JPH0731598Y2 - Suction head for chip-shaped circuit component mounting device - Google Patents

Suction head for chip-shaped circuit component mounting device

Info

Publication number
JPH0731598Y2
JPH0731598Y2 JP40604490U JP40604490U JPH0731598Y2 JP H0731598 Y2 JPH0731598 Y2 JP H0731598Y2 JP 40604490 U JP40604490 U JP 40604490U JP 40604490 U JP40604490 U JP 40604490U JP H0731598 Y2 JPH0731598 Y2 JP H0731598Y2
Authority
JP
Japan
Prior art keywords
chip
suction head
suction
circuit component
shaped circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP40604490U
Other languages
Japanese (ja)
Other versions
JPH0492698U (en
Inventor
智史 土屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP40604490U priority Critical patent/JPH0731598Y2/en
Publication of JPH0492698U publication Critical patent/JPH0492698U/ja
Application granted granted Critical
Publication of JPH0731598Y2 publication Critical patent/JPH0731598Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】本考案は、基板上にチップ状回路
部品を搭載する装置において、テンプレート上の前記チ
ップ状回路部品を吸着し、回路基板の上に移動させ配置
するのに用いられる吸着ヘッドに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting chip-shaped circuit components on a substrate, which is used for adsorbing the chip-shaped circuit components on a template and moving and arranging them on the circuit board. Regarding the head.

【0002】[0002]

【従来の技術】従来において、回路基板の所定の位置に
チップ状回路部品を搭載する場合、図6で示すような装
置により、次のような方法で行なわれていた。すなわ
ち、複数の収納容器1の中にバルク状に収納されたチッ
プ状回路部品を、パイプ状のシュート21とベース板3
により構成された案内手段2により一つずつ取り出し
て、ベース板3の下に挿入されたテンプレート6上の所
定の位置に設けられた収納容器61へ各々送り、そこに
収受する。この収納容器61は、各々のチップ状回路部
品を回路基板9に搭載する位置に合わせて配設されてい
る。続いて、このテンプレート6は、ベース板3の下か
ら吸着ユニット8の下に移動する。吸着ユニット8の下
面には、前記収納容器61、61…の位置に対応して吸
着ノズル(図7と図8参照)が設けられており、そのノ
ズルの先端が負圧に維持される。そして、収納容器6
1、61…に収納されたチップ状回路部品a、a…が、
収納された位置のまま、同吸着ヘッドの先端に吸着、保
持される。図6において、符号81は、吸着ノズルの先
端を負圧に維持するため、図示しない真空ポンプに接続
される吸着ユニット8の吸引ダクトである。吸着ユニッ
ト8が上昇し、その下からテンプレート6が退避した
後、吸着ユニット8が下降し、吸着ヘッドの先端に吸
着、保持された前記チップ状回路部品aを回路基板9の
上に搭載する。これによって、前記各チップ状回路部品
が回路基板9の所定の位置に各々搭載される。図6にお
いて7は、前記回路基板9を搬送するコンベアを示す。
2. Description of the Related Art Conventionally, when a chip-shaped circuit component is mounted at a predetermined position on a circuit board, it has been carried out by the following method using a device shown in FIG. That is, the chip-shaped circuit components stored in bulk in the plurality of storage containers 1 are connected to the pipe-shaped chute 21 and the base plate 3.
One by one is taken out by the guide means 2 constituted by and is sent to the storage container 61 provided at a predetermined position on the template 6 inserted under the base plate 3 and received there. The storage container 61 is arranged in accordance with the position where each chip-shaped circuit component is mounted on the circuit board 9. Subsequently, the template 6 moves from below the base plate 3 to below the suction unit 8. Adsorption nozzles (see FIGS. 7 and 8) are provided on the lower surface of the adsorption unit 8 corresponding to the positions of the storage containers 61, 61 ... And the tip of the nozzles is maintained at a negative pressure. And the storage container 6
The chip-shaped circuit components a, a ...
It is adsorbed and held on the tip of the adsorption head in the stored position. In FIG. 6, reference numeral 81 is a suction duct of the suction unit 8 that is connected to a vacuum pump (not shown) to maintain the tip of the suction nozzle at a negative pressure. After the suction unit 8 moves up and the template 6 retracts from below, the suction unit 8 moves down and the chip-shaped circuit component a sucked and held by the tip of the suction head is mounted on the circuit board 9. As a result, the respective chip-shaped circuit components are mounted on the circuit board 9 at predetermined positions. In FIG. 6, reference numeral 7 indicates a conveyer that conveys the circuit board 9.

