components 28 and 29 are connected to the electronic substrate 16 via wiring lines 30 .
- the wiring lines 30 are, e.g., flexible printed circuits.
- the wiring lines 30 are arranged through the gap G above the surface 24 a of the battery device 24 . In other words, the gap G is acquired as a space to arrange the wiring lines 30 or other wiring lines in the thin chassis 12 .
- the heat conducting sheet 22 is provided on the other surface 20 c of the heat sink 20 which absorbs the heat from the electronic component 18 from the one surface 20 a . Further, the heat conducting sheet 22 is formed to have a larger outer shape than the outer shape of the heat sink 20 , and the heat releasing section 22 b is extended to the outside of the outer shape of the heat sink 20 .
- the heat generated from the electronic component 18 is conducted from the heat sink 20 to the heat conducting sheet 22 and then diffused as indicated by arrows H depicted by alternate long and short dash lines in FIG. 2 . Consequently, the heat from the electronic component 18 is released from the heat absorbing section 22 a or the heat releasing section 22 b of the heat conducting sheet 22 into the chassis 12 , and eventually released to the outside of the chassis 12 through, e.g., the exterior cover 12 a . That is, although the heat sink 20 has the high heat releasing performance, it has a certain level of thickness. Thus, when the outer shape area of the heat sink 20 is extremely increased to improve the heat releasing performance, a reduction in thickness of the chassis 12 is inhibited.
- the heat conducting sheet 22 which can be greatly thinned as compared with the heat sink 20 is used, whereby the heat absorbed by the heat sink 20 can be considerably diffused and efficiently released. Consequently, both the reduction in thickness of the chassis 12 and the improvement in a heat releasing performance can be achieved. That is, the heat conducting sheet 22 is formed in a thinner and more flexible state as compared with the heat sink 20 .
- the heat conducting sheet 22 can be relatively freely arranged on, e.g., the surface 24 a of the battery device in the chassis 12 , and the high heat releasing performance and the reduction in thickness of the chassis 12 can be acquired.
- the gap G serving as the above-described space for the wiring lines 30 is provided.
- arranging the heat releasing section 22 b of the heat conducting sheet 22 in the extra space in the gap G which does not overlap the wiring lines 30 enhances the use efficiency of the space.
- FIG. 3 is a side sectional view schematically showing an internal structure of an electronic apparatus 10 including a heat conducting sheet 40 according to a first modification.
- a heat conducting sheet 40 is constituted of a first heat conducting sheet 41 and a second heat conducting sheet 42 .
- the first heat conducting sheet 41 and the second heat conducting sheet 42 are made of the same material as that of the heat conducting sheet 22 .
- the first heat conducting sheet 41 and the second heat conducting sheet 42 are thin heat releasing sheets to further diffuse heat from an electronic component 18 absorbed by a heat sink 20 and release the heat to the outside.
- the first heat conducting sheet 41 is closely arranged on the other surface 20 c of the heat sink 20 so that the heat can be conducted.
- the first heat conducting sheet 41 has a larger outer shape area than an outer shape area of the heat sink 20 in planar view.
- the second heat conducting sheet 42 is closely arranged on one surface 20 a of the heat sink 20 so that the heat can be conducted.
- the second heat conducting sheet 42 has a notch portion 42 a which avoids the electronic component 18 arranged on the one surface 20 a of the heat sink 20 , and is closely arranged on an exposed surface 20 b .
- the second heat conducting sheet 42 has an outer shape area larger than the outer shape area of the heat sink 20 in planar view.
- the notch portion 42 a is formed of, e.g., a rectangular hole portion which is slightly larger than an outer shape of the electronic component 18 (see the notch portion 42 a depicted by an alternate long and two dashes line in FIG. 1 ).
- Each of the first heat conducting sheet 41 and the second heat conducting sheet 42 has a thickness which is approximately a half (e.g., 0.025 mm to 0.05 mm) of that of the heat conducting sheet 22 .
- each of the first heat conducting sheet 41 and the second heat conducting sheet 42 pressed against the other surface 20 c and the exposed surface 20 b of the heat sink 20 functions as a heat absorbing section 40 a .
- portions of the first heat conducting sheet 41 and the second heat conducting sheet 42 which extend to the outside of outer shapes of the other surface 20 c and the exposed surface 20 b function as a heat releasing section 40 b .
