JPH073989U - Chip circuit component suction nozzle - Google Patents

Abstract

(57) [Summary] (Corrected) [Purpose] It is necessary to securely suck the chip-shaped circuit parts, and when picking up the chip-shaped circuit parts, there is no need to return the angle of the suction nozzle to the original angle each time. To do. A concave surface 3 formed of a part of a spherical surface or an elliptic spherical surface is formed on the tip surface of the nozzle body 1, and openings 4 for air passages are formed in the concave surface 3. The openings 4, 4, ... Have a shape that is elongated along the guide portions 5, 5, ... Between them and has a wide width in the central portion, and is provided radially with respect to the central axis of the nozzle body 1.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a nozzle for adsorbing a chip-shaped circuit component on a device for mounting the chip-shaped circuit component on a circuit board by applying a negative pressure to the tip end, and particularly to adsorbing a cylindrical chip-shaped circuit component. The present invention relates to a chip-shaped circuit component suction nozzle suitable for.

[0002]

[Prior art]

 FIG. 8 shows a tip portion of a conventional chip-shaped circuit component suction nozzle. As shown in FIG. 8, an air passage is formed in the internal vertical direction from the nozzle body 1 to the tip portion 2 for adsorbing the chip-shaped circuit component a, and the opening 8 is opened in the tip surface of the tip portion 2. is doing. The opening 8 has a circular shape, and in the illustrated conventional example, a groove 7 is formed on the tip surface of the tip 2 so as to pass through the opening 8. In this chip-shaped circuit component suction nozzle, the air passage is connected to a vacuum source (not shown), and the opening 8 is set to a negative pressure, so that the chip-shaped circuit component a can be sucked onto the tip surface thereof. The suction can be released by releasing the negative pressure in the opening 8.

[0003]

[Problems that the device is trying to solve]

 The chip-shaped circuit component a sucked by such a chip-shaped circuit component suction nozzle includes a rectangular chip component such as a laminated ceramic capacitor and a laminated ceramic inductor, and a cylindrical chip component such as a cylindrical ceramic capacitor. There are parts. FIG. 8 shows the latter cylindrical chip component as the chip-shaped circuit component a.

Among these chip-shaped circuit components, for example, in a cylindrical chip component a, as shown in FIG. 8, a central portion c between electrode portions b at both ends is a thick insulating exterior portion. The central portion c has a spherical shape or an elliptic spherical shape, that is, a so-called drum shape. Therefore, at the time of suction, the central portion c of the chip-shaped circuit component a comes into point contact with the edge 9 of the concave groove 3 on the tip surface of the suction head. For this reason, the chip-shaped circuit component a cannot be held stably, and air is often leaked at the time of adsorption, resulting in an adsorption error. As described above, when the chip-shaped circuit component a is picked up by the suction nozzle, the chip-shaped circuit component a is not mounted on the circuit board, and a predetermined chip-shaped circuit component is out of stock. There is a problem that defective products occur in the circuit board manufacturing process.

Further, since the conventional chip-shaped circuit component suction nozzle has the concave groove 7 on the suction surface at the tip, the chip-shaped circuit component a is sucked only in the direction along the concave groove 7, Can be held. Therefore, when mounting the chip-shaped circuit component a in different directions on the circuit board, after sucking the chip-shaped circuit component a at a predetermined suction position, the suction nozzle is rotated to move the chip-shaped circuit component a into the circuit. After mounting on the substrate, when returning to the suction position again and picking up the next chip-shaped circuit component a, it was necessary to rotate the suction nozzle to return the angle to the original angle. For this reason, there is a problem that the production efficiency is low because it hinders the mounting of the chip-shaped circuit component on the circuit board at a high speed. Therefore, the present invention solves the above-mentioned problems of the conventional chip-shaped circuit component suction nozzle, and can reliably suck the chip-shaped circuit component, and the angle of the suction nozzle when the chip-shaped circuit component is sucked. It is an object of the present invention to provide a chip-shaped circuit component supply device that does not need to be returned to the original angle each time.

[0006]

[Means for Solving the Problems]

 That is, in the present invention, in order to achieve the above-mentioned object, in the chip-shaped circuit component suction nozzle in which the opening 4 of the air passage for suction is opened in the tip surface of the nozzle body 1 for sucking the chip-shaped circuit component a, A concave surface 3 formed of a part of a spherical surface or an elliptic spherical surface is formed on the tip surface of the nozzle body 1, and openings 4, 4, ... Of the air passage are formed in the concave surface 3, and the openings 4, 4 ,. Is a plurality of openings divided by the guide portions 5, 5, ... Provided is a chip-shaped circuit component suction nozzle. In this case, it is preferable that the openings 4, 4, ... Have an elongated shape along the guide portions 5, 5 ,. Further, the openings 4, 4, ... And the guide portions 5, 5, ... Are preferably provided radially with respect to the central axis of the nozzle body 1.