【0003】なお、回路基板には、チップ状回路部品を
搭載すべき位置に予め接着剤を塗布しておき、搭載され
た前記回路部品をこの接着剤で仮固定した状態で、半田
付けを行なう。このような装置に使用される従来の吸着
ヘッド8は、図7に示されたように、チップ状回路部品
aを吸着すべき位置に合わせて、吸着ヘッド8の本体か
ら吸着ノズル85を各々突設していた。そして、図8に
示されたように、この吸着ノズル85を取り付けるた
め、チップ状回路部品aを吸着すべき位置に合わせて吸
着ヘッド8の本体に予めのノズル取付孔を兼ねる取付孔
87、87を穿孔しておき、吸着ノズル85の上部から
突設されたピン86、86を取付孔87、87に嵌め込
むことにより、前記吸着ノズル85が吸着ヘッド8に取
り付けられていた。
It should be noted that the circuit board is preliminarily coated with an adhesive at a position where the chip-shaped circuit component is to be mounted, and the mounted circuit component is soldered while the circuit component is temporarily fixed with this adhesive. . In the conventional suction head 8 used in such an apparatus, as shown in FIG. 7, the suction nozzles 85 are respectively projected from the main body of the suction head 8 in accordance with the position where the chip-shaped circuit component a is to be sucked. Had been set up. Then, as shown in FIG. 8, in order to attach the suction nozzle 85, attachment holes 87, 87 which also serve as nozzle attachment holes in advance in the main body of the adsorption head 8 are aligned with the position where the chip-shaped circuit component a is to be adsorbed. The suction nozzle 85 is attached to the suction head 8 by punching holes and fitting pins 86, 86 protruding from the upper portion of the suction nozzle 85 into the mounting holes 87, 87.

【0004】このような吸着ノズル85は、その先端に
チップ状回路部品aを吸着するときや、吸着したチップ
状回路部品aを回路基板の上に載せるとき、チップ状回
路部品aの当たって衝撃を受ける。このため、従来の吸
着ヘッド8では、吸着ノズル85がゴム等の弾性体から
なっており、その弾性で先端に受ける衝撃を緩和してい
た。
Such a suction nozzle 85 hits the tip-shaped circuit component a when the tip-shaped circuit component a is sucked onto the tip or when the sucked chip-shaped circuit component a is placed on the circuit board. Receive. For this reason, in the conventional suction head 8, the suction nozzle 85 is made of an elastic material such as rubber, and the elasticity thereof relaxes the impact on the tip.

【0005】[0005]

【考案が解決しようとしている課題】しかしながら、前
記従来の吸着ヘッド8では、吸着ノズル85がゴムで出
来ているため、時間の経過に従って、硬く、脆くなり、
耐久性に欠けるという欠点があった。また、吸着ノズル
85の先端にチップ状回路部品aが貼り付きやすく、チ
ップ状回路部品aの離れが悪いため、チップ状回路部品
aを回路基板の上に搭載するとき、チップ状回路部品a
が吸着ノズル85の先端に付いたまま、回路基板の上に
搭載されないというトラブルが発生しやすい。本考案
は、このような従来の課題に鑑み、耐久性や強度に優
れ、基板への搭載が確実に行なわれる吸着ヘッドを提供
することを目的とする。
However, in the conventional suction head 8, since the suction nozzle 85 is made of rubber, it becomes hard and brittle over time.
It had the drawback of lacking in durability. Further, since the chip-shaped circuit component a is easily attached to the tip of the suction nozzle 85 and the chip-shaped circuit component a is not easily separated, when the chip-shaped circuit component a is mounted on the circuit board, the chip-shaped circuit component a
It is easy to cause a problem that is attached to the tip of the suction nozzle 85 and is not mounted on the circuit board. SUMMARY OF THE INVENTION The present invention has been made in view of such problems in the related art, and an object of the present invention is to provide a suction head which has excellent durability and strength and can be mounted on a substrate reliably.