- the heat releasing section 40 b is arranged to extend on a surface 24 a of a battery device 24 like the heat releasing section 22 b of the heat conducting sheet 22 .
- a portion of one heat conducting sheet is split into two layers along a thickness direction to form the first heat conducting sheet 41 and the second heat conducting sheet 42 .
- the other portion which serves as an unsplit base side of this one heat conducting sheet forms the heat releasing section 40 b .
- the heat releasing section 40 b has a thickness which is approximately the same (e.g., 0.05 mm to 0.1 mm) as that of the heat conducting sheet 22 .
- the heat conducting sheet 40 having the first heat conducting sheet 41 and the second heat conducting sheet 42 may be provided.
- the heat generated from the electronic component 18 is conducted from both surfaces of the heat sink 20 to the first heat conducting sheet 41 and the second heat conducting sheet 42 and then released. Consequently, the heat from the electronic component 18 is released from the first heat conducting sheet 41 and the second heat conducting sheet 42 constituting the heat absorbing section 40 a or the heat releasing section 40 b where these sheets join together into a chassis 12 , and eventually released to the outside of the chassis 12 through, e.g., an exterior cover 12 a . That is, the heat conducting sheet 40 can absorb the heat from both the surfaces of the heat sink and release the same, it has the higher heat releasing performance than that of the heat conducting sheet 22 .
- the heat conducting sheet 40 is thinned by splitting one heat conducting sheet into two layers, i.e., the first heat conducting sheet 41 and the second heat conducting sheet 42 along the thickness direction.
- the first heat conducting sheet 41 and the second heat conducting sheet 42 are arranged on both the surfaces of the heat sink 20 respectively, a thickness dimension is not increased, and a reduction in thickness of the chassis 12 is not inhibited.
- the heat releasing section 40 b has a thickness which is approximately double the thickness of the first heat conducting sheet 41 or the second heat conducting sheet 42 , the higher heat releasing performance can be acquired.
- the second heat conducting sheet 42 avoids the electronic component 18 by the notch portion 42 a , this second heat conducting sheet 42 does not affect the reduction in thickness of the chassis 12 .
- FIG. 4 is a side sectional view schematically showing an internal structure of an electronic apparatus 10 including a heat conducting sheet 50 according to a second modification.
- the heat conducting sheet 50 is constituted of a first heat conducting sheet 51 and a second heat conducting sheet 52 .
- the first heat conducting sheet 51 and the second heat conducting sheet 52 are made of the same material as that of the above-described heat conducting sheets 22 and 40 .
- the first heat conducting sheet 51 and the second heat conducting sheet 52 are thin heat releasing sheets to further diffuse heat from an electronic component 18 absorbed by a heat sink 20 and release the heat to the outside.
- the first heat conducting sheet 51 is closely arranged on the other surface 20 c of the heat sink 20 so that the heat can be conducted.
- the first heat conducting sheet 51 has an outer shape area larger than an outer shape area of the heat sink 20 in planar view.
- the second heat conducting sheet 52 is closely arranged on one surface 20 a of the heat sink 20 so that the heat can be conducted. Specifically, the second heat conducting sheet 52 is closely arranged on an exposed surface 20 b in a state where an electronic component 18 is avoided at a notch portion 42 a like the above-described second heat conducting sheet 42 .
- the second heat conducting sheet 52 has an outer shape area larger than the outer shape area of the heat sink 20 in planar view.
- Each of the first heat conducting sheet 51 and the second heat conducting sheet 52 has a thickness which is approximately a half (e.g., 0.025 mm to 0.05 mm) of that of the heat conducting sheet 22 .
- each of the first heat conducting sheet 51 and the second heat conducting sheet 52 pressed against the other surface 20 c and the exposed surface 20 b of the heat sink 20 functions as a heat absorbing section 50 a .
- portions of the first heat conducting sheet 51 and the second heat conducting sheet 52 which extend to the outside of outer shapes of the other surface 20 c and the exposed surface 20 b function as a heat releasing section 50 b .
- the heat releasing section 50 b is arranged to extend on a surface 24 a of a battery device 24 like the above-described heat releasing section 22 b or 40 b .
- the heat releasing section 50 b is formed by bonding the portions of the first heat conducting sheet 51 and the second heat conducting sheet 52 which extend to the outside of the outer shape of heat sink 20 .
- the heat releasing section 50 b has a thickness which is approximately the same (e.g., 0.05 mm to 0.1 mm) as that of the heat conducting sheet 22 or 40 .