[0007]

[Action]

 In the chip-shaped circuit component suction nozzle according to the present invention, since the concave surface 3 formed of a part of a spherical surface or an elliptic spherical surface is formed around the opening 4 of the air passage on the tip surface of the nozzle body 1, the openings 4, 4, ... When the central portion c of the chip-shaped circuit component a is sucked and held there by applying a negative pressure, the tip surface of the nozzle body 1 and the central portion c of the chip-shaped circuit component a contact with each other with a substantially flat surface. . Therefore, the chip-shaped circuit component a can be stably held, air leakage during adsorption is small, and the chip-shaped circuit component a is reliably sucked.

Further, the openings 4, 4, ... Of the air passages opened on the tip end surface are provided as a plurality of openings divided by the guide portions 5, 5 ,. The guide portions 5, 5, ... Between them prevent the edges and steps of the chip-shaped circuit component a from hitting the edges of the openings 4, 4 ,. The body is pressed down. Then, since the chip-shaped circuit component a is sucked by the negative pressure in the openings 4, 4, ... On both sides thereof, the chip-shaped circuit component a is reliably sucked.

In particular, when the openings 4, 4, ... Are elongated along the guides 5, 5, ... And wide in the central part and narrow in both ends, the openings 4, 4 ,. Since the width of both ends of the chip-shaped circuit component a is narrow, the corners of the chip-shaped circuit component a are not caught by the edges of the openings 4, 4 ,. Further, when the openings 4, 4, ... Are provided radially with respect to the central axis of the nozzle body 1, even if the nozzle body 1 is rotated, the orientation of the openings 4, 4, ... Since no change occurs, the chip-shaped circuit component a can be reliably sucked at a constant state at any angle.

[0010]

【Example】

 Next, an embodiment of the present invention will be specifically described with reference to the drawings. 1 and 2 show a first embodiment of the present invention, in which a cylindrical tip 2 is provided at the tip of a cylindrical nozzle body 1 in which an air passage is formed. Has been done. A concave surface 3 having a spherical surface or an elliptic spherical shape is formed on the tip surface of the tip portion 2. The shape of the concave surface 3 conforms to the shape of the central portion c of the chip-shaped circuit component a, and is a curved surface having the same or slightly larger radius of curvature as the central portion c of the chip-shaped circuit component a.

Further, in the concave surface 3, openings 4 of the air passage are formed radially with respect to the central axis of the nozzle body 1. In the case of the illustrated embodiment, the center of the concave surface 3 is on the central axis of the nozzle body 1, so that the openings 4, 4, ... Are provided radially around the center of the concave surface 3. The openings 4, 4, ... Are so-called teardrop-shaped, which are elongated in the radial direction and have a wide central portion. The eight openings 4, 4, ... Are arranged at equal angular intervals, and the radially elongated guides 5, 5, ... Are arranged between them.

In this chip-shaped circuit component suction nozzle, a vacuum source (not shown) sucks air from the openings 4, 4, ... Through the air passage, and makes the openings 4, 4, ... Negative pressure. The chip-shaped circuit component a is adsorbed to the tip surface of the nozzle body 1. At this time, as shown by the chain double-dashed line in FIG. 2, the central portion c of the chip-shaped circuit component a is held by the concave surface 3.

Next, a second embodiment of the present invention shown in FIGS. 3 and 4 will be described. Here, a circular recess is provided in the center of the tip portion 2, and a cylindrical rubber or the like is provided in the recess. The elastic body 6 is fitted. The elastic body 6 has a spherical concave surface 3 at the front end thereof, and also has air passages arranged radially around its central axis, and the openings 4, 4 ... It is open to. The openings 4, 4, ... Have an elliptical shape whose major axis is radially arranged with respect to the center of the concave surface 3, and the guide portions 5, 5, ... Are arranged between them. In the chip-shaped circuit component suction nozzle according to this embodiment, the body portion of the chip-shaped circuit component a can be elastically pressed by the concave surface 3 that is the tip surface of the elastic body 6.