【0006】[0006]

【課題を解決するための手段】すなわち、前記目的を達
成するため、本考案において採用された手段の要旨は、
チップ状回路部品を搭載しようとする基板上の位置に合
わせて前記チップ状回路部品を吸引するノズル16が設
けられた吸着ヘッドであって、吸引ダクト15が接続さ
れた吸着ヘッド本体14と、該吸着ヘッド本体14の下
面壁11に開設されたノズル取付孔12に挿入され、先
端から基端にわたる空気通路を有するノズル16と、前
記吸着ヘッド本体14の中に収納され、ノズル16の基
端側を下方に押圧する通気性を有する弾性部材13とを
備えることを特徴とするチップ状回路部品マウント装置
用吸着ヘッドである。
[Means for Solving the Problems] That is, the gist of the means adopted in the present invention to achieve the above object is as follows.
A suction head body 14 having a nozzle 16 for sucking the chip-shaped circuit component in accordance with a position on the substrate on which the chip-shaped circuit component is mounted, the suction head main body 14 having a suction duct 15 connected thereto, A nozzle 16 having an air passage extending from the tip to the base end, which is inserted into the nozzle mounting hole 12 formed in the lower surface wall 11 of the suction head body 14, and housed in the suction head body 14, the base end side of the nozzle 16. And a breathable elastic member (13) for pressing downward.

【0007】[0007]

【作用】前記吸着ヘッドでは、吸着ノズル16の背後に
通気性を有する弾性部材13があり、これが吸着ノズル
16の先端に受ける衝撃を緩衝する。このため、吸着ノ
ズル16を特にゴム等の弾性体で形成する必要がなく、
合成樹脂等の硬質体で形成することができる。よって、
強度や耐久性が高く、先端にチップ状回路部品aが貼り
付きにくい吸着ノズル16を備える吸着ヘッドが得られ
る。なお、弾性部材13が通気性を有するため、吸引ダ
クト15側から吸着ノズル16の空気通路18を通し
て、吸着ノズル16の先端を負圧に維持することができ
る。
In the suction head, there is a breathable elastic member 13 behind the suction nozzle 16, and this cushions the shock received at the tip of the suction nozzle 16. Therefore, it is not necessary to form the suction nozzle 16 with an elastic body such as rubber,
It can be formed of a hard body such as a synthetic resin. Therefore,
A suction head having a high strength and durability and a suction nozzle 16 at the tip of which the chip-shaped circuit component a hardly sticks can be obtained. Since the elastic member 13 has air permeability, the tip of the suction nozzle 16 can be maintained at a negative pressure from the suction duct 15 side through the air passage 18 of the suction nozzle 16.

【0008】[0008]

【実施例】次に、図面を参照しながら本考案の実施例に
ついて説明する。図1〜図3に示すように、吸着ヘッド
本体14は薄い箱形であり、その下面が開いており、こ
の開口部からその中に通気性を有する前記弾性部材13
が収納され、さらにこの開口部を閉じるように、前記下
面壁11が取り付けられる。この吸着ヘッド本体14に
は吸引ダクト15が接続されており、この吸引ダクト1
5は、吸着ヘッド本体14の中に通じている。
Embodiments of the present invention will now be described with reference to the drawings. As shown in FIGS. 1 to 3, the suction head main body 14 has a thin box shape, the lower surface of which is open, and the elastic member 13 having air permeability from the opening to the inside thereof.
Is accommodated, and the lower surface wall 11 is attached so as to close the opening. A suction duct 15 is connected to the suction head body 14, and the suction duct 1
5 communicates with the inside of the suction head body 14.

【0009】前記吸着ヘッド本体14の下面壁11に
は、チップ状回路部品aの搭載位置に合わせてノズル取
付孔12が開設されており、このノズル取付孔12に吸
引ノズル16が嵌め込まれている。吸着ノズル16は、
基端側にフランジ部17を有しており、その先端から基
端にわたって空気通路18が開設されている。前記フラ
ンジ部17が下面壁11の上面に当り、吸着ノズル16
をノズル取付孔12から抜け止めしていると共に、その
フランジ部17に弾性部材13が当り、吸着ノズル16
を下方に押している。
A nozzle mounting hole 12 is formed in the lower surface wall 11 of the suction head body 14 in accordance with the mounting position of the chip-shaped circuit component a, and a suction nozzle 16 is fitted in the nozzle mounting hole 12. . The suction nozzle 16 is
A flange portion 17 is provided on the base end side, and an air passage 18 is opened from the tip to the base end. The flange portion 17 contacts the upper surface of the lower surface wall 11, and the suction nozzle 16
Of the suction nozzle 16 from the nozzle mounting hole 12, and the elastic member 13 contacts the flange portion 17 of the suction nozzle 16
Is pushing downwards.