- the heat conducting sheet 50 having the first heat conducting sheet 51 and the second heat conducting sheet 52 may be provided.
- the heat generated from the electronic component 18 is released from the heat absorbing section 50 a or the heat releasing section 50 b into a chassis 12 , and eventually released to the outside of the chassis 12 through, e.g., an exterior cover 12 a .
- the heat conducting sheet 50 can absorb and release the heat from both the surfaces of the heat sink 20 , and has a high heat releasing performance.
- the heat conducting sheet 50 can be formed by just bonding the portions of the first heat conducting sheet 51 and the second heat conducting sheet 52 as two heat conducting sheets and has excellent manufacturing efficiency, and costs can be reduced. It is to be noted that, for example, a constitution in which the first heat conducting sheet 51 and the second heat conducting sheet 52 are extended on the surface 24 a of the battery device 24 and a back surface on the reverse side of the same may be adopted without bonding these sheets.
- FIG. 5 is a side sectional view schematically showing an internal structure of an electronic apparatus 10 including a heat conducting sheet 60 according to a third modification.
- an end portion of the heat conducting sheet 60 on the side opposite to the heat releasing section 22 b side of the heat conducting sheet shown in FIG. 2 is extended, folded back, and arranged on one surface 20 a of a heat sink 20 .
- the heat conducting sheet 60 is constituted of a heat conducting sheet 22 and a second heat conducting sheet 62 which is provided by extending and folding back the end portion of the heat conducting sheet 22 .
- the second heat conducting sheet 62 is closely arranged on the one surface 20 a of the heat sink 20 so that heat can be conducted. Specifically, the second heat conducting sheet 62 is closely arranged on an exposed surface 20 b in a state where an electronic component 18 is avoided by a notch portion 42 a like the above-described second heat conducting sheet 42 or 52 .
- the second heat conducting sheet 62 has an outer shape area larger than an outer shape area of the heat sink 20 in planar view.
- each of the heat conducting sheet 22 and the second heat conducting sheet 62 which are appressed against the other surface 20 c and the exposed surface 20 b of the heat sink 20 , functions as a heat absorbing section 60 a .
- a portion of the heat conducting sheet 22 which extends to the outside of an outer shape of the other surface 20 c functions as a heat releasing section 22 b.
- the electronic apparatus 10 may include the heat conducting sheet 60 which has the heat conducting sheet 22 and the second heat conducting sheet 62 . Consequently, the heat generated from the electronic component 18 is released into a chassis 12 from the heat absorbing section 60 a or the heat releasing section 22 b , and eventually released to the outside of the chassis 12 through, e.g., an exterior cover 12 a . That is, the heat conducting sheet 60 can absorb the heat from both the surfaces of the heat sink and release it, and has the high heat releasing performance. Furthermore, the heat conducting sheet 60 has the second heat conducting sheet 62 formed by folding back the heat conducting sheet 22 which is one heat conducting sheet, has the excellent production efficiency, and can reduce costs.
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2016-143332 | 2016-07-21 | ||
JP2016143332A JP6649854B2 (en) | 2016-07-21 | 2016-07-21 | Electronics |
JP2016143332 | 2016-07-21 |
Publications (2)
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US20180027694A1 US20180027694A1 (en) | 2018-01-25 |
US10356947B2 true US10356947B2 (en) | 2019-07-16 |
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US15/634,844 Active US10356947B2 (en) | 2016-07-21 | 2017-06-27 | Electronic apparatus |