Further, a third embodiment shown in FIG. 5 will be described. In this embodiment, the tip portion 2 is formed into a square shape, and a groove is provided in the middle portion thereof, and the groove is formed in the center portion of the tip surface. An elastic body 6 made of rubber or the like having a concave surface 3 having an elliptic spherical shape is fitted therein. Circular air passage openings 4, 4, ... Are opened around the center of the concave surface 3 of the elastic body 6. Also in this embodiment, the elasticity of the elastic body 6 can be utilized to elastically hold the chip-shaped circuit component a.

Further, a fourth embodiment shown in FIG. 6 will be described. In this embodiment, the tip portion 2 is round and an elastic body 11 such as rubber is attached to the tip portion. Square air passage openings 4, 4, ... Are opened around the center of the concave surface 3 of the elastic body 11. Also in this embodiment, the elasticity of the elastic body 6 can be utilized to elastically hold the chip-shaped circuit component a. The elastic body 11 can be attached to the tip portion 2 by means such as adhesion.

Further, a fifth embodiment shown in FIG. 7 will be described. In this embodiment, the tip portion 2 is formed in a square shape and the tip surface is coated with an elastic body 12 such as rubber. Circular air passage openings 4, 4, ... Are opened around the center of the concave surface 3 of the tip surface coated with the elastic body 12. The elastic body 12 can be provided by applying a paste-like elastic material and baking it.

In the above embodiment, the openings 4, 4, ... Are formed in a teardrop shape, an elliptical shape, or a circular shape, but the opening 4 may be rectangular, triangular, or the like. Good. The concave surface 3 is provided at the center of the tip surface of the tip portion 2 of the nozzle body 1, and the opening 4 is provided around the center of the concave surface 3 so that the central portion c of the chip-shaped circuit component a can be securely attracted. It is desirable to provide them radially.

[0018]

[Effect of device]

 As explained above, according to the suction nozzle of the present invention, the central portion c of the cylindrical chip-shaped circuit component a can be stably held, and air leakage during suction is small, so that the cylindrical tip The circuit component can be securely attracted and held. Further, it is possible to mount the chip-shaped circuit component on the circuit board without correcting the angle of the nozzle to the origin each time the chip-shaped circuit component is mounted, and the efficiency of the chip-shaped circuit component mounting work can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of a tip end portion of a chip-shaped circuit component suction nozzle according to an embodiment of the present invention as viewed from below.

FIG. 2 is a bottom view of the chip-shaped circuit component suction nozzle showing the same embodiment.

FIG. 3 is a perspective view of a tip end portion of a chip-shaped circuit component suction nozzle according to another embodiment of the present invention, as viewed from below.

FIG. 4 is a vertical cross-sectional side view of a tip end portion of a chip-shaped circuit component suction nozzle showing the same embodiment.

FIG. 5 is a perspective view of a tip end portion of a chip-shaped circuit component suction nozzle according to still another embodiment of the present invention, as viewed from below.

FIG. 6 is a perspective view of a tip end portion of a chip-shaped circuit component suction nozzle according to still another embodiment of the present invention as viewed from below.

FIG. 7 is a perspective view of a tip end portion of a chip-shaped circuit component suction nozzle according to still another embodiment of the present invention, as viewed from below.

FIG. 8 is a perspective view of a tip portion of a chip-shaped circuit component suction nozzle showing a conventional example as viewed from below.

[Explanation of symbols]

 1 Nozzle body 2 Tip part 3 Concave surface 4 Opening part of air passage a Chip-shaped circuit component b Electrode part of chip-shaped circuit component c Central part of chip-shaped circuit component

Claims (3)

[Reference number] 0050266-01 [Claims for utility model registration] 1. A chip-shaped circuit component suction nozzle in which an opening (4) of an air passage for suction is opened in a tip surface of a nozzle body (1) for sucking the chip-shaped circuit component (a). A concave surface (3) formed of a part of a spherical surface or an elliptic spherical surface is formed on the tip surface of 1), and
The openings (4), (4) ... Of the air passage are formed in the concave surface (3), and the openings (4), (4) ... Are divided by the guides (5), (5). A chip-shaped circuit component suction nozzle, characterized in that 2. The opening (4) according to claim 1,
The chip-shaped circuit component suction nozzle is characterized in that (4) ... Elongate along the guide portions (5), (5) ... Between them and have a wide central portion. 3. In the above claim 1 or 2, the openings (4), (4) ... And the guide portions (5), (5) ...
A chip-shaped circuit component suction nozzle provided radially with respect to the central axis of the nozzle body (1).