【0010】従って、吸着ノズル16は、通常図1に示
すように、フランジ部17が下面壁11の上面に当たる
よう弾性部材13に押されているが、図2で示すよう
に、吸着ノズル16の先端にチップ状回路部品aを介し
て矢印で示すような力を受けると、弾性部材13の弾性
に抗して吸着ノズル16が上昇する。また、弾性部材1
3は、通気性を有するため、吸引ダクト15側から吸着
ノズル16の空気通路18を通して、吸着ノズル16の
先端を負圧に維持することができる。前記のような弾性
部材13は、多孔質の発泡性樹脂により形成することが
できる。また、吸着ノズル16は、耐変形性、耐摩耗性
の高い硬質樹脂で形成することができる。
Therefore, the suction nozzle 16 is normally pushed by the elastic member 13 so that the flange portion 17 contacts the upper surface of the lower surface wall 11 as shown in FIG. 1, but as shown in FIG. When the tip end receives a force indicated by an arrow through the chip-shaped circuit component a, the suction nozzle 16 rises against the elasticity of the elastic member 13. Also, the elastic member 1
Since 3 has air permeability, the tip of the suction nozzle 16 can be maintained at a negative pressure from the suction duct 15 side through the air passage 18 of the suction nozzle 16. The elastic member 13 as described above can be formed of a porous foaming resin. Further, the suction nozzle 16 can be formed of a hard resin having high deformation resistance and high wear resistance.

【0011】図4と図5に本考案の他の実施例が示され
ている。すなわち、図4は、吸着ヘッド本体14の中に
多数の通孔20が穿孔された穿孔板19を設け、その下
部に弾性部材13を挿入した例である。また、図5は、
ノズル取付孔12の周囲の下面壁11の上面部分に凹部
を形成し、ここに吸着ノズル16のフランジ部17を嵌
め込んだものである。なお、本考案は前記実施例に限ら
れず、例えば吸着ユニット本体14の下面壁11が一体
となっており、上面側が開いていて、その上面が吸引ダ
クト15が接続された上面壁で閉じられるものであって
もよい。但し、下面壁11が吸着ユニット本体14に着
脱できるものでは、ノズル取付孔12の穿孔パターンの
異なる下面壁11に交換すれば、チップ状回路部品aの
搭載パターンを変更できるので、便利である。
FIG. 4 and FIG. 5 show another embodiment of the present invention. That is, FIG. 4 shows an example in which a perforated plate 19 in which a large number of through holes 20 are perforated is provided in the suction head main body 14, and the elastic member 13 is inserted under the perforated plate 19. In addition, FIG.
A concave portion is formed in the upper surface portion of the lower surface wall 11 around the nozzle mounting hole 12, and the flange portion 17 of the suction nozzle 16 is fitted therein. The present invention is not limited to the above-described embodiment, and for example, the lower surface wall 11 of the suction unit body 14 is integrated, the upper surface side is open, and the upper surface is closed by the upper surface wall to which the suction duct 15 is connected. May be However, in the case where the lower surface wall 11 can be attached to and detached from the suction unit body 14, it is convenient to replace the lower surface wall 11 with a different drilling pattern of the nozzle mounting holes 12 because the mounting pattern of the chip-shaped circuit component a can be changed.

【0012】[0012]

【考案の効果】以上説明した通り、本考案の吸着ヘッド
によれば、強度及び耐久性が高く、チップ状回路部品a
を確実に回路基板に相対できる吸着ヘッド提供すること
ができる。
As described above, according to the suction head of the present invention, the strength and durability are high and the chip-shaped circuit component a
It is possible to provide a suction head that can reliably face the circuit board.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の実施例による吸着ヘッドの要部縦断側
面図である。
FIG. 1 is a vertical sectional side view of a main part of a suction head according to an embodiment of the present invention.

【図2】本考案の実施例による吸着ヘッドの要部縦断側
面図である。
FIG. 2 is a vertical sectional side view of a main part of a suction head according to an embodiment of the present invention.

【図3】本考案の実施例による吸着ヘッドの底面側から
の分解斜視図である。
FIG. 3 is an exploded perspective view from the bottom side of the suction head according to the embodiment of the present invention.

【図4】本考案の他の実施例による吸着ヘッドの要部縦
断側面図である。
FIG. 4 is a vertical sectional side view of a main part of a suction head according to another embodiment of the present invention.

【図5】本考案のさらに他の実施例による吸着ヘッドの
要部縦断側面図である。
FIG. 5 is a vertical sectional side view of a main part of a suction head according to another embodiment of the present invention.