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US (1) | US10356947B2 (en) |
JP (1) | JP6649854B2 (en) |
CN (1) | CN107643806B (en) |
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US11495519B2 (en) | 2019-06-07 | 2022-11-08 | Dana Canada Corporation | Apparatus for thermal management of electronic components |
JP2021040096A (en) * | 2019-09-05 | 2021-03-11 | レノボ・シンガポール・プライベート・リミテッド | Heat dissipation mechanism and electronic device |
KR20220068039A (en) * | 2020-11-18 | 2022-05-25 | 삼성전자주식회사 | Electronic device with radiant heat structure |
FR3120152A1 (en) * | 2021-02-22 | 2022-08-26 | Sagemcom Broadband Sas | Electronic equipment comprising a sealed acoustic duct |
Citations (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5731952A (en) * | 1995-04-28 | 1998-03-24 | Kabushiki Kaisha Toshiba | Portable electronic apparatus having the heat radiation device for circuit module |
US6223815B1 (en) * | 1999-03-19 | 2001-05-01 | Kabushiki Kaisha Toshiba | Cooling unit for cooling a heat-generating component and electronic apparatus having the cooling unit |
US20020080577A1 (en) * | 2000-12-27 | 2002-06-27 | International Business Machines Corporation | Apparatus and method for cooling a wearable computer |
US20040174673A1 (en) * | 2003-03-03 | 2004-09-09 | Jen-Cheng Lin | Hard disc drive heat sink and sound absorbing frame |
US20050117292A1 (en) * | 2001-04-24 | 2005-06-02 | John Difonzo | Computer component protection |
US20060120047A1 (en) * | 2000-04-19 | 2006-06-08 | Denso Corporation | Coolant cooled type semiconductor device |
JP3122382U (en) | 2006-03-31 | 2006-06-08 | 大塚電機株式会社 | Thermal conduction member, heat dissipation structure, and electronic equipment |
US20060181858A1 (en) * | 2005-02-14 | 2006-08-17 | Kabushiki Kaisha Toshiba | Heat dissipation device and heat dissipation method for electronic equipment |
US20060187645A1 (en) * | 2005-02-23 | 2006-08-24 | Kabushiki Kaisha Toshiba | Heat dissipation device for electronic equipment |
US20060198108A1 (en) * | 2005-03-07 | 2006-09-07 | Ati Technologies, Inc. | Thermal management apparatus and method for a circuit substrate |
US20060268510A1 (en) * | 2005-05-25 | 2006-11-30 | Jeong Kwang J | Plasma display device |
US20070178873A1 (en) * | 2006-01-18 | 2007-08-02 | Mitsumi Electric Co. Ltd. | Tuner module for radio receiver |
US20070297145A1 (en) * | 2006-06-22 | 2007-12-27 | Siemens Vdo Automotive Aktiengesellschaft | Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink |
US20080013286A1 (en) * | 2006-07-13 | 2008-01-17 | Shinko Electric Industries Co., Ltd. | Semiconductor module and heat radiating plate |
JP2008078564A (en) | 2006-09-25 | 2008-04-03 | Fujikura Ltd | Heat dissipating structure |
US20080165494A1 (en) * | 2005-03-24 | 2008-07-10 | Dell Products L.P. | Method And Apparatus For Thermal Dissipation In An Information Handling System |
US20080257585A1 (en) * | 2005-01-15 | 2008-10-23 | Thermastrate Limited | Electrical Power Substrate |
US20090135563A1 (en) * | 2007-11-27 | 2009-05-28 | Sony Corporation | Heat radiation structure of electronic component and display device |
US20090244852A1 (en) * | 2008-03-25 | 2009-10-01 | Fujitsu Limited | Heat radiator |
US20100165574A1 (en) * | 2008-12-26 | 2010-07-01 | Panasonic Corporation | Image display apparatus |
US20100251536A1 (en) * | 2009-04-06 | 2010-10-07 | Moxa Inc. | Heat-dissipating structure on case of industrial computer and manufacturing method thereof |
US20110096505A1 (en) * | 2009-08-31 | 2011-04-28 | Funai Electric Co., Ltd. | Package substrate |
US20110279970A1 (en) * | 2010-05-17 | 2011-11-17 | Hon Hai Precision Industry Co., Ltd. | Electronic device with thermal insulation member for heat sink |
US20120020017A1 (en) * | 2010-07-20 | 2012-01-26 | Kehret William E | Printed circuit board module enclosure and apparatus using same |
US8199509B2 (en) * | 2009-06-12 | 2012-06-12 | Sony Corporation | Electronic equipment |
