JP2533590Y2 - Chip-shaped electronic component suction unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application field] In the present invention, in a device for mounting chip-shaped electronic components on a substrate, the chip-shaped electronic components on a template are sucked and transferred onto a circuit board. The present invention relates to a suction head used to perform the operation.

[Prior Art] Conventionally, when a chip-shaped electronic component is mounted at a predetermined position on a circuit board, an apparatus as shown in FIG.
This was done in the following way. That is, the chip-shaped electronic components housed in a bulk in the plurality of storage containers 1 are sent one by one from the sending section 11 to the guide tube 2 of the guide means 2.
Send it out to 1, 21 ... The chip-shaped electronic components a, a.
To the template 6 inserted below. On this template 6, each chip-shaped electronic component is placed on a circuit board 9
The receiving containers 61 are arranged in accordance with the positions where the chip-like electronic components are conveyed from the guide tubes 21, 21. Subsequently, the template 6 moves from below the base plate 3 to below the suction head 8. On the lower surface of the suction head 8, suction nozzles 82 as shown in FIG. 3 are provided corresponding to the positions of the storage containers 61, 61,.
With the chip-like electronic components a, a ... stored in 1, 61 ... kept in the relative position when stored, the suction nozzles
Adsorbed and held at the tip of 82. After the suction unit 8 is raised and the template 6 is retracted from below, the suction unit 8 is lowered and the chip-shaped electronic component a sucked and held by the tip of the suction nozzle 82 is mounted on the circuit board 9. . Thereby, each of the chip-shaped electronic components is mounted at a predetermined position on the circuit board 9. 4 in FIG.
Is a conveyor for transporting the circuit board 9, and 10 and 12 are
A light source and a light receiver for checking whether or not a chip-shaped electronic component is stored in each of the storage recesses 61 of the tape rate 6 are shown.

An adhesive is applied to the circuit board in advance at a position where the chip-shaped electronic component is to be mounted, and soldering is performed while the mounted electronic component is temporarily fixed with the adhesive.

As shown in FIG. 3, a conventional chip-type electronic component suction device used in such a device is arranged so that a chip-shaped electronic component a is to be suctioned and a suction nozzle 82 is drawn from a suction head 8. Were protruding from each other. The distal end portion 84 of the suction nozzle 82 is made of an elastic member such as rubber for the purpose of, for example, alleviating an impact when hitting the chip-shaped electronic component a and preventing air from leaking at the time of suction.

In the conventional suction device, since the distal end portion 84 of the suction nozzle 82 is made of rubber, it is easily worn or deformed, and has poor durability. Further, since the tip of the suction nozzle 82 is easily attached to the chip-shaped electronic component a, the chip-shaped electronic component a is not easily separated from the suction surface of the suction nozzle when the suction is released, and the circuit of the chip-shaped electronic component a Displacement of the mounting position on the substrate and mounting errors are likely to occur. Therefore, it is conceivable to form the tip portion of the suction nozzle with a hard material.

[Problem to be solved by the invention] However, in the case of a suction nozzle, when the suction port at the tip of the suction nozzle is set to a negative pressure and the chip-shaped electronic component is sucked on the surrounding component suction surface, the tip of the suction nozzle is chip-shaped. It is necessary to prevent leakage of air to be deformed according to the shape of the electronic component and to be sucked. However, if the tip of the suction nozzle is formed of a hard material, the deformability of the tip is lost, so that the component suction surface does not easily deform according to the shape of the chip-shaped electronic component, and air leaks from the suction port. Cause This allows
There has been a problem that the chip-shaped electronic component cannot be reliably attracted.

The present invention has been made in view of such conventional problems, and provides a suction head which is excellent in durability, has good separation of chip-shaped electronic components at the time of suction release, and can reliably suction chip-shaped electronic components. With the goal.

[Means for Solving the Problems] That is, in order to achieve the above object, according to the present invention, a film-like hard surface is formed on a component suction surface formed around a suction port at a tip portion made of an elastic body at a tip of a suction nozzle. The material is coated so that the end surface can be elastically deformed on the suction surface, and the end portion has durability and releasability.

That is, the chip-shaped electronic component suction unit according to the present invention is provided with a suction nozzle for suctioning the chip-shaped electronic component in accordance with a position on the substrate on which the chip-shaped electronic component is to be mounted, and at least a tip portion of the suction nozzle. In a chip-shaped electronic component suction unit made of an elastic body, a suction surface of a suction nozzle formed at least around a suction port at a distal end portion made of an elastic body and having a negative pressure by air sucked from the suction port is provided. Characterized by being covered with a hard coating.