【図6】チップ状回路部品自動搭載装置の例を示す斜視
図である。
FIG. 6 is a perspective view showing an example of a chip-shaped circuit component automatic mounting apparatus.

【図7】従来の吸着ヘッドの要部側面図である。FIG. 7 is a side view of a main part of a conventional suction head.

【図8】従来の吸着ヘッドの要部断面図である。FIG. 8 is a sectional view of a main part of a conventional suction head.

【符号の説明】[Explanation of symbols]

11 下面壁 12 ノズル取付孔 13 弾性部材 14 吸着ヘッド本体 15 吸引ダクト 16 吸着ノズル 11 Lower Surface Wall 12 Nozzle Mounting Hole 13 Elastic Member 14 Suction Head Main Body 15 Suction Duct 16 Suction Nozzle

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 チップ状回路部品を搭載しようとする基
板上の位置に合わせて前記チップ状回路部品を吸引する
ノズル16が設けられた吸着ヘッドであって、吸引ダク
ト15が接続された吸着ヘッド本体14と、該吸着ヘッ
ド本体14の下面壁11に開設されたノズル取付孔12
に挿入され、先端から基端にわたる空気通路を有するノ
ズル16と、前記吸着ヘッド本体14の中に収納され、
ノズル16の基端側を下方に押圧する通気性を有する弾
性部材13とを備えることを特徴とするチップ状回路部
品マウント装置用吸着ヘッド。
1. A suction head provided with a nozzle 16 for sucking the chip-shaped circuit component in accordance with a position on a substrate on which the chip-shaped circuit component is to be mounted, the suction head having a suction duct 15 connected thereto. A main body 14 and a nozzle mounting hole 12 formed in a lower surface wall 11 of the suction head main body 14.
A nozzle 16 having an air passage extending from the tip to the base end, and housed in the suction head body 14.
A suction head for a chip-shaped circuit component mounting device, comprising: a breathable elastic member 13 that presses the base end side of the nozzle 16 downward.
JP40604490U 1990-12-29 1990-12-29 Suction head for chip-shaped circuit component mounting device Expired - Lifetime JPH0731598Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40604490U JPH0731598Y2 (en) 1990-12-29 1990-12-29 Suction head for chip-shaped circuit component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40604490U JPH0731598Y2 (en) 1990-12-29 1990-12-29 Suction head for chip-shaped circuit component mounting device

Publications (2)

Publication Number Publication Date
JPH0492698U JPH0492698U (en) 1992-08-12
JPH0731598Y2 true JPH0731598Y2 (en) 1995-07-19

Family

ID=31883363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40604490U Expired - Lifetime JPH0731598Y2 (en) 1990-12-29 1990-12-29 Suction head for chip-shaped circuit component mounting device

Country Status (1)

Country Link
JP (1) JPH0731598Y2 (en)

Also Published As

Publication number Publication date
JPH0492698U (en) 1992-08-12

Similar Documents

Publication Publication Date Title
US4733462A (en) Apparatus for positioning circuit components at predetermined positions and method therefor
JPH09293995A (en) Part vacuum-sucking method
JPH0983193A (en) Component suction head for electronic-component mounting machine
JPH0731598Y2 (en) Suction head for chip-shaped circuit component mounting device
US5997404A (en) Racking system for arranging pool balls
JPS58160086U (en) Mounting structure of board box for pachinko machine
JP2533590Y2 (en) Chip-shaped electronic component suction unit
KR20050093718A (en) Egg printing a letter device
CN220867849U (en) Hot-stamping drill pattern arranging device and honeycomb plate thereof
JPH083034Y2 (en) Chip circuit component mounting device template
JP3351314B2 (en) Apparatus and method for mounting conductive ball
JP2501085Y2 (en) Chip circuit component mounting device
JP3305295B2 (en) Membrane fixing device in DNA array automatic production equipment
JPS63107100A (en) Pin inserter
JPH0846389A (en) Part feeder
JPH0577995U (en) Chip circuit component mounting device
JPH085594Y2 (en) Chip circuit component mounting device
JPH03100U (en)
JPH085595Y2 (en) Chip circuit component mounting device
JPH085596Y2 (en) Chip circuit component mounting device
JPS58105377U (en) Ball removal device for pachinko machine prize tray
JPH0682897U (en) Template for chip circuit component placement
JPH0547519Y2 (en)
JPS6011854Y2 (en) Automatic chip separation and feeding device
JP2516330Y2 (en) Chip circuit component mounting device template

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19960319

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term