US20120160456A1 (en) * | 2010-12-28 | 2012-06-28 | Fujitsu Limited | Cooling apparatus and electronic apparatus |
US20130083488A1 (en) * | 2011-09-30 | 2013-04-04 | Fujitsu Limited | Semiconductor package, wiring board unit, and electronic apparatus |
US20130094152A1 (en) * | 2011-10-13 | 2013-04-18 | Hon Hai Precision Industry Co., Ltd. | Electronic device and heat sink employing the same |
US20130188314A1 (en) * | 2010-09-30 | 2013-07-25 | Nec Corporation | Vapor phase cooling apparatus and electronic equipment using same |
US20130199767A1 (en) * | 2012-02-02 | 2013-08-08 | International Business Machines Corporation | Compliant pin fin heat sink and methods |
US20130242542A1 (en) * | 2012-03-19 | 2013-09-19 | Canon Kabushiki Kaisha | Display apparatus |
US20130265722A1 (en) * | 2009-06-05 | 2013-10-10 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
US20130286592A1 (en) * | 2012-04-27 | 2013-10-31 | Canon Kabushiki Kaisha | Electronic component and electronic apparatus |
US20130301222A1 (en) * | 2012-05-09 | 2013-11-14 | Gemtek Technology Co., Ltd | Stacked heat dissipating module of an electronic device |
US20130308269A1 (en) * | 2009-12-02 | 2013-11-21 | Hamilton Sundstrand Corporation | Method of converting power using a power semiconductor module |
US20140009891A1 (en) * | 2012-07-09 | 2014-01-09 | Lite-On Technology Corporation | Planar heat dissipation structure and electronic device utilizing the same |
US20140085832A1 (en) * | 2012-09-26 | 2014-03-27 | Panasonic Corporation | Electronic device with efficient heat radiation structure for electronic components |
US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
US20140140011A1 (en) * | 2012-11-16 | 2014-05-22 | Hitachi Metals, Ltd. | Signal Transmission Device |
US20140160684A1 (en) * | 2012-12-06 | 2014-06-12 | Apple Inc. | Cooling for electronic components |
US20150062820A1 (en) * | 2013-09-04 | 2015-03-05 | Cisco Technology, Inc. | Heat transfer for electronic equipment |
US20150208550A1 (en) * | 2014-01-21 | 2015-07-23 | Seagate Technology Llc | Dissipating Heat During Device Operation |
US20150250074A1 (en) * | 2013-12-13 | 2015-09-03 | Hitachi, Ltd. | Cooling structure for heating element and power converter |
US20150305205A1 (en) * | 2012-12-03 | 2015-10-22 | CoolChip Technologies, Inc. | Kinetic-Heat-Sink-Cooled Server |
US20160050790A1 (en) * | 2013-03-08 | 2016-02-18 | International Business Machines Corporation | Multi-component electronic module with integral coolant-cooling |
US20160079150A1 (en) * | 2014-09-12 | 2016-03-17 | Intel Corporation | Techniques and configurations associated with a package load assembly |
US20160150673A1 (en) * | 2014-11-20 | 2016-05-26 | Hitachi Metals, Ltd. | Communication Module |
US20160174416A1 (en) * | 2010-09-09 | 2016-06-16 | International Business Machines Corporation | Electronic module with laterally-conducting heat distributor layer |
US20160183407A1 (en) * | 2014-12-19 | 2016-06-23 | Fujitsu Limited | Board assembly including cooling system and electronic apparatus |
US20160282914A1 (en) * | 2013-11-14 | 2016-09-29 | Fujikura Ltd. | Cooling structure for portable electronic device |
US20170023306A1 (en) * | 2015-07-22 | 2017-01-26 | Compulab Ltd. | Layered heat pipe structure for cooling electronic component |
US20170083060A1 (en) * | 2011-05-05 | 2017-03-23 | Carefusion 303, Inc. | Passive cooling and emi shielding system |
US20170196122A1 (en) * | 2015-12-30 | 2017-07-06 | Msi Computer (Shenzhen) Co.,Ltd. | Heat dissipation system |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2727959Y (en) * | 2004-08-14 | 2005-09-21 | 鸿富锦精密工业(深圳)有限公司 | Radiator |
JP4440838B2 (en) * | 2005-06-30 | 2010-03-24 | ポリマテック株式会社 | Thermally conductive member and cooling structure using the thermally conductive member |
JP2007324016A (en) * | 2006-06-02 | 2007-12-13 | Matsushita Electric Ind Co Ltd | Induction heating apparatus |