[Operation] In the suction unit, since the suction surface formed around the suction port at the tip portion made of the elastic body of the suction nozzle is covered with a hard material, the tip portion is hardly worn, and the durability of the suction nozzle is improved. Will be higher. In addition, since the hard material that covers the suction surface is a film-like film, the suction port at the tip of the suction nozzle has a negative pressure, and when the chip-shaped electronic component is to be suctioned to the component suction surface, it is made of an elastic body. Does not hinder the elastic deformation of the tip. For this reason, the component suction surface is deformed according to the shape of the chip-shaped electronic component to be sucked, thereby preventing air from leaking from between the suction surface and the chip-shaped electronic component. Therefore, the chip-shaped electronic component is reliably sucked to the component suction surface of the suction nozzle.

Furthermore, when the negative pressure of the suction port is released and the suction is released, the elastic body constituting the tip portion of the suction nozzle does not directly contact the chip-shaped electronic component due to the hard coating, so that the chip-shaped electronic device There is no sticking of parts. For this reason, the separation of the chip-like electronic component from the suction nozzle is improved, and the suction can be reliably released.

Thus, in the present invention, by forming a hard film on the component suction surface that deforms according to the shape of the chip-shaped electronic component due to the negative pressure, there is no air leakage, and therefore, even if the suction performance is not impaired. Regardless, separation of the chip-shaped electronic component at the time of suction release is also improved. In addition, wear of the component suction surface can be prevented.

[Example] Next, an example of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 2, the suction unit according to the present invention has a suction nozzle 82 projecting from the lower surface of the suction head 8 so as to be positioned so as to suck the chip-shaped electronic component a. The suction nozzle 82 includes a base 83 fixed to the lower surface of the suction unit 8 and a tip 84. The base 83 is usually
It is made of a resin material that is easy to mold, and has mounting pins 85, 85 projecting upward, which are fitted into mounting holes 87, 87 pre-drilled in the lower surface of the suction unit 8, thereby lowering the lower surface of the suction unit. Attached to. On the other hand, the distal end portion 84 is made of an elastic material such as rubber, and is attached to the tip of the base portion 83. The distal end surface of the distal end portion 84 is formed in a curved concave shape according to the shape of the chip-shaped electronic component a to be sucked.

An air flow path 86 extending from the mounting pins 85 of the base 83 to the distal end surface of the distal end portion 84 is formed, and is opened at the distal end surface of the distal end portion 84. This air flow path 86 is
By attaching the suction nozzle 82 to the suction unit 8 via 85, 85, the exhaust duct is
81 (see FIG. 4), and to the vacuum means (not shown) via the duct 81. As a result, air is sucked into the flow path 86 from the opening at the tip end surface of the suction nozzle 82.

In the present invention, a hard coating 88 is formed on at least the distal end surface of the distal end portion 84 formed of the elastic body of the suction nozzle 82 by, for example, plating. Such a coating 88
The coating 88 may be formed by painting or the like. As shown in the drawing, the coating 88 may not be formed on almost the entire surface of the distal end portion 84, but may be formed only on the distal end surface of the chip-shaped electronic component a to be sucked.

FIG. 1 shows that the chip-shaped electronic component a
2 shows a state where it is adsorbed to the tip of the.

[Effects of the Invention] As described above, according to the suction unit of the present invention,
It has excellent durability, and the component suction surface is elastically deformed in accordance with the chip-shaped electronic component to be sucked, so that the chip-shaped electronic component can be reliably sucked and held.
When the suction is released, it is possible to provide a suction unit having a suction nozzle from which the chip-shaped electronic component is easily detached.

[Brief description of the drawings]

1A and 1B are a vertical front view and a vertical side view showing a suction nozzle portion of a suction unit according to an embodiment of the present invention, and FIGS. 2A and 2B are conventional examples. FIG. 3 is a vertical sectional front view and a vertical sectional side view showing a suction nozzle portion of a certain suction unit, and FIG. 3 is a perspective view showing an example of a chip-shaped electronic component automatic mounting apparatus. 8 Suction head, 82 Suction nozzle, 83 Suction nozzle base, 84 Suction nozzle tip, 88 Hard film, 89 Thin hard plate

Claims (1)

(57) [Scope of request for utility model registration] A suction nozzle for sucking the chip-shaped electronic component is arranged in accordance with a position on a substrate on which the chip-shaped electronic component is to be mounted, and at least the tip of the suction nozzle is made of an elastic material. In the component suction unit, a component suction surface formed at least around a suction port at a distal end portion made of an elastic body of the suction nozzle and having a negative pressure by air sucked from the suction port is covered with a hard coating. A chip-shaped electronic component suction unit.