CN200990750Y (en) * | 2006-12-27 | 2007-12-12 | 华为技术有限公司 | A radiating structure and equipment including the same radiating structure |
JP5978457B2 (en) * | 2012-03-19 | 2016-08-24 | パナソニックIpマネジメント株式会社 | Thermal conductor |
JP5850160B2 (en) * | 2012-07-30 | 2016-02-03 | 株式会社村田製作所 | Electronics |
US9099080B2 (en) * | 2013-02-06 | 2015-08-04 | Muzak Llc | System for targeting location-based communications |
JP2015088575A (en) * | 2013-10-30 | 2015-05-07 | パナソニックIpマネジメント株式会社 | Heat insulation sheet and thermal insulation structure using the same |
-
2016
- 2016-07-21 JP JP2016143332A patent/JP6649854B2/en active Active
-
2017
- 2017-06-22 CN CN201710479792.9A patent/CN107643806B/en active Active
- 2017-06-27 US US15/634,844 patent/US10356947B2/en active Active
Patent Citations (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5731952A (en) * | 1995-04-28 | 1998-03-24 | Kabushiki Kaisha Toshiba | Portable electronic apparatus having the heat radiation device for circuit module |
US6223815B1 (en) * | 1999-03-19 | 2001-05-01 | Kabushiki Kaisha Toshiba | Cooling unit for cooling a heat-generating component and electronic apparatus having the cooling unit |
US20060120047A1 (en) * | 2000-04-19 | 2006-06-08 | Denso Corporation | Coolant cooled type semiconductor device |
US20020080577A1 (en) * | 2000-12-27 | 2002-06-27 | International Business Machines Corporation | Apparatus and method for cooling a wearable computer |
US20050117292A1 (en) * | 2001-04-24 | 2005-06-02 | John Difonzo | Computer component protection |
US20040174673A1 (en) * | 2003-03-03 | 2004-09-09 | Jen-Cheng Lin | Hard disc drive heat sink and sound absorbing frame |
US20080257585A1 (en) * | 2005-01-15 | 2008-10-23 | Thermastrate Limited | Electrical Power Substrate |
US20060181858A1 (en) * | 2005-02-14 | 2006-08-17 | Kabushiki Kaisha Toshiba | Heat dissipation device and heat dissipation method for electronic equipment |
US20060187645A1 (en) * | 2005-02-23 | 2006-08-24 | Kabushiki Kaisha Toshiba | Heat dissipation device for electronic equipment |
US20060198108A1 (en) * | 2005-03-07 | 2006-09-07 | Ati Technologies, Inc. | Thermal management apparatus and method for a circuit substrate |
US20080165494A1 (en) * | 2005-03-24 | 2008-07-10 | Dell Products L.P. | Method And Apparatus For Thermal Dissipation In An Information Handling System |
US20060268510A1 (en) * | 2005-05-25 | 2006-11-30 | Jeong Kwang J | Plasma display device |
US20070178873A1 (en) * | 2006-01-18 | 2007-08-02 | Mitsumi Electric Co. Ltd. | Tuner module for radio receiver |
JP3122382U (en) | 2006-03-31 | 2006-06-08 | 大塚電機株式会社 | Thermal conduction member, heat dissipation structure, and electronic equipment |
US20070297145A1 (en) * | 2006-06-22 | 2007-12-27 | Siemens Vdo Automotive Aktiengesellschaft | Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink |
US20080013286A1 (en) * | 2006-07-13 | 2008-01-17 | Shinko Electric Industries Co., Ltd. | Semiconductor module and heat radiating plate |
JP2008078564A (en) | 2006-09-25 | 2008-04-03 | Fujikura Ltd | Heat dissipating structure |
US20090135563A1 (en) * | 2007-11-27 | 2009-05-28 | Sony Corporation | Heat radiation structure of electronic component and display device |
US20090244852A1 (en) * | 2008-03-25 | 2009-10-01 | Fujitsu Limited | Heat radiator |
US20100165574A1 (en) * | 2008-12-26 | 2010-07-01 | Panasonic Corporation | Image display apparatus |
US20100251536A1 (en) * | 2009-04-06 | 2010-10-07 | Moxa Inc. | Heat-dissipating structure on case of industrial computer and manufacturing method thereof |
US20130265722A1 (en) * | 2009-06-05 | 2013-10-10 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
US8199509B2 (en) * | 2009-06-12 | 2012-06-12 | Sony Corporation | Electronic equipment |
US20110096505A1 (en) * | 2009-08-31 | 2011-04-28 | Funai Electric Co., Ltd. | Package substrate |
US20130308269A1 (en) * | 2009-12-02 | 2013-11-21 | Hamilton Sundstrand Corporation | Method of converting power using a power semiconductor module |
US20110279970A1 (en) * | 2010-05-17 | 2011-11-17 | Hon Hai Precision Industry Co., Ltd. | Electronic device with thermal insulation member for heat sink |
US20120020017A1 (en) * | 2010-07-20 | 2012-01-26 | Kehret William E | Printed circuit board module enclosure and apparatus using same |
US20160174416A1 (en) * | 2010-09-09 | 2016-06-16 | International Business Machines Corporation | Electronic module with laterally-conducting heat distributor layer |
US20130188314A1 (en) * | 2010-09-30 | 2013-07-25 | Nec Corporation | Vapor phase cooling apparatus and electronic equipment using same |
US20120160456A1 (en) * | 2010-12-28 | 2012-06-28 | Fujitsu Limited | Cooling apparatus and electronic apparatus |
US20170083060A1 (en) * | 2011-05-05 | 2017-03-23 | Carefusion 303, Inc. | Passive cooling and emi shielding system |
US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
US20130083488A1 (en) * | 2011-09-30 | 2013-04-04 | Fujitsu Limited | Semiconductor package, wiring board unit, and electronic apparatus |
US20130094152A1 (en) * | 2011-10-13 | 2013-04-18 | Hon Hai Precision Industry Co., Ltd. | Electronic device and heat sink employing the same |
US20130199767A1 (en) * | 2012-02-02 | 2013-08-08 | International Business Machines Corporation | Compliant pin fin heat sink and methods |
US20130242542A1 (en) * | 2012-03-19 | 2013-09-19 | Canon Kabushiki Kaisha | Display apparatus |
US20130286592A1 (en) * | 2012-04-27 | 2013-10-31 | Canon Kabushiki Kaisha | Electronic component and electronic apparatus |
US20130301222A1 (en) * | 2012-05-09 | 2013-11-14 | Gemtek Technology Co., Ltd | Stacked heat dissipating module of an electronic device |
US20140009891A1 (en) * | 2012-07-09 | 2014-01-09 | Lite-On Technology Corporation | Planar heat dissipation structure and electronic device utilizing the same |
US20140085832A1 (en) * | 2012-09-26 | 2014-03-27 | Panasonic Corporation | Electronic device with efficient heat radiation structure for electronic components |
US20140140011A1 (en) * | 2012-11-16 | 2014-05-22 | Hitachi Metals, Ltd. | Signal Transmission Device |
US20150305205A1 (en) * | 2012-12-03 | 2015-10-22 | CoolChip Technologies, Inc. | Kinetic-Heat-Sink-Cooled Server |
US20140160684A1 (en) * | 2012-12-06 | 2014-06-12 | Apple Inc. | Cooling for electronic components |
US20160050790A1 (en) * | 2013-03-08 | 2016-02-18 | International Business Machines Corporation | Multi-component electronic module with integral coolant-cooling |
US20150062820A1 (en) * | 2013-09-04 | 2015-03-05 | Cisco Technology, Inc. | Heat transfer for electronic equipment |
US20160282914A1 (en) * | 2013-11-14 | 2016-09-29 | Fujikura Ltd. | Cooling structure for portable electronic device |
US20150250074A1 (en) * | 2013-12-13 | 2015-09-03 | Hitachi, Ltd. | Cooling structure for heating element and power converter |
US20150208550A1 (en) * | 2014-01-21 | 2015-07-23 | Seagate Technology Llc | Dissipating Heat During Device Operation |
US20160079150A1 (en) * | 2014-09-12 | 2016-03-17 | Intel Corporation | Techniques and configurations associated with a package load assembly |
US20160150673A1 (en) * | 2014-11-20 | 2016-05-26 | Hitachi Metals, Ltd. | Communication Module |
US20160183407A1 (en) * | 2014-12-19 | 2016-06-23 | Fujitsu Limited | Board assembly including cooling system and electronic apparatus |
US20170023306A1 (en) * | 2015-07-22 | 2017-01-26 | Compulab Ltd. | Layered heat pipe structure for cooling electronic component |
US20170196122A1 (en) * | 2015-12-30 | 2017-07-06 | Msi Computer (Shenzhen) Co.,Ltd. | Heat dissipation system |
Also Published As
Publication number | Publication date |
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CN107643806B (en) | 2020-12-04 |
CN107643806A (en) | 2018-01-30 |
JP6649854B2 (en) | 2020-02-19 |
JP2018014428A (en) | 2018-01-25 |
US20180027694A1 (en) | 2018-01-25 